Supermicro X11DPi-NT operation manual
X11DPI-N
X11DPI-NT
USER’S MANUAL
Revision 1.10
The information in this user’s manual has been carefully reviewed and is believed to be accurate. The vendor assumes
no responsibility for any inaccuracies that may be contained in this document, and makes no commitment to update
or to keep current the information in this manual, or to notify any person or organization of the updates. Please Note:
For the most up-to-date version of this manual, please see our website at
www.supermicro.com.
Super Micro Computer, Inc. ("Supermicro") reserves the right to make changes to the product described in this manual
at any time and without notice. This product, including software and documentation, is the property of Supermicro and/
or its licensors, and is supplied only under a license. Any use or reproduction of this product is not allowed, except
as expressly permitted by the terms of said license.
IN NO EVENT WILL SUPERMICRO COMPUTER, INC. BE LIABLE FOR DIRECT, INDIRECT , SPECIAL, INCIDENT AL,
SPECULA TIVE OR CONSEQUENTIAL DAMAGES ARISING FROM THE USE OR INABILITY TO USE THIS PRODUCT
OR DOCUMENT ATION, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. IN PARTICULAR, SUPER
MICRO COMPUTER, INC. SHALL NOT HAVE LIABILITY FOR ANY HARDWARE, SOFTWARE, OR DATA STORED
OR USED WITH THE PRODUCT, INCLUDING THE COSTS OF REPAIRING, REPLACING, INTEGRATING,
INSTALLING OR RECOVERING SUCH HARDWARE, SOFTWARE, OR DATA.
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State of California, USA. The State of California, County of Santa Clara shall be the exclusive venue for the resolution
of any such disputes. Supermicro's total liability for all claims will not exceed the price paid for the hardware product.
FCC Statement: This equipment has been tested and found to comply with the limits for a Class A digital device
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful
interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can
radiate radio frequency energy and, if not installed and used in accordance with the manufacturer’s instruction manual,
may cause harmful interference with radio communications. Operation of this equipment in a residential area is likely
to cause harmful interference, in which case you will be required to correct the interference at your own expense.
California Best Management Practices Regulations for Perchlorate Materials: This Perchlorate warning applies only
to products containing CR (Manganese Dioxide) Lithium coin cells. “Perchlorate Material-special handling may apply.
See
www.dtsc.ca.gov/hazardouswaste/perchlorate”.
WARNING: This product can expose you to chemicals including
lead, known to the State of California to cause cancer and birth
!
defects or other reproductive harm. For more information, go
to www.P65Warnings.ca.gov
.
The products sold by Supermicro are not intended for and will not be used in life support systems, medical equipment,
nuclear facilities or systems, aircraft, aircraft devices, aircraft/emergency communication devices or other critical
systems whose failure to perform be reasonably expected to result in signifi cant injury or loss of life or catastrophic
property damage. Accordingly, Supermicro disclaims any and all liability, and should buyer use or sell such products
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proceedings of any kind arising out of or related to such ultra-hazardous use or sale.
Manual Revision 1.10
Release Date: August 13, 2018
Unless you request and receive written permission from Super Micro Computer, Inc., you may not copy any part of this
document. Information in this document is subject to change without notice. Other products and companies referred
to herein are trademarks or registered trademarks of their respective companies or mark holders.
Copyright © 2018 by Super Micro Computer, Inc.
All rights reserved.
Printed in the United States of America
Preface
Preface
About This Manual
This manual is written for system integrators, IT technicians, and knowledgeable end users.
It provides information for the installation and use of the X11DPi-N(T) motherboard.
About This Motherboard
The Super X11DPi-N(T) motherboard supports dual Intel® Xeon
81xx/61xx/51xx/41xx/31xx series processors (Socket P0) with a TDP (Thermal Design
Power) of up to 205W and a UPI (Ultra Path Interconnect) of up to 10.4 GT/s (Note below).
With the Intel C621/C622 PCH built-in (Note 2), this motherboard supports four PCI-E 3.0
x16 slots, two PCI-E 3.0 x8 slots, 14 SATA 3.0 connections, and 3DS LRDIMM/LRDIMM/3DS
RDIMM/RDIMM/NV-DIMM DDR4 ECC 2666/2400/2133 MHz memory in 16 memory slots.
The X11DPi-N(T) provides maximum performance, system cooling, and PCI-E capacity
currently available on the market. This motherboard is optimized for PCI-Express expansion
with fl exible IO support, and is ideal for high-performance, general-purpose server platforms.
Please note that this motherboard is intended to be installed and serviced by professional
technicians only. For processor/memory updates, please refer to our website at http://www.
supermicro.com/products/.
Notes: 1. UPI/memory speeds are dependent on the processors installed in your
system. 2. The X11DPi-N supports Intel C621 PCH, and the X11DPi-NT, Intel C622.
Manual organization
Chapter 1 describes the features, specifi cations and performance of the motherboard, and
provides detailed information on the C621/C622 chipset.
Chapter 2 provides hardware installation instructions. Read this chapter when installing the
processor, memory modules, and other hardware components into the system.
If you encounter any problems, see Chapter 3, which describes troubleshooting procedures
for video, memory, and system setup stored in the CMOS.
Chapter 4 includes an introduction to the BIOS, and provides detailed information on running
the CMOS Setup utility.
Appendix A provides BIOS Error Beep Codes.
Appendix B lists software program installation instructions.
Appendix C lists standardized warning statements in various languages.
Appendix D provides UEFI BIOS Recovery instructions.
3
Super X11DPi-N(T) User's Manual
Contacting Supermicro
Headquarters
Address: Super Micro Computer, Inc.
980 Rock Ave.
San Jose, CA 95131 U.S.A.
Tel: +1 (408) 503-8000
Fax: +1 (408) 503-8008
Email: marketing@supermicro.com (General Information)
support@supermicro.com (Technical Support)
Website:
Europe
Address: Super Micro Computer B.V.
Tel: +31 (0) 73-6400390
Fax: +31 (0) 73-6416525
Email: sales@supermicro.nl (General Information)
Website:
Asia-Pacifi c
Address: Super Micro Computer, Inc.
www.supermicro.com
Het Sterrenbeeld 28, 5215 ML
's-Hertogenbosch, The Netherlands
support@supermicro.nl (Technical Support)
rma@supermicro.nl (Customer Support)
www.supermicro.nl
3F, No. 150, Jian 1st Rd.
Zhonghe Dist., New Taipei City 235
Taiwan (R.O.C)
Tel: +886-(2) 8226-3990
Fax: +886-(2) 8226-3992
Email: support@supermicro.com.tw
Website:
www.supermicro.com.tw
4
Table of Contents
Table of Contents
Chapter 1 Introduction
1.1 Checklist ...............................................................................................................................7
1.2 Processor and Chipset Overview .......................................................................................17
1.3 Special Features ................................................................................................................18
1.4 System Health Monitoring ..................................................................................................18
1.5 ACPI Features ....................................................................................................................19
1.6 Power Supply .....................................................................................................................19
1.7 Super I/O ............................................................................................................................19
1.8 Advanced Power Management ..........................................................................................20
®
Intel
Intelligent Power Node Manager (IPNM).................................................................20
Management Engine (ME) ................................................................................................20
Chapter 2 Installation
2.1 Static-Sensitive Devices .....................................................................................................21
2.2 Motherboard Installation .....................................................................................................22
2.3 Processor and Heatsink Installation ...................................................................................24
The Intel 81xx/61xx/51xx/41xx/31xx Series Processors ...................................................24
Overview of the Processor Socket Assembly ...................................................................25
Overview of the Processor Heatsink Module (PHM) ........................................................26
Attaching the Processor to the Narrow Processor Clip to Create the Processor Package
Assembly ...........................................................................................................................27
Attaching the Processor Package Assembly to the Heatsink to Form the Processor
Heatsink Module (PHM) ....................................................................................................28
Preparing the CPU Socket for Installation ........................................................................29
Removing the Dust Cover from the CPU Socket .............................................................29
Installing the Processor Heatsink Module (PHM) ............................................................30
Removing the Processor Heatsink Module (PHM) from the Motherboard .......................31
2.4 Memory Support and Installation .......................................................................................32
Memory Support ................................................................................................................32
Memory Installation Sequence ..........................................................................................32
General Memory Population Requirements ......................................................................32
DIMM Population Requirements for the 81xx/61xx/51xx/41xx/31xx Processors .............33
DIMM Population Table .....................................................................................................34
5
Super X11DPi-N(T) User's Manual
DIMM Installation ..............................................................................................................35
DIMM Removal .................................................................................................................35
2.5 Rear I/O Ports ....................................................................................................................36
2.6 Front Control Panel ............................................................................................................40
2.7 Connectors .........................................................................................................................45
2.7 Jumper Settings .................................................................................................................55
2.8 LED Indicators ....................................................................................................................59
Chapter 3 Troubleshooting
3.1 Troubleshooting Procedures ..............................................................................................62
3.2 Technical Support Procedures ...........................................................................................66
3.3 Frequently Asked Questions ..............................................................................................67
3.4 Battery Removal and Installation .......................................................................................68
3.5 Returning Merchandise for Service ....................................................................................69
Chapter 4 BIOS
4.1 Introduction .........................................................................................................................70
4.2 Main Setup .........................................................................................................................71
4.3 Advanced Setup Confi gurations .........................................................................................73
4.4 Event Logs .........................................................................................................................99
4.5 IPMI ..................................................................................................................................101
4.6 Security Settings ..............................................................................................................104
4.7 Boot Settings ....................................................................................................................107
4.8 Save & Exit .......................................................................................................................110
Appendix A BIOS Codes
Appendix B Software Installation
B.1 Installing Software Programs ...........................................................................................114
B.2 SuperDoctor
®
5 ................................................................................................................. 115
Appendix C Standardized Warning Statements
Appendix D UEFI BIOS Recovery
6
Chapter 1: Introduction
Chapter 1
Introduction
Congratulations on purchasing your computer motherboard from an industry leader.
Supermicro motherboards are designed to provide you with the highest standards in quality
and performance.
In addition to the motherboard, several important parts that are included with your shipment
are listed below. If anything listed is damaged or missing, please contact your retailer.
1.1 Checklist
Main Parts List
Description Part Number Quantity
Supermicro motherboard-X11DPi-N or X11DPi-NT MNL-1773 1
SATA cables CBL-0044L (x2) 2
Mini SAS to 4 SATA cable CBL-0476L (x1) 1
I/O Backplane MCP-260-00042-ON 1
Important Links
For your system to work properly, please follow the links below to download all necessary
drivers/utilities and the user’s manual for your server.
• Supermicro product manuals: http://www.supermicro.com/support/manuals/
• Product drivers and utilities: http://www.supermicro.com/wftp
• Product safety info: http://www.supermicro.com/about/policies/safety_information.cfm
• If you have any questions, please contact our support team at: support@supermicro.com
his manual may be periodically updated without notice. Please check the Supermicro website
T
for possible updates to the manual revision level.
7
Super X11DPi-N(T) User's Manual
Figure 1-1. X11DPi-N(T) Motherboard Image
Note: All graphics shown in this manual were based upon the latest PCB revision
available at the time of publication of the manual. The motherboard you received may
or may not look exactly the same as the graphics shown in this manual.
8
Chapter 1: Introduction
COM2
JIPMB1
JPME2
(3.0)
USB 6
JTPM1
T-SGPIO3
S-SATA 0~3
JPG1
JPL1
LEDM1
CPU1 SLOT2 PCI-E 3.0 X16
CPU1 SLOT1 PCI-E 3.0 X8
JPCIE1
MAC CODE
BAR CODE
USB 2/3
(2.0)
JP4
USB 7/8
JM2_1
(3.0)
JD1
JWD1
JRK1
M.2-PCH
JP2
BIOS
BMC
JPCIE2
CPU1 SLOT3 PCI-E 3.0 X8
LICENSE
BT1
JBT1
LE3
A
Figure 1-2. X11DPi-N(T) Motherboard Layout
(not drawn to scale)
UID
LAN CTRL
JPCIE3
JPCIE4
CPU2 SLOT4 PCI-E 3.0 X16
CPU2 SLOT5 PCI-E 3.0 X16
BIOS
P1-DIMME1
P1-DIMMF1
P1-DIMMD1
P1-DIMMD2
LE1
FAN6
CPU2 SLOT6 PCI-E 3.0 X16
JPCIE5
JPCIE6
JNVI2C2
X11DPi-N(T)
Rev. 1.21
P2-DIMMC1
VGA
P2-DIMMA1
P2-DIMMB1
FAN5
P2-DIMMA2
CPU1
LAN2 LAN1
CPU2
USB0/1
(2.0)
P1-DIMMA2
P1-DIMMB1
P1-DIMMC1
P1-DIMMA1
IPMI_LAN
USB4/5 (3.0)
COM1
P2-DIMMD2
P2-DIMMD1
P2-DIMME1
JPWR2JPWR1
P2-DIMMF1
JPI2C1
I-SATA 0~3
PCH
A
LE2
C
JF1
JPWR3
FAN1FAN2
I-SATA 4~7
FANB
JL1
FANA
JSTBY1
S-SATA4
JNVI2C1
S-SATA5
JNVME2
FAN4
JNVME1
FAN3
Notes:
1. Components not documented are for internal testing only.
2. Intel C622/x722 supports two 10G (10 GbE) LAN ports on the X11DPi-NT, and Intel
C622/x722 supports two 10G (10 GbE) LAN ports on the X11DPi-NT.
9
Super X11DPi-N(T) User's Manual
Quick Reference
JPG1
JPL1
COM2
JIPMB1
JPME2
USB2/3
USB6
JM2_1
USB7/8
LE3
JTPM1
JBT1
JD1
T-SGPIO3
JWD1
JRK1
S-SATA0-3
I-SATA0-3
I-SATA4-7
JNVI2C1
JL1
FANB
FANA
SLOT1
JPG1
JPL1
COM2
JIPMB1
JPME2
(3.0)
USB 6
JTPM1
JD1
T-SGPIO3
JRK1
S-SATA 0~3
I-SATA 0~3
I-SATA 4~7
FANB
FANA
JSTBY1
S-SATA4
SLOT2
LEDM1
SLOT3
BMC
LEDM1
CPU1 SLOT2 PCI-E 3.0 X16
JP4
JP2
JSTBY1
S-SATA4
JPCIE1
MAC CODE
BAR CODE
JM2_1
M.2-PCH
LE3
A
JNVI2C1
JPCIE2
PCH
S-SATA5
JNVME2
CPU1 SLOT1 PCI-E 3.0 X8
USB 2/3
(2.0)
USB 7/8
(3.0)
BIOS
JWD1
JL1
S-SATA5
SLOT4
BT1
SLOT5
JPCIE3
JPCIE4
CPU2 SLOT4 PCI-E 3.0 X16
BIOS
FAN4
P1-DIMMF1
FAN3
CPU2 SLOT5 PCI-E 3.0 X16
P1-DIMME1
P1-DIMMD1
CPU1 SLOT3 PCI-E 3.0 X8
LICENSE
BT1
JBT1
JNVME1
FAN3
FAN4
JNVME1JNVME2
P1-DIMMF1
FAN6
SLOT6
LAN CTRL
CPU2 SLOT6 PCI-E 3.0 X16
JPCIE5
JPCIE6
X11DPi-N(T)
Rev. 1.21
P1-DIMMD2
P1-DIMMD1
P1-DIMME1
UID
LE1
UID
LE1
FAN6
JNVI2C2
P2-DIMMC1
P2-DIMMB1
P1-DIMMD2
VGA
FAN5
VGA
P2-DIMMA1
P2-DIMMA2
CPU1
FAN5
CPU1
LAN2
LAN2 LAN1
LAN1
USB0/1
CPU2
P1-DIMMA2
USB0/1
(2.0)
USB4/5 (3.0)
P1-DIMMB1
P1-DIMMC1
P1-DIMMA1
IPMI LAN
USB4/5
IPMI_LAN
FAN2
COM1
COM1
P2-DIMMD2
P2-DIMMD1
JF1
LE2
A
C
FAN1FAN2
FAN1
P2-DIMME1
P2-DIMMF1
JPI2C1
JPWR2JPWR1
JPWR3
P2-DIMMD2
P2-DIMMD1
P2-DIMME1
P2-DIMMF1
CPU2
P2-DIMMC1
P2-DIMMB1
P2-DIMMA1
P2-DIMMA2
JPI2C1
JPWR1
JPWR2
P1-DIMMA2
P1-DIMMA1
P1-DIMMB1
P1-DIMMC1
JPWR3
JF1
LE2
= mounting hole
Notes:
• See Chapter 2 for detailed information on jumpers, I/O ports, and JF1 front panel con-
nections.
• " " indicates the location of Pin 1.
• Jumpers/components/LED indicators not indicated are used for internal testing only.
• Use only the correct type of onboard CMOS battery as specifi ed by the manufacturer. Do
not install the onboard battery upside down to avoid possible explosion.
10
Chapter 1: Introduction
Quick Reference Table
Jumper Description Default Setting
JBT1 CMOS Clear Open (Normal)
JPG1 VGA Enable Pins 1-2 (Enabled)
JPME2 Manufacturing Mode Select Pins 1-2 (Normal)
JWD1 Watch Dog Timer Enable Pins 1-2 (Reset to System)
Connector Description
BT1 Onboard CMOS battery socket
COM1/COM2 Back panel COM port/COM header for front access
FAN1-6, FANA/FANB System cooling fan headers (FAN1-FAN6, FAN A, FAN B)
IPMI_LAN Dedicated IPMI_LAN port
I-SATA0~3, I-SATA4~7 SATA 3.0 connection header supported by the Intel PCH
JD1 Internal speaker/Buzzer header
JF1 Front Panel Control header
JIPMB1 4-pin BMC External I2C header (for an IPMI-supported card)
JL1 Chassis Intrusion header
JM2_1 PCI-E M.2 slot
NVMe SMBus (I2C) headers used for PCI-E hot-plug SMBus clock & data connections (an SMCI-
JNVI2C1/JNVI2C2
JNVME1 NVMe Connector1
JNVME2 NVMe Connector2
JPI2C1 Power Supply SMBus I2C header
JPWR1/JPWR2 8-pin Power Supply connectors
JPWR3 24-pin ATX main power supply connector
JRK1 Intel RAID Key header for NVMe SDD
JSTBY1 Standby power header
JTPM1 Trusted Platform Module (TPM)/Port 80 connector
LAN1/LAN2 Gigabit LAN/10G LAN Ethernet ports on the IO back panel (10G LAN ports on X11DPi-NT only)
S-SATA0-3 S-SATA 3.0 connection Header supported by the Intel SCU
S-SATA4/S-SATA5
SLOT1/SLOT3 PCI-Express 3.0 X8 Slots supported by CPU1
SLOT2 PCI-Express 3.0 X16 Slot supported by CPU1
SLOT4/SLOT5/SLOT6 PCI-Express 3.0 X16 Slots supported by CPU2
T-SGPIO3 General Purpose Serial I/O Port
UID Unit Identifi er (UID) Switch
USB0/1 Back panel USB 2.0 Ports
USB2/3 Front Accessible USB 2.0 Header
USB4/5 Back panel USB 3.0 Ports
USB6 Type A USB 3.0 Header
proprietary NVMe add-on card and cable are required; available for a Supermicro complete system
only)
S-SATA Ports with built-in power pins and with support of Supermicro SuperDOM (Disk On Module)
devices
11
Super X11DPi-N(T) User's Manual
Connector Description
USB7/8 Front Accessible USB 3.0 Header
VGA VGA Port
LED Description Status
LE1 UID (Unit Identifi er) LED Solid Blue: Unit identifi ed
LE2 Onboard Power LED On: Onboard power on
LE3 M.2 Active LED On: M.2 active
LEDM1 BMC Heartbeat LED Blinking Green: BMC normal
12
Chapter 1: Introduction
Motherboard Features
Motherboard Features
CPU
• This motherboard supports dual 81xx/61xx/51xx/41xx/31xx series (Socket P0) processors which offer Intel® UltraPath
Interconnect (UPI) of up to 10.4 GT/s
Note: Both CPUs need to be installed for full access to the PCI-E slots, DIMM slots, and onboard controllers. Refer
to the block diagram on page 18 to determine which slots or devices may be affected.
Memory
• Integrated memory controller embedded in the processor supports up to 2TB of 3DS Load Reduced DIMM (3DS LRDIMM),
Load Reduced DIMM (LRDIMM), 3DS Registered DIMM (3DS RDIMM), Registered DIMM (RDIMM), Non-Volatile DIMM
(NV-DIMM) DDR4 (288-pin) ECC 2666/2400/2133 MHz modules in 16 slots.
DIMM Size
• Up to 256GB at 1.2V
Note 1: Memory speed support depends on the processors used in the system.
Note 2: For the latest CPU/memory updates, please refer to our website at http://www.supermicro.com/products/
motherboard.
Chipset
• Intel C621/C622 PCH (C621: for X11DPi-N, C622: for X11DPi-NT)
Expansion Slots
• Two (2) PCI-E 3.0 x8 slots supported by CPU1 (CPU1 Slot1/CPU1 Slot3)
• One (1) PCI-E 3.0 x16 slot supported by CPU1 (CPU1 Slot2)
• Three (3) PCI-E 3.0 x16 slots supported by CPU2 (CPU2 Slot4/CPU2 Slot5/CPU2 Slot6)
BaseBoard Management Controller (BMC)
• ASpeed AST 2500 Baseboard Controller (BMC) supports IPMI 2.0
• One (1) Dedicated IPMI LAN located on the rear IO back panel
Graphics
• Graphics controller via AST 2500 BMC (BaseBoard Management Controller)
Network Connection
• Intel C621/x722 supports two Gigabit LAN (1 GbE) ports on the X11DPi-N
• Intel C622/x722 supports two 10G (10 GbE) LAN ports on the X11DPi-NT
• One IPMI-dedicated LAN supported by the AST2500 BMC
I/O Devices
•
Serial (COM) Port • One (1) Fast UART 16550 port on the I/O back panel
• Eight (8) SATA 3.0 ports supported by Intel PCH (I-SATA 0-3, I-SATA 4-7)
• SATA 3.0
• Four (4) S-SATA 3.0 ports supported by Intel SCU
• Two (2) SATA 3.0 ports with power-pins built-in, w/support of Supermicro
SuperDOM (S-SATA4/S-SATA5)
• RAID (PCH) • RAID 0, 1, 5, and 10
13
Super X11DPi-N(T) User's Manual
Motherboard Features
Peripheral Devices
• Two (2) USB 3.0 ports on the rear I/O panel (USB 4/5)
BIOS
• 32 MB SPI AMI BIOS
• ACPI 3.0/4.0, USB keyboard, Plug-and-Play (PnP), SPI dual/quad speed support, riser-card auto detection support, and
SMBIOS 2.7 or later
Power Management
• Main switch override mechanism
• Power-on mode for AC power recovery
• Intel® Intelligent Power Node Manager 4.0 (available when the Supermicro Power Manager [SPM] is installed and a
special power supply is used)
• Management Engine (ME)
System Health Monitoring
• Onboard voltage monitoring for +3.3V, 3.3V standby, +5V, +5V standby, +12V, CPU core, memory, chipset, BMC, PCH,
and battery voltages
• CPU System LED and control
• CPU Thermal Trip support
• Status monitor for speed control
• Status monitor for on/off control
• CPU Thermal Design Power (TDP) support of up to 205W (See Note 1 on next page.)
®
SM Flash UEFI BIOS
Fan Control
• Fan status monitoring via IPMI connections
• Dual cooling zone
• Low-noise fan speed control
• Pulse Width Modulation (PWM) fan control
System Management
• Trusted Platform Module (TPM) support
• PECI (Platform Environment Control Interface) 2.0 support
• UID (Unit Identifi cation)/Remote UID
• System resource alert via SuperDoctor® 5
• SuperDoctor® 5, Watch Dog, NMI
• Chassis intrusion header and detection
LED Indicators
• CPU/Overheating
• Fan Failure
• UID/remote UID.
• LAN activity.
Dimensions
• 12" (L) x 13" (W) (304.8 mm x 330.2 mm)
14
Chapter 1: Introduction
Note 1: The CPU maximum thermal design power (TDP) is subject to chassis and
heatsink cooling restrictions. For proper thermal management, please check the chassis and heatsink specifi cations for proper CPU TDP sizing.
Note 2: For IPMI confi guration instructions, please refer to the Embedded IPMI Con-
fi guration User's Guide available at http://www.supermicro.com/support/manuals/.
Note 3: It is strongly recommended that you change BMC log-in information upon initial system power-on. The manufacture default username is ADMIN and the password
is ADMIN. For proper BMC confi guration, please refer to http://www.supermicro.com.
15
Super X11DPi-N(T) User's Manual
Figure 1-3.
System Block Diagram
RJ45
DDR4
BMC
Boot Flash
SLOT 2
PCI-E X16
SLOT 1
PCI-E X8
SLOT 3
LAN3
RTL8211E-VB-CG
SPI
P1-DIMMF1
P1-DIMME1
P1-DIMMD2
P1-DIMMD1
P1-DIMMC1
P1-DIMMB1
up to 2666
P1-DIMMA2
P1-DIMMA1
DDR4
PCI-E X16 G3 (LANE REVERSE)
PCI-E X8 G3
PCI-E X8 G3
2 x NVME
PCI-E X8
LAN 10G/1G
(*X11DPi-N supports GLAN ports)
(*X11DPi-NT supports 10G LAN
ports)
M.2 Slot
RGRMII
RMII/NCSI
PCI-E X1 G2
BMC
AST2500
DDR4 DDR4
#2
PCI-E X8 G3
PCI-E
USB 2.0
ESPI
#3A
KR/KX
#3
#2
#5
#12 USB2.0
PCI-E X8 G3
PCH
P0
P1
3IMID
DMI3
UPI
UPI
P1
P0
#1 #2 #3#1B#1A #3B
VCCP1VCCP0
PCI-E X16 G3
#0
6.0 Gb/S
USB 2.0
USB 3.0
1:DI TEKCOS0:DI TEKCOS
PCI-E X16 G3
PCI-E X16 G3
#9
#8
#7
#6
#5
#4
#3
#2
#1
SATA
USB
USB
PCI-E X16
SLOT 5
#13
#12
#11
#10
SATA
up to 2666
DDR4
PCI-E X16
PCI-E X16
SLOT 6
P2-DIMMD1
P2-DIMMC1
P2-DIMMB1
P2-DIMMA2
P2-DIMMA1
SLOT 4
P2-DIMMF1
P2-DIMME1
P2-DIMMD2
SPI
VGA CONN
COM1
Connector
COM2
Header
TPM HEADER
Debug Card
BIOS
Temp Sensor
W83773 at SMBUS
Note: This is a general block diagram and may not exactly represent the features on
your motherboard. See the previous pages for the actual specifi cations of your moth-
erboard.
16
Chapter 1: Introduction
1.2 Processor and Chipset Overview
Built upon the functionality and capability of the Intel Xeon 81xx/61xx/51xx/41xx/31xx series
processors (Socket P0) and the C621/C622 chipset (Note below), this motherboard provides
superb system performance, effi cient power management, and a rich feature set based on
cutting edge technology to address the needs of next-generation computer users. With support
of Intel® UltraPath Interconnect (UPI) of up to 10.4 GT/s, and Intel® AVX-512 new instructions,
this motherboard offers an innovative solution with maximum system performance to meet
the ongoing demands of High Performance Computing (HPC) platforms. This motherboard
is optimized for general purpose server use.
The Intel Xeon 81xx/61xx/51xx/41xx/31xx series processor and the C621/C622 chipset
support the following features:
• Intel® AVX-512 support with memory bandwidth increase to 6 channels (x1.5 from the
previous generation)
• High availability interconnect between multiple nodes
• Rich set of available IOs, full fl exibility in usage model, and software stack
• Dedicated subsystems fo r customer innovation
• Increased platform security with Intel® Boot Guard for hardware -based boot integrit y pro-
tection; prevention of buffer overfl ow class secur ity threads
• Integrated solution for real-time compression, streaming write & read performance in-
creases from gen-to -gen
• Hot plug and enclosure management with Intel Volume Management Device (Intel VMD)
• Single standard server development (Accelerate NFV transition) consolidating application,
control, and data plane workloads, reducing total platform investment needs
Note: The X11DPi-N supports Intel C621 PCH, and the X11DPi-NT, Intel C622.
17
Super X11DPi-N(T) User's Manual
1.3 Special Features
This section describes the health monitoring features of the X11DPi-N(T) motherboard. The
motherboard has an onboard ASpeed 2500 Baseboard Management Controller (BMC) that
supports system health monitoring.
Recovery from AC Power Loss
The Basic I/O System (BIOS) provides a setting that determines how the system will respond
when AC power is lost and then restored to the system. You can choose for the system to
remain powered off (in which case you must press the power switch to turn it back on), or
for it to automatically return to the power-on state. See the Advanced BIOS Setup section
for this setting. The default setting is Last State.
1.4 System Health Monitoring
This section describes the health monitoring features of the X11DPi-N(T) motherboard. The
motherboard has an onboard Baseboard Management Controller (BMC) chip that supports
system health monitoring. Once a voltage becomes unstable, a warning is given or an error
message is sent to the screen. The user can adjust the voltage thresholds to defi ne the
sensitivity of the voltage monitor.
Onboard Voltage Monitors
The onboard voltage monitor will continuously scan crucial voltage levels. Once a voltage
becomes unstable, it will give a warning or send an error message to the screen. The user
can adjust the voltage thresholds to defi ne the sensitivity of the voltage monitor. Real time
readings of these voltage levels are all displayed in IPMI.
Fan Status Monitor with Firmware Control
The system health monitor embedded in the BMC chip can check the RPM status of the
cooling fans. The CPU and chassis fans are controlled via lPMI.
Environmental Temperature Control
System Health sensors in the BMC monitor the temperatures and voltage settings of onboard
processors and the system in real time via the IPMI interface. Whenever the temperature of
the CPU or the system exceeds a user-defi ned threshold, system/CPU cooling fans will be
turned on to prevent the CPU or the system from overheating.
Note: To avoid possible system overheating, please be sure to provide adequate airfl ow to your system.
18
Chapter 1: Introduction
System Resource Alert
This feature is available when used with SuperDoctor 5®. SuperDoctor 5 is used to notify the
user of certain system events. For example, you can confi gure SuperDoctor 5 to provide you
with warnings when the system temperature, CPU temperatures, voltages and fan speeds
go beyond a predefi ned range.
1.5 ACPI Features
ACPI stands for Advanced Confi guration and Power Interface. The ACPI specifi cation defi nes
a fl exible and abstract hardware interface that provides a standard way to integrate power
management features throughout a computer system including its hardware, operating system
and application software. This enables the system to automatically turn on and off peripherals
such as network cards, hard disk drives and printers.
In addition to enabling operating system-directed power management, ACPI also provides a
generic system event mechanism for Plug and Play and an operating system-independent
interface for confi guration control. ACPI leverages the Plug and Play BIOS data structures
while providing a processor architecture-independent implementation that is compatible with
Windows 2012/2012R2, and Windows 2016 operating systems.
1.6 Power Supply
As with all computer products, a stable power source is necessary for proper and reliable
operation. It is even more important for processors that have high CPU clock rates, especially
in the areas where noisy power transmission is present.
1.7 Super I/O
The Super I/O (ASpeed AST2500 chip) provides a high-speed, 16550 compatible serial
communication port (UART), which supports serial infrared communication. The UART
includes send/receive FIFO, a programmable baud rate generator, complete modem control
capability, and a processor interrupt system. The UART provides legacy speed with baud
rate of up to 115.2 Kbps as well as an advanced speed with baud rates of 250 K, 500 K, or
1 Mb/s, supporting higher speed modems.
The Super I/O provides functions that comply with ACPI (Advanced Confi guration and Power
Interface), which includes support of legacy and ACPI power management through a SMI
or SCI function pin. It also features auto power management to reduce power consumption.
19
Super X11DPi-N(T) User's Manual
1.8 Advanced Power Management
The following new advanced power management features are supported by the motherboard.
Intel® Intelligent Power Node Manager (IPNM)
Intel's Intelligent Power Node Manager (IPNM) provides your system with real-time thermal
control and power management for maximum energy effi ciency. Although IPNM Specifi cation
Version 2.0/3.0 is supported by the BMC (Baseboard Management Controller), your system
must also have IPNM-compatible Management Engine (ME) fi rmware installed to use this
feature.
Note: Support for IPNM 2.0/3.0 support is dependent on the power supply used in
the system.
Management Engine (ME)
The Management Engine, which is an ARC controller embedded in the IOH (I/O Hub), provides
Server Platform Services (SPS) to your system. The services provided by SPS are different
from those provided by the ME on client platforms.
20
Chapter 2: Installation
Chapter 2
Installation
2.1 Static-Sensitive Devices
Electrostatic Discharge (ESD) can damage electronic com ponents. To avoid damaging
your motherboard and your system, it is important to handle it very carefully. The following
measures are generally suffi cient to protect your equipment from ESD.
Precautions
• Use a grounded wrist strap designed to prevent static discharge.
• Touch a grounded metal object before removing the board from the antistatic bag.
• Handle the board by its edges only; do not touch its components, peripheral chips, memory
modules or gold contacts.
• When handling chips or modules, avoid touching their pins.
• Put the motherboard and peripherals back into their antistatic bags when not in use.
• For grounding purposes, make sure that your chassis provides excellent conductivity be-
tween the power supply, the case, the mounting fasteners and the motherboard.
• Use only the correct type of CMOS onboard battery as specifi ed by the manufacturer. Do
not install the CMOS battery upside down, which may result in a possible explosion.
Unpacking
The motherboard is shipped in antistatic packaging to avoid static damage. When unpacking
the motherboard, make sure that the person handling it is static protected.
21
Super X11DPi-N(T) User's Manual
2.2 Motherboard Installation
All motherboards have standard mounting holes to fi t different types of chassis. Make sure
that the locations of all the mounting holes for both the motherboard and the chassis match.
Although a chassis may have both plastic and metal mounting fasteners, metal ones are
highly recommended because they ground the motherboard to the chassis. Make sure that
the metal standoffs click in or are screwed in tightly.
Philips
Screwdriver
(1)
Tools Needed
JPG1
JPL1
LEDM1
CPU1 SLOT1 PCI-E 3.0 X8
JPCIE1
COM2
JIPMB1
JPME2
USB 2/3
(2.0)
(3.0)
USB 6
JP4
USB 7/8
(3.0)
JTPM1
JP2
JD1
BIOS
T-SGPIO3
JWD1
JRK1
S-SATA 0~3
I-SATA 0~3
I-SATA 4~7
JL1
FANB
FANA
JSTBY1
S-SATA4
BMC
JPCIE2
CPU1 SLOT3 PCI-E 3.0 X8
LICENSE
BT1
JBT1
LE3
A
PCH
JNVI2C1
S-SATA5
JNVME2
JNVME1
JPCIE3
BIOS
CPU1 SLOT2 PCI-E 3.0 X16
MAC CODE
BAR CODE
JM2_1
M.2-PCH
Philips Screws
(10)
LAN CTRL
CPU2 SLOT6 PCI-E 3.0 X16
JPCIE5
JPCIE4
CPU2 SLOT4 PCI-E 3.0 X16
CPU2 SLOT5 PCI-E 3.0 X16
X11DPi-N(T)
Rev. 1.21
P1-DIMME1
P1-DIMMF1
P1-DIMMD1
P1-DIMMD2
FAN4
FAN3
JPCIE6
FAN6
JNVI2C2
LE1
P2-DIMMC1
UID
P2-DIMMB1
VGA
P2-DIMMA1
P2-DIMMA2
CPU1
FAN5
LAN2 LAN1
CPU2
P1-DIMMA2
USB0/1
(2.0)
P1-DIMMB1
P1-DIMMC1
P1-DIMMA1
Standoffs (10)
Only if Needed
COM1
IPMI_LAN
USB4/5 (3.0)
P2-DIMMD2
P2-DIMMD1
P2-DIMME1
JPI2C1
JPWR2JPWR1
JPWR3
JF1
LE2
A
C
FAN1FAN2
P2-DIMMF1
Location of Mounting Holes
Notes: 1) To avoid damaging the motherboard and its components, please do not use
a force greater than 8 lb/inch on each mounting screw during motherboard installation.
2) Some components are very close to the mounting holes. Please take precautionary
measures to avoid damaging these components when installing the motherboard to
the chassis.
22
Chapter 2: Installation
Installing the Motherboard
1. Install the I/O shield into the back of the chassis if needed.
2. Locate the mounting holes on the motherboard. See the previous page for the location.
3. Locate the matching mounting holes on the chassis. Align the mounting holes on the
motherboard against the mounting holes on the chassis.
4. Install standoffs in the chassis as needed.
5. Install the motherboard into the chassis carefully to avoid damaging other motherboard
components.
6. Using the Phillips screwdriver, insert a Phillips head #6 screw into a mounting hole on
the motherboard and its matching mounting hole on the chassis.
7. Repeat Step 5 to insert #6 screws into all mounting holes.
8. Make sure that the motherboard is securely placed in the chassis.
Note: Images displayed in this manual are for illustration only. Your chassis or
components might look different from those shown in this manual.
23
Super X11DPi-N(T) User's Manual
2.3 Processor and Heatsink Installation
Warning: When handling the processor package, avoid placing direct pressure on the label
area of the CPU or CPU socket. Also, improper CPU installation or socket misalignment can
cause serious damage to the CPU or motherboard which may result in RMA repairs. Please
read and follow all instructions thoroughly before installing your CPU and heatsink.
Notes:
• Always connect the power cord last, and always remove it before adding, removing, or
changing any hardware components. Please note that the processor and heatsink should
be assembled together fi rst to form the Processor Heatsink Module (PHM), and then install
the entire PHM into the CPU socket.
• When you receive a motherboard without a processor pre-installed, make sure that the
plastic CPU socket cap is in place and that none of the socket pins are bent; otherwise,
contact your retailer immediately.
• Refer to the Supermicro website for updates on CPU support.
• Please follow the instructions given in the ESD Warning section on the fi rst page of this
chapter before handling, installing, or removing system components.
The Intel 81xx/61xx/51xx/41xx/31xx Series Processors
Note: The 81xx/61xx/51xx/41xx/31xx processors contain two models-the F model
processors and the Non-F model processors. This motherboard supports NonF model processors only.
Intel Processor (Non-F Model)
Note: All graphics, drawings, and pictures shown in this manual are for illustration only.
The components that came with your machine may or may not look exactly the same
as those shown in this manual.
24
Chapter 2: Installation
Overview of the Processor Socket Assembly
The processor socket assembly contains 1) the Intel 81xx/61xx/51xx/41xx/31xx processor,
2) the narrow processor clip, 3) the dust cover, and 4) the CPU socket.
1. The 81xx/61xx/51xx/41xx/31xx
Processor
(The 81xx/61xx/51xx/41xx/31xx Processor)
2. Narrow processor clip (the plastic processor package carrier used for the CPU)
3. Dust Cover
4. CPU Socket
(for the non-F Model)
Note: Be sure to cover the CPU socket with the dust cover when the CPU is not in-
stalled.
25
Super X11DPi-N(T) User's Manual
Overview of the Processor Heatsink Module (PHM)
The Processor Heatsink Module (PHM) contains 1) a heatsink, 2) a narrow processor clip,
and 3) the 81xx/61xx/51xx/41xx/31xx processor.
1. Heatsink
2. Narrow processor clip
3. Intel Processor
Processor Heatsink Module (PHM)
(Bottom View for the non-F Model)
26
Chapter 2: Installation
Attaching the Processor to the Narrow Processor Clip to Create
the Processor Package Assembly
To properly install the CPU into the narrow processor clip, please follow the steps below.
1. Locate pin 1 (notch A), which is the triangle located on the top of the narrow processor
clip. Also locate notch B and notch C on the processor clip.
2. Locate pin 1 (notch A), which is the triangle on the substrate of the CPU. Also, locate
notch B and notch C on the CPU as shown below.
3. Align pin 1 (the triangle on the substrate) of the CPU with pin 1 (the triangle) of
the narrow processor clip. Once they are aligned, carefully insert the CPU into the
processor clip by sliding notch B of the CPU into notch B of the processor clip, and
sliding notch C of the CPU into notch C of the processor clip.
4. Examine all corners of the CPU to ensure that it is properly seated on the processor
clip. Once the CPU is securely attached to the processor clip, the processor package
assembly is created.
Note: Please exercise extreme caution when handling the CPU. Do not touch the
CPU LGA-lands to avoid damaging the LGA-lands or the CPU. Be sure to wear ESD
gloves when handling components.
CPU (Upside Down)
w/CPU LGA Lands up
Align Notch B of the CPU
and Notch B of the Processor Clip
Align CPU Pin 1
C
Align Notch C of the CPU
and Notch C of the Processor Clip
B
Allow Notch C to
latch on to CPU
A
Pin 1
C
C
B
CPU/Heatsink Package
(Upside Down)
A
Allow Notch B to
latch on to CPU
B
A
Processor Package Carrier (w/CPU mounted
on the Processor Clip)
27
Super X11DPi-N(T) User's Manual
Attaching the Processor Package Assembly to the Heatsink to
Form the Processor Heatsink Module (PHM)
After you have made a processor package assembly by following the instructions on the
previous page, please follow the steps below to mount the processor package assembly onto
the heatsink to create the Processor Heatsink Module (PHM).
1. Locate "1" on the heatsink label and the triangular corner next to it on the heatsink.
With your index fi nger pressing against the screw at this triangular corner, carefully hold
and turn the heatsink upside down with the thermal-grease side facing up. Remove the
protective thermal fi lm if present, and apply the proper amount of the thermal grease
as needed. (Skip this step if you have a new heatsink because the necessary thermal
grease is pre-applied in the factory.)
2. Holding the processor package assembly at the center edge, turn it upside down. With
the thermal-grease side facing up, locate the hollow triangle located at the corner of the
processor carrier assembly ("a" in the graphic). Note a larger hole and plastic mounting
clicks located next to the hollow triangle. Also locate another set of mounting clicks and
a larger hole at the diagonal corner
of the same (reverse) side of the
processor carrier assembly ("b" in
the graphic).
3. With the back of heatsink and
the reverse side of the processor
package assembly facing up, align
the triangular corner on the heatsink
("A" in the graphic) against the
mounting clips next to the hollow
triangle ("a") on the processor
package assembly.
4. Also align the triangular corner ("B")
at the diagonal side of the heatsink
with the corresponding clips on the
processor package assembly ("b").
Triangle on the CPU
Triangle on the
Processor Clip
Non-Fabric CPU and Processor Clip
(Upside Down)
b
d
B
a
D
Heatsink
(Upside Down)
A
On Locations of (C, D), the notches
snap onto the heat sink’s
B
c
C
mounting holes
5. Once the mounting clips on the
processor package assembly
are properly aligned with the
corresponding holes on the back
of heatsink, securely attach the
heatsink to the processor package
assembly by snapping the mounting
clips at the proper places on the
heatsink to create the processor
heatsink module (PHM).
28
D
A
On Locations (A, B), the notches
snap onto the heatsink’s sides
C
Make sure Mounting
Notches snap into place
Chapter 2: Installation
Preparing the CPU Socket for Installation
This motherboard comes with the CPU socket pre-assembled in the factory. The CPU socket
contains 1) a dust cover, 2) a socket bracket, 3) the CPU (P0) socket, and 4) a back plate.
These components are pre-installed on the motherboard before shipping.
CPU Socket w/Dust Cover On
Removing the Dust Cover from the CPU Socket
Remove the dust cover from the CPU socket, exposing the CPU socket and socket pins as
shown on the illustration below.
Note: Do not touch the socket pins to avoid damaging them, causing the CPU to
malfunction.
Dusk Cover
Remove the dust cover from
the CPU socket. Do not
touch the socket pins!
Socket Pins
CPU Socket
29
Super X11DPi-N(T) User's Manual
Installing the Processor Heatsink Module (PHM)
1. Once you have assembled the processor heatsink module (PHM) by following the
instructions listed on page 30 or page 31, you are ready to install the processor heatsink
module (PHM) into the CPU socket on the motherboard. To install the PHM into the
CPU socket, follow the instructions below.
2. Locate the triangle (pin 1) on the CPU socket, and locate the triangle (pin 1) at the
corner of the PHM that is closest to "1." (If you have diffi culty locating pin 1 of the PHM,
turn the PHM upside down. With the LGA-lands side facing up, you will note the hollow
triangle located next to a screw at the corner. Turn the PHM right side up, and you will
see a triangle marked on the processor clip at the same corner of hollow triangle.)
3. Carefully align pin 1 (the triangle) on the the PHM against pin 1 (the triangle) on the
CPU socket.
4. Once they are properly aligned, insert the two diagonal oval holes on the heatsink into
the guiding posts.
5. Using a T30 Torx-bit screwdriver, install four screws into the mounting holes on the
socket to securely attach the PHM onto the motherboard starting with the screw marked
"1" (in the sequence of 1, 2, 3, and 4).
Note: Do not use excessive force when tightening the screws to avoid damaging the
LGA-lands and the processor.
Oval C
Use a torque
Oval D
Large Guiding Post
T30 Torx Driver
of 12 lbf
#4
#1
#2
Small Guiding Post
Printed Triangle
Mounting the Processor Heatsink Module
into the CPU socket (on the motherboard)
#3
Tighten the screws in the
sequence of 1, 2, 3, 4 (top 3 quarter view)
30
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