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Manual Revision 1.0
Release Date: June 27, 2019
Unless you request and receive written permission from Super Micro Computer, Inc., you may not copy any part of this
document. Information in this document is subject to change without notice. Other products and companies referred
to herein are trademarks or registered trademarks of their respective companies or mark holders.
This manual is written for system integrators, IT technicians and knowledgeable end users.
It provides information for the installation and use of the H12SSW-iN/NT motherboard.
About This Motherboard
Built upon the functionality and capability of the AMD EPYC® 7002 series processor, the
H12SSW-iN/NT motherboard provides a high performance, expandable solution while
consuming little power. Please note that this motherboard is intended to be installed and
serviced by professional technicians only. For processor/memory updates, please refer to
our website at http://www.supermicro.com/products/.
Conventions Used in the Manual
Special attention should be given to the following symbols for proper installation and to prevent
damage done to the components or injury to yourself:
Warning! Indicates important information given to prevent equipment/property damage
or personal injury.
Warning! Indicates high voltage may be encountered when performing a procedure.
C.2 Recovering the UEFI BIOS Image .....................................................................................95
C.3 Recovering the BIOS Block with a USB Device ................................................................95
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H12SSW-iN/NT Motherboard User's Manual
Chapter 1
Introduction
Congratulations on purchasing your computer motherboard from an industry leader.
Supermicro motherboards are designed to provide you with the highest standards in quality
and performance.
In addition to the motherboard, several important parts that are included with the system are
listed below. If anything listed is damaged or missing, please contact your retailer.
1.1 Checklist
Main Parts List
DescriptionPart NumberQuantity
Supermicro motherboard-H12SSW-iN or H12SSW-NT
Slimline SAS x8 (LA) to SATA CableCBL-SAST-08132
MBD-H12SSW-IN-P or
MBD-H12SSW-NT-P
1
Important Links
For your system to work properly, please follow the links below to download all necessary
drivers/utilities and the user’s manual for your server.
Note: The table above is continued on the next page.
12
Chapter 1: Introduction
ConnectorDescription
M.2-C1, M.2-C2M.2 Slots
PWRI2CPower supply SMBus I2C header
JIPMB14-pin External BMC I2C Header (for an IPMI Card)
LAN1, LAN2Back panel LAN1, LAN2 connectors
VGABack panel VGA port
NVMe0~5NVMe slots 0~5
Note: Jumpers, connectors, switches, and LED indicators that are not described in the
preceding tables are for manufacturing testing purposes only, and are not covered in this
manual.
13
H12SSW-iN/NT Motherboard User's Manual
Motherboard Features
CPU
•
Single AMD EPYC® 7002 series processor, in one SP3 socket
Memory
•
Up to two TB of ECC DDR4 3200 MHz speed, RDIMM/LRDIMM/3DS/NVDIMM memory in eight slots
DIMM Size
• Up to 128GB size at 1.2V
Chipset
•
System on Chip
Features
Expansion Slots
•
1x PCI-E 4.0 (x32) Left Riser Slot
• 1x PCI-E 4.0 (x16) Right Riser Slot
• M.2 Interface: 2x PCI-E 4.0 x2/SATA.
• M.2 Form Factor: 2280, 22110
• M.2 Key: M-Key
Network
•
ATEN IPMI from ASPEED AST 2500 BMC for gigabit RJ45 port
• Two RJ45 1GbE LAN ports, H12SSW-iN(1GbE Broadcom 5720L); H12SSW-NT(10GbE Broadcom 57416)
Graphics
•
ASPEED AST2500 BMC chip with one VGA port
I/O Devices
•
One COM RS-232 type connector
• One COM header
• Six USB 3.0 headers
• One USB 3.0 Type A connector
Peripheral Devices
•
Two native NVMe Ports (SlimSAS x8); Four internal NVMe or sixteen SATA dual use ports (SlimSAS x8)
• Two SATA DOM ports
BIOS
•
128Mb SPI AMI BIOS®
• ACPI 6.2, SMBIOS 3.1.1, Plug-and-Play (PnP), BIOS rescue hot-key, RTC (Real Time Clock) wake up, Riser Card Auto-
Detection Support
Note: The table above is continued on the next page.
14
Features
Power Management
•
ACPI power management (S5)
• Power button override mechanism
• Power-on mode for AC power recovery
System Health Monitoring
•
Onboard voltage monitoring for +1.8V, 3.3V, +5V, +12V, +3.3V Standby, +5V Standby, VBAT, HT, Memory
• Onboard monitoring for CPU, system, and memory temperature
Note: This is a general block diagram and may not exactly represent the features on your
motherboard. See the previous pages for the actual specications of your motherboard.
Figure 1-3. System Block Diagram
16
Chapter 1: Introduction
1.2 Processor and Chipset Overview
The H12SSW-iN/NT motherboard offers maximum I/O expandability, energy efciency, and
data reliability in a 7-nm process architecture. It is optimized for high-performance computing,
NVMe storage solutions, and ideal for High Density Data Center applications.
The H12SSW-iN/NT supports the new 7 nm microarchitecture process technology, which
signicantly increases system performance for a multitude of server applications.
The AMD EPYC® 7002 series processor supports the following features:
• ACPI Power Management Logic Support Rev. 6.2
• Adaptive Thermal Management/Monitoring
• PCI-E 4.0 w/transfer rates of up to 16 Gb/s
• SATA 3.0 w/transfer rates of up to 6 Gb/s
• System Management Bus (SMBus) Specication Version 2.0
1.3 Special Features
This section describes the health monitoring features of the H12SSW-iN/NT. The motherboard
has an onboard System Hardware Monitor chip that supports system health monitoring.
Recovery from AC Power Loss
The Basic I/O System (BIOS) provides a setting that determines how the system will respond
when AC power is lost and then restored to the system. You can choose for the system to
remain powered off (in which case you must press the power switch to turn it back on), or
for it to automatically return to the power-on state. See the Advanced BIOS Setup section
for this setting. The default setting is Last State.
1.4 System Health Monitoring
This section describes the health monitoring features of the H12SSW-iN/NT motherboard. The
motherboard has an onboard Baseboard Management Controller (BMC) chip that supports
system health monitoring. Once a voltage becomes unstable, a warning is given or an error
message is sent to the screen. The user can adjust the voltage thresholds to dene the
sensitivity of the voltage monitor.
17
H12SSW-iN/NT Motherboard User's Manual
Onboard Voltage Monitors
The onboard voltage monitor will continuously scan crucial voltage levels. Once a voltage
becomes unstable, it will give a warning or send an error message to the screen. Users can
adjust the voltage thresholds to dene the sensitivity of the voltage monitor. Real time readings
of these voltage levels are all displayed in BMC.
Fan Status Monitor with Firmware Control
Users can check the RPM status of the cooling fans through the IPMI Web interface. The
chassis fans are controlled by Thermal Management.
Environmental Temperature Control
The thermal control sensor monitors the CPU temperature in real time and will turn on the
thermal control fan whenever the CPU temperature exceeds a user-dened threshold. The
overheat circuitry runs independently from the CPU. Once the thermal sensor detects that
the CPU temperature is too high, it will automatically turn on the thermal fans to prevent the
CPU from overheating. The onboard chassis thermal circuitry can monitor the overall system
temperature and alert the user when the chassis temperature is too high.
Note: To avoid possible system overheating, please be sure to provide adequate airow to
your system.
System Resource Alert
This feature is available when used with SuperDoctor 5®. SuperDoctor 5 is used to notify the
user of certain system events. For example, you can congure SuperDoctor 5 to provide you
with warnings when the system temperature, CPU temperatures, voltages and fan speeds
go beyond a predened range.
1.5 ACPI Features
ACPI stands for Advanced Conguration and Power Interface. The ACPI specication denes
a exible and abstract hardware interface that provides a standard way to integrate power
management features throughout a computer system including its hardware, operating system
and application software. This enables the system to automatically turn on and off peripherals
such as network cards, hard disk drives and printers.
In addition to enabling operating system-directed power management, ACPI also provides a
generic system event mechanism for Plug and Play and an operating system-independent
interface for conguration control. ACPI leverages the Plug and Play BIOS data structures
while providing a processor architecture-independent implementation that is compatible with
Windows 2016 and 2019 operating systems.
18
Chapter 1: Introduction
1.6 Power Supply
As with all computer products, a stable power source is necessary for proper and reliable
operation. It is even more important for processors that have high CPU clock rates. In areas
where noisy power transmission is present, you may choose to install a line lter to shield
the computer from noise. It is recommended that you also install a power surge protector to
help avoid problems caused by power surges.
1.7 Super I/O
The ASpeed AST2500 Super I/O provides one high-speed, 16550 compatible Universal
Asynchronous Receiver/Transmitter (UART), which support serial infrared communications.
This UART includes a send/receive FIFO, a programmable baud rate generator, complete
modem control capability and a processor interrupt system. This UART provides legacy speed
with baud rate of up to 115.2 Kbps as well as an advanced speed with baud rates of 250 K,
500 K, or 1 Mb/s, which support higher speed modems.
The Super I/O provides functions that comply with ACPI (Advanced Conguration and Power
Interface), which includes support of legacy and ACPI power management through the System
Management Interrupt (SMI) or System Control Interrupt (SCI). It also features auto power
management to reduce power consumption.
19
H12SSW-iN/NT Motherboard User's Manual
Chapter 2
Installation
2.1 Static-Sensitive Devices
Electrostatic Discharge (ESD) can damage electronic com ponents. To prevent damage to your
motherboard, it is important to handle it very carefully. The following measures are generally
sufcient to protect your equipment from ESD.
Precautions
•
Use a grounded wrist strap designed to prevent static discharge.
• Touch a grounded metal object before removing the board from the antistatic bag.
• Handle the board by its edges only; do not touch its components, peripheral chips, memory
modules or gold contacts.
• When handling chips or modules, avoid touching their pins.
• Put the motherboard and peripherals back into their antistatic bags when not in use.
• For grounding purposes, make sure that your chassis provides excellent conductivity be-
tween the power supply, the case, the mounting fasteners and the motherboard.
• Use only the correct type of CMOS onboard battery as specied by the manufacturer. Do
not install the CMOS battery upside down, which may result in a possible explosion.
Unpacking
The motherboard is shipped in antistatic packaging to avoid static damage. When unpacking
the motherboard, make sure that the person handling it is static protected.
20
Chapter 2: Installation
2.2 Motherboard Installation
All motherboards have standard mounting holes to t different types of chassis. Make sure
that the locations of all the mounting holes for both the motherboard and the chassis match.
Although a chassis may have both plastic and metal mounting fasteners, metal ones are
highly recommended because they ground the motherboard to the chassis. Make sure that
the metal standoffs click in or are screwed in tightly.
Phillips
Screwdriver (1)
Phillips Screws
Tools Needed
Standoffs
(Only if needed)
Location of Mounting Holes
Notes:
1. To avoid damaging the motherboard and its components, please do not use a force
greater than 8 lb/inch on each mounting screw during motherboard installation.
2. Some components are very close to the mounting holes. Please take precautionary
measures to avoid damaging these components when installing the motherboard to the
chassis.
21
H12SSW-iN/NT Motherboard User's Manual
Figure 2-1. Motherboard Mounting Holes
22
Chapter 2: Installation
Installing the Motherboard
1. Install the I/O shield into the back of the chassis.
2. Locate the mounting holes on the motherboard. See the previous page for the locations.
3. Locate the matching mounting holes on the chassis. Align the mounting holes on the
motherboard with the mounting holes on the chassis.
4. Install standoffs in the chassis as needed.
5. Install the motherboard into the chassis carefully to avoid damaging other motherboard
components.
6. Using the Phillips screwdriver, insert a Phillips head #6 screw into a mounting hole on
the motherboard and its matching mounting hole on the chassis.
7. Repeat Step 5 to insert #6 screws into all mounting holes.
8. Make sure that the motherboard is securely placed in the chassis.
Note: Images displayed are for illustration only. Your chassis or components might look
different from those shown in this manual.
23
H12SSW-iN/NT Motherboard User's Manual
2.3 Processor and Heatsink Installation
Warning: When handling the processor package, avoid placing direct pressure on the label
area of the fan.
Important:
• For the Processor/Heatsink installation you need to use a T20 screwdriver when opening/
closing the CPU socket.
• Always connect the power cord last, and always remove it before adding, removing or
changing any hardware components. Make sure that you install the processor into the
CPU socket before you install the CPU heatsink.
• If you buy a CPU separately, make sure that you use an AMD-certied heatsink only. Make
sure to install the motherboard into the chassis before you install the CPU heatsink.
• When receiving a motherboard without a processor pre-installed, make sure that the plastic
CPU socket cap is in place and none of the socket pins are bent; otherwise, contact your
retailer immediately.
• Refer to the Supermicro website for updates on CPU support.
Installing the Processor and Heatsink
1. Unscrew the screws holding down Force Frame in the sequence of 3-2-1. The screws
are numbered on the force frame next to each screw hole.
Screw #3
Screw #1
Screw #2
Force Frame
24
Chapter 2: Installation
2. The spring-loaded force frame will raise up after the last screw securing it (#1) is
removed. Gently allow it to lift up to its stopping position.
3. Lift the rail frame up by gripping the lift tabs near the front end of the rail frame. While
keeping a secure grip of the rail frame, lift it to a position so you can do the next step of
removing the external cap.
Note: The rail frame is spring loaded, so keep a secure grip on it as you lift it so it does
not snap up.
Rail Frame
PnP Cover Cap
25
H12SSW-iN/NT Motherboard User's Manual
4. Remove the external cap from the Rail Frame by pulling it upwards through the rail
guides on the rail frame.
External Cap
PnP Cover Cap
5. The CPU package is shipped from the factory with the blue carrier frame pre-assembled.
Grip the handle of the carrier frame/CPU package assembly from its shipping tray, and
while gripping the handle, align the anges of the carrier frame onto the rails of the rail
frame so its pins will be at the bottom when the rail frame is lowered later.
6. Slide the carrier frame/CPU package downwards to the bottom of the rail frame. Ensure
the anges are secure on the rails as you lower it downwards.
Carrier Frame/
CPU Package
26
Chapter 2: Installation
Note: You can only install the CPU inside the socket in one direction with the handle at the
top. Make sure that it is properly inserted into the CPU socket before closing the rail frame
plate. If it doesn't close properly, do not force it as it may damage your CPU. Instead, open
the rail frame plate again, and double-check that the CPU is aligned properly.
7. Lift up the rail frame till it securely rests in upright position. Then remove the PnP cover
cap from the CPU socket below. Grip the two lift tabs marked "Remove" at the middle of
the cap and pull vertically upwards to remove the PnP cover cap.
Warning! The exposed socket contacts are extremely vulnerable and can be damaged easily.
Do not touch or drop objects onto the contacts and be careful removing the PnP cover cap and
when placing the rail frame over the socket.
8. Gently lower the rail frame down onto the socket until the latches on the rail frame
engage with the socket housing and it rests in place. DO NOT force it into place!
27
H12SSW-iN/NT Motherboard User's Manual
9. Gently lower the force frame down onto the rail frame and hold it in place until it is
seated in the Socket housing. Note that the force frame is spring loaded and has to be
held in place before it is secured. Important: Use a torque screwdriver, set it at 16.1
kgf-cm (14.0 lbf-in) with a Torx T20 screw head bit, to prevent damage to the CPU.
10. Place and re-screw the screws in the reverse order to the way you removed them
(holes 1-2-3 in order). When nished, the force frame will be secure over both the rail
frame and CPU package.
28
Chapter 2: Installation
11. After the force frame is secured and the CPU package is in place, now you must install
the heatsink to the frame. Lower the heatsink down till it rests securely over the four
screw holes on CPU package on the socket frame.
12. Using a diagonal pattern, tighten the four screws down on the heatsink in a clockwise
fashion till it is secure. The heatsink will now be secured and you have nished installing
the processor and heatsink onto the motherboard. Repeat this procedure for any
remaining CPU sockets on the motherboard.
#1 Screw
#3 Screw
#4 Screw
29
#2 Screw
H12SSW-iN/NT Motherboard User's Manual
Uninstalling the Processor and Heatsink
1. Remove the heatsink attached to the top of the CPU package by reversing the
installation procedure.
2. Clean the Thermal grease left by the heatsink on the CPU package lid to limit the risk of
it contaminating the CPU package land pads or contacts in the socket housing.
3. Reverse the procedure for installing the force frame onto the socket, unscrewing the
plate in the 3-2-1 screw order and lift the force frame to the vertical position.
4. Lift the rail frame using the lift tabs near the front end of the rail frame. Note that the rail
frame is spring loaded, so be careful lifting it up into a vertical position.
5. Grip the handle of the carrier frame and pull upwards to extract it from the rail frame.
Return the carrier frame/CPU package to its original shipping container.
6. Grip the handle on the external cap and return it to the rail frame sliding it downwards
till it rests in the frame.
7. Gripping the rail frame, rotate it downwards till it rests above and locks over the socket
housing in its horizontal position.
8. Push and rotate down the force frame till it is over the external cap and rail frame into a
horizontal position.
9. While holding down the force frame, secure it back to the socket frame by securing
screw 1 in place. Note that without a CPU package in place, it is not necessary to
tighten down screws 2 and 3 at this time.
30
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