Supermicro X11DPS-RE User Manual

X11DPS-RE

USER’S MANUAL

Revision 1.0

The information in this user’s manual has been carefully reviewed and is believed to be accurate. The vendor assumes
no responsibility for any inaccuracies that may be contained in this document, and makes no commitment to update
or to keep current the information in this manual, or to notify any person or organization of the updates. Please Note:

For the most up-to-date version of this manual, please see our website at

www.supermicro.com.

Super Micro Computer, Inc. ("Supermicro") reserves the right to make changes to the product described in this manual
at any time and without notice. This product, including software and documentation, is the property of Supermicro and/
or its licensors, and is supplied only under a license. Any use or reproduction of this product is not allowed, except as
expressly permitted by the terms of said license.

IN NO EVENT WILL SUPER MICRO COMPUTER, INC. BE LIABLE FOR DIRECT, INDIRECT , SPECIAL, INCIDENTAL,
SPECULATIVE OR CONSEQUENTIAL DAMAGES ARISING FROM THE USE OR INABILITY TO USE THIS PRODUCT
OR DOCUMENTATION, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. IN PARTICULAR, SUPER
MICRO COMPUTER, INC. SHALL NOT HA VE LIABILITY FOR ANY HARDW ARE, SOFTWARE, OR DATA STORED OR
USED WITH THE PRODUCT, INCLUDING THE COSTS OF REPAIRING, REPLACING, INTEGRATING, INSTALLING
OR RECOVERING SUCH HARDWARE, SOFTWARE, OR DATA.

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of any such disputes. Supermicro's total liability for all claims will not exceed the price paid for the hardware product.

FCC Statement: This equipment has been tested and found to comply with the limits for a Class A digital device pursuant
to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference
when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio
frequency energy and, if not installed and used in accordance with the manufacturer’s instruction manual, may cause
harmful interference with radio communications. Operation of this equipment in a residential area is likely to cause
harmful interference, in which case you will be required to correct the interference at your own expense.

California Best Management Practices Regulations for Perchlorate Materials: This Perchlorate warning applies only
to products containing CR (Manganese Dioxide) Lithium coin cells. “Perchlorate Material-special handling may apply.
See

www.dtsc.ca.gov/hazardouswaste/perchlorate”.

WARNING: This product can expose you to chemicals including
lead, known to the State of California to cause cancer and birth

!

defects or other reproductive harm. For more information, go
to www.P65Warnings.ca.gov

.

The products sold by Supermicro are not intended for and will not be used in life support systems, medical equipment,
nuclear facilities or systems, aircraft, aircraft devices, aircraft/emergency communication devices or other critical
systems whose failure to perform be reasonably expected to result in signifi cant injury or loss of life or catastrophic
property damage. Accordingly, Supermicro disclaims any and all liability, and should buyer use or sell such products
for use in such ultra-hazardous applications, it does so entirely at its own risk. Furthermore, buyer agrees to fully
indemnify, defend and hold Supermicro harmless for and against any and all claims, demands, actions, litigation, and
proceedings of any kind arising out of or related to such ultra-hazardous use or sale.

Manual Revision 1.0
Release Date: July 6, 2018
Unless you request and receive written permission from Super Micro Computer, Inc., you may not copy any part of this

document. Information in this document is subject to change without notice. Other products and companies referred
to herein are trademarks or registered trademarks of their respective companies or mark holders.

Copyright © 2018 by Super Micro Computer, Inc.
All rights reserved.

Printed in the United States of America

Preface

Preface

About This Manual

This manual is written for system integrators, IT technicians, and knowledgeable end users.
It provides information for the installation and use of the X11DPS-RE motherboard.

About This Motherboard

The X11DPS-RE motherboard supports dual Intel® Xeon 81xx/61xx/51xx/41xx/31xx series
processors (Socket P)
Interconnects (UPIs) of up to 10.4 GT/s (Note below). With the Intel C627 PCH built-in, this
motherboard supports up to 3TB of LRDIMM/RDIMM/NVDIMM DDR4 ECC 2666/2400/2133
MHz memory in 24 DIMM slots, and it comes equipped with four SATA 3.0 ports, two SATA
DOM ports, and two PCI-E/SATA Hybrid M.2 ports. The cutting-edge X11DPS-RE offers
highly versatile NVMe options with an array of fl exible PCI-E solutions. This motherboard is
optimized for storage-intensive and high-perfomance systems with demanding workloads.
Please note that this motherboard is intended to be installed and serviced by professional
technicians only. For processor/memory updates, please refer to our website at http://www.
supermicro.com/products/.

with a TDP (Thermal Design Power) of up to 205W , and three UltraPath

Note: UPI/memory speeds are dependent on the processors installed in your system.

Manual Organization

Chapter 1 describes the features, specifi cations and performance of the motherboard, and

provides detailed information on the Intel C627 chipset.
Chapter 2 provides hardware installation instructions. Read this chapter when installing the

processor, memory modules, and other hardware components into the system.
If you encounter any problems, see Chapter 3, which describes troubleshooting procedures

for video, memory, and system setup stored in the CMOS.
Chapter 4 includes an introduction to the BIOS, and provides detailed information on running

the CMOS Setup utility.

Appendix A provides BIOS Error Beep Codes.
Appendix B lists software program installation instructions.
Appendix C lists standardized warning statements in various languages.
Appendix D provides UEFI BIOS Recovery instructions.

3

Super X11DPS-RE User's Manual

Contacting Supermicro

Headquarters

Address: Super Micro Computer, Inc.

980 Rock Ave.

San Jose, CA 95131 U.S.A.
Tel: [phone]
Fax: [phone]
Email: [e-mail] (General Information)

[e-mail] (Technical Support)
Website:

Europe

Address: Super Micro Computer B.V.

Tel: [phone]
Fax: [phone]
Email: [e-mail] (General Information)

Website:

Asia-Pacifi c

Address: Super Micro Computer, Inc.

www.supermicro.com

Het Sterrenbeeld 28, 5215 ML
's-Hertogenbosch, The Netherlands

[e-mail] (Technical Support)
[e-mail] (Customer Support)

www.supermicro.nl

3F, No. 150, Jian 1st Rd.
Zhonghe Dist., New Taipei City 235

Taiwan (R.O.C)
Tel: [phone]
Fax: [phone]
Email: [e-mail]
Website:

www.supermicro.com.tw

4

Preface

Table of Contents

Chapter 1 Introduction

1.1 Check List .............................................................................................................................8

1.2 Processor and Chipset Overview .......................................................................................18

1.3 Special Features ................................................................................................................18

1.4 System Health Monitoring ..................................................................................................19

1.5 ACPI Features ....................................................................................................................20

1.6 Power Supply .....................................................................................................................20

1.7 Super I/O ............................................................................................................................20

1.8 Advanced Power Management ..........................................................................................21

®

Intel

Intelligent Power Node Manager (IPNM).................................................................21

Management Engine (ME) ................................................................................................21

1.9 Intel® QuickAssist Technology ...........................................................................................21

Chapter 2 Installation

2.1 Static-Sensitive Devices .....................................................................................................22

2.2 Motherboard Installation .....................................................................................................23

2.3 Processor and Heatsink Installation ...................................................................................25

The 81xx/61xx/51xx/41xx/31xx Series Processor ............................................................25

Overview of the Processor Socket Assembly ...................................................................26

Overview of the Processor Heatsink Module (PHM) ........................................................27

Attaching the Processor to the Narrow Processor Clip to Create the Processor Package

Assembly ...........................................................................................................................28

Attaching the Processor Package Assembly to the Heatsink to Form the Processor

Heatsink Module (PHM) ....................................................................................................29

Preparing the CPU Socket for Installation ........................................................................30

Removing the Dust Cover from the CPU Socket .............................................................30

Installing the Processor Heatsink Module (PHM) ............................................................31

Removing the Processor Heatsink Module (PHM) from the Motherboard .......................32

2.4 Memory Support and Installation .......................................................................................33

Memory Support ........................................................................................................................33

Memory Installation Sequence ..................................................................................................33

General Memory Population Requirements ..............................................................................33

DIMM Population Guidelines for Optimal Performance .....................................................34

5

Super X11DPS-RE User's Manual

Key Parameters for DIMM Confi guration ..........................................................................34

DIMM Mixing Guidelines ...................................................................................................34

DIMM Installation ..............................................................................................................36

DIMM Removal .................................................................................................................36

2.5 Rear I/O Ports ....................................................................................................................37

2.6 Front Control Panel ............................................................................................................41

2.7 Connectors .........................................................................................................................47

2.8 Jumper Settings .................................................................................................................56

2.9 LED Indicators ....................................................................................................................63

Chapter 3 Troubleshooting

3.1 Troubleshooting Procedures ..............................................................................................66

3.2 Technical Support Procedures ...........................................................................................70

3.3 Frequently Asked Questions ..............................................................................................71

3.4 Battery Removal and Installation .......................................................................................72

3.5 Returning Merchandise for Service ....................................................................................73

Chapter 4 BIOS

4.1 Introduction .........................................................................................................................74

4.2 Main Setup .........................................................................................................................75

4.3 Advanced Setup Confi gurations .........................................................................................77

4.4 Event Logs .......................................................................................................................106

4.5 IPMI ..................................................................................................................................108

4.6 Security Settings ..............................................................................................................111

4.7 Boot Settings ....................................................................................................................114

4.8 Save & Exit .......................................................................................................................116

Appendix A BIOS Codes

A.1 BIOS Error POST (Beep) Codes .....................................................................................118

Appendix B Software Installation

B.1 Installing Software Programs ...........................................................................................120

B.2 SuperDoctor

®

5 .................................................................................................................121

Appendix C Standardized Warning Statements
Appendix D UEFI BIOS Recovery

D.1 Overview ...........................................................................................................................125

D.2 Recovering the UEFI BIOS Image ...................................................................................125

D.3 Recovering the Main BIOS Block with a USB Device .....................................................126

6

Chapter 1: Introduction

Chapter 1

Introduction

Congratulations on purchasing your computer motherboard from an industry leader.
Supermicro motherboards are designed to provide you with the highest standards in quality
and performance.

1.1 Check List

This motherboard was designed to be used in an SMCI-proprietary chassis only as a part of
an integrated, complete system solution. It is not to be sold as an independent, standalone
product; therefore, no shipping package will be included in the shipment.

Important Links

For your system to work properly, please follow the links below to download all necessary
drivers/utilities and the user’s manual for your server.

• Supermicro product manuals: http://www.supermicro.com/support/manuals/

• Product drivers and utilities: ftp://ftp.supermicro.com

• Product safety info: http://www.supermicro.com/about/policies/safety_information.cfm

• If you have any questions, please contact our support team at: [e-mail]

This manual may be periodically updated without notice. Please check the Supermicro website
for possible updates to the manual revision level.

7

Super X11DPS-RE User's Manual

Figure 1-1. X11DPS-RE Motherboard Image

Note: All graphics shown in this manual were based upon the latest PCB revision avail-

able at the time of publication of the manual. The components in the motherboard you
received may or may not look exactly the same as the graphics shown in this manual.

8

Figure 1-2. X11DPS-RE Motherboard Layout

(not drawn to scale)

Chapter 1: Introduction

JIPMB1

SP1

JPL1

JWD1

JPB1

JPG1

JPQAT

JTPM1

LEDM1

LE2

JRK1

CPU1 SLOT1 PCIe 3.0X16

JPWR1

LE1

VGA

JSDCARD1

A

C

JLAN2

CPU2 SLOT2 PCIe 3.0X16

JLAN1

JUSB1

USB12/13(3.0)

LED4

J30

J30

JIPMILAN

JCOM1

S-SATA4S-SATA5

M.2

JSD2JSD1

JPWR2

CN3

A1

B37

A37

CN1

A1

B1

A37

CN2

JPME1

CPU1

JBT1

BT1

P1-DIMMA1P1-DIMMA2 P1-DIMMB2 P1-DIMMB1 P1-DIMMC2 P1-DIMMC1

X11DPS-RE
REV:1.01

DESIGNED IN USA

CN6

CN4

CN5

P2-DIMMF1 P2-DIMME1P2-DIMMF2 P2-DIMME2 P2-DIMMD1 P2-DIMMD2

JUIDB2

LED1

JCOM2

LED3

M.2

J31

JP2

JP1

JP_BSCAN_BMC

JPME2

JP6JP5

PSU1

JL1

IPMI CODE BAR CODE

CPU2

PSU2

P2-DIMMA2 P2-DIMMB2P2-DIMMA1 P2-DIMMB1 P2-DIMMC2 P2-DIMMC1P1-DIMMF1 P1-DIMMF2 P1-DIMME1 P1-DIMMD1P1-DIMME2 P1-DIMMD2

FAN7FAN8 FAN5FAN6

FAN3FAN4

Note: Components not documented are for internal testing only.

9

JF1

FAN1FAN2

BIOS LICENSE

Super X11DPS-RE User's Manual

JPB1

JWD1

JIPMB1

JTPM1

JRK1

LE1

JPME1

JPWR1

BT1

JBT1

JPG1

JPQAT

LE2

SP1

JPL1

JSDCARD1

VGA

JLAN2

JLAN1

LEDM1

SP1

JPL1

JWD1

JPB1

JPG1

JIPMB1

JPQAT

JTPM1

JRK1

JPWR1

CN3

A1

B37

A37

CN1

A1

B1

A37

CN2

LE2

CPU1 SLOT1 PCIe 3.0X16

LEDM1

LE1

CPU1

VGA

JSDCARD1

JPME1

A

C

JLAN2

CPU2 SLOT2 PCIe 3.0X16

JBT1

BT1

P1-DIMMA1P1-DIMMA2 P1-DIMMB2 P1-DIMMB1 P1-DIMMC2 P1-DIMMC1

JLAN1

DESIGNED IN USA

JUSB1

USB12/13(3.0)

X11DPS-RE
REV:1.01

LED4

JUSB1

LED4

IPMI_LAN

JIPMILAN

J30

J30

JCOM1

S-SATA5

LED1

JCOM1

S-SATA4S-SATA5

JPWR2

CN6

CN5

LED3

M.2

J31

JSD2JSD1

CN4

M.2

P2-DIMMF1 P2-DIMME1P2-DIMMF2 P2-DIMME2 P2-DIMMD1 P2-DIMMD2

JUIDB2

JCOM2

JP2

JP1

JP_BSCAN_BMC

JPME2

JP6JP5

JUIDB2

LED1

S-SATA4

JCOM2

J31

JSD2

JP6

JP1

JPME2

JP5

PSU2

PSU2

CPU2

LED3

J30

JSD1

JPWR2

PSU1

JL1

PSU1

P2-DIMMA2 P2-DIMMB2P2-DIMMA1 P2-DIMMB1 P2-DIMMC2 P2-DIMMC1P1-DIMMF1 P1-DIMMF2 P1-DIMME1 P1-DIMMD1P1-DIMME2 P1-DIMMD2

JL1

IPMI CODE BAR CODE

JF1

FAN7FAN8 FAN5FAN6

FAN7

FAN8

FAN6

FAN5

FAN3FAN4

FAN3

FAN4

FAN2

FAN1FAN2

FAN1

BIOS LICENSE

JF1

Notes:

• See Chapter 2 for detailed information on jumpers, I/O ports, and JF1 front panel connec-

tions.

• " " indicates the location of Pin 1.

• Jumpers/LED indicators not indicated are used for testing only.

• To avoid causing interference with other components, please be sure to use an add-on

card that is fully compliant with the PCI-standard on a PCI slot.

• Use only the correct type of onboard CMOS battery as specifi ed by the manufacturer. Do

not install the onboard battery upside down to avoid possible explosion.

10

Chapter 1: Introduction

Quick Reference Table

Jumper Description Default Setting

JBT1 CMOS Clear Open (Normal)
JP1 BIOS Advance Function Pins 2-3 (Normal)
JP5 BMC Power Button Ready Test Header Pins 1-2 (Normal)
JPB1 BMC Enable/Disable Pins 1-2 (Enabled)
JPG1 VGA Enable/Disable Pins 1-2 (Enabled)
JPL1 GLAN Enable/Disable Pins 1-2 (Enabled)
JPME1 ME Recovery Pins 1-2 (Normal)
JPME2 Manufacturing Mode Pins 1-2 (Normal)
JPQAT QAT (QuickAssist Technology) Enable/Disable Pins 1-2 (Enabled)

JWD1 Watch Dog Timer Enable Pins 1-2 (Reset)

LED Description Status

LE1 CPLD Heartbeat LED Blinking Green: Normal

LE2 Onboard Power LED Solid Green: Power on

LED1 UID LED Solid Blue: Unit Identifi ed
LED3 PCI-E/SATA Hybrid M.2 SLOT 1 LED Blinking Green: M.2 Active
LED4 PCI-E/SATA Hybrid M.2 SLOT 2 LED Blinking Green: M.2 Active
LEDM1 BMC Heartbeat LED Blinking Green: Normal

Connector Description

BT1 Onboard CMOS battery
FAN1 ~ FAN8 System/CPU fan headers (FAN1: CPU Fan)
J30 PCI-E/SATA Hybrid M.2 Slot 1
J31 PCI-E/SATA Hybrid M.2 Slot 2
JCOM1/JCOM2 COM ports
JF1 Front control panel header
JIPMB1 4-pin external I²C header (for an IPMI card)
JIPMILAN IPMI-Dedicated LAN port
JL1 Chassis intrusion header
JLAN1/JLAN2 10G LAN ports 1 and 2
JPWR1/JPWR2 Backplane power connectors
JRK1 Intel RAID key header for NVMe Solid State Devices (SSD)
JSDCARD1 SD card socket
JSD1 - JSD2 SATA Disk-On-Module (DOM) power connectors
JTPM1 TPM/PORT80 Trusted Platform Module/Port 80 connector
JUIDB2 Unit Identifi er (UID) switch

11

Super X11DPS-RE User's Manual

Connector Description

JUSB1 (3.0) USB 3.0 rear ports (USB12/13)
PSU1 Power Supply Unit 1
PSU2 Power Supply Unit 2
S-SATA4~5 (Powered) SATA connectors with power-pins built-in with support of SuperDOMs

VGA VGA port

Note: To avoid causing interference with other components, please be sure to use an
add-on card that is fully compliant with the PCI-standard on a PCI slot.

12

Chapter 1: Introduction

Motherboard Features

Motherboard Features

CPU

• Dual Intel 81xx/61xx/51xx/41xx/31xx series processors (Socket P) with support of 3 Intel UltraPath Interconnects (UPIs)

of up to 10.4 G/s

Note: Both CPUs need to be installed for full access to the PCI-E slots, DIMM slots, and onboard controllers. Refer
to the block diagram on page 18 to determine which slots or devices may be affected.

Memory

• The X11DPS-RE supports up to 3TB of LRDIMM/RDIMM/NVDIMM DDR4 ECC 2666/2400/2133 MHz memory in 24

memory slots.

DIMM Size

• Up to 128GB at 1.2V

Note 1: Memory speed support depends on the processors used in the system.
Note 2: For the latest CPU/memory updates, please refer to our website at http://www.supermicro.com/products/

motherboard.

Chipset

• Intel® C627

Expansion Slots

• 2 PCI-E 3.0 x32 Tray cable connector interface

• 2 PCI-E 3.0 x16 slots with riser card support

Network

• Dual RJ45 10G LAN ports

BaseBoard Management Controller (BMC)

• ASpeed AST 2500 Baseboard Management Controller (BMC) supports IPMI 2.0

• One (1) dedicated IPMI_LAN located on the rear IO backpanel

Graphics

• Graphics controller via ASpeed AST2500

I/O Devices

Serial (COM) Port • Two (2) serial-port header

•

• Total of 4 SATA 3 ports:

• SATA 3.0

• Two (2) SATA DOM connectors (S-SATA4, S-SATA5)

• Two (2) PCI-E/SATA Hybrid M.2 connections

Note: The table above is continued on the next page.

13

Super X11DPS-RE User's Manual

Motherboard Features

Peripheral Devices

• Two (2) USB 3.0 ports on the rear I/O panel (USB 12/13)

BIOS

• 32 Mb SPI AMI BIOS

• ACPI 3.0 or later, PCI F/W 3.0, SMBIOS 2.7 or later

Power Management

• ACPI power management (S4, S5)

• Power-on mode for AC power recovery

• Power button override mechanism

System Health Monitoring

• Onboard voltage monitoring for +1.8V, +3.3V, +5V, +/-12V, +3.3V Stdby, +5V Stdby, VBAT, HT, Memory, PCH Temp,

System Temp, Memory Temp

• 5 CPU (# of switching-phase voltage regulator)

• CPU/system overheat LED and control

• CPU Thermal Trip support

• PECI / TSI

• CPU Thermal Design Power (TDP) support of up to 165W

®

SM Flash UEFI BIOS

Fan Control

• Eight 4-pin fan headers

• Fan speed control

System Management

• Trusted Platform Module (TPM) support

• Watch Dog / Non-maskable interrupt

• RoHS

• BMC SD Card Slot

• Chassis intrusion header and detection (JL1)

14

LED Indicators

• CPU/Overheating

• Power/Suspend-state indicator

• Fan Failure

• UID/Remote UID

• HDD Activity

• LAN Activity

Dimensions

• 13.5" (L) x 16.73" (W) (342.9 mm x 424.94 mm)

Note 1: The CPU maximum thermal design power (TDP) is subject to chassis and
heatsink cooling restrictions. For proper thermal management, please check the chas­sis and heatsink specifi cations for proper CPU TDP sizing.

Chapter 1: Introduction

Motherboard Features

Note 2: For IPMI confi guration instructions, please refer to the Embedded IPMI Con-

fi guration User's Guide available at http://www.supermicro.com/support/manuals/.

Note 3: It is strongly recommended that you change BMC log-in information upon initial
system power-on. The manufacture default username is ADMIN and the password is
ADMIN. For proper BMC confi guration, please refer to http://www.supermicro.com/
products/info/fi les/IPMI/Best_Practices_BMC_Security.pdf

15

Super X11DPS-RE User's Manual

Figure 1-3.

System Block Diagram

LAN1

LAN2

NCSI

VGA LAN

VGA

32MB
BMC

64MB

SPI

BIOS

FLASH

TPM
Header

Intel X550

x8

PCI-E
MUX

x16 x8

UPI

DMI

x8

8GB/s

#2

A

x8

PCI-E

X32

x8

PCI-E x16 slot

#1

#2

F

DDR4 DIMM

CABLE

CN1/2/3

x16

x16

32GB/s

32GB/s

32GB/s

PE1 PE2 UPI0

#1

#1

#2

#2

E

DDR4 DIMM

DDR4 DIMM

PE3 UPI1

D

CPU 0

HSSI

SPI
FLASH

PCI-E
MUX

#1

DDR4 DIMM

SPI

PE

MUX

PE[5]

PE[0..3]

x8x8

FX_UPLINK[0:7]

x8

x8

UPLINK[0:7]

x16

#1

#2

B

DDR4 DIMM

SPI

C

BMC

AST2500

HWM

LPC/eSPI

USBSPI

USB2.0 [7]

PCH

LPC/eSPI

PE[6-7]/sSATA[0]

PE[8-9]/sSATA[2]

sSATA Gen3 [4, 5]

USB2.0 [12,13]
USB3.0 [1,2]

#1

#2

DDR4 DIMM

DDR4

UART

DMI

DDR4

PHY
RTL8211F

COM1

COM2

10.4G/11.2G T/s

Polarity Inversion

#1

#2

M

DDR4 DIMM

S-SATA4

M.2

M.2

S-SATA5

REAR
port 0,1

#1

DDR4 DIMM

IPMI LAN
RJ45

x16

PCI-E

X32

x8

CABLE
CN4/5/6

x8

UPI

32GB/s

32GB/s

32GB/s

PE1 PE2 PE3

#1

DMI

#2

K

L

DDR4 DIMM

CPU 1

UPI0

UPI1

2IPU2IPU

G

PCI-E x16 slot

x16

#1

#2

H

DDR4 DIMM

#1

#1

#2

#2#2

J

DDR4 DIMM

DDR4 DIMM

Note: This is a general block diagram and may not exactly represent the features on
your motherboard. See the previous pages for the actual specifi cations of your moth-
erboard.

16

Chapter 1: Introduction

1.2 Processor and Chipset Overview

Built upon the functionality and capability of the Intel Xeon 81xx/61xx/51xx/41xx/31xx series
processors (Socket P) and the Intel C627 chipset, the X11DPS-RE motherboard provides
advanced storage solutions and a rich feature set based on cutting edge technology to
address the needs of next-generation computer users. With the support of three Intel®
UltraPath Interconnects (UPIs) of up to 10.4 GT/s, new Intel® AVX-512 instructions, and
Intel® QuickAssist Technology, this motherboard offers maximum NVMe storage capabilities
in a 1U form factor, and excellent system performance to meet the ongoing demands of High
Performance Computing (HPC) platforms. This motherboard is optimized for big data platforms
and Intel storage systems. The Intel Xeon 81xx/61xx/51xx/41xx/31x x series processor and
the Intel C627 chipset support the following features:

• Intel® AVX-512 support with memor y bandwidth of up to 6 channels

• High availability interconnect between multiple nodes

• Rich set of available IOs, full fl exibilit y in usage model, and software stack

• Dedic ated subsystems for customer inn ovation

• Integrated solution for real-time compression, streaming write & read performance in-

creases from gen-to -gen

• Quick Assist Technology (QAT) support

1.3 Special Features

This section describes the health monitoring features of the X11DPS-RE motherboard. The
motherboard has an onboard System Hardware Monitor chip that supports system health
monitoring.

Recovery from AC Power Loss

The Basic I/O System (BIOS) provides a setting that determines how the system will respond
when AC power is lost and then restored to the system. You can choose for the system to
remain powered off (in which case you must press the power switch to turn it back on), or
for it to automatically return to the power-on state. See the Advanced BIOS Setup section
for this setting. The default setting is Last State.

17

Super X11DPS-RE User's Manual

1.4 System Health Monitoring

This section describes the health monitoring features of the X11DPS-RE motherboard. The
motherboard has an onboard ASpeed AST2500 Baseboard Management Controller (BMC)
that supports system health monitoring. Once a voltage becomes unstable, a warning is
given or an error message is sent to the screen. The user can adjust the voltage thresholds
to defi ne the sensitivity of the voltage monitor.

Onboard Voltage Monitors

The onboard voltage monitor will continuously scan crucial voltage levels. Once a voltage
becomes unstable, it will give a warning or send an error message to the screen. The user
can adjust the voltage thresholds to defi ne the sensitivity of the voltage monitor. Real time
readings of these voltage levels are all displayed in IPMI.

Fan Status Monitor with Firmware Control

The system health monitor embedded in the BMC chip can check the RPM status of the
cooling fans. The CPU and chassis fans are controlled via lPMI.

Environmental Temperature Control

System Health sensors in the BMC monitor the temperatures and voltage settings of onboard
processors and the system in real time via the IPMI interface. Whenever the temperature of
the CPU or the system exceeds a user-defi ned threshold, system/CPU cooling fans will be
turned on to prevent the CPU or the system from overheating.

Note: To avoid possible system overheating, please be sure to provide adequate air­fl ow to your system.

System Resource Alert

This feature is available when used with SuperDoctor 5® which is used to notify the user of
certain system events. For example, you can confi gure SuperDoctor 5 to provide you with
warnings when the system temperature, CPU temperatures, voltages and fan speeds go
beyond a predefi ned range.

18

Chapter 1: Introduction

1.5 ACPI Features

ACPI stands for Advanced Confi guration and Power Interface. The ACPI specifi cation defi nes
a fl exible and abstract hardware interface that provides a standard way to integrate power
management features throughout a computer system including its hardware, operating system
and application software. This enables the system to automatically turn on and off peripherals
such as network cards, hard disk drives and printers.

In addition to enabling operating system-directed power management, ACPI also provides a
generic system event mechanism for Plug and Play and an operating system-independent
interface for confi guration control. ACPI leverages the Plug and Play BIOS data structures
while providing a processor architecture-independent implementation that is compatible with
Windows 2012/2012R2 and 2016 operating systems.

1.6 Power Supply

As with all computer products, a stable power source is necessary for proper and reliable
operation, especially for processors that have high CPU clock rates.

1.7 Super I/O

The Super I/O (ASpeed AST2500 chip) provides a high-speed, 16550 compatible serial
communication port (UART), which supports serial infrared communication. The UART
includes send/receive FIFO, a programmable baud rate generator, complete modem control
capability, and a processor interrupt system. The UART provides legacy speed with baud
rate of up to 115.2 Kbps as well as an advanced speed with baud rates of 250 K, 500 K, or
1 Mb/s, supporting higher speed modems.

The Super I/O provides functions that comply with ACPI (Advanced Confi guration and Power
Interface), which includes support of legacy and ACPI power management through a SMI
or SCI function pin. It also features auto power management to reduce power consumption.

19

Super X11DPS-RE User's Manual

1.8 Advanced Power Management

The following new advanced power management features are supported by the motherboard.

Intel® Intelligent Power Node Manager (IPNM)

Intel's Intelligent Power Node Manager (IPNM) provides your system with real-time thermal
control and power management for maximum energy effi ciency. Although IPNM Specifi cation
Version 2.0/3.0 is supported by the BMC (Baseboard Management Controller), your system
must also have IPNM-compatible Management Engine (ME) fi rmware installed to use this
feature.

Note: Support for IPNM 2.0/3.0 support is dependent on the power supply used in
the system.

Management Engine (ME)

The Management Engine, which is an ARC controller embedded in the IOH (I/O Hub), provides
Server Platform Services (SPS) to your system. The services provided by SPS are different
from those provided by the ME on client platforms.

1.9 Intel® QuickAssist Technology

Built upon the architecture of Intel 81xx/61xx/51xx/41xx/31xx processors and Intel 627 chipset,
the X1 1DPS-RE supports Intel® QuickAssist Technology (Intel QAT), which offers high-profi le
security and compression acceleration to standard server platforms in a software-defi ned
infrastructure.

By eliminating unneeded roadblocks, Intel QA T accelerates computation-intensive operations;
provides software-enabled foundation for security, authentication and compression; and
signifi cantly increases the performance and effi ciency across applications and platforms,
including cryptography, symmetric encryption and authentication, asymmetric encryption,
digital signature, pattern matching, and lossless data compression.

With Intel QuickAssist Technology built in, the X11DPS-RE is optimized for the use and
deployment of integrated accelerators in networking and security applications, and effi ciently
meets the complex demands of High-Performance Computing (HPC), Virtualization, storage,
and big data platforms.

20

Chapter 2: Installation

Chapter 2

Installation

2.1 Static-Sensitive Devices

Electrostatic Discharge (ESD) can damage electronic com ponents. To avoid damaging your
motherboard and your system, it is important to handle them very carefully. The following
measures are generally suffi cient to protect your equipment from ESD.

Precautions

• Use a grounded wrist strap designed to prevent static discharge.

• Touch a grounded metal object before removing the board from the antistatic bag.

• Handle the board by its edges only; do not touch its components, peripheral chips, memory

modules, or gold contacts.

• When handling chips or modules avoid touching their pins.

• Put the motherboard and peripherals back into their antistatic bags when not in use.

• For grounding purposes, make sure that your chassis provides excellent conductivity be-

tween the power supply, the case, the mounting fasteners, and the motherboard.

• Use only the correct type of CMOS onboard battery as specifi ed by the manufacturer. Do

not install the CMOS battery upside down as it may result in a possible explosion.

Unpacking

The motherboard is shipped in antistatic packaging to avoid static damage. When unpacking
the motherboard, make sure that the person handling it is static protected.

21

Super X11DPS-RE User's Manual

2.2 Motherboard Installation

All motherboards have standard mounting holes to fi t different types of chassis. Make sure
that the locations of all the mounting holes for both the motherboard and the chassis match.
Although a chassis may have both plastic and metal mounting fasteners, metal ones are
highly recommended because they ground the motherboard to the chassis. Make sure that
the metal standoffs click in or are screwed in tightly.

Phillips Screwdriver (1)

Tools Needed

SP1

JPL1

JWD1

JPB1

JPG1

JIPMB1

JPQAT

JTPM1

JRK1

JPWR1

CN3

A1

B37

A37

CN1

A1

B1

A37

CN2

LE2

CPU1 SLOT1 PCIe 3.0X16

LEDM1

LE1

CPU1

VGA

JSDCARD1

JPME1

A

C

CPU2 SLOT2 PCIe 3.0X16

JLAN2

JBT1

BT1

Phillips Screws (12)

JUSB1

JIPMILAN

USB12/13(3.0)

JLAN1

X11DPS-RE
REV:1.01

DESIGNED IN USA

P1-DIMMA1P1-DIMMA2 P1-DIMMB2 P1-DIMMB1 P1-DIMMC2 P1-DIMMC1

LED4

J30

J30

M.2

JPWR2

CN6

CN4

CN5

P2-DIMMF1 P2-DIMME1P2-DIMMF2 P2-DIMME2 P2-DIMMD1 P2-DIMMD2

JCOM1

S-SATA4S-SATA5

JSD2JSD1

Standoffs (12)

Only if Needed

JUIDB2

LED1

JCOM2

LED3

JP_BSCAN_BMC

JP2

M.2

J31

JPME2

JP1

JP6JP5

PSU1

JL1

IPMI CODE BAR CODE

CPU2

PSU2

P2-DIMMA2 P2-DIMMB2P2-DIMMA1 P2-DIMMB1 P2-DIMMC2 P2-DIMMC1P1-DIMMF1 P1-DIMMF2 P1-DIMME1 P1-DIMMD1P1-DIMME2 P1-DIMMD2

FAN7FAN8 FAN5FAN6

FAN3FAN4

FAN1FAN2

BIOS LICENSE

Location of Mounting Holes

Notes: 1) To avoid damaging the motherboard and its components, please do not use

a force greater than 8 lb/inch on each mounting screw during motherboard installation.

2) Some components are very close to the mounting holes. Please take precautionary
measures to avoid damaging these components when installing the motherboard to
the chassis.

22

JF1

Chapter 2: Installation

Installing the Motherboard

1. Locate the mounting holes on the motherboard. See the previous page for the location.

2. Locate the matching mounting holes on the chassis. Align the mounting holes on the
motherboard against the mounting holes on the chassis.

Chassis

Chassis

3. Install standoffs in the chassis as needed.

Motherboard

Motherboard

Chassis

Chassis

4. Install the motherboard into the chassis carefully to avoid damaging other motherboard
components.

5. Using the Phillips screwdriver, insert a Phillips head #6 screw into a mounting hole on
the motherboard and its matching mounting hole on the chassis.

6. Repeat Step 5 to insert #6 screws into all mounting holes.

7. Make sure that the motherboard is securely placed in the chassis.

Note: Images displayed in this manual are for illustration only. Your chassis or com­ponents might look different from those shown in this manual.

23

Super X11DPS-RE User's Manual

2.3 Processor and Heatsink Installation

Warning: When handling the processor package, avoid placing direct pressure on the label

area of the CPU or CPU socket. Also, improper CPU installation or socket misalignment can
cause serious damage to the CPU or motherboard which may result in RMA repairs. Please
read and follow all instructions thoroughly before installing your CPU and heatsink.

Notes:

• Always connect the power cord last and always remove it before adding, removing, or

changing any hardware components. Please note that the processor and heatsink should
be assembled together fi rst to form the Processor Heatsink Module (PHM), and then install
the entire PHM into the CPU socket.

• When you receive a motherboard without a processor pre-installed, make sure that the

plastic CPU socket cap is in place and that none of the socket pins are bent. Otherwise,
please contact your retailer immediately.

• Refer to the Supermicro website for updates on CPU support.

• Please follow the instructions given in the ESD Warning section on the fi rst page of this

chapter before handling, installing, or removing system components.

The 81xx/61xx/51xx/41xx/31xx Series Processor

Note: The Intel 81xx/61xx/51xx/41xx/31xx processors contain two models-the F model

processors and the Non-F model processors. This motherboard support Non-F proces­sors only.

81xx/61xx/51xx/41xx/31xx Processor

Note: All graphics, drawings, and pictures shown in this manual are for illustration only.

The components that came with your machine may or may not look exactly the same
as those shown in this manual.

24

Chapter 2: Installation

Overview of the Processor Socket Assembly

The processor socket assembly contains 1) the Intel 81xx/61xx/51xx/41xx/31xx Processor,

2) the narrow processor clip, 3) the dust cover, and 4) the CPU socket.

1. The 81xx/61xx/51xx/41xx/31xx Processor

81xx/61xx/51xx/41xx/31xx Processor

2. Narrow processor clip (the plastic processor package carrier used for the CPU)

3. Dust Cover

4. CPU Socket

Note: Be sure to cover the CPU socket with the dust cover when the CPU is not in-

stalled.

25

Super X11DPS-RE User's Manual

Overview of the Processor Heatsink Module (PHM)

The Processor Heatsink Module (PHM) contains 1) a heatsink, 2) a narrow processor clip,
and 3) 81xx/61xx/51xx/41xx/31xx processor.

1. Heatsink

2. Narrow processor clip

3. The 81xx/61xx/51xx/41xx/31xx Processor

Processor Heatsink Module (PHM)

Bottom View

26

Chapter 2: Installation

Attaching the Processor to the Narrow Processor Clip to Create
the Processor Package Assembly

To properly install the CPU into the narrow processor clip, please follow the steps below.

1. Locate pin 1 (notch A), which is the triangle located on the top of the narrow processor
clip. Also locate notch B and notch C on the processor clip.

2. Locate pin 1 (notch A), which is the triangle on the substrate of the CPU. Also, locate
notch B and notch C on the CPU as shown below.

3. Align pin 1 (the triangle on the substrate) of the CPU with pin 1 (the triangle) of
the narrow processor clip. Once they are aligned, carefully insert the CPU into the
processor clip by sliding notch B of the CPU into notch B of the processor clip, and
sliding notch C of the CPU into notch C of the processor clip.

4. Examine all corners of the CPU to ensure that it is properly seated on the processor
clip. Once the CPU is securely attached to the processor clip, the processor package
assembly is created.

Note: Please exercise extreme caution when handling the CPU. Do not touch the
CPU LGA-lands to avoid damaging the LGA-lands or the CPU. Be sure to wear ESD
gloves when handling components.

CPU (Upside Down)
w/CPU LGA Lands up

Align Notch B of the CPU
and Notch B of the Processor Clip

Align CPU Pin 1

C

Align Notch C of the CPU
and Notch C of the Processor Clip

B

A

Pin 1

C

Allow Notch C to

B

CPU/Heatsink Package
(Upside Down)

latch on to CPU

C

A

B

Allow Notch B to
latch on to CPU

27

A

Processor Package Carrier (w/CPU mounted

on the Processor Clip)

Super X11DPS-RE User's Manual

Attaching the Processor Package Assembly to the Heatsink to
Form the Processor Heatsink Module (PHM)

After you have made a processor package assembly by following the instructions on the
previous page, please follow the steps below to mount the processor package assembly onto
the heatsink to create the Processor Heatsink Module (PHM).

1. Locate "1" on the heatsink label and the triangular corner next to it on the heatsink.
With your index fi nger pressing against the screw at this triangular corner, carefully hold
and turn the heatsink upside down with the thermal-grease side facing up. Remove the
protective thermal fi lm if present, and apply the proper amount of the thermal grease
as needed. (Skip this step if you have a new heatsink because the necessary thermal
grease is pre-applied in the factory.)

2. Holding the processor package assembly at the center edge, turn it upside down. With
the thermal-grease side facing up, locate the hollow triangle located at the corner of
the processor carrier assembly ("a" in the graphic). Note the larger hole and plastic
mounting clicks located next to the hollow triangle. Locate another set of mounting clicks
and a larger hole at the diagonal
corner of the same (reverse) side of
the processor carrier assembly ("b"
in the graphic).

3. With the back of heatsink and
the reverse side of the processor
package assembly facing up, align
the triangular corner on the heatsink
("A" in the graphic) against the
mounting clips next to the hollow
triangle ("a") on the processor
package assembly.

4. Align the triangular corner ("B") at
the diagonal side of the heatsink
with the corresponding clips on the
processor package assembly ("b").

5. Once the mounting clips on the
processor package assembly
are properly aligned with the
corresponding holes on the back
of heatsink, securely attach the
heatsink to the processor package
assembly by snapping the mounting
clips at the proper places on the
heatsink to create the Processor /
Heatsink Module (PHM).

Triangle on the CPU

Triangle on the
Processor Clip

On Locations (A, B), the notches
snap onto the heatsink’s sides

CPU and Processor Clip

(Upside Down)

d

a

D

Heatsink

(Upside Down)

A

On Locations of (C, D), the notches

B

D

A

b

c

B

C

snap onto the heat sink’s

mounting holes

C

Make sure Mounting

Notches snap into place

28

Chapter 2: Installation

Preparing the CPU Socket for Installation

This motherboard comes with the CPU socket pre-assembled in the factory. The CPU socket
contains 1) a dust cover, 2) a socket bracket, 3) the CPU (P0) socket, and 4) a back plate.
These components are pre-installed on the motherboard before shipping.

CPU Socket w/Dust Cover On

Removing the Dust Cover from the CPU Socket

Remove the dust cover from the CPU socket, exposing the CPU socket and socket pins as
shown on the illustration below.

Note: Do not touch the socket pins to avoid damaging them, causing the CPU to
malfunction.

Dusk Cover

Remove the dust cover from

the CPU socket. Do not

touch the socket pins!

Socket Pins

CPU Socket

29

Super X11DPS-RE User's Manual

Installing the Processor Heatsink Module (PHM)

1. Once you have assembled the Processor Heatsink Module (PHM) by following the
instructions listed on page 29, you are ready to install the module into the CPU socket
on the motherboard. To install the PHM into the CPU socket, follow the instructions
below.

2. Locate the triangle (pin 1) on the CPU socket, and locate the triangle (pin 1) at the
corner of the PHM that is closest to "1." (If you have diffi culty locating pin 1 of the PHM,
turn the PHM upside down. With the LGA-lands side facing up, you will note the hollow
triangle located next to a screw at the corner. Turn the PHM right side up, and you will
see a triangle marked on the processor clip at the same corner of hollow triangle.)

3. Carefully align pin 1 (the triangle) on the the PHM against pin 1 (the triangle) on the
CPU socket.

4. Once they are properly aligned, insert the two diagonal oval holes on the heatsink into
the guiding posts.

5. Using a T30 Torx-bit screwdriver, install four screws into the mounting holes on the
socket to securely attach the PHM onto the motherboard starting with the screw marked
"1" (in the sequence of 1, 2, 3, and 4).

Note: To avoid damaging the LGA-lands and the processor, do not use excessive
force when tightening the screws.

Oval C

Use a torque

Oval D

Large Guiding Post

T30 Torx Driver

of 12 lbf

#4

#1

#2

Small Guiding Post

Printed Triangle

Mounting the Processor Heatsink Module

into the CPU socket (on the motherboard)

#3

Tighten the screws in the

sequence of 1, 2, 3, 4 (top 3 quarter view)

30