Supermicro H11DSi, H11DSi-NT Instruction manual

H11DSi / H11DSi-NT

USER’S MANUAL

Revision 1.1a

The information in this User’s Manual has been carefully reviewed and is believed to be accurate. The vendor assumes
no responsibility for any inaccuracies that may be contained in this document, and makes no commitment to update
or to keep current the information in this manual, or to notify any person or organization of the updates. Please Note:

For the most up-to-date version of this manual, please see our website at www.supermicro.com.

Super Micro Computer, Inc. ("Supermicro") reserves the right to make changes to the product described in this manual
at any time and without notice. This product, including software and documentation, is the property of Supermicro and/
or its licensors, and is supplied only under a license. Any use or reproduction of this product is not allowed, except
as expressly permitted by the terms of said license.

IN NO EVENT WILL Super Micro Computer, Inc. BE LIABLE FOR DIRECT, INDIRECT, SPECIAL, INCIDENTAL,
SPECULATIVE OR CONSEQUENTIAL DAMAGES ARISING FROM THE USE OR INABILITY TO USE THIS PRODUCT
OR DOCUMENTATION, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. IN PARTICULAR, SUPER
MICRO COMPUTER, INC. SHALL NOT HAVE LIABILITY FOR ANY HARDWARE, SOFTWARE, OR DATA STORED
OR USED WITH THE PRODUCT, INCLUDING THE COSTS OF REPAIRING, REPLACING, INTEGRATING,
INSTALLING OR RECOVERING SUCH HARDWARE, SOFTWARE, OR DATA.

Any disputes arising between manufacturer and customer shall be governed by the laws of Santa Clara County in the
State of California, USA. The State of California, County of Santa Clara shall be the exclusive venue for the resolution
of any such disputes. Supermicro's total liability for all claims will not exceed the price paid for the hardware product.

FCC Statement: This equipment has been tested and found to comply with the limits for a Class A digital device
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful
interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can
radiate radio frequency energy and, if not installed and used in accordance with the manufacturer’s instruction manual,
may cause harmful interference with radio communications. Operation of this equipment in a residential area is likely
to cause harmful interference, in which case you will be required to correct the interference at your own expense.

California Best Management Practices Regulations for Perchlorate Materials: This Perchlorate warning applies only
to products containing CR (Manganese Dioxide) Lithium coin cells. “Perchlorate Material-special handling may apply.
See www.dtsc.ca.gov/hazardouswaste/perchlorate”.

WARNING: Handling of lead solder materials used in this product may expose you to lead, a
chemical known to the State of California to cause birth defects and other reproductive harm.

The products sold by Supermicro are not intended for and will not be used in life support systems, medical equipment,
nuclear facilities or systems, aircraft, aircraft devices, aircraft/emergency communication devices or other critical

systems whose failure to perform be reasonably expected to result in signicant injury or loss of life or catastrophic

property damage. Accordingly, Supermicro disclaims any and all liability, and should buyer use or sell such products
for use in such ultra-hazardous applications, it does so entirely at its own risk. Furthermore, buyer agrees to fully
indemnify, defend and hold Supermicro harmless for and against any and all claims, demands, actions, litigation, and
proceedings of any kind arising out of or related to such ultra-hazardous use or sale.

Manual Revision 1.1a

Release Date: August 06, 2020

Unless you request and receive written permission from Super Micro Computer, Inc., you may not copy any part of this

document. Information in this document is subject to change without notice. Other products and companies referred

to herein are trademarks or registered trademarks of their respective companies or mark holders.

Copyright © 2020 by Super Micro Computer, Inc.
All rights reserved.

Printed in the United States of America

Preface

Preface

About This Manual

This manual is written for system integrators, IT technicians and knowledgeable end users.
It provides information for the installation and use of the H11DSi / H11DSi-NT motherboard.

About This Motherboard

Built upon the functionality and capability of the EPYC 7001/7002* Series Processors ,
the H11DSi / H11DSi-NT motherboard provides superior graphics capability and system
performance while consuming little power. Please note that this motherboard is intended to
be installed and serviced by professional technicians only. For processor/memory updates,
please refer to our website at http://www.supermicro.com/products/.

*AMD EPYC 7002 series drop-in support requires board revision 2.x

Conventions Used in the Manual

Special attention should be given to the following symbols for proper installation and to prevent

damage done to the components or injury to yourself:

Warning! Indicates important information given to prevent equipment/property damage

or personal injury.

Warning! Indicates high voltage may be encountered when performing a procedure.

3

H11DSi / H11DSi-NT User's Manual

Contacting Supermicro

Headquarters

Address: Super Micro Computer, Inc.

980 Rock Ave.

San Jose, CA 95131 U.S.A.

Tel: [phone]

Fax: [phone]

Email: [e-mail] (General Information)

[e-mail] (Technical Support)

Website: www.supermicro.com

Europe

Address: Super Micro Computer B.V.

Het Sterrenbeeld 28, 5215 ML

's-Hertogenbosch, The Netherlands

Tel: [phone]

Fax: [phone]

Email: [e-mail] (General Information)

[e-mail] (Technical Support)

[e-mail] (Customer Support)

Website: www.supermicro.nl

Asia-Pacic

Address: Super Micro Computer, Inc.

3F, No. 150, Jian 1st Rd.

Zhonghe Dist., New Taipei City 235

Taiwan (R.O.C)

Tel: [phone]

Fax: [phone]

Email: [e-mail]

Website: www.supermicro.com.tw

4

Preface

Table of Contents

Chapter 1 Introduction

Quick Reference ...............................................................................................................11

Quick Reference Table ......................................................................................................12

Motherboard Features .......................................................................................................14

1.2 Processor and Chipset Overview .......................................................................................17

1.3 Special Features ................................................................................................................17

Recovery from AC Power Loss .........................................................................................17

1.4 System Health Monitoring ..................................................................................................18

Onboard Voltage Monitors ................................................................................................18

Fan Status Monitor with Firmware Control .......................................................................18

Environmental Temperature Control .................................................................................18

System Resource Alert......................................................................................................18

1.5 ACPI Features ....................................................................................................................19

1.6 Power Supply .....................................................................................................................19

1.7 Super I/O ............................................................................................................................19

Chapter 2 Installation

2.1 Static-Sensitive Devices .....................................................................................................20

Precautions .......................................................................................................................20

Unpacking .........................................................................................................................20

2.2 Motherboard Installation .....................................................................................................21

Location of Mounting Holes ..............................................................................................21

Installing the Motherboard.................................................................................................23

2.3 Processor and Heatsink Installation ...................................................................................24

Memory Support and Installation ......................................................................................31

Memory Support ............................................................................................................31

DIMM Module Population ..................................................................................................33

DIMM Installation ..............................................................................................................34

DIMM Removal .................................................................................................................34

2.5 Rear I/O Ports ....................................................................................................................35

2.6 Front Control Panel ............................................................................................................37

2.7 Connectors .........................................................................................................................40

5

H11DSi / H11DSi-NT User's Manual

Power Connections ...........................................................................................................40

Headers .............................................................................................................................41

2.8 Jumper Settings .................................................................................................................44

How Jumpers Work ...........................................................................................................44

2.9 LED Indicators ....................................................................................................................47

Chapter 3 Troubleshooting

3.1 Troubleshooting Procedures ..............................................................................................49

Before Power On ..............................................................................................................49

No Power ..........................................................................................................................49

No Video ...........................................................................................................................50

System Boot Failure ..........................................................................................................50

Memory Errors ..................................................................................................................50

What to do if the System is Losing the Setup Conguration............................................50

When the System Becomes Unstable ..............................................................................51

3.2 Technical Support Procedures ...........................................................................................52

3.3 Frequently Asked Questions ..............................................................................................52

3.4 Returning Merchandise for Service ....................................................................................55

3.5 Battery Removal and Installation .......................................................................................56

Battery Removal ................................................................................................................56

Proper Battery Disposal ....................................................................................................56

Battery Installation .............................................................................................................56

Chapter 4 BIOS (EPYC 7001 Series)

4.1 Introduction .........................................................................................................................57

Starting the Setup Utility ...................................................................................................57

4.2 Main Setup .........................................................................................................................58

4.3 Advanced ............................................................................................................................60

4.4 IPMI ....................................................................................................................................75

4.5 Event Logs .........................................................................................................................78

4.6 Security ...............................................................................................................................80

4.7 Boot ....................................................................................................................................83

4.8 Save & Exit .........................................................................................................................85

6

Preface

Chapter 5 BIOS (EPYC 7002 Series)

5.1 Introduction .........................................................................................................................87

Starting the Setup Utility ...................................................................................................87

5.2 Main Setup .........................................................................................................................88

5.3 Advanced ............................................................................................................................90

5.4 IPMI ..................................................................................................................................107

5.5 Event Logs .......................................................................................................................110

5.6 Security .............................................................................................................................112

5.7 Boot ..................................................................................................................................115

5.8 Save & Exit .......................................................................................................................117

Appendix A Software Installation

A.1 Installing Software Programs ...........................................................................................11 9

®

A.2 SuperDoctor

5 .................................................................................................................120

Appendix B Standardized Warning Statements

B-1 Battery Handling ...............................................................................................................121

B-2 Product Disposal ..............................................................................................................123

Appendix C UEFI BIOS Recovery

C.1 Overview ...........................................................................................................................124

C.2 Recovering the UEFI BIOS Image ...................................................................................124

C.3 Recovering the BIOS Block with a USB Device ..............................................................124

7

H11DSi / H11DSi-NT User's Manual

Chapter 1

Introduction

Congratulations on purchasing your computer motherboard from an industry leader. Supermicro
boards are designed to provide you with the highest standards in quality and performance.

In addition to the motherboard, several important parts that are included with the system are
listed below. If anything listed is damaged or missing, please contact your retailer.

Important Links

For your system to work properly, please follow the links below to download all necessary
drivers/utilities and the user’s manual for your server.

• Supermicro product manuals: http://www.supermicro.com/support/manuals/

• Product drivers and utilities: ftp://ftp.supermicro.com

• Product safety info: http://www.supermicro.com/about/policies/safety_information.cfm

• If you have any questions, please contact our support team at: [e-mail]

This manual may be periodically updated without notice. Please check the Supermicro website
for possible updates to the manual revision level.

8

Chapter 1: Introduction

Figure 1-1. H11DSi / H11DSi-NT Motherboard Image

Note: All graphics shown in this manual were based upon the latest PCB revision available

at the time of publication of the manual. The motherboard you received may or may not look
exactly the same as the graphics shown in this manual.

9

H11DSi / H11DSi-NT User's Manual

Figure 1-2. H11DSi / H11DSi-NT Motherboard Layout

2-3:NMI

JVRM1 JPB1

JVR1

JL1:

CHASSIS

INTRUSION

1-2:RST

JWD1:WATCH DOG

1 3

JWD1

1
JVRM2

3

1

JPL1

3

1

JPG1

3

1

JI2C1

3

3 2 14 3 2 14

3 2 14

JNVI2C1

J27

6

JL1

JSTBY1

+

1

3

P2_NVMe1

P2_NVMe0

P2_NVME1

MH1

1

3

1

3

2-3:DISABLE

1-2:ENABLE

JI2C2:

1

JI2C2

3

JSMB

JIPMB1

JSEN1

SP1

TP138

DESIGNED IN USA

H11DSi

REV:1.01

CPU2 SLOT1 PCI-E 3.0 X8

JPCIE1

JPCIE2

A48

JSDCARD1

1-2:ENABLE

2-3:DISABLE

JI2C1:

2-3:DISABLE

JPB1:BMC

1-2:ENABLE

2-3:DISABLE

JPL1:

1-2:ENABLE

1-2:ENABLE

2-3:DISABLE

JPG1:

VGA

LAN1

P2_NVME0

LEDM1

1

CPU1 SLOT2 PCI-E 3.0 X16

S/N LABEL

BIOS LICENSE

CPU1 SATA0-3

CPU1 SLOT3 PCI-E 3.0 X8

JPCIE3

JMD1

CPU1 SLOT4 PCI-E 3.0 X16

JPCIE4

CPU2 SATA0-3

MAC CODE

CPU1 SLOT5 PCI-E 3.0 X8

JPCIE5

MH5MH4

BAR CODE

C

LED1

FAN6

MH2

VGA

A

UID

FAN5

P1-DIMMA1

P1-DIMMB1

P1-DIMMC1

P1-DIMMD1

LAN2

1

USB0/1

LAN1

IPMI_LAN
USB4/5(3.0)

CPU1

P1-DIMME1

P1-DIMMF1

P1-DIMMG1

1

P1-DIMMH1

JCOM1

COM1

MH3

ALWAYS POPULATE DIMMx1 FIRST

ALWAYS POPULATE DIMMx1 FIRST

CMOS

CLEAR

JBT1

JBT1:

BT1

+

P2-DIMMF1

P2-DIMMG1

P2-DIMMH1

ALWAYS POPULATE DIMMx1 FIRST

P2-DIMME1

A

K

Y

CPU2

P2-DIMMA1

P2-DIMMB1

P2-DIMMC1

1

P2-DIMMD1

ALWAYS POPULATE DIMMx1 FIRST

MH6

15

JPWR2

48

1

JPI2C1

5

PWR I2C

JPI2C1:

15

JPWR3

8

4

1

13

JF1

JTPM1

JTPM1:

TPM/PORT80

PWR

ON

RST

FAIL

PS

LED

UID NIC

2

JF1

NIC

1 LED

HDDPWR

LED

NMIX

LED2

JSD1

LED3

MH10

FANB

USB2/3

SATA DOM+POWER

JSD1/2:SATA DOM POWER

P2-SATA1

1

P2-SATA0

SATA DOM+POWER

IPMI CODE

MAC CODE

JSD2

RT1

MH8

FANA

41

FAN4

FAN3

JPWR1

24

12

FAN1

FAN2

MH9

41

41

10

Chapter 1: Introduction

Quick Reference

LAN1

LAN1

USB0/1

IPMI LAN

USB0/1

USB4/5

IPMI_LAN

USB4/5(3.0)

COM1

JCOM1

COM1

MH3

LEDM1

FAN6

MH1

LEDM1

1

UID LED

FAN5

FAN6

MH2

UID SW

C

LED1

A

UID

FAN5

LAN2VGA

VGA

LAN2

1

JWD1

JPL1

JSDCARD1

JPG1
JI2C1
JI2C2
JSMB

JIPMB1

SP1

JL1

JSTBY1

P2_NVME1
P2_NVME0

JTPM1

JF1

FANB

CPU2 SLOT1 PCI-E 3.0 X8

2-3:NMI

1-2:RST

JWD1:WATCH DOG

1 3

JWD1

1

1

JVRM2

JVRM1 JPB1

3

3

1

1

JPL1

JVR1

3

3

1

JPG1

3

2-3:DISABLE

1-2:ENABLE

JI2C2:

2-3:DISABLE

1

1

JI2C1

JI2C2

3

3

3 2 14 3 2 14

JSMB

JIPMB1

3 2 14

JSEN1

JNVI2C1

+

SP1

TP138

J27

6

JL1

JL1:

CPU1-SATA0-3

CHASSIS

1

INTRUSION

3

JSTBY1

DESIGNED IN USA

H11DSi

P2_NVMe1

P2_NVMe0

REV:1.01

P2_NVME1

JF1

JTPM1

JTPM1:

TPM/PORT80

PWR

ON

RST

FAIL

PS

LED

UID NIC

2

JF1

NIC

MH10

1 LED

FANB

HDDPWR

LED

NMIX

LED3

USB 2/3

1-2:ENABLE

JI2C1:

JPCIE1

A48

2-3:DISABLE

1-2:ENABLE

2-3:DISABLE

JPG1:

VGA

P2_NVME0

JPCIE2

JSDCARD1

2-3:DISABLE

JPL1:

1-2:ENABLE

JPB1:BMC

1-2:ENABLE

LAN1

LED2

LED3

USB2/3

CPU1 SLOT2 PCI-E 3.0 X16

JPCIE3

JMD1

S/N LABEL

BIOS LICENSE

CPU1 SATA0-3

LED2

JSD1

SATA DOM+POWER

P2-SATA0

P2-SATA0

P2-SATA1

JSD1

CPU1 SLOT4 PCI-E 3.0 X16

CPU1 SLOT3 PCI-E 3.0 X8

JPCIE4

P1-DIMMA1

JMD1

P1-DIMMB1
P1-DIMMC1
P1-DIMMD1

JBT1

BT1

P2-DIMME1
P2-DIMMF1
P2-DIMMG1
P2-DIMMH1

CPU2-SATA0-3

MAC CODE

CPU2 SATA0-3

MAC CODE

JSD1/2:SATA DOM POWER

JSD2

P2-SATA1

1

SATA DOM+POWER

FANA

FANA

JSD2

CPU1 SLOT5 PCI-E 3.0 X8

JPCIE5

MH5MH4

BAR CODE

IPMI CODE

RT1

MH8

P1-DIMMA1

P1-DIMMB1

P1-DIMMC1

P1-DIMMD1

ALWAYS POPULATE DIMMx1 FIRST

CPU1

P1-DIMME1

P1-DIMMF1

P1-DIMMG1

1

P1-DIMMH1

ALWAYS POPULATE DIMMx1 FIRST

P1-DIMME1

P1-DIMMF1
P1-DIMMG1
P1-DIMMH1

CPU1

CMOS
CLEAR

JBT1

JBT1:

BT1

+

P2-DIMMG1

P2-DIMMH1

P2-DIMME1

P2-DIMMF1

ALWAYS POPULATE DIMMx1 FIRST

A

K

Y

CPU2

CPU2

P2-DIMMA1

P2-DIMMB1

P2-DIMMC1

1

P2-DIMMD1

ALWAYS POPULATE DIMMx1 FIRST

MH6

JPI2C1

PWR I2C

8

13

15

JPWR2

48

1

5

JPI2C1:

15

JPWR3

4

P2-DIMMA1

1

JPWR2

JPI2C1

JPWR3

P2-DIMMB1
P2-DIMMC1
P2-DIMMD1

JPWR1

JPWR1

24

12

FAN1

FAN2

FAN2

41

41

FAN1

MH9

FAN4

FAN4

41

FAN3

FAN3

Notes:

• See Chapter 2 for detailed information on jumpers, I/O ports, and JF1 front panel

connections.

• Jumpers/LED indicators not indicated are used for testing only.

• Use only the correct type of onboard CMOS battery as specied by the manufacturer. Do

not install the onboard battery upside down to avoid possible explosion.

11

H11DSi / H11DSi-NT User's Manual

Quick Reference Table

Jumper Description Default Setting

UID SW Unit ID Switch (push-button toggle switch ON/OFF) Off

JI2C1 / JI2C2 PCI-E Slot SMB (System Management Bus) Enable/Disable Pins 2-3 (Disabled)

JBT1 CMOS Clear Open (Normal)

JPG1 VGA Enable/Disable Pins 1-2 (Enabled)

JPL1 LAN Enable/Disable Pins 1-2 (Enabled)

JWD1 Watch Dog Pins 1-2 (Reset)

LED Description Status

UID LED Unit ID LED Solid Blue: UID Switched to ON

LED2 Onboard Overheat / Fan Failure Solid Red: System Overheat, Blinking Red: Fan Failure

LED3 Onboard Power LED Off: Sytem Off, Solid Green: System ON

LEDM1 BMC Heartbeat LED Blinking Green: Normal

Connector Description

JIPMB1 System Management Bus Header

COM1 COM Port

FANA, FANB, FAN1~FAN6 4-pin System/CPU Fan Headers

P2-SATA0, P2-SATA1 SATA 3.0 Ports for SATA/DOM with integrated power

CPU1-SATA0-3, CPU2-SATA0-3 Connectors for SATA0~3, use iPass breaklout cable (4 ports each)

JF1 Front Control Panel Header 1

JL1 Chassis Intrusion Header

LAN1/LAN2 RJ45 LAN Port (H11DSi-NT supports 10Gb)

IPMI LAN Gigabit LAN (RJ45) Port for IPMI

JPWR1 24-pin Main Power Connector

JPWR2/JPWR3 8-pin Auxilliary Power Connectors

JSD1/JSD2 SATA DOM (Device on Module) power connectors 1/2

JMD1 M.2 Connector with integrated SATA/PCIe signals

JTPM1 Trusted Platform Module/Port 80 Connector

USB0/1, USB4/5 Back Panel USB Type A Ports for USB0/USB1 (2.0) and USB4/USB5 (3.0)

USB2/3 Front Panel USB Header for USB2/USB3 (2.0).

P2-NVME0/1 Processor 2 NVMe Ports 0/1 for NVMe Hard Disk Drives (H11DSi-NT only)

JSTBY1 Stand-by Power Header

BT1 On-board CMOS Backup Battery

12

Chapter 1: Introduction

Connector Description

VGA Legacy VGA video port

JSDCARD1 Micro SD Card Slot

P1-DIMMA1~P1-DIMMH1 DIMM sockets for CPU1

P2-DIMMA1~P2-DIMMH1 DIMM sockets for CPU2

CPU2 SLOT 1 X8 PCIE 3.0 Slot via CPU2

CPU1 SLOT 2, SLOT 4 X16 PCIE 3.0 Slot via CPU1

CPU1 SLOT 3, SLOT 5 X8 PCIE 3.0 Slot via CPU1

Note: Jumpers, connectors, switches, and LED indicators that are not described in the
preceding tables are for manufacturing testing purposes only, and are not covered in this
manual.

13

H11DSi / H11DSi-NT User's Manual

Motherboard Features

CPU

•

Dual EPYC 7001/7002* Series Processors, in Socket SP3. (*AMD EPYC 7002 series drop-in support requires board

revision 2.x)

Memory

•

2 TB of ECC DDR4 2666 MHz speed/ 4TB of ECC DDR4 3200 MHz* speed, RDIMM/LRDIMM/3DS/NVDIMM memory in

Sixteen (16) slots (*Board reversion 2.x required)

DIMM Size

• Up to 128GB size at 1.2V

Chipset

•

System on Chip

Motherboard Features

Expansion Slots

•

2 x PCI-E 3.0 x16

• 3 x PCI-E 3.0 x8

• 2 x Internal NVMe Ports (PCI-E 3.0 x4)

• M.2 Interface: 1 SATA/PCI-E 3.0 x2

M.2 Form Factor: 2280, 22110

M.2 Key: M-Key

Network

•

Dual RJ45 LAN Ports (H11DSi-NT: Intel X550-BT2 / (H11DSi: I350-BT2)

• ATEN IPMI from ASPEED AST 2500 BMC for gigabit RJ45 port

Graphics

•

ASPEED AST2500 BMC chip with one (1) VGA port

I/O Devices

COM Port • One (1) COM connector on rear I/O panel

•

• Eight (8) SATA 3.0 ports (iPASS)

• SATA/NVMe Ports

• Two (2) SATA-DOM ports

• Two (2) internal NVMe ports (H11DSi-NT only)

Peripheral Devices

•

Two (2) USB 3.0 “Type A” ports on the rear I/O panel (USB 4/5)

• Two (2) USB 2.0 “Type A” ports on the rear I/O panel (USB 0/1)

• One (1) USB 2.0 header for front control panel (USB 2/3)

Note: The table above is continued on the next page.

14

Chapter 1: Introduction

Motherboard Features

BIOS

•

128Mb SPI AMI BIOS (board Rev. 1.x); 256Mb SPI AMI BIOS (board Rev. 2.x)

• ACPI 6.1, SMBIOS 3.1.1, Plug-and-Play (PnP), RTC (Real Time Clock) wakeup, Riser Card Auto-Detection Support

Power Management

•

ACPI power management (S5)

• Power button override mechanism

• Power-on mode for AC power recovery

System Health Monitoring

•

Onboard voltage monitoring for 3.3V, +5V, +/- 12V, +3.3V Standby, +5V Standby, Memory, HT, Memory, CPU Temperature,

System Temperature, and Memory Temperature

• CPU switching phase voltage regulator

• CPU Thermal Trip support

Fan Control

•

Dual cooling zones

• Low-noise fan speed control

• Pulse Width Modulation (PWM) fan control

System Management

•

Trusted Platform Module (TPM) support

• System resource alert via SuperDoctor® 5

• Power Supply Monitoring (JP1

2

C1)

• SuperDoctor® 5, Watch Dog

• Chassis intrusion header and detection (JL1)

• SUM-InBand, SUM-OOB, IPMICFG, IPMIVIew, SMCIPMITOOL

LED Indicators

CPU/Overheating

•

• Fan Failure

• LAN activity

Dimensions

•

13.05" (L) x 12.00" (W) (331 mm x 305 mm)

15

H11DSi / H11DSi-NT User's Manual

H11DSi-(NT)

SYSTEM BLOCK DIAGRAM

Figure 1-3.

System Block Diagram

5 Phase VR

Slot 5 PCIe x8

Slot 4 PCIe x16

Slot 3 PCIe x8

Slot 2 PCIe x16

LAN PCIe x8

M.2 PCIe x2

iPass_0

SATA x4

Rear USB 3.0 x 2

Rear USB 2.0 x 2

SVID

PCIe3.0_x8

8.0GT/s

Die 1 15~8 (Reversed)

PCIe3.0_x16

8.0GT/s

Die 2 15~0 (Reversed)

PCIe3.0_x8

8.0GT/s

Die 0 15~8 (Reversed)

PCIe3.0_x16

8.0GT/s

Die 3 15~0 (Reversed)

PCIe3.0_x8

8.0GT/s

Die 0 7~0 (Reversed)

PCIe3.0_x2

8.0GT/s

Die 1 3~2 (Reversed)

SATA-III

6Gb/s

Die 1 7~4

USB3.0
5Gbps

USB2.0
500Mbps

P0_DIMMA

P0_DIMMB

P0_DIMMC

P0_DIMMD

2666MHz 2666MHz

SVI2

NAPLES SP3

SM-LGA 4094

VGA (KVM)

COM1 (KVM)

Health Info.

AMD

RJ45

P0_DIMME

P0_DIMMF

P0_DIMMG

P0_DIMMH

HUB

HUB

FP

USB2 x2

CPU1

AST2500

PCIe x 1

LPC

P1_DIMMA

CPU2

TPM1.2 Header

P1_DIMMC

P1_DIMMD

NAPLES SP3

SM-LGA 4094

AMD

P1_DIMME

P1_DIMMFP1_DIMMB

P1_DIMMG

P1_DIMMH

2666MHz2666MHz

SVI2

SATA-III

6Gb/s

Die 0 1~0

SATA-III

6Gb/s

Die 1 3~0

PCIe3.0_x4

8.0GT/s

Die 1 11~8

PCIe3.0_x4

8.0GT/s

Die 1 15~12

PCIe3.0_x8

8.0GT/s

Die 2 7~0

SVID

5 Phase VR

2 X SATA-III (DOM)

iPass_1

SATA x4

NVMe_0

NVMe_1

Slot 1 PCIe x8

SPI

FLASH
SPI 128Mb

Notes: 1) This is a general block diagram and may not exactly represent the features on your

motherboard. 2) See the previous pages for the actual specications of your motherboard.

3) Motherboard revision 2.x features a 32MB BIOS chip.

16

Chapter 1: Introduction

1.2 Processor and Chipset Overview

The H11DSi / H11DSi-NT motherboard offers maximum I/O expandability, energy efciency,

and data reliability in a 14nm/7nm process architecture, and is optimized for embedded
storage solutions, networking applications, or cloud-computing platforms.

The H11DSi / H11DSi-NT supports the new microarchitecture 14nm/7nm process technology,
which drastically increases system performance for a multitude of server applications.

The EPYC 7001/7002* Series Processors supports the following features:

• ACPI Power Management Logic Support Rev. 6.1

• Adaptive Thermal Management/Monitoring

• PCIe 3.0 w/ transfer rate of up to 8.0 GT/s and SATA 3.0 w/ transfer rate of up to 6.0 GB/s

• System Management Bus (SMBus) Specication Version 3.1.1

1.3 Special Features

This section describes the health monitoring features of the H11DSi / H11DSi-NT motherboard.
The motherboard has an onboard System Hardware Monitor chip that supports system health
monitoring.

Recovery from AC Power Loss

The Basic I/O System (BIOS) provides a setting that determines how the system will respond
when AC power is lost and then restored to the system. You can choose for the system to
remain powered off (in which case you must press the power switch to turn it back on), or
for it to automatically return to the power-on state. See the Advanced BIOS Setup section
for this setting. The default setting is Last State.

17

H11DSi / H11DSi-NT User's Manual

1.4 System Health Monitoring

This section describes the health monitoring features of the H11DSi / H11DSi-NT motherboard.
The motherboard has an onboard chip that supports system health monitoring. Once a voltage
becomes unstable, a warning is given or an error message is sent to the screen. The user

can adjust the voltage thresholds to dene the sensitivity of the voltage monitor.

Onboard Voltage Monitors

The onboard voltage monitor will continuously scan crucial voltage levels. Once a voltage
becomes unstable, it will give a warning or send an error message to the screen. Users can

adjust the voltage thresholds to dene the sensitivity of the voltage monitor. Real time readings

of these voltage levels are all displayed in BMC.

Fan Status Monitor with Firmware Control

Users can check the RPM status of the cooling fans through the IPMI Web interface. The
onboard CPU and chassis fans are controlled by Thermal Management.

Environmental Temperature Control

The thermal control sensor monitors the CPU temperature in real time and will turn on the

thermal control fan whenever the CPU temperature exceeds a user-dened threshold. The

overheat circuitry runs independently from the CPU. Once the thermal sensor detects that
the CPU temperature is too high, it will automatically turn on the thermal fans to prevent the
CPU from overheating. The onboard chassis thermal circuitry can monitor the overall system
temperature and alert the user when the chassis temperature is too high.

Note: To avoid possible system overheating, please be sure to provide adequate airow to

your system.

System Resource Alert

This feature is available when used with SuperDoctor 5®. SuperDoctor 5 is used to notify the

user of certain system events. For example, you can congure SuperDoctor 5 to provide you

with warnings when the system temperature, CPU temperatures, voltages and fan speeds

go beyond a predened range.

18

Chapter 1: Introduction

1.5 ACPI Features

ACPI stands for Advanced Conguration and Power Interface. The ACPI specication denes
a exible and abstract hardware interface that provides a standard way to integrate power

management features throughout a computer system including its hardware, operating system
and application software. This enables the system to automatically turn on and off peripherals
such as network cards, hard disk drives and printers.

In addition to enabling operating system-directed power management, ACPI also provides a
generic system event mechanism for Plug and Play and an operating system-independent

interface for conguration control. ACPI leverages the Plug and Play BIOS data structures

while providing a processor architecture-independent implementation that is compatible with
Windows 2012/R2 operating systems.

1.6 Power Supply

As with all computer products, a stable power source is necessary for proper and reliable
operation. It is even more important for processors that have high CPU clock rates. In areas

where noisy power transmission is present, you may choose to install a line lter to shield

the computer from noise. It is recommended that you also install a power surge protector to
help avoid problems caused by power surges.

1.7 Super I/O

The Super I/O (Aspeed AST2500 chip) includes a data separator, write pre-compensation
circuitry, decode logic, data rate selection, a clock generator, drive interface control logic and
interrupt and DMA logic. The wide range of functions integrated onto the Super I/O greatly

reduces the number of components required for interfacing with oppy disk drives.

The Super I/O provides one high-speed, 16550 compatible serial communication port
(UART), which supports serial infrared communication. This UART includes a 16-byte send/
receive FIFO, a programmable baud rate generator, complete modem control capability and
a processor interrupt system. This UART provides legacy speed with baud rate of up to

115.2 Kbps as well as an advanced speed with baud rates of 250 K, 500 K, or 1 Mb/s, which
support higher speed modems.

The Super I/O provides functions that comply with ACPI (Advanced Conguration and Power

Interface), which includes support of legacy and ACPI power management through a SMI
or SCI function pin. It also features auto power management to reduce power consumption.

The IRQs, DMAs and I/O space resources of the Super I/O can be exibly adjusted to meet

ISA PnP requirements, which support ACPI and APM (Advanced Power Management).

19

H11DSi / H11DSi-NT User's Manual

Chapter 2

Installation

2.1 Static-Sensitive Devices

Electrostatic Discharge (ESD) can damage electronic com ponents. To prevent damage to your
motherboard, it is important to handle it very carefully. The following measures are generally

sufcient to protect your equipment from ESD.

Precautions

•

Use a grounded wrist strap designed to prevent static discharge.

• Touch a grounded metal object before removing the board from the antistatic bag.

• Handle the board by its edges only; do not touch its components, peripheral chips, memory

modules or gold contacts.

• When handling chips or modules, avoid touching their pins.

• Put the motherboard and peripherals back into their antistatic bags when not in use.

• For grounding purposes, make sure that your chassis provides excellent conductivity be-

tween the power supply, the case, the mounting fasteners and the motherboard.

• Use only the correct type of CMOS onboard battery as specied by the manufacturer. Do

not install the CMOS battery upside down, which may result in a possible explosion.

Unpacking

The motherboard is shipped in antistatic packaging to avoid static damage. When unpacking
the motherboard, make sure that the person handling it is static protected.

20

Chapter 2: Installation

2.2 Motherboard Installation

All motherboards have standard mounting holes to t different types of chassis. Make sure

that the locations of all the mounting holes for both the motherboard and the chassis match.
Although a chassis may have both plastic and metal mounting fasteners, metal ones are
highly recommended because they ground the motherboard to the chassis. Make sure that
the metal standoffs click in or are screwed in tightly.

Philips

Screwdriver (1)

Philips Screws (13)

Tools Needed

Standoffs (13)

Only if Needed

Location of Mounting Holes

Notes:

1. To avoid damaging the motherboard and its components, please do not use a force
greater than 8 lb/inch on each mounting screw during motherboard installation.

2. Some components are very close to the mounting holes. Please take precautionary
measures to avoid damaging these components when installing the motherboard to the
chassis.

21

H11DSi / H11DSi-NT User's Manual

Figure 2-1. Motherboard Mounting Holes

22

Chapter 2: Installation

Installing the Motherboard

1. Install the I/O shield into the back of the chassis.

2. Locate the mounting holes on the motherboard. See the previous page for the locations.

3. Locate the matching mounting holes on the chassis. Align the mounting holes on the
motherboard with the mounting holes on the chassis.

4. Install standoffs in the chassis as needed.

5. Install the motherboard into the chassis carefully to avoid damaging other motherboard
components.

6. Using the Phillips screwdriver, insert a Phillips head #6 screw into a mounting hole on
the motherboard and its matching mounting hole on the chassis.

7. Repeat Step 5 to insert #6 screws into all mounting holes.

8. Make sure that the motherboard is securely placed in the chassis.

Note: Images displayed are for illustration only. Your chassis or components might look
different from those shown in this manual.

23

H11DSi / H11DSi-NT User's Manual

2.3 Processor and Heatsink Installation

Warning: When handling the processor package, avoid placing direct pressure on the label

area of the fan.

Important:

• For the Processor/Heatsink installation you need to use a T20 screwdriver when opening/

closing the CPU socket.

• Always connect the power cord last, and always remove it before adding, removing or

changing any hardware components. Make sure that you install the processor into the
CPU socket before you install the CPU heatsink.

• If you buy a CPU separately, make sure that you use an AMD-certied multi-directional

heatsink only.

• Make sure to install the motherboard into the chassis before you install the CPU heatsink.

• When receiving a motherboard without a processor pre-installed, make sure that the plastic

CPU socket cap is in place and none of the socket pins are bent; otherwise, contact your
retailer immediately.

• Refer to the Supermicro website for updates on CPU support.

Installing the Processor and Heatsink

1. Unscrew the screws holding down Force Frame in the sequence of 3-2-1. The screws
are numbered on the Force Frame next to each screw hole.

Screw #3

Screw #1

Screw #2

Force Frame

24

Chapter 2: Installation

2. The spring-loaded Force Frame will raise up after the last screw securing it (#1) is
removed. Gently allow it to lift up to its stopping position.

3. Lift the Rail Frame up by gripping the lift tabs near the front end of the rail frame. While
keeping a secure grip of the Rail Frame, lift it to a position so you can do the next step
of removing the External Cap.

Note: The Rail Frame is spring loaded, so keep a secure grip on it as you lift it so it does
not snap up.

Rail Frame

PnP Cover Cap

25

H11DSi / H11DSi-NT User's Manual

4. Remove the External Cap from the Rail Frame by pulling it upwards through the rail
guides on the Rail Frame.

External Cap

PnP Cover Cap

5. The CPU Package is shipped from the factory with the blue Carrier Frame pre­assembled. Grip the handle of the Carrier Frame/CPU Package assembly from its

shipping tray, and while gripping the handle, align the anges of the Carrier Frame

onto the rails of the Rail Frame so its pins will be at the bottom when the Rail Frame is
lowered later.

6. Slide the Carrier Frame/CPU Package downwards to the bottom of the Rail Frame.

Ensure the anges are secure on the rails as you lower it downwards.

Carrier Frame/

CPU Package

26

Chapter 2: Installation

Note: You can only install the CPU inside the socket in one direction with the handle at the
top. Make sure that it is properly inserted into the CPU socket before closing the Rail Frame
plate. If it doesn't close properly, do not force it as it may damage your CPU. Instead, open
the Rail Frame plate again, and double-check that the CPU is aligned properly.

7. Lift up the Rail Frame till it securely rests in upright position. Then remove the PnP
Cover Cap from the CPU socket below. Grip the two lift tabs marked "Remove" at the
middle of the cap and pull vertically upwards to remove the PnP Cover Cap.

Warning! The exposed socket contacts are extremely vulnerable and can be damaged easily.
Do not touch or drop objects onto the contacts and be careful removing the PnP Cover Cap
and when placing the Rail Frame over the socket.

8. Gently lower the Rail Frame down onto the socket until the latches on the Rail Frame
engage with the Socket housing. and it rests in place. DO NOT force it into place!

27

H11DSi / H11DSi-NT User's Manual

9. Gently lower the Force Frame down onto the Rail Frame and hold it in place until it is
seated in the Socket housing. Note that the Force Frame is spring loaded and has to be

held in place before it is secured. Important: Use a torque screwdriver, set it at 16.1

kgf-cm (14.0 lbf-in) with a Torx T20 screw head bit, to prevent damage to the CPU.

10. Place and re-screw the screws in the reverse order to the way you removed them

(holes 1-2-3 in order). When nished, the Force Frame will be secure over both the Rail

Frame and CPU Package.

28

Chapter 2: Installation

11. After the Force Frame is secured and the CPU package is in place, now you must
install the heatsink to the frame. Lower the heatsink down till it rests securely over the
four screw holes on CPU Package on the socket frame.

12. Using a diagonal pattern, tighten the four screws down on the heatsink in a clockwise

fashion till it is secure. The heatsink will now be secured and you have nished installing

the processor and heatsink onto the motherboard. Repeat this procedure for any
remaining CPU sockets on the Motherboard.

#1 Screw

#3 Screw

#4 Screw

29

#2 Screw

H11DSi / H11DSi-NT User's Manual

Un-installing the Processor and Heatsink

1. Remove the heatsink attached to the top of the CPU Package by reversing the
installation procedure.

2. Clean the Thermal grease left by the heatsink on the CPU package lid to limit the risk of
it contaminating the CPU package land pads or contacts in the socket housing.

3. Reverse the procedure for installing the Force Frame onto the socket, unscrewing the
plate in the 3-2-1 screw order and lift the Force Frame to the vertical position.

4. Lift the Rail Frame using the lift tabs near the front end of the Rail Frame. Note that the
Rail Frame is spring loaded, so be careful lifting it up into a vertical position.

5. Grip the handle of the Carrier Frame and pull upwards to extract it from the Rail Frame.
Return the Carrier Frame/CPU Package to its original shipping container.

6. Grip the handle on the External Cap and return it to the Rail Frame sliding it downwards
till it rests in the frame.

7. Gripping the Rail Frame, rotate it downwards till it rests above and locks over the socket
housing in its horizontal position.

8. Push and rotate down the Force Frame till it is over the External Cap and Rail Frame
into a horizontal position.

9. While holding down the Force Frame, secure it back to the socket frame by securing
screw 1 in place. Note that without a CPU Package in place, it is not necessary to
tighten down screws 2 and 3 at this time.

30