Supermicro H11DSU-iN User Manual
H11DSU-iN
USER’S MANUAL
Revision 1.0
3
Preface
Preface
About This Manual
This manual is written for system integrators, IT technicians and knowledgeable end users.
It provides information for the installation and use of the H11DSU-iN motherboard.
About This Motherboard
Built upon the functionality and capability of the EPYC 7000 series processor, the H11DSU-iN
motherboard provides superior graphics capability and system performance while consuming
little power. Please note that this motherboard is intended to be installed and serviced by
professional technicians only. For processor/memory updates, please refer to our website at
http://www.supermicro.com/products/.
Conventions Used in the Manual
Special attention should be given to the following symbols for proper installation and to prevent
damage done to the components or injury to yourself:
Warning! Indicates high voltage may be encountered when performing a procedure.
Warning! Indicates important information given to prevent equipment/property damage
or personal injury.
The information in this User’s Manual has been carefully reviewed and is believed to be accurate. The vendor assumes
no responsibility for any inaccuracies that may be contained in this document, and makes no commitment to update
or to keep current the information in this manual, or to notify any person or organization of the updates. Please Note:
For the most up-to-date version of this manual, please see our website at www.supermicro.com.
Super Micro Computer, Inc. ("Supermicro") reserves the right to make changes to the product described in this manual
at any time and without notice. This product, including software and documentation, is the property of Supermicro and/
or its licensors, and is supplied only under a license. Any use or reproduction of this product is not allowed, except
as expressly permitted by the terms of said license.
IN NO EVENT WILL Super Micro Computer, Inc. BE LIABLE FOR DIRECT, INDIRECT, SPECIAL, INCIDENTAL,
SPECULATIVE OR CONSEQUENTIAL DAMAGES ARISING FROM THE USE OR INABILITY TO USE THIS PRODUCT
OR DOCUMENTATION, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. IN PARTICULAR, SUPER
MICRO COMPUTER, INC. SHALL NOT HAVE LIABILITY FOR ANY HARDWARE, SOFTWARE, OR DATA STORED
OR USED WITH THE PRODUCT, INCLUDING THE COSTS OF REPAIRING, REPLACING, INTEGRATING,
INSTALLING OR RECOVERING SUCH HARDWARE, SOFTWARE, OR DATA.
Any disputes arising between manufacturer and customer shall be governed by the laws of Santa Clara County in the
State of California, USA. The State of California, County of Santa Clara shall be the exclusive venue for the resolution
of any such disputes. Supermicro's total liability for all claims will not exceed the price paid for the hardware product.
FCC Statement: This equipment has been tested and found to comply with the limits for a Class A digital device
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful
interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can
radiate radio frequency energy and, if not installed and used in accordance with the manufacturer’s instruction manual,
may cause harmful interference with radio communications. Operation of this equipment in a residential area is likely
to cause harmful interference, in which case you will be required to correct the interference at your own expense.
California Best Management Practices Regulations for Perchlorate Materials: This Perchlorate warning applies only
to products containing CR (Manganese Dioxide) Lithium coin cells. “Perchlorate Material-special handling may apply.
See www.dtsc.ca.gov/hazardouswaste/perchlorate”.
WARNING: Handling of lead solder materials used in this product may expose you to lead, a
chemical known to the State of California to cause birth defects and other reproductive harm.
The products sold by Supermicro are not intended for and will not be used in life support systems, medical equipment,
nuclear facilities or systems, aircraft, aircraft devices, aircraft/emergency communication devices or other critical
systems whose failure to perform be reasonably expected to result in signicant injury or loss of life or catastrophic
property damage. Accordingly, Supermicro disclaims any and all liability, and should buyer use or sell such products
for use in such ultra-hazardous applications, it does so entirely at its own risk. Furthermore, buyer agrees to fully
indemnify, defend and hold Supermicro harmless for and against any and all claims, demands, actions, litigation, and
proceedings of any kind arising out of or related to such ultra-hazardous use or sale.
Manual Revision 1.0
Release Date: July 17, 2017
Unless you request and receive written permission from Super Micro Computer, Inc., you may not copy any part of this
document. Information in this document is subject to change without notice. Other products and companies referred
to herein are trademarks or registered trademarks of their respective companies or mark holders.
Copyright © 2017 by Super Micro Computer, Inc.
All rights reserved.
Printed in the United States of America
54
Contacting Supermicro
Headquarters
Address: Super Micro Computer, Inc.
980 Rock Ave.
San Jose, CA 95131 U.S.A.
Tel: +1 (408) 503-8000
Fax: +1 (408) 503-8008
Email: marketing@supermicro.com (General Information)
support@supermicro.com (Technical Support)
Website: www.supermicro.com
Europe
Address: Super Micro Computer B.V.
Het Sterrenbeeld 28, 5215 ML
's-Hertogenbosch, The Netherlands
Tel: +31 (0) 73-6400390
Fax: +31 (0) 73-6416525
Email: sales@supermicro.nl (General Information)
support@supermicro.nl (Technical Support)
rma@supermicro.nl (Customer Support)
Website: www.supermicro.nl
Asia-Pacic
Address: Super Micro Computer, Inc.
3F, No. 150, Jian 1st Rd.
Zhonghe Dist., New Taipei City 235
Taiwan (R.O.C)
Tel: +886-(2) 8226-3990
Fax: +886-(2) 8226-3992
Email: support@supermicro.com.tw
Website: www.supermicro.com.tw
H11DSU-iN User's Manual
Table of Contents
Chapter 1 Introduction
Quick Reference ...............................................................................................................11
Quick Reference Table ......................................................................................................12
Motherboard Features .......................................................................................................14
1.2 Processor and Chipset Overview .......................................................................................17
1.3 Special Features ................................................................................................................17
Recovery from AC Power Loss .........................................................................................17
1.4 System Health Monitoring ..................................................................................................18
Onboard Voltage Monitors ................................................................................................18
Fan Status Monitor with Firmware Control .......................................................................18
Environmental Temperature Control .................................................................................18
System Resource Alert......................................................................................................18
1.5 ACPI Features ....................................................................................................................19
1.6 Power Supply .....................................................................................................................19
1.7 Super I/O ............................................................................................................................19
Chapter 2 Installation
2.1 Static-Sensitive Devices .....................................................................................................20
Precautions .......................................................................................................................20
Unpacking .........................................................................................................................20
2.2 Motherboard Installation .....................................................................................................21
Location of Mounting Holes ..............................................................................................21
Installing the Motherboard.................................................................................................23
2.3 Processor and Heatsink Installation ...................................................................................24
Memory Support and Installation ......................................................................................31
Memory Support ............................................................................................................31
DIMM Module Population Sequence ................................................................................32
DIMM Installation ..............................................................................................................33
DIMM Removal .................................................................................................................33
2.5 Rear I/O Ports ....................................................................................................................34
2.6 Front Control Panel ............................................................................................................36
Preface
76
2.7 Connectors .........................................................................................................................39
Power Connections ...........................................................................................................39
Headers .............................................................................................................................40
2.8 Jumper Settings .................................................................................................................43
How Jumpers Work ...........................................................................................................43
2.9 LED Indicators ....................................................................................................................45
Chapter 3 Troubleshooting
3.1 Troubleshooting Procedures ..............................................................................................46
Before Power On ..............................................................................................................46
No Power ..........................................................................................................................46
No Video ...........................................................................................................................47
System Boot Failure ..........................................................................................................47
Memory Errors ..................................................................................................................47
Losing the System's Setup Conguration .........................................................................47
When the System Becomes Unstable ..............................................................................48
3.2 Technical Support Procedures ...........................................................................................49
3.3 Frequently Asked Questions ..............................................................................................50
3.4 Returning Merchandise for Service ....................................................................................50
3.5 Battery Removal and Installation .......................................................................................51
Battery Removal ................................................................................................................51
Proper Battery Disposal ....................................................................................................51
Battery Installation .............................................................................................................51
Chapter 4 BIOS
4.1 Introduction .........................................................................................................................52
Starting the Setup Utility ...................................................................................................52
4.2 Main Setup .........................................................................................................................53
4.3 Advanced Setup Congurations .........................................................................................54
4.4 Chipset ...............................................................................................................................68
4.5 AMD CBS ...........................................................................................................................70
4.6 IPMI ....................................................................................................................................78
4.7 Event Logs .........................................................................................................................81
4.8 Security ...............................................................................................................................83
4.9 Boot ....................................................................................................................................87
H11DSU-iN User's Manual
4.10 Save & Exit .......................................................................................................................89
Appendix A Software Installation
A.1 Installing Software Programs .............................................................................................91
A.2 SuperDoctor
®
5 ...................................................................................................................92
Appendix B Standardized Warning Statements
Battery Handling ................................................................................................................93
Product Disposal ...............................................................................................................95
Appendix C UEFI BIOS Recovery
Preface
98
Chapter 1: Introduction
H11DSU-iN User's Manual
Chapter 1
Introduction
Congratulations on purchasing your computer motherboard from an industry leader. Supermicro
boards are designed to provide you with the highest standards in quality and performance.
In addition to the motherboard, several important parts that are included with the system are
listed below. If anything listed is damaged or missing, please contact your retailer.
Important Links
For your system to work properly, please follow the links below to download all necessary
drivers/utilities and the user’s manual for your server.
• Supermicro product manuals: http://www.supermicro.com/support/manuals/
• Product drivers and utilities: ftp://ftp.supermicro.com
• Product safety info: http://www.supermicro.com/about/policies/safety_information.cfm
• If you have any questions, please contact our support team at: support@supermicro.com
This manual may be periodically updated without notice. Please check the Supermicro website
for possible updates to the manual revision level.
Figure 1-1. H11DSU-iN Motherboard Image
Note: All graphics shown in this manual were based upon the latest PCB revision available
at the time of publication of the manual. The motherboard you received may or may not look
exactly the same as the graphics shown in this manual.
1110
Chapter 1: Introduction
H11DSU-iN User's Manual
H11DSU-i(N)
REV:1.01
JL1
JF1
FAN7
FAN8
JF2
P2-DIMMA1
P2-DIMMB1
P2-DIMMA2
P2-DIMMC1
P2-DIMMB2
P2-DIMMD2
P2-DIMMD1
P2-DIMMC2
JVR1
FAN3
FAN4
FAN5
FAN6
P2-DIMMH2
P2-DIMMG2
P2-DIMMH1
P2-DIMMF2
P2-DIMMG1
P2-DIMME2
P2-DIMMF1
P2-DIMME1
P1-DIMMD2
P1-DIMMC2
P1-DIMMC1
P1-DIMMD1
P1-DIMMA1
P1-DIMMA2
P1-DIMMB1
P1-DIMMB2
CPU1CPU2
P1-DIMMG1
P1-DIMMG2
P1-DIMMH1
P1-DIMMF2
P1-DIMMF1
P1-DIMME2
P1-DIMME1
P1-DIMMH2
FAN1
FAN2
JSGPIO
JGPW3
JUSB3
JTPM1
JSD2
SATA13
SATA12
JGPW2
JSD1
JBT1
Battery
P2_NVME0
P2_NVME1 P1_NVME1
P1_NVME0
JL2
J38
LEDM1
LE1
CPU1 PCI-E 3.0 x16 + CPU1 PCI-E 3.0 x16
CPU2 PCI-E 3.0 x16 + CPU2 PCI-E 3.0 x16
SXB3C
SXB1C
SXB1A
CPU1 PCIE 3.0 X8
PSU2 PSU1
LED1
JIPMB1
JLAN1
UID-LED
COM1
VGA
IPMI_LAN
USB0/1
(3.0)
JWD1JPG1
JSDCARD1
JPW4
JPW3JPW2
JPW1
JGPW1
SATA4~7SATA0~3
JS1: SATA8~11
JUSBA1
SXB2
CPU2 PCI-E 3.0 X16
JPB1
FAN8
JF1
FAN3
USB0/1
JPB1/JPG1/JWD1/
JL2
SGPIO
JIPMB1
SATA0~7
Figure 1-2. H11DSU-iN Motherboard Layout
H11DSU-i(N)
REV:1.01
JL1
JF1
FAN7
FAN8
JF2
P2-DIMMA1
P2-DIMMB1
P2-DIMMA2
P2-DIMMC1
P2-DIMMB2
P2-DIMMD2
P2-DIMMD1
P2-DIMMC2
JVR1
FAN3
FAN4
FAN5
FAN6
P2-DIMMH2
P2-DIMMG2
P2-DIMMH1
P2-DIMMF2
P2-DIMMG1
P2-DIMME2
P2-DIMMF1
P2-DIMME1
P1-DIMMD2
P1-DIMMC2
P1-DIMMC1
P1-DIMMD1
P1-DIMMA1
P1-DIMMA2
P1-DIMMB1
P1-DIMMB2
CPU1CPU2
P1-DIMMG1
P1-DIMMG2
P1-DIMMH1
P1-DIMMF2
P1-DIMMF1
P1-DIMME2
P1-DIMME1
P1-DIMMH2
FAN1
FAN2
JSGPIO
JGPW3
JUSB3
JTPM1
JSD2
SATA13
SATA12
JGPW2
JSD1
JBT1
Battery
P2_NVME0
P2_NVME1 P1_NVME1
P1_NVME0
JL2
J38
LEDM1
LE1
CPU1 PCI-E 3.0 x16 + CPU1 PCI-E 3.0 x16
CPU2 PCI-E 3.0 x16 + CPU2 PCI-E 3.0 x16
SXB3C
SXB1C
SXB1A
CPU1 PCIE 3.0 X8
PSU2 PSU1
LED1
JIPMB1
JLAN1
UID-LED
COM1
VGA
IPMI_LAN
USB0/1
(3.0)
JWD1JPG1
JSDCARD1
JPW4
JPW3JPW2
JPW1
JGPW1
SATA4~7SATA0~3
JS1: SATA8~11
JUSBA1
SXB2
CPU2 PCI-E 3.0 X16
JPB1
P2-DIMMA1~D2
BP
PWR1~4
GPU PWR3
JSDCARD1
IPMI LAN
SXB2
COM1
Notes:
• See Chapter 2 for detailed information on jumpers, I/O ports, and JF1 front panel
connections.
• Jumpers/LED indicators not indicated are used for testing only.
• Use only the correct type of onboard CMOS battery as specied by the manufacturer. Do
not install the onboard battery upside down to avoid possible explosion.
Quick Reference
VGA
SXB1A
SXB3B
SXB3A
JBR2
CPU1
JF2
JL1
FAN6
FAN2
FAN5
FAN4
FAN7
JVR1
FAN1
CPU2
JTPM1
NVMe Ports
GPU PWR2
USB3/4
JSD1/2
SATA12/13
GPU
PWR1
P2-DIMME1~H2
P1-DIMMA1~D2
P1-DIMME1~H2
LE1
LEDM1
LED1
JUIDB2 Switch and UID LED
JBT1
SXB1B
SATA8~11
PSU1/2
1312
Chapter 1: Introduction
H11DSU-iN User's Manual
Quick Reference Table
Jumper Description Default Setting
J38 CPLD Code Programming NA
J39 Debug message through CPU UART0 NA
JBR2 Debug Mode for IPMI Use Pins 1-2 (Normal)
JBT1 CMOS Clear Open (Normal)
JPG1 VGA Enable/Disable Pins 1-2 (Enabled)
JVR1 VRM Code Programming Pin1: CLK, Pin2: DAT
JWD1 Watch Dog Pins 1-2 (Reset)
LED Description Status
LE1 Power LED Solid Green: Power On
LED1 UID LED Solid Blue: UID Switch On
LEDM1 BMC Heartbeat LED
Connector Description
BT1 Onboard Battery
COM1 COM Port
FAN1~FAN8 4-pin System/CPU Fan Headers
SATA0~13 SATA 3.0 Ports
SGPIO Serial Link General Purpose I/O Header
JF1 Front Control Panel Header 1
JF2 UltraIO Riser Card LAN LED Header
JIPMB1 System Management Bus Header
JL1 Chassis Intrusion Header
JLAN1 IPMI Gigabit LAN (RJ45) Port
GPU PWR1~3 12V 8-pin Power Connector for Riser Card GPU
BP PWR1~4 12V and 5V 8-pin Power Connector for Backplane
JSD1/JSD2 SATA DOM (Device on Module) power connectors 1/2
JSDCARD1 SD Card Port
JTPM1 Trusted Platform Module/Port 80 Connector
JUSBA1 USB 3.0 Type A Header
USB3 Front Panel USB3/4 3.0 ports
P1-NVME0/1 Processor 1 NVMe Ports
P2-NVME0/1 Processor 2 NVMe Ports
PSU1 Serverboard Main Power Supply Connector
PSU2 Serverboard Main Power Supply Connector
SXB1A/1B/1C WIO-L Riser Card Support (CPU1 PCI-E 3.0 x16 and CPU2 PCI-E 3.0 x16)
SXB2 WIO-R Riser Card Support (CPU2 PCI-E 3.0 x16)
SXB3A/3B/3C Ultra I/O Riser Card Support (CPU1 PCI-E 3.0 x 24, CPU2 PCI-E 3.0 x16)
USB0/1 Back panel Universal Serial Bus (USB) 3.0 Ports
Connector Description
VGA VGA Video Port
Note: Jumpers in the table not described are for manufacturing testing purposes only and
are not covered in this manual.
1514
Chapter 1: Introduction
H11DSU-iN User's Manual
Note: The table above is continued on the next page.
Motherboard Features
Power Management
•
ACPI power management (S5)
• Power button override mechanism
• Power-on mode for AC power recovery
System Health Monitoring
•
Onboard voltage monitoring for +3.3V, +3.3V Standby, +5V, +5V Standby, +12V, VBAT, Memory, PCH Temp., System
Temp., Memory Temp.
• CPU switching phase voltage regulator
• CPU Thermal Trip support
• CPU Thermal Design Power (TDP) support of up to 180W (See Note 1 at the bottom)
Fan Control
•
Single cooling zone
• Low-noise fan speed control
• Pulse Width Modulation (PWM) fan control
System Management
•
Trusted Platform Module (TPM) support
• System resource alert via SuperDoctor® 5
• Power Supply Monitoring (JP1
2
C1)
• SuperDoctor® 5, Watch Dog
• Chassis intrusion header and detection (JL1)
• QA2, SUM-InBand, SUM-OOB, IPMICFG, IPMIVIew, SMCIPMITOOL
LED Indicators
•
CPU/Overheating
• Fan Failure
• HDD activity
• LAN activity
Dimensions
•
17" (L) x 16.8" (W) (431.8 mm x 426.72 mm)
Note 1: The CPU maximum thermal design power (TDP) is subject to chassis and heatsink
cooling restrictions. For proper thermal management, please check the chassis and heatsink
specications for proper CPU TDP sizing.
Motherboard Features
CPU
•
Dual EPYC 7000 series, processor in Socket SP3 sockets
Memory
•
Up to 4 TB of ECC DDR4 2400/2666 MHz speed, RDIMM/LRDIMM/3DS/NVDIMM memory in thirty-two (32) slots
DIMM Size
• Up to 128 GB size at 1.2V
Chipset
•
System on Chip
Expansion Slots
WIO:
• 1 x PCI-E 3.0 x32
• 1 x PCI-E 3.0 x16
Ultra:
• 1 x PCI-E 3.0 x40
Network
•
ATEN IPMI from ASPEED BMC for gigabit RJ45 port
Graphics
•
ASPEED AST2500 BMC chip with one (1) VGA port
I/O Devices
•
COM Port • One (1) COM connector on rear I/O panel
• SATA/NVMe Ports
• Fourteen (14) SATA 3.0 ports (SATA0~13)
• Two (2) SATA-DOM ports
• Four (4) internal NVMe ports
Peripheral Devices
•
Two (2) USB 3.0 ports on the rear I/O panel (USB0/1)
• One (1) USB 3.0 Type A connector for front access (USB2)
• One (1) USB 3.0 header for front control panel (USB3/4)
BIOS
•
128Mb SPI AMI BIOS® SM Flash UEFI BIOS
• ACPI 5.1, SMBIOS 3.1.1, Plug-and-Play (PnP), BIOS rescue hot-key, RTC (Real Time Clock) wakeup, Riser Card Auto-
Detection Support
Motherboard Features
1716
Chapter 1: Introduction
H11DSU-iN User's Manual
Note: This is a general block diagram and may not exactly represent the features on your
motherboard. See the previous pages for the actual specications of your motherboard.
Figure 1-3.
System Block Diagram
1.2 Processor and Chipset Overview
Built upon the functionality and capability of the EPYC 7000 series processor in an Socket SP3
socket and a System on Chip chipset. The H11DSU-iN motherboard offers maximum I/O
expendability, energy efciency, and data reliability in a 14-nm process architecture, and
is optimized for embedded storage solutions, networking applications, or cloud-computing
platforms.
With support of the new microarchitecture 14 nm process technology, the H11DSU-iN
drastically increases system performance for a multitude of server applications.
The EPYC 7000 series supports the following features:
• ACPI Power Management Logic Support Rev. 6.1
• Adaptive Ther mal Management/Monitor ing
• PCI -E 3.0, SATA 3.0 w/transfer rates of up to 6 Gb/s
• System Management Bus (SMBus) Specic ation Version 2.0
1.3 Special Features
This section describes the health monitoring features of the H11DSU-iN motherboard. The
motherboard has an onboard System Hardware Monitor chip that supports system health
monitoring.
Recovery from AC Power Loss
The Basic I/O System (BIOS) provides a setting that determines how the system will respond
when AC power is lost and then restored to the system. You can choose for the system to
remain powered off (in which case you must press the power switch to turn it back on), or
for it to automatically return to the power-on state. See the Advanced BIOS Setup section
for this setting. The default setting is Last State.
5
5
4
4
3
3
2
2
1
1
D D
C C
B B
A A
H11DSU-iN
AMD SP3 Rev. 1.02
CPU 1
A
DDR4 DIMM
#1
#2
E
CPU 2
NVMe x4
I- PASS SATA x4
I- PASS SATA x4
NVMe x4
NVMe x4
NVMe x4
CPU1 P0 [15:8]CPU2 P0 [15:8]
BMC
AST2500
CPU1 P0 [0]
CPU1 P1 [7:0]
CPU1 USB
Rear USB
X 2
CPU1 P0 [2]
VGA COM
IPMI LAN
RJ45
PHY
RTL8211F
DDR4
LPC
BMC ROM
32MB
TPM
BIOS ROM
32MB
MUX
SPI
SPI
DDR4 DIMM
#1
#2
DDR4 DIMM
#1
#2
DDR4 DIMM
#1
#2
DDR4 DIMM
#1
#2
DDR4 DIMM
#1
#2
DDR4 DIMM
#1
#2
DDR4 DIMM
#1
#2
DDR4 DIMM
#1
#2
DDR4 DIMM
#1
#2
DDR4 DIMM
#1
#2
DDR4 DIMM
#1
#2
DDR4 DIMM
#1
#2
DDR4 DIMM
#1
#2
DDR4 DIMM
#1
#2
DDR4 DIMM
#1
#2
B
C
D
F
G
H
E
H
G
F
A
B
C
D
NIC
Port A
0~7
Port A NCSI Port B
Port B
0~15
Port C
Port C
0~15
CPU1 P1 [15:8]
CPU1 P3 [15:0]
NCSI
Port 1
0 ~ 15
Port 2
0 ~ 15
Ultra IO
WIO-L
WIO-R
CPU2 P2 [15:0]
0 ~ 15
CPU2 P3 [15:0] CPU1 P2 [15:0]CPU2 P1 [15:0]
SATA DOM
SATA DOM
CPU2 P0 [3:2]
USB3
CTRL
Micro SD
I- PASS SATA x4
CPU2 P0 [7:4]
TYPE-A x1
CPU1 USB
USB3
CTRL
USB3 HDR x2
CPU1 P0 [4]
Title
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of
UPER
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980 Rock Ave., San Jose CA, 95131
TEL : (408) 503-8000
CONFIDENTIAL - DO NOT DUPLICATE
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Date: Sheet
of
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980 Rock Ave., San Jose CA, 95131
TEL : (408) 503-8000
CONFIDENTIAL - DO NOT DUPLICATE
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1.00
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Custom
1 115
<Variant Name>
Title
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Date: Sheet
of
UPER
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980 Rock Ave., San Jose CA, 95131
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CONFIDENTIAL - DO NOT DUPLICATE
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1.00
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Chapter 1: Introduction
H11DSU-iN User's Manual
1.4 System Health Monitoring
This section describes the health monitoring features of the H11DSU-iN motherboard. The
motherboard has an onboard chip that supports system health monitoring. Once a voltage
becomes unstable, a warning is given or an error message is sent to the screen. The user
can adjust the voltage thresholds to dene the sensitivity of the voltage monitor.
Onboard Voltage Monitors
The onboard voltage monitor will continuously scan crucial voltage levels. Once a voltage
becomes unstable, it will give a warning or send an error message to the screen. Users can
adjust the voltage thresholds to dene the sensitivity of the voltage monitor. Real time readings
of these voltage levels are all displayed in BMC.
Fan Status Monitor with Firmware Control
PC health monitoring in the BIOS can check the RPM status of the cooling fans. The onboard
CPU and chassis fans are controlled by Thermal Management.
Environmental Temperature Control
The thermal control sensor monitors the CPU temperature in real time and will turn on the
thermal control fan whenever the CPU temperature exceeds a user-dened threshold. The
overheat circuitry runs independently from the CPU. Once the thermal sensor detects that
the CPU temperature is too high, it will automatically turn on the thermal fans to prevent the
CPU from overheating. The onboard chassis thermal circuitry can monitor the overall system
temperature and alert the user when the chassis temperature is too high.
Note: To avoid possible system overheating, please be sure to provide adequate airow to
your system.
System Resource Alert
This feature is available when used with SuperDoctor 5®. SuperDoctor 5 is used to notify the
user of certain system events. For example, you can congure SuperDoctor 5 to provide you
with warnings when the system temperature, CPU temperatures, voltages and fan speeds
go beyond a predened range.
1.5 ACPI Features
ACPI stands for Advanced Conguration and Power Interface. The ACPI specication denes
a exible and abstract hardware interface that provides a standard way to integrate power
management features throughout a computer system including its hardware, operating system
and application software. This enables the system to automatically turn on and off peripherals
such as network cards, hard disk drives and printers.
In addition to enabling operating system-directed power management, ACPI also provides a
generic system event mechanism for Plug and Play and an operating system-independent
interface for conguration control. ACPI leverages the Plug and Play BIOS data structures
while providing a processor architecture-independent implementation that is compatible with
Windows 8/R2 and Windows 2012/R2 operating systems.
1.6 Power Supply
As with all computer products, a stable power source is necessary for proper and reliable
operation. It is even more important for processors that have high CPU clock rates. In areas
where noisy power transmission is present, you may choose to install a line lter to shield
the computer from noise. It is recommended that you also install a power surge protector to
help avoid problems caused by power surges.
1.7 Super I/O
The Super I/O (Aspeed AST2500 chip) includes a data separator, write pre-compensation
circuitry, decode logic, data rate selection, a clock generator, drive interface control logic and
interrupt and DMA logic. The wide range of functions integrated onto the Super I/O greatly
reduces the number of components required for interfacing with oppy disk drives.
The Super I/O provides one high-speed, 16550 compatible serial communication port
(UART), which supports serial infrared communication. This UART includes a 16-byte send/
receive FIFO, a programmable baud rate generator, complete modem control capability and
a processor interrupt system. This UART provides legacy speed with baud rate of up to
115.2 Kbps as well as an advanced speed with baud rates of 250 K, 500 K, or 1 Mb/s, which
support higher speed modems.
The Super I/O provides functions that comply with ACPI (Advanced Conguration and Power
Interface), which includes support of legacy and ACPI power management through a SMI
or SCI function pin. It also features auto power management to reduce power consumption.
The IRQs, DMAs and I/O space resources of the Super I/O can be exibly adjusted to meet
ISA PnP requirements, which support ACPI and APM (Advanced Power Management).
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Chapter 2
Installation
2.1 Static-Sensitive Devices
Electrostatic Discharge (ESD) can damage electronic com ponents. To prevent damage to your
motherboard, it is important to handle it very carefully. The following measures are generally
sufcient to protect your equipment from ESD.
Precautions
•
Use a grounded wrist strap designed to prevent static discharge.
• Touch a grounded metal object before removing the board from the antistatic bag.
• Handle the board by its edges only; do not touch its components, peripheral chips, memory
modules or gold contacts.
• When handling chips or modules, avoid touching their pins.
• Put the motherboard and peripherals back into their antistatic bags when not in use.
• For grounding purposes, make sure that your chassis provides excellent conductivity be-
tween the power supply, the case, the mounting fasteners and the motherboard.
• Use only the correct type of CMOS onboard battery as specied by the manufacturer. Do
not install the CMOS battery upside down, which may result in a possible explosion.
Unpacking
The motherboard is shipped in antistatic packaging to avoid static damage. When unpacking
the motherboard, make sure that the person handling it is static protected.
2.2 Motherboard Installation
All motherboards have standard mounting holes to t different types of chassis. Make sure
that the locations of all the mounting holes for both the motherboard and the chassis match.
Although a chassis may have both plastic and metal mounting fasteners, metal ones are
highly recommended because they ground the motherboard to the chassis. Make sure that
the metal standoffs click in or are screwed in tightly.
Philips
Screwdriver (1)
Standoffs (13)
Only if Needed
Philips Screws (13)
Tools Needed
Location of Mounting Holes
Notes:
1. To avoid damaging the motherboard and its components, please do not use a force
greater than 8 lb/inch on each mounting screw during motherboard installation.
2. Some components are very close to the mounting holes. Please take precautionary
measures to avoid damaging these components when installing the motherboard to the
chassis.
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Figure 2-1. Motherboard Mounting Holes
Installing the Motherboard
1. Install the I/O shield into the back of the chassis.
2. Locate the mounting holes on the motherboard. See the previous page for the location.
3. Locate the matching mounting holes on the chassis. Align the mounting holes on the
motherboard against the mounting holes on the chassis.
4. Install standoffs in the chassis as needed.
5. Install the motherboard into the chassis carefully to avoid damaging other motherboard
components.
6. Using the Phillips screwdriver, insert a Phillips head #6 screw into a mounting hole on
the motherboard and its matching mounting hole on the chassis.
7. Repeat Step 5 to insert #6 screws into all mounting holes.
8. Make sure that the motherboard is securely placed in the chassis.
Note: Images displayed are for illustration only. Your chassis or components might look
different from those shown in this manual.
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2.3 Processor and Heatsink Installation
Warning: When handling the processor package, avoid placing direct pressure on the label
area of the fan.
Important:
• For the Processor/Heatsink installation you need to use a T20 screwdriver when opening/
closing the CPU socket.
• Always connect the power cord last, and always remove it before adding, removing or
changing any hardware components. Make sure that you install the processor into the
CPU socket before you install the CPU heatsink.
• If you buy a CPU separately, make sure that you use an Intel-certied multi-directional
heatsink only.
• Make sure to install the motherboard into the chassis before you install the CPU heatsink.
• When receiving a motherboard without a processor pre-installed, make sure that the plastic
CPU socket cap is in place and none of the socket pins are bent; otherwise, contact your
retailer immediately.
• Refer to the Supermicro website for updates on CPU support.
Installing the Processor and Heatsink
1. Unscrew the screws holding down Force Frame in the sequence of 3-2-1. The screws
are numbered on the Force Frame next to each screw hole.
Screw #1
Screw #2
Screw #3
Force Frame
2. The spring-loaded Force Frame will raise up after the last screw securing it (#1) is
removed. Gently allow it to lift up to its stopping position.
3. Lift the Rail Frame up by gripping the lift tabs near the front end of the rail frame. While
keeping a secure grip of the Rail Frame, lift it to a position so you can do the next step
of removing the External Cap.
Note: The Rail Frame is spring loaded, so keep a secure grip on it as you lift it so it does
not snap up.
Rail Frame
PnP Cover Cap
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4. Remove the External Cap from the Rail Frame by pulling it upwards through the rail
guides on the Rail Frame.
External Cap
5. The CPU Package is shipped from the factory with the blue Carrier Frame preassembled. Grip the handle of the Carrier Frame/CPU Package assembly from its
shipping tray, and while gripping the handle, align the anges of the Carrier Frame
onto the rails of the Rail Frame so its pins will be at the bottom when the Rail Frame is
lowered later.
6. Slide the Carrier Frame/CPU Package downwards to the bottom of the Rail Frame.
Ensure the anges are secure on the rails as you lower it downwards.
Carrier Frame/
CPU Package
PnP Cover Cap
Note: You can only install the CPU inside the socket in one direction with the handle at the
top. Make sure that it is properly inserted into the CPU socket before closing the Rail Frame
plate. If it doesn't close properly, do not force it as it may damage your CPU. Instead, open
the Rail Frame plate again, and double-check that the CPU is aligned properly.
7. Lift up the Rail Frame till it securely rests in upright position. Then remove the PnP
Cover Cap from the CPU socket below. Grip the two lift tabs marked "Remove" at the
middle of the cap and pull vertically upwards to remove the PnP Cover Cap.
Warning! The exposed socket contacts are extremely vulnerable and can be damaged easily.
Do not touch or drop objects onto the contacts and be careful removing the PnP Cover Cap
and when placing the Rail Frame over the socket.
8. Gently lower the Rail Frame down onto the socket until the latches on the Rail Frame
engage with the Socket housing. and it rests in place. DO NOT force it into place!
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9. Gently lower the Force Frame down onto the Rail Frame and hold it in place until it is
seated in the Socket housing. Note that the Force Frame is spring loaded and has to be
held in place before it is secured.
10. Place and re-screw the screws in the reverse order to the way you removed them
(holes 1-2-3 in order). When nished, the Force Frame will be secure over both the Rail
Frame and CPU Package.
11. After the Force Frame is secured and the CPU package is in place, now you must
install the heatsink to the frame. Lower the heatsink down till it rests securely over the
four screw holes on CPU Package on the socket frame.
12. Using a diagonal pattern, tighten the four screws down on the heatsink in a clockwise
fashion till it is secure. The heatsink will now be secured and you have nished installing
the processor and heatsink onto the motherboard. Repeat this procedure for any
remaining CPU sockets on the Motherboard.
#1 Screw
#2 Screw
#3 Screw
#4 Screw
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Un-installing the Processor and Heatsink
1. Remove the heatsink attached to the top of the CPU Package by reversing the
installation procedure.
2. Clean the Thermal grease left by the heatsink on the CPU package lid to limit the risk of
it contaminating the CPU package land pads or contacts in the socket housing.
3. Reverse the procedure for installing the Force Frame onto the socket, unscrewing the
plate in the 3-2-1 screw order and lift the Force Frame to the vertical position.
4. Lift the Rail Frame using the lift tabs near the front end of the Rail Frame. Note that the
Rail Frame is spring loaded, so be careful lifting it up into a vertical position.
5. Grip the handle of the Carrier Frame and pull upwards to extract it from the Rail Frame.
Return the Carrier Frame/CPU Package to its original shipping container.
6. Grip the handle on the External Cap and return it to the Rail Frame sliding it downwards
till it rests in the frame.
7. Gripping the Rail Frame, rotate it downwards till it rests above and locks over the socket
housing in its horizontal position.
8. Push and rotate down the Force Frame till it is over the External Cap and Rail Frame
into a horizontal position.
9. While holding down the Force Frame, secure it back to the socket frame by securing
screw 1 in place. Note that without a CPU Package in place, it is not necessary to
tighten down screws 2 and 3 at this time.
Memory Support and Installation
Note: Check the Supermicro website for recommended memory modules.
Important: Exercise extreme care when installing or removing DIMM modules to prevent
any possible damage.
Memory Support
The H11DSU-iN supports Up to 4 TB of ECC DDR4 2400/2666 MHz speed, RDIMM/
LRDIMM/3DS/NVDIMM memory in thirty-two (32) slots. Refer to the table below for additional
memory information.
Processors and their Corresponding Memory Modules
CPU#
Channel 1Channel 2Channel 3Channel 4Channel 5Channel 6Channel 7Channel
8
8 DIMMS
CPU1
A2 B2 C2 D2 E2 F2 G2 H2
16 DIMMS
CPU1
A1 A2 B1 B2 C1 C2 D1 D2 E1 E2 F1 F2 G1 G2 H1 H2
16 DIMMS
CPU1
A2 B2 C2 D2 E2 F2 G2 H2
CPU2
A2 B2 C2 D2 E2 F2 G2 H2
32 DIMMS
CPU1
A1 A2 B1 B2 C1 C2 D1 D2 E1 E2 F1 F2 G1 G2 H1 H2
CPU2
A1 A2 B1 B2 C1 C2 D1 D2 E1 E2 F1 F2 G1 G2 H1 H2
Populating RDIMM/RDIMM 3DS/LRDIMM/LRDIMM 3DS DDR4 Memory
Modules
Type
DIMM Population
Maximum DIMM
Capacity (GB)
Maximum Frequency
(MHz)
DIMM1 DIMM2 1 Channel 8 Channel
RDIMM
1R 16GB 128GB 2666
1R 1R 32GB 256GB 2133
2R 32GB 256GB 2400
1R 2R 48GB 384GB 1866
2R 2R 64GB 512GB 2133
LRDIMM
4R 64GB 512GB 2666
4R 4R 128GB 1TB 2133
8R 128GB 1TB 2666
4R 8R 192GB 1.5TB 2133
8R 8R 256GB 2TB 2133
LRDIMM 3DS
2R2H 64GB 512GB 2400
2R2H 2R2H 128GB 1TB 1866
2R4H 128GB 1TB 2400
2R2H 2R4H 192GB 1.5TB 1866
2R4H 2R4H 256GB 2TB 1866
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