Supermicro H11DST-B User

H11DST-B

USER’S MANUAL

Revision 1.0

The information in this User’s Manual has been carefully reviewed and is believed to be accurate. The vendor assumes
no responsibility for any inaccuracies that may be contained in this document, and makes no commitment to update
or to keep current the information in this manual, or to notify any person or organization of the updates. Please Note:

For the most up-to-date version of this manual, please see our website at www.supermicro.com.

Super Micro Computer, Inc. ("Supermicro") reserves the right to make changes to the product described in this manual
at any time and without notice. This product, including software and documentation, is the property of Supermicro and/
or its licensors, and is supplied only under a license. Any use or reproduction of this product is not allowed, except
as expressly permitted by the terms of said license.

IN NO EVENT WILL Super Micro Computer, Inc. BE LIABLE FOR DIRECT, INDIRECT, SPECIAL, INCIDENTAL,
SPECULATIVE OR CONSEQUENTIAL DAMAGES ARISING FROM THE USE OR INABILITY TO USE THIS PRODUCT
OR DOCUMENTATION, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. IN PARTICULAR, SUPER
MICRO COMPUTER, INC. SHALL NOT HAVE LIABILITY FOR ANY HARDWARE, SOFTWARE, OR DATA STORED
OR USED WITH THE PRODUCT, INCLUDING THE COSTS OF REPAIRING, REPLACING, INTEGRATING,
INSTALLING OR RECOVERING SUCH HARDWARE, SOFTWARE, OR DATA.

Any disputes arising between manufacturer and customer shall be governed by the laws of Santa Clara County in the
State of California, USA. The State of California, County of Santa Clara shall be the exclusive venue for the resolution
of any such disputes. Supermicro's total liability for all claims will not exceed the price paid for the hardware product.

FCC Statement: This equipment has been tested and found to comply with the limits for a Class A digital device
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful
interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can
radiate radio frequency energy and, if not installed and used in accordance with the manufacturer’s instruction manual,
may cause harmful interference with radio communications. Operation of this equipment in a residential area is likely
to cause harmful interference, in which case you will be required to correct the interference at your own expense.

California Best Management Practices Regulations for Perchlorate Materials: This Perchlorate warning applies only
to products containing CR (Manganese Dioxide) Lithium coin cells. “Perchlorate Material-special handling may apply.
See www.dtsc.ca.gov/hazardouswaste/perchlorate”.

WARNING: Handling of lead solder materials used in this product may expose you to lead, a
chemical known to the State of California to cause birth defects and other reproductive harm.

The products sold by Supermicro are not intended for and will not be used in life support systems, medical equipment,
nuclear facilities or systems, aircraft, aircraft devices, aircraft/emergency communication devices or other critical

systems whose failure to perform be reasonably expected to result in signicant injury or loss of life or catastrophic

property damage. Accordingly, Supermicro disclaims any and all liability, and should buyer use or sell such products
for use in such ultra-hazardous applications, it does so entirely at its own risk. Furthermore, buyer agrees to fully
indemnify, defend and hold Supermicro harmless for and against any and all claims, demands, actions, litigation, and
proceedings of any kind arising out of or related to such ultra-hazardous use or sale.

Manual Revision 1.0

Release Date: October 23, 2017

Unless you request and receive written permission from Super Micro Computer, Inc., you may not copy any part of this

document. Information in this document is subject to change without notice. Other products and companies referred

to herein are trademarks or registered trademarks of their respective companies or mark holders.

Copyright © 2017 by Super Micro Computer, Inc.
All rights reserved.

Printed in the United States of America

Preface

Preface

About This Manual

This manual is written for system integrators, IT technicians and knowledgeable end users.
It provides information for the installation and use of the H11DST-B motherboard.

About This Motherboard

Built upon the functionality and capability of the EPYC 7000 series processor, the H11DST-B
motherboard provides superior graphics capability and system performance while consuming
little power. Please note that this motherboard is intended to be installed and serviced by
professional technicians only. For processor/memory updates, please refer to our website at
http://www.supermicro.com/products/.

Conventions Used in the Manual

Special attention should be given to the following symbols for proper installation and to prevent

damage done to the components or injury to yourself:

Warning! Indicates important information given to prevent equipment/property damage

or personal injury.

Warning! Indicates high voltage may be encountered when performing a procedure.

3

H11DST-B User's Manual

Contacting Supermicro

Headquarters

Address: Super Micro Computer, Inc.

980 Rock Ave.

San Jose, CA 95131 U.S.A.

Tel: [phone]

Fax: [phone]

Email: [e-mail] (General Information)

[e-mail] (Technical Support)

Website: www.supermicro.com

Europe

Address: Super Micro Computer B.V.

Het Sterrenbeeld 28, 5215 ML

's-Hertogenbosch, The Netherlands

Tel: [phone]

Fax: [phone]

Email: [e-mail] (General Information)

[e-mail] (Technical Support)

[e-mail] (Customer Support)

Website: www.supermicro.nl

Asia-Pacic

Address: Super Micro Computer, Inc.

3F, No. 150, Jian 1st Rd.

Zhonghe Dist., New Taipei City 235

Taiwan (R.O.C)

Tel: [phone]

Fax: [phone]

Email: [e-mail]

Website: www.supermicro.com.tw

4

Preface

Table of Contents

Chapter 1 Introduction

1.1 Quick Reference .................................................................................................................11

Quick Reference Table ......................................................................................................13

Motherboard Features .......................................................................................................14

1.2 Processor and Chipset Overview .......................................................................................17

1.3 Special Features ................................................................................................................17

Recovery from AC Power Loss .........................................................................................17

1.4 System Health Monitoring ..................................................................................................18

Onboard Voltage Monitors ................................................................................................18

Fan Status Monitor with Firmware Control .......................................................................18

Environmental Temperature Control .................................................................................18

System Resource Alert......................................................................................................18

1.5 ACPI Features ....................................................................................................................19

1.6 Power Supply .....................................................................................................................19

1.7 Super I/O ............................................................................................................................19

Chapter 2 Installation

2.1 Static-Sensitive Devices .....................................................................................................20

Precautions .......................................................................................................................20

Unpacking .........................................................................................................................20

2.2 Motherboard Installation .....................................................................................................21

Location of Mounting Holes ..............................................................................................21

Installing the Motherboard.................................................................................................23

2.3 Processor and Heatsink Installation ...................................................................................24

2.4 Memory Support and Installation .......................................................................................31

Memory Support ............................................................................................................31

DIMM Module Population ..................................................................................................32

DIMM Installation ..............................................................................................................33

DIMM Removal .................................................................................................................33

2.5 Rear I/O Ports ....................................................................................................................34

2.6 Front Control Panel ...........................................................................................................35

5

H11DST-B User's Manual

2.7 Connectors .........................................................................................................................36

2.8 Jumper Settings .................................................................................................................39

How Jumpers Work ...........................................................................................................39

2.9 LED Indicators ....................................................................................................................42

2.10 PCI-E 3.0 Slots .................................................................................................................44

Chapter 3 Troubleshooting

3.1 Troubleshooting Procedures ..............................................................................................45

Before Power On ..............................................................................................................45

No Power ..........................................................................................................................45

No Video ...........................................................................................................................46

System Boot Failure ..........................................................................................................46

Memory Errors ..................................................................................................................46

When the System Loses its Setup Conguration .............................................................46

When the System Becomes Unstable ..............................................................................47

3.2 Technical Support Procedures ...........................................................................................48

3.3 Frequently Asked Questions ..............................................................................................48

3.4 Returning Merchandise for Service ....................................................................................50

3.5 Battery Removal and Installation .......................................................................................50

Battery Removal ................................................................................................................50

Proper Battery Disposal ....................................................................................................51

Battery Installation .............................................................................................................51

Chapter 4 BIOS

4.1 Introduction .........................................................................................................................52

Starting the Setup Utility ...................................................................................................52

4.2 Main Setup .........................................................................................................................53

4.3 Advanced ............................................................................................................................55

4.4 IPMI ....................................................................................................................................69

4.5 Event Logs .........................................................................................................................73

4.6 Security ...............................................................................................................................75

4.7 Boot ....................................................................................................................................78

4.8 Save & Exit .........................................................................................................................80

6

Preface

Appendix A BIOS Codes

A.1 BIOS POST Codes ...........................................................................................................82

Appendix B Software Installation

B.1 Installing Software Programs .............................................................................................83

B.2 SuperDoctor® 5 ...................................................................................................................84

Appendix C Standardized Warning Statements

C-1 Battery Handling .................................................................................................................85

C-2 Product Disposal ................................................................................................................87

Appendix D UEFI BIOS Recovery

D.1 Overview .............................................................................................................................88

D.2 Recovering the UEFI BIOS Image .....................................................................................88

D.3 Recovering the BIOS Block with a USB Device ................................................................88

7

H11DST-B User's Manual

Chapter 1

Introduction

Congratulations on purchasing your computer motherboard from an industry leader. Supermicro
boards are designed to provide you with the highest standards in quality and performance.

In addition to the motherboard, several important parts that are included with the system are
listed below. If anything listed is damaged or missing, please contact your retailer.

Important Links

For your system to work properly, please follow the links below to download all necessary
drivers/utilities and the user’s manual for your server.

• Supermicro product manuals: http://www.supermicro.com/support/manuals/

• Product drivers and utilities: ftp://ftp.supermicro.com

• Product safety info: http://www.supermicro.com/about/policies/safety_information.cfm

• If you have any questions, please contact our support team at: [e-mail]

This manual may be periodically updated without notice. Please check the Supermicro website
for possible updates to the manual revision level.

8

Chapter 1: Introduction

Figure 1-1. H11DST-B Motherboard Image

Note: All graphics shown in this manual were based upon the latest PCB revision available

at the time of publication of the manual. The motherboard you received may or may not look
exactly the same as the graphics shown in this manual.

9

H11DST-B User's Manual

BMC FLASH

Figure 1-2. H11DST-B Motherboard Layout

10

1.1 Quick Reference

UID LED

BMC_HB_LED

JPB1
JPG1
JWD1

JDBG1

PWR_OK_LED

SXB3

IPMI LAN

UID SW

SATA 6

USB0/1

BMC FLASH

JTPM1

VGA

COM1

FAN3

FAN4
JBT1

Chapter 1: Introduction

SIOM

SXB4

JF2

JSD1

USB3

SXB1

P1-DIMMA1
P1-DIMMB1
P1-DIMMC1
P1-DIMMD1

SXB2

P2-DIMME1
P2-DIMMF1
P2-DIMMG1
P2-DIMMH1

JSDCARD1

J2 (PCI-E/SATA M.2)

P1-DIMME1
P1-DIMMF1
P1-DIMMG1
P1-DIMMH1

CPU1

P2-DIMMA1

P2-DIMMB1
P2-DIMMC1
P2-DIMMD1

CPU2

JF1

BT1

11

H11DST-B User's Manual

Notes:

• See Chapter 2 for detailed information on jumpers, I/O ports, and JF1 front panel

connections.

• Jumpers/LED indicators not indicated are used for testing only.

• Use only the correct type of onboard CMOS battery as specied by the manufacturer. Do

not install the onboard battery upside down to avoid possible explosion.

12

Chapter 1: Introduction

Quick Reference Table

Jumper Description Default Setting

UID SW Unit ID switch (push-button toggle switch ON/OFF) Off

JBT1 Clear CMOS Open (Normal)

JPB1 BMC Enable/Disable Pins 1-2: (Enabled)

JPG1 VGA Enable/Disable Pins 1-2 (Enabled)

JDBG1 Debug mode control Pins 1-2: Normal mode

JWD1 Watch Dog control Pins 1-2 (Reset)

LED Description Status

UID LED1 Rear unit ID LED Solid blue: UID switched to ON, unit identied

BMC_HB LED2 BMC Heartbeat LED Green: Blinking (BMC normal), Green: Fast blinking (BMC initializing)

PWR_OK LED3 Power OK LED Green: System power OK

Connector Description

Battery (BT1) Onboard CMOS battery

COM 1 Front panel COM port #1

FAN 3/4 System cooling fan headers

IPMI_LAN Dedicated IPMI LAN port

JF1 Front control panel

JF2 PCI-E 3.0 x4 slot supported by CPU2

JSD1 SATA DOM power connector

JSDCARD1 Micro SD Card slot

JTPM1 Trusted Platform Module (TPM)/Port 80 connector

SIOM PCI-E 3.0 x16 slot for proprietary add-on module supported by CPU1

SXB1 PCI-E 3.0 x4 slot supported by CPU2 and SATA connections (SATA0~5) by CPU1

SXB2 PCI-E 3.0 x24 slot supported by CPU2

SXB3 PCI-E 3.0 x16 left hand riser slot supported by CPU1

SXB4 PCI-E 3.0 x16 right hand riser slot supported by CPU1

SATA 6 SATA DOM with power-pin connector

J2 M.2 connector PCI-E 3.0 x4 supported by CPU1 and SATA7 connection

USB 0/1 (3.0) Back panel USB 3.0 ports

USB3 (2.0) Internal USB 2.0 port

VGA Back panel VGA port

Note: Jumpers, connectors, switches, and LED indicators that are not described in the
preceding tables are for manufacturing testing purposes only, and are not covered in this
manual.

13

H11DST-B User's Manual

Motherboard Features

Features

CPU

• Dual EPYC 7000 series processor, in SP3 sockets

Memory

• Up to 2 TB of ECC DDR4 2667 MHz speed, RDIMM/LRDIMM/3DS/NVDIMM memory in Sixteen (16) slots

DIMM Size

• Up to 128GB size at 1.2V

Chipset

• System on Chip

Expansion Slots

• 2 x PCI-E 3.0 x16 via CPU1 on Riser Cards (SXB3, SXB4)

• 1 x PCI-E 3.0 x4 via CPU2 and SATA 0~5 (SXB1)

• 1 x PCI-E 3.0 x4 via CPU2 (JF2)

• 1 x PCI-E 3.0 x4 M.2 Port

• 1 x PCI-E 3.0 x24 via CPU2 (SXB2)

Network

• ATEN IPMI from ASPEED AST 2500 BMC for gigabit RJ45 port

Graphics

• ASPEED AST2500 BMC chip with one (1) VGA port

I/O Devices

• One (1) COM connector

• Six (6) SATA 3.0 ports (via riser card)

• One (1) SATA-DOM port

• One (1) SATA port via M.2 Slot

Peripheral Devices

• Two (2) USB 3.0 “Type A” ports on the rear I/O panel (USB 0/1)

• One (1) USB 2.0 internal "Type A" connection (USB 3)

BIOS

• 128Mb SPI AMI BIOS

®

• ACPI 5.1, SMBIOS 3.1.1, Plug-and-Play (PnP), BIOS rescue hot-key, RTC (Real Time Clock) wake up, Riser Card Auto-

Detection Support

Note: The table above is continued on the next page.

14

Chapter 1: Introduction

Features

Power Management

• ACPI power management (S5)

• Power button override mechanism

• Power-on mode for AC power recovery

System Health Monitoring

• Onboard voltage monitoring for +3.3V, +5V, +12V, +3.3V Standby, +5V Standby, VBAT, Vcore, Vsoc, and memory

• Onboard monitoring for CPU, system, and memory temperature

• CPU switching phase voltage regulator

• CPU Thermal Trip support

Fan Control

• Dual cooling zones

• Low-noise fan speed control

• Pulse Width Modulation (PWM) fan control

System Management

• Trusted Platform Module (TPM) support

• System resource alert via SuperDoctor® 5

• SuperDoctor® 5, Watch Dog

• Non-Maskable Interrupt (NMI)

• QA2, SUM-InBand, SUM-OOB, IPMICFG, IPMIVIew, SMCIPMITOOL

LED Indicators

• Power State Indicator

• CPU/Overheating

• Fan Failure

• LAN activity

• UID / Remote UID

Dimensions

• 18.86" (L) x 7.62" (W), 479.04 mm x 193.04 mm

15

H11DST-B User's Manual

5

4

3

2

1

H11DST-B
AMD SP3

SXB3

CPU0 P1 [15:0]

JF2

CPU1 P2 [15:12]

BIOS ROM
16MB

Micro SD

DDR4

BMC ROM
32MB

MUX

VGA COM

BMC
AST2500

SPI

TPM

SPI

Rear USB
X 2

CPU0 USB2 [1_2]

CPU0 P0 [8]

LPC

IPMI LAN
RJ45

PHY
RTL8211F

CPU0 USB2 [0_1:0]

CPU0 USB3 [0_1:0]

CPU0 P0 [15:12]

CPU0 P0 SATA[7]

RMII

JSIOM1

J2

M.2 Conn
M key

CPU0 P3 [15:0]

SXB4

CPU0 P2 [15:0]

SXB1

CPU0 P0 SATA[5:0]

SXB2

CPU1 P3 [15:0]

CPU1 P0 [15:8]

CPU1 P2 [11:8]

JUSBA1

USB2.0
Type A

#0

#0

CPU0 USB2 [1_3]

AMD SP3

E F GHABCD

#0

CPU0

DDR4 DIMM#0DDR4 DIMM#0DDR4 DIMM#0DDR4 DIMM

xGMI

AMD SP3

G

DDR4 DIMM#0DDR4 DIMM#0DDR4 DIMM#0DDR4 DIMM

CPU1

xGMI

ABCDHGFE

#0

DDR4 DIMM#0DDR4 DIMM

CPU0 P0 SATA[6]

G

SATA6

SATA
DOM

DDR4 DIMM#0DDR4 DIMM#0DDR4 DIMM#0DDR4 DIMM

#0

DDR4 DIMM#0DDR4 DIMM

Figure 1-3.

System Block Diagram

Note: This is a general block diagram and may not exactly represent the features on your

motherboard. See the previous pages for the actual specications of your motherboard.

16

Chapter 1: Introduction

1.2 Processor and Chipset Overview

The H11DST-B motherboard offers maximum I/O expandability, energy efciency, and data

reliability in a 14-nm process architecture, and is optimized for high performance computing,
NVMe storage solutions, and ideal for High Density Data Center applications.

The H11DST-B supports the new microarchitecture 14 nm process technology, which
drastically increases system performance for a multitude of server applications.

The EPYC 7000 series processor supports the following features:

• ACPI Power Management Logic Support Rev. 6.1

• Adaptive Thermal Management/Monitoring

• PCI-E 3.0, SATA 3.0 w/transfer rates of up to 6 Gb/s

• System Management Bus (SMBus) Specication Version 2.0

1.3 Special Features

This section describes the health monitoring features of the H11DST-B motherboard. The
motherboard has an onboard System Hardware Monitor chip that supports system health
monitoring.

Recovery from AC Power Loss

The Basic I/O System (BIOS) provides a setting that determines how the system will respond
when AC power is lost and then restored to the system. You can choose for the system to
remain powered off (in which case you must press the power switch to turn it back on), or
for it to automatically return to the power-on state. See the Advanced BIOS Setup section
for this setting. The default setting is Last State.

17

H11DST-B User's Manual

1.4 System Health Monitoring

This section describes the health monitoring features of the H11DST-B motherboard. The
motherboard has an onboard Baseboard Management Controller (BMC) chip that supports
system health monitoring. Once a voltage becomes unstable, a warning is given or an error

message is sent to the screen. The user can adjust the voltage thresholds to dene the

sensitivity of the voltage monitor.

Onboard Voltage Monitors

The onboard voltage monitor will continuously scan crucial voltage levels. Once a voltage
becomes unstable, it will give a warning or send an error message to the screen. Users can

adjust the voltage thresholds to dene the sensitivity of the voltage monitor. Real time readings

of these voltage levels are all displayed in BMC.

Fan Status Monitor with Firmware Control

Users can check the RPM status of the cooling fans through the IPMI Web interface. The
chassis fans are controlled by Thermal Management.

Environmental Temperature Control

The thermal control sensor monitors the CPU temperature in real time and will turn on the

thermal control fan whenever the CPU temperature exceeds a user-dened threshold. The

overheat circuitry runs independently from the CPU. Once the thermal sensor detects that
the CPU temperature is too high, it will automatically turn on the thermal fans to prevent the
CPU from overheating. The onboard chassis thermal circuitry can monitor the overall system
temperature and alert the user when the chassis temperature is too high.

Note: To avoid possible system overheating, please be sure to provide adequate airow to

your system.

System Resource Alert

This feature is available when used with SuperDoctor 5®. SuperDoctor 5 is used to notify the

user of certain system events. For example, you can congure SuperDoctor 5 to provide you

with warnings when the system temperature, CPU temperatures, voltages and fan speeds

go beyond a predened range.

18

Chapter 1: Introduction

1.5 ACPI Features

ACPI stands for Advanced Conguration and Power Interface. The ACPI specication denes
a exible and abstract hardware interface that provides a standard way to integrate power

management features throughout a computer system including its hardware, operating system
and application software. This enables the system to automatically turn on and off peripherals
such as network cards, hard disk drives and printers.

In addition to enabling operating system-directed power management, ACPI also provides a
generic system event mechanism for Plug and Play and an operating system-independent

interface for conguration control. ACPI leverages the Plug and Play BIOS data structures

while providing a processor architecture-independent implementation that is compatible with
Windows 2012/R2 and Windows 2016 operating systems.

1.6 Power Supply

As with all computer products, a stable power source is necessary for proper and reliable
operation. It is even more important for processors that have high CPU clock rates. In areas

where noisy power transmission is present, you may choose to install a line lter to shield

the computer from noise. It is recommended that you also install a power surge protector to
help avoid problems caused by power surges.

1.7 Super I/O

The ASpeed AST2500 Super I/O provides one high-speed, 16550 compatible Universal
Asynchronous Receiver/Transmitter (UART), which support serial infrared communications.
This UART includes a send/receive FIFO, a programmable baud rate generator, complete
modem control capability and a processor interrupt system. This UART provides legacy speed
with baud rate of up to 115.2 Kbps as well as an advanced speed with baud rates of 250 K,
500 K, or 1 Mb/s, which support higher speed modems.

The Super I/O provides functions that comply with ACPI (Advanced Conguration and Power

Interface), which includes support of legacy and ACPI power management through the System
Management Interrupt (SMI) or System Control Interrupt (SCI). It also features auto power
management to reduce power consumption.

19

H11DST-B User's Manual

Chapter 2

Installation

2.1 Static-Sensitive Devices

Electrostatic Discharge (ESD) can damage electronic com ponents. To prevent damage to your
motherboard, it is important to handle it very carefully. The following measures are generally

sufcient to protect your equipment from ESD.

Precautions

• Use a grounded wrist strap designed to prevent static discharge.

• Touch a grounded metal object before removing the board from the antistatic bag.

• Handle the board by its edges only; do not touch its components, peripheral chips, memory

modules or gold contacts.

• When handling chips or modules, avoid touching their pins.

• Put the motherboard and peripherals back into their antistatic bags when not in use.

• For grounding purposes, make sure that your chassis provides excellent conductivity be-

tween the power supply, the case, the mounting fasteners and the motherboard.

• Use only the correct type of CMOS onboard battery as specied by the manufacturer. Do

not install the CMOS battery upside down, which may result in a possible explosion.

Unpacking

The motherboard is shipped in antistatic packaging to avoid static damage. When unpacking
the motherboard, make sure that the person handling it is static protected.

20

Chapter 2: Installation

2.2 Motherboard Installation

All motherboards have standard mounting holes to t different types of chassis. Make sure

that the locations of all the mounting holes for both the motherboard and the chassis match.
Although a chassis may have both plastic and metal mounting fasteners, metal ones are
highly recommended because they ground the motherboard to the chassis. Make sure that
the metal standoffs click in or are screwed in tightly.

Phillips

Screwdriver (1)

Phillips Screws

Tools Needed

Standoffs (11)

Only if Needed

Location of Mounting Holes

Notes:

1. To avoid damaging the motherboard and its components, please do not use a force
greater than 8 lb/inch on each mounting screw during motherboard installation.

2. Some components are very close to the mounting holes. Please take precautionary
measures to avoid damaging these components when installing the motherboard to the
chassis.

21

H11DST-B User's Manual

Figure 2-1. Motherboard Mounting Holes

22

Chapter 2: Installation

Installing the Motherboard

1. Install the I/O shield into the back of the chassis.

2. Locate the mounting holes on the motherboard. See the previous page for the locations.

3. Locate the matching mounting holes on the chassis. Align the mounting holes on the
motherboard with the mounting holes on the chassis.

4. Install standoffs in the chassis as needed.

5. Install the motherboard into the chassis carefully to avoid damaging other motherboard
components.

6. Using the Phillips screwdriver, insert a Phillips head #6 screw into a mounting hole on
the motherboard and its matching mounting hole on the chassis.

7. Repeat Step 5 to insert #6 screws into all mounting holes.

8. Make sure that the motherboard is securely placed in the chassis.

Note: Images displayed are for illustration only. Your chassis or components might look
different from those shown in this manual.

23

H11DST-B User's Manual

2.3 Processor and Heatsink Installation

Warning: When handling the processor package, avoid placing direct pressure on the label

area of the fan.

Important:

• For the Processor/Heatsink installation you need to use a T20 screwdriver when opening/

closing the CPU socket.

• Always connect the power cord last, and always remove it before adding, removing or

changing any hardware components. Make sure that you install the processor into the
CPU socket before you install the CPU heatsink.

• If you buy a CPU separately, make sure that you use an AMD-certied heatsink only. Make

sure to install the motherboard into the chassis before you install the CPU heatsink.

• When receiving a motherboard without a processor pre-installed, make sure that the plastic

CPU socket cap is in place and none of the socket pins are bent; otherwise, contact your
retailer immediately.

• Refer to the Supermicro website for updates on CPU support.

Installing the Processor and Heatsink

1. Unscrew the screws holding down Force Frame in the sequence of 3-2-1. The screws
are numbered on the force frame next to each screw hole.

Screw #3

Screw #1

Screw #2

Force Frame

24

Chapter 2: Installation

2. The spring-loaded force frame will raise up after the last screw securing it (#1) is
removed. Gently allow it to lift up to its stopping position.

3. Lift the rail frame up by gripping the lift tabs near the front end of the rail frame. While
keeping a secure grip of the rail frame, lift it to a position so you can do the next step of
removing the external cap.

Note: The rail frame is spring loaded, so keep a secure grip on it as you lift it so it does
not snap up.

Rail Frame

PnP Cover Cap

25

H11DST-B User's Manual

4. Remove the external cap from the Rail Frame by pulling it upwards through the rail
guides on the rail frame.

External Cap

PnP Cover Cap

5. The CPU package is shipped from the factory with the blue carrier frame pre-assembled.
Grip the handle of the carrier frame/CPU package assembly from its shipping tray, and

while gripping the handle, align the anges of the carrier frame onto the rails of the rail

frame so its pins will be at the bottom when the rail frame is lowered later.

6. Slide the carrier frame/CPU package downwards to the bottom of the rail frame. Ensure

the anges are secure on the rails as you lower it downwards.

Carrier Frame/

CPU Package

26

Chapter 2: Installation

Note: You can only install the CPU inside the socket in one direction with the handle at the
top. Make sure that it is properly inserted into the CPU socket before closing the rail frame
plate. If it doesn't close properly, do not force it as it may damage your CPU. Instead, open
the rail frame plate again, and double-check that the CPU is aligned properly.

7. Lift up the rail frame till it securely rests in upright position. Then remove the PnP cover
cap from the CPU socket below. Grip the two lift tabs marked "Remove" at the middle of
the cap and pull vertically upwards to remove the PnP cover cap.

Warning! The exposed socket contacts are extremely vulnerable and can be damaged easily.
Do not touch or drop objects onto the contacts and be careful removing the PnP cover cap and
when placing the rail frame over the socket.

8. Gently lower the rail frame down onto the socket until the latches on the rail frame
engage with the socket housing and it rests in place. DO NOT force it into place!

27

H11DST-B User's Manual

9. Gently lower the force frame down onto the rail frame and hold it in place until it is
seated in the Socket housing. Note that the force frame is spring loaded and has to be
held in place before it is secured.

10. Place and re-screw the screws in the reverse order to the way you removed them

(holes 1-2-3 in order). When nished, the force frame will be secure over both the rail

frame and CPU package.

28