Studer D-424 Service manual

Studer D424

2-Channel Magneto-Optical Disk Recorder,
SW Version 1.6

1. General

2. Operating Elements

3. Quick Start Guide

4. Operation

5. Troubleshooting

6. Circuit Description/Jumper Setting – D424

7. Circuit Description/Jumper Setting – Desktop Controller

8. Diagrams

9. Appendix

Operating and Service Instructions

Prepared and edited by Copyright by Studer Pr ofessional Audio AG
Studer Professional Audio AG Printed in Switzerland
Technical Documentation Order no. 10.27.3811 (Ed. 0202)
Althardstrasse 30
CH-8105 Regensdorf – Switzerland
http://www.studer.ch Subject to change

Studer is a regi stered trade mar k of Studer Professional Audio AG, Regensdorf

SAFETY / SECURITE / SICHERHEIT

To reduce the risk of electric shock, do not remove covers (or back). No
user-serviceable parts inside. Refer servicing to qualified service per­sonnel.

Afin de prévenir un choc électrique, ne pas enlever les couvercles (où
l’arrière) de l’appareil. Il ne se trouve à l’intérieur aucune pièce pouvant
être réparée par l’usager.

Um die Gefahr eines elektrischen Schlages zu vermeiden, entfernen Sie
weder Geräteabdeckungen noch Rückwand. Überlassen Sie Wartung
und Reparatur qualifiziertem Fachpersonal.

This symbol is intended to alert the user to presence of uninsulated
“dangerous voltage” within the apparatus that may be of sufficient
magnitude to constitute a risk of electric shock to a person.

Ce symbole indique à l'utilisateur qu'il existent à l'intérieur de l'appareil
des “tensions dangereuses”. Ces tensions élevées ont pour consé­quence un risque de choc électrique en cas de contact.

Dieses Symbol deutet dem Anwender an, dass im Geräteinnern die Ge­fahr der Berührung von “ gefährlicher Spannung” besteht. Die Höhe
der Spannung kann zu einem elektrischen Schlag führen.

CAUTION: Lithium battery. Danger of explosion by incorrect handling. Replace by

ATTENTION: Pile au lithium. Danger d'explosion en cas de manipulation incorrecte.

ACHTUNG: Explosionsgefahr bei unsachgemässem Auswechseln der Lithium-

ADVARSEL: Lithiumbatterei. Eksplosinsfare. Udskinftning ma kun foretages af en

CLASS 1

LED PRODUCT

CLASS 1

LASER PRODUCT

This symbol is intended to alert the user to the presence of important
instructions for operating and maintenance in the enclosed documenta-

tion.
Ce symbole indique à l’utilisateur que la documentation jointe contient

d'importantes instructions concernant le fonctionnement et la mainte­nance.

Dieses Symbol deutet dem Anwender an, dass die beigelegte Doku­mentation wichtige Hinweise für Betrieb und Wartung enthält.

battery of the same make and type only.

Ne remplacer que par un modèle de même type.

batterie. Nur durch den selben Typ ersetzen.

sagkyndig of som beskrevet i servicemanualen (DK).

Assemblies or sub-assemblies of this product can contain optoelectronic
devices. As long as these devices comply with Class 1 of laser or LED
product according to EN 60825-1:1994, they will not be expressly
marked on the product. If a special design should be covered by a
higher class of this standard, the device concerned will be marked di­rectly on the assembly or sub-assembly in accordance with the above
standard.

Baugruppen oder Unterbaugruppen dieses Produktes können opto­elektronische Komponenten enthalten. Solange diese der Klasse 1 für
Laser- oder LED-Produkte nach der Norm EN 60825-1:1994 entspre­chen, sind sie nicht direkt am Gerät bezeichnet. Sollte eine Sonderaus­führung in eine höhere Klasse fallen, so ist die betreffende Baugruppe
oder Unterbaugruppe gemäss dieser Norm mit entsprechender Auf­schrift versehen.

I

SAFETY / SECURITE / SICHERHEIT

FIRST AID

(in case of electric shock)

1. Separate the person as quickly as
possible from the electric power
source:

• by switching off the equipment

• or by unplugging or disconnecting
the mains cable

• pushing the person away from the
power source by using dry insu­lating material (such as wood or
plastic).

• After having sustained an electric

shock, always consult a doctor.

WARNING!

DO NOT TOUCH THE PERSON
OR HIS CLOTHING BEFORE THE
POWER IS TURNED OFF, OTHER­WISE YOU STAND THE RISK OF
SUSTAINING AN ELECTRIC
SHOCK AS WELL!

PREMIERS SECOURS

(en cas d'électrocution)

1. Si la personne est dans l'impos­sibilité de se libérer:

• Couper l'interrupteur principal

• Couper le courant

• Repousser la personne de l'appareil
à l'aide d'un objet en matière non
conductrice (matière plastique ou
bois)

• Après une électrocution, toujours

consulter un médecin.

ATTENTION!

NE JAMAIS TOUCHER UNE PER­SONNE QUI EST SOUS TENSION,
SOUS PEINE DE SUBIR EGALE­MENT UNE ELECTROCUTION.

ERSTE HILFE

(bei Stromunfällen)

1. Bei einem Stromunfall die be­troffene Person so rasch wie mög­lich vom Strom trennen:

• Ausschalten des Gerätes

• Ziehen oder Unterbrechen der
Netzzuleitung

• Betroffene Person mit isoliertem
Material (Holz, Kunststoff) von
der Gefahrenquelle wegstossen

• Nach einem Stromunfall sollte

immer ein Arzt aufgesucht werden.

ACHTUNG!

EINE UNTER SPANNUNG STE­HENDE PERSON DARF NICHT
BERÜHRT WERDEN. SIE KÖN­NEN DABEI SELBST ELEKTRI­SIERT WERDEN!

2. If the person is unconscious:

• check the pulse,

• reanimate the person if respiration
is poor,

• lay the body down, turn it to one
side, call for a doctor immediately.

2. En cas de perte de connaissance de
la personne électrocutée:

• Contrôler le pouls

• Si nécessaire, pratiquer la respi­ration artificielle

• Placer l'accidenté sur le flanc et
consulter un médecin.

2. Bei Bewusstlosigkeit des Verun­fallten:

• Puls kontrollieren,

• bei ausgesetzter Atmung künstlich
beatmen,

• Seitenlagerung des Verunfallten
vornehmen und Arzt verständigen.

II

SICHERHEIT / SAFETY

Installation

Vor der Installation des Gerätes müssen die hier aufgeführ­ten und auch die weiter in dieser Anleitung mit
bezeichneten Hinweise gelesen und während der Instal­lation und des Betriebes beachtet werden.
Untersuchen Sie das Gerät und sein Zubehör auf allfällige
Transportschäden.
Ein Gerät, das mechanische Beschädigung aufweist oder in
welches Flüssigkeit oder Gegenstände eingedrungen sind,
darf nicht ans Netz angeschlossen oder muss sofort durch
Ziehen des Netzsteckers vom Netz getrennt werden. Das
Öffnen und Instandsetzen des Gerätes darf nur von Fachper­sonal unter Einhaltung der geltenden Vorschriften durchge­führt werden.

Liegt dem Gerät kein konfektioniertes Netzkabel bei, so
muss dieses durch eine Fachperson unter Verwendung der
mitgelieferten Kabel-Gerätedose IEC320/C13 oder
IEC320/C19 und unter Berücksichtigung der einschlägigen,
im jeweiligen Lande geltenden Bestimmungen angefertigt
werden; siehe unten.
Vor Anschluss des Netzkabels an die Netzsteckdose muss
überprüft werden, ob die Stromversorgungs- und An­schlusswerte des Gerätes (Netzspannung, Netzfrequenz)
innerhalb der erlaubten Toleranzen liegen. Die im Gerät
eingesetzten Sicherungen müssen den am Gerät angebrach­ten Angaben entsprechen.
Ein Gerät mit einem dreipoligen Gerätestecker (Gerät der
Schutzklasse I) muss an eine dreipolige Netzsteckdose ange­schlossen und somit das Gerätegehäuse mit dem Schutzleiter
der Netzinstallation verbunden werden (Für Dänemark gel­ten Starkstrombestimmungen, Abschnitt 107).

Installation

Before you install the equipment, please read and adhere to
the following recommendations and all sections of these
instructions marked with .

Check the equipment for any transport damage.

A unit that is mechanically damaged or which has been
penetrated by liquids or foreign objects must not be con­nected to the AC power outlet or must be immediately dis­connected by unplugging the power cable. Repairs must only
be performed by trained personnel in accordance with the
applicable regulations.

Should the equipment be delivered without a matching mains
cable, the latter has to be prepared by a trained person using
the attached female plug (IEC320/C13 or IEC320/C19) with
respect to the applicable regulations in your country - see
diagram below.

Before connecting the equipment to the AC power outlet,
check that the local line voltage matches the equipment
rating (voltage, frequency) within the admissible tolerance.
The equipment fuses must be rated in accordance with the
specifications on the equipment.

Equipment supplied with a 3-pole appliance inlet (equipment
conforming to protection class I) must be connected to a 3­pole AC power outlet so that the equipment cabinet is con­nected to the protective earth conductor of the AC supply
(for Denmark the Heavy Current Regulations, Section 107,
are applicable).

Female plug (IEC320), view from contact side:

L live; brown National American Standard: Black
N neutral; blue White
PE protective earth; green and yellow green

Connecteur femelle (IEC320), vue de la face aux contacts:

L phase; brun Standard national américain: Noir
N neutre; bleu Blanc
PE terre protectrice; vert et jaune Vert

Ansicht auf Steckkontakte der Kabel-Gerätesteckdose (IEC320):

L Phase; braun USA-Standard: Schwarz
N Nulleiter; blau Weiss
PE Schutzleiter; gelb/grün grün

III

SICHERHEIT / SAFETY

Zugentlastung für den Netzanschluss

Zum Verankern von Steckverbindungen ohne mechanische
Verriegelung (z.B. IEC-Kaltgerätedosen) empfehlen wir die
folgende Anordnung:

Mains connector strain relief

For anchoring connectors without a mechanical lock (e.g.
IEC mains connectors), we recommend the following ar­rangement:

Vorgehen: Der mitgelieferte Kabelhalter ist selbstklebend.
Bitte beachten Sie bei der Montage die folgenden Regeln:

1. Der Untergrund muss sauber, trocken und frei von Fett,
Öl und anderen Verunreinigungen sein. Temperaturbe­reich für optimale Verklebung: 20...40° C.

2. Entfernen Sie die Schutzfolie auf der Rückseite des Ka­belhalters und bringen sie ihn mit kräftigem Druck an der
gewünschten Stelle an. Lassen sie ihn unbelastet so lange
wie möglich ruhen – die maximale Klebekraft ist erst
nach rund 24 Stunden erreicht.

3. Die Stabilität des Kabelhalters wird erhöht, wenn Sie ihn
zusätzlich verschrauben. Zu diesem Zweck liegen ihm
eine selbstschneidende Schraube sowie eine M4­Schraube mit Mutter bei.

4. Legen Sie das Kabel gemäss Figur in den Halter ein und
pressen Sie die Klemme kräftig auf, bis das Kabel fixiert
ist.

Procedure: The cable clamp shipped with your unit is auto­adhesive. If mounting, please follow the rules below:

1. The surface to be adhered to must be clean, dry, and free
from grease, oil or other contaminants. Best application
temperature range is 20...40° C.

2. Remove the plastic protective backing from the rear side
of the clamp and apply it firmly to the surface at the de­sired position. Allow as much time as possible for curing.
The bond continues to develop for as long as 24 hours.

3. For improved stability, the clamp can be fixed with a
screw. For this purpose, a self-tapping screw and an M4
bolt and nut are included.

4. Place the cable into the clamp as shown in the illustration
above and firmly press down the internal top cover until
the cable is fixed.

IV

UMGEBUNGSBEDINGUNGEN / AMBIENT CONDITIONS

Lufttemperatur und Feuchtigkeit

Allgemein

Die Betriebstauglichkeit des Gerätes oder Systems ist unter
folgenden Umgebungsbedingungen gewährleistet:

EN 60721-3-3, Set IE32, Wert 3K3.

Diese Norm besteht aus einem umfassenden Katalog von Pa­rametern; die wichtigsten davon sind: Umgebungstemperatur
+5...+40 °C; rel. Luftfeuchtigkeit 5...85% – d.h. weder Kon­densation noch Eisbildung; abs. Luftfeuchtigkeit 1...25 g/m³;
Temperatur-Änderungsrate < 0,5 °C/min. In den folgenden
Abschnitten wird darauf näher eingegangen.
Unter den genannten Bedingungen startet und arbeitet das
Gerät oder System problemlos. Ausserhalb dieser Spezifikatio­nen möglicherweise auftretende Probleme sind in den folgen­den Abschnitten beschrieben.

Umgebungstemperatur

Geräte und Systeme von Studer sind allgemein für einen Um­gebungs-Temperaturbereich (d.h. Temperatur der eintretenden
Kühlluft) von +5...+40 °C ausgelegt. Bei Installation in einem
Schrank muss der vorgesehene Luftdurchsatz und dadurch die
Konvektionskühlung gewährleistet sein. Folgende Tatsachen
sind dabei zu berücksichtigen:

1. Die zulässige Umgebungstemperatur für den Betrieb der
Halbleiter-Bauelemente beträgt 0 °C bis +70 °C (commercial
temperature range for operation).

2. Der Luftdurchsatz der Anlage muss gewährleisten, dass die
austretende Kühlluft ständig kühler ist als 70 °C.

3. Die mittlere Erwärmung der Kühlluft soll 20 K betragen,
die maximale Erwärmung an den heissen Komponenten darf
somit um weitere 10 K höher liegen.

4. Zum Abführen einer Verlustleistung von 1 kW bei dieser
zulässigen mittleren Erwärmung ist eine Luftmenge von
2,65 m³/min notwendig.
Beispiel: Für ein Rack mit einer Leistungsaufnahme P = 800 W
ist eine Kühlluftmenge von 0,8 * 2,65 m³/min nötig, entspre-
chend 2,12 m³/min.

5. Soll die Kühlfunktion der Anlage (z.B. auch bei Lüfter­Ausfall oder Bestrahlung durch Spotlampen) überwacht wer­den, so ist die Temperatur der Abluft unmittelbar oberhalb der
Einschübe an mehreren Stellen im Rack zu messen; die An­sprechtemperatur der Sensoren soll 65 bis 70 °C betragen.

Air temperature and humidity

General

Normal operation of the unit or system is warranted under the
following ambient conditions defined by:

EN 60721-3-3, set IE32, value 3K3.

This standard consists of an extensive catalogue of parameters,
the most important of which are: ambient temperature +5...
+40° C, relative humidity 5...85% – i.e. no formation of con­densation or ice; absolute humidity 1...25 g/m³; rate of tem­perature change < 0,5 °C/min. These parameters are dealt with
in the following paragraphs.
Under these conditions the unit or system starts and works
without any problem. Beyond these specifications, possible
problems are described in the following sections.

Ambient temperature

Units and systems by Studer are generally designed for an
ambient temperature range (i.e. temperature of the incoming
air) of +5...+40 °C. When rack mounting the units, the intended
air flow and herewith adequate cooling must be provided. The
following facts must be considered:

1. The admissible ambient temperature range for operation of
the semiconductor components is 0 °C to +70 °C (commercial
temperature range for operation).

2. The air flow through the installation must provide that the
outgoing air is always cooler than 70 °C.

3. Average heat increase of the cooling air shall be 20 K,
allowing for an additional maximum 10 K increase at the hot
components.

4. In order to dissipate 1 kW with this admissible average heat
increase, an air flow of 2,65 m³/min is required.

Example: A rack dissipating P = 800 W requires an air flow of
0,8 * 2,65 m³/min which corresponds to 2,12 m³/min.

5. If the cooling function of the installation must be moni­tored (e.g. for fan failure or illumination with spot lamps), the
outgoing air temperature must be measured directly above the
modules at several places within the rack. The trigger tempera­ture of the sensors should be 65 to 70 °C.

Reif und Tau

Das unversiegelte System (Steckerpartien, Halbleiteranschlüs­se) verträgt zwar leichte Eisbildung (Reif). Mit blossem Auge
sichtbare Betauung führt jedoch bereits zu Funktionsstörungen.
In der Praxis kann mit einem zuverlässigen Betrieb der Geräte
bereits im Temperaturbereich ab –15 °C gerechnet werden,
wenn für die Inbetriebnahme des kalten Systems die folgende
allgemeine Regel beachtet wird:
Wird die Luft im System abgekühlt, so steigt ihre relative
Feuchtigkeit an. Erreicht diese 100%, kommt es zu Nieder­schlag, meist in der Grenzschicht zwischen der Luft und einer
kühleren Oberfläche, und somit zur Bildung von Eis oder Tau
an empfindlichen Systemstellen (Kontakte, IC-Anschlüsse etc.).
Ein störungsfreier Betrieb mit interner Betauung, unabhängig
von der Temperatur, ist nicht gewährleistet.

Frost and dew

The unsealed system parts (connector areas and semiconductor
pins) allow for a minute formation of ice or frost. However,
formation of dew visible with the naked eye will already lead to
malfunctions. In practice, reliable operation can be expected in
a temperature range above –15 °C, if the following general rule
is considered for putting the cold system into operation:

If the air within the system is cooled down, the relative humid­ity rises. If it reaches 100%, condensation will arise, usually in
the boundary layer between the air and a cooler surface, to­gether with formation of ice or dew at sensitive areas of the
system (contacts, IC pins, etc.). Once internal condensation
occurs, trouble-free operation cannot be guaranteed, independ­ent of temperature.

V

UMGEBUNGSBEDINGUNGEN / AMBIENT CONDITIONS

Vor der Inbetriebnahme muss das System auf allfällige interne
Betauung oder Eisbildung überprüft werden. Nur bei sehr
leichter Eisbildung kann mit direkter Verdunstung (Sublimati­on) gerechnet werden; andernfalls muss das System im abge­schalteten Zustand gewärmt und getrocknet werden.
Das System ohne feststellbare interne Eisbildung oder Betau­ung soll möglichst homogen (und somit langsam) mit eigener
Wärmeleistung aufgewärmt werden; die Lufttemperatur der
Umgebung soll ständig etwas tiefer als diejenige der Syste­mabluft sein.
Ist es unumgänglich, das abgekühlte System sofort in warmer
Umgebungsluft zu betreiben, so muss diese entfeuchtet sein.
Die absolute Luftfeuchtigkeit muss dabei so tief sein, dass die
relative Feuchtigkeit, bezogen auf die kälteste Oberfläche im
System, immer unterhalb 100% bleibt.
Es ist dafür zu sorgen, dass beim Abschalten des Systems die
eingeschlossene Luft möglichst trocken ist (d.h. vor dem Ab­schalten im Winter den Raum mit kalter, trockener Luft belüf­ten und feuchte Gegenstände, z.B. Kleider, entfernen).
Die Zusammenhänge sind im folgenden Klimatogramm er­sichtlich. Zum kontrollierten Verfahren gehören Thermometer
und Hygrometer sowie ein Thermometer im System.
Beispiel 1: Ein Ü-Wagen mit einer Innentemperatur von 20 °C
und 40% relativer Luftfeuchtigkeit wird am Abend abgeschal­tet. Sinkt die Temperatur unter +5 °C, bildet sich Tau oder Eis.
Beispiel 2: Ein Ü-Wagen wird morgens mit 20 °C warmer Luft
von 40% relativer Luftfeuchtigkeit aufgewärmt. Auf Teilen, die
kälter als +5 °C sind, bildet sich Tau oder Eis.

Before putting into operation, the system must be checked for
internal formation of condensation or ice. Only with a minute
formation of ice, direct evaporation (sublimation) may be ex­pected; otherwise the system must be heated and dried while
switched off.
A system without visible internal formation of ice or condensa­tion should be heated up with its own heat dissipation, as ho­mogeneously (and subsequently as slow) as possible; the ambi­ent temperature should then always be lower than the outgoing
air.
If it is absolutely necessary to operate the system immediately
within warm ambient air, this air must be dehydrated. In such a
case, the absolute humidity must be so low that the relative
humidity, related to the coldest system surface, always remains
below 100%.
Ensure that the enclosed air is as dry as possible when power­ing off (i.e. before switching off in winter, aerate the room with
cold, dry air, and remove humid objects as clothes from the
room).
These relationships are visible from the following climatogram.
For a controlled procedure, thermometer and hygrometer as
well as a thermometer within the system will be required.
Example 1: An OB-van having an internal temperature of
20 °C and rel. humidity of 40% is switched off in the evening.
If temperature falls below +5 °C, dew or ice will be forming.
Example 2: An OB-van is heated up in the morning with air of
20 °C and a rel. humidity of 40%. On all parts being cooler
than +5 °C, dew or ice will be forming.

VI

WARTUNG / MAINTENANCE

Wartung und Reparatur

Durch Entfernen von Gehäuseteilen, Abschirmungen etc.
werden stromführende Teile freigelegt. Deshalb müssen u.a.
die folgenden Grundsätze beachtet werden:
Eingriffe in das Gerät dürfen nur von Fachpersonal unter
Einhaltung der geltenden Vorschriften vorgenommen wer­den.
Vor Entfernen von Gehäuseteilen muss das Gerät ausge­schaltet und vom Netz getrennt werden.

Bei geöffnetem, vom Netz getrenntem Gerät dürfen Teile
mit gefährlichen Ladungen (z. B. Kondensatoren, Bildröh­ren) erst nach kontrollierter Entladung, heisse Bauteile (Lei­stungshalbleiter, Kühlkörper etc.) erst nach deren Abkühlen
berührt werden.

Bei Wartungsarbeiten am geöffneten, unter Netzspannung
stehenden Gerät dürfen blanke Schaltungsteile und metallene
Halbleitergehäuse weder direkt noch mit nichtisoliertem
Werkzeug berührt werden.

Zusätzliche Gefahren bestehen bei unsachgemässer Handha­bung besonderer Komponenten:

• Explosionsgefahr bei Lithiumzellen, Elektrolyt-Konden­satoren und Leistungshalbleitern

• Implosionsgefahr bei evakuierten Anzeigeeinheiten

• Strahlungsgefahr bei Lasereinheiten (nichtionisierend),
Bildröhren (ionisierend)

• Verätzungsgefahr bei Anzeigeeinheiten (LCD) und Kom­ponenten mit flüssigem Elektrolyt.

Solche Komponenten dürfen nur von ausgebildetem Fach­personal mit den vorgeschriebenen Schutzmitteln (u.a.
Schutzbrille, Handschuhe) gehandhabt werden.

Maintenance and Repair

The removal of housing parts, shields, etc. exposes ener­gized parts. For this reason the following precautions should
be observed:
Maintenance should only be performed by trained personnel
in accordance with the applicable regulations.

The equipment should be switched off and disconnected
from the AC power outlet before any housing parts are re­moved.
Even if the equipment is disconnected from the power, parts
with hazardous charges (e.g. capacitors, picture tubes) must
not be touched until they have been properly discharged.
Touch hot components (power semiconductors, heat sinks,
etc.) only when cooled off.

If maintenance is performed on a unit that is opened and
switched on, no uninsulated circuit components and metallic
semiconductor housings must be touched neither with your
bare hands nor with uninsulated tools.

Certain components pose additional hazards:

• Explosion hazard from lithium batteries, electrolytic
capacitors and power semiconductors

• Implosion hazard from evacuated display units

• Radiation hazard from laser units (non-ionizing), picture
tubes (ionizing)

• Caustic effect of display units (LCD) and such compo­nents containing liquid electrolyte.

Such components should only be handled by trained per­sonnel who are properly protected (e.g. safety goggles,
gloves).

VII

WARTUNG / MAINTENANCE

Elektrostatische Entladung (ESD)
bei Wartung und Reparatur

ATTENTION:

ATTENTION:

ACHTUNG:

Viele ICs und andere Halbleiter sind empfindlich gegen
elektrostatische Entladung (ESD). Unsachgemässe Behand­lung von Baugruppen mit solchen Komponenten bei War­tung und Reparatur kann deren Lebensdauer drastisch ver­mindern.
Bei der Handhabung der ESD-empfindlichen Komponenten
sind u.a. folgende Regeln zu beachten:

• ESD-empfindliche Komponenten dürfen ausschliesslich
in dafür bestimmten und bezeichneten Verpackungen ge­lagert und transportiert werden.

• Unverpackte, ESD-empfindliche Komponenten dürfen
nur in dafür eingerichteten Schutzzonen (EPA, z.B. Ge­biet für Feldservice, Reparatur- oder Serviceplatz) ge­handhabt und nur von Personen berührt werden, die durch
ein Handgelenkband mit Serienwiderstand mit dem Mas­sepotential des Reparatur- oder Serviceplatzes verbunden
sind. Das gewartete Gerät wie auch Werkzeug, Hilfsmit­tel, EPA-taugliche (elektrisch halbleitende) Arbeits-, Ab­lage- und Bodenmatten müssen ebenfalls mit diesem Po­tential verbunden sein.

• Die Anschlüsse der ESD-empfindlichen Komponenten
dürfen unkontrolliert weder mit elektrostatisch aufladba­ren (Gefahr von Spannungsdurchschlag), noch mit metal­lischen Oberflächen (Schockentladungsgefahr) in Berüh­rung kommen.

• Um undefinierte transiente Beanspruchung der Kompo­nenten und deren eventuelle Beschädigung durch un­erlaubte Spannung oder Ausgleichsströme zu vermeiden,
dürfen elektrische Verbindungen nur am abgeschalteten
Gerät und nach dem Abbau allfälliger Kondensator­ladungen hergestellt oder getrennt werden.

Electrostatic Discharge (ESD)
during Maintenance and Repair

Observe precautions for handling devices sensitive to elec­trostatic discharge!

Respecter les précautions d’usage concernant la mani­pulation de composants sensibles à l’électricité statique!

Vorsichtsmassnahmen bei der Handhabung von ESD­empfindlichen Bauelementen beachten!

Many ICs and semiconductors are sensitive to electrostatic
discharge (ESD). The life of components containing such
elements can be drastically reduced by improper handling
during maintenance and repair work.

Please observe the following rules when handling ESD sen­sitive components:

• ESD sensitive components should only be stored and
transported in the packing material specifically provided
for this purpose.

• Unpacked ESD sensitive components should only be
handled in ESD protected areas (EPA, e.g. area for field
service, repair or service bench) and only be touched by
persons who wear a wristlet that is connected to the
ground potential of the repair or service bench by a series
resistor. The equipment to be repaired or serviced and all
tools, aids, as well as electrically semi-conducting work,
storage and floor mats should also be connected to this
ground potential.

• The terminals of ESD sensitive components must not
come in uncontrolled contact with electrostatically
chargeable (voltage puncture) or metallic surfaces (dis­charge shock hazard).

• To prevent undefined transient stress of the components
and possible damage due to inadmissible voltages or
compensation currents, electrical connections should only
be established or separated when the equipment is
switched off and after any capacitor charges have de­cayed.

VIII

WARTUNG / MAINTENANCE

SMD-Bauelemente

Der Austausch von SMD-Bauelementen ist ausschliesslich
geübten Fachleuten vorbehalten. Für verwüstete Platinen
können keine Ersatzansprüche geltend gemacht werden.
Beispiele für korrekte und falsche SMD-Lötverbindungen in
der Abbildung weiter unten.

Bei Studer werden keine handelsüblichen SMD-Bauteile
bewirtschaftet. Für Reparaturen sind die notwendigen Bau­teile lokal zu beschaffen. Die Spezifikationen von Spezialb­auteilen finden Sie in der Serviceanleitung.

SMD Components

SMD components should only be replaced by skilled spe­cialists. No warranty claims will be accepted for circuit
boards that have been ruined. Proper and improper SMD
soldering joints are depicted below.

Studer does not keep any commercially available SMD
components in stock. For repair the corresponding devices
should be purchased locally. The specifications of special
components can be found in the service manual.

IX

EMV / EMC

Störstrahlung und Störfestigkeit

Das Gerät entspricht den Schutzanforderungen auf dem
Gebiet elektromagnetischer Phänomene, wie u.a. in den
Richtlinien 89/336/EWG und FCC, Part 15, aufgeführt:

1. Vom Gerät erzeugte elektromagnetische Strahlung ist
soweit begrenzt, dass bestimmungsgemässer Betrieb an­derer Geräte und Systeme möglich ist.

2. Das Gerät weist eine angemessene Festigkeit gegen elek­tromagnetische Störungen auf, so dass sein bestimmungs­gemässer Betrieb möglich ist.

Das Gerät wurde getestet und erfüllt die Bedingungen der im
Kapitel „ Technische Daten“ aufgeführten EMV-Normen.
Die Limiten dieser Standards gewährleisten mit angemesse­ner Wahrscheinlichkeit sowohl den Schutz der Umgebung
wie auch entsprechende Störfestigkeit des Gerätes. Absolute
Garantie, dass keine unerlaubte elektromagnetische Beein­trächtigung während des Betriebes entsteht, ist jedoch nicht
gegeben.
Um die Wahrscheinlichkeit solcher Beeinträchtigung weit­gehend auszuschliessen, sind u.a. folgende Massnahmen zu
beachten:

• Installieren Sie das Gerät gemäss den Angaben in der Be­triebsanleitung, und verwenden Sie das mitgelieferte Zu­behör.

• Verwenden Sie im System und in der Umgebung, in de­nen das Gerät eingesetzt ist, nur Komponenten (Anlagen,
Geräte), die ihrerseits die Anforderungen der obener­wähnten Standards erfüllen.

• Sehen Sie ein Erdungskonzept des Systems vor, das so­wohl die Sicherheitsanforderungen (die Erdung der Ge­räte gemäss Schutzklasse I mit einem Schutzleiter muss
gewährleistet sein), wie auch die EMV-Belange berück­sichtigt. Bei der Entscheidung zwischen stern- oder flä­chenförmiger bzw. kombinierter Erdung sind Vor- und
Nachteile gegeneinander abzuwägen.

• Benutzen Sie abgeschirmte Kabel, wo vorgesehen. Ach­ten Sie auf einwandfreie, grossflächige, korrosions­beständige Verbindung der Abschirmung zum entspre­chenden Steckeranschluss und dessen Gehäuse. Beachten
Sie, dass eine nur an einem Ende angeschlossene Ka­belabschirmung als Sende- bzw. Empfangsantenne wirken
kann (z.B. bei wirksamer Kabellänge von 5 m oberhalb
von 10 MHz), und dass die Flanken digitaler Kommuni­kationssignale hochfrequente Aussendungen verursachen
(z.B. LS- oder HC-Logik bis 30 MHz).

• Vermeiden Sie Bildung von Masseschleifen oder ver­mindern Sie deren unerwünschte Auswirkung, indem Sie
deren Fläche möglichst klein halten und den darin flie­ssenden Strom durch Einfügen einer Impedanz (z.B.
Gleichtaktdrossel) reduzieren.

Electromagnetic Compatibility

The equipment conforms to the protection requirements
relevant to electromagnetic phenomena that are listed in the
guidelines 89/336/EC and FCC, part 15.

1. The electromagnetic interference generated by the equip­ment is limited in such a way that other equipment and
systems can be operated normally.

2. The equipment is adequately protected against electro­magnetic interference so that it can operate correctly.

The unit has been tested and conforms to the EMC standards
applicable to residential, commercial and light industry, as
listed in the section „Technical Data“ . The limits of these
standards reasonably ensure protection of the environment
and corresponding noise immunity of the equipment. How­ever, it is not absolutely warranted that the equipment will
not be adversely affected by electromagnetic interference
during operation.
To minimize the probability of electromagnetic interference
as far as possible, the following recommendations should be
followed:

• Install the equipment in accordance with the operating
instructions. Use the supplied accessories.

• In the system and in the vicinity where the equipment is
installed, use only components (systems, equipment) that
also fulfill the above EMC standards.

• Use a system grounding concept that satisfies the safety
requirements (protection class I equipment must be con­nected with a protective ground conductor) that also takes
into consideration the EMC requirements. When deciding
between radial, surface or combined grounding, the ad­vantages and disadvantages should be carefully evaluated
in each case.

• Use shielded cables where shielding is specified. The
connection of the shield to the corresponding connector
terminal or housing should have a large surface and be
corrosion-proof. Please note that a cable shield connected
only single-ended can act as a transmitting or receiving
antenna (e.g. with an effective cable length of 5 m, the
frequency is above 10 MHz) and that the edges of the
digital communication signals cause high-frequency ra­diation (e.g. LS or HC logic up to 30 MHz).

• Avoid ground loops or reduce their adverse effects by
keeping the loop surface as small as possible, and reduce
the noise current flowing through the loop by inserting an
additional impedance (e.g. common-mode rejection
choke).

X

Class A Equipment - FCC Notice

Konformitätserklärungen / Declarations of conformity

This equipment has been tested and found to comply with
the limits for a Class A digital device, pursuant to Part 15 of
the FCC Rules. These limits are designed to provide a rea­sonable protection against harmful interference when the
equipment is operated in a commercial environment. This
equipment generates, uses, and can radiate radio frequency
energy and, if not installed and used in accordance with the
instruction manual, may cause harmful interference to radio
communications. Operation of this equipment in a residential

CE-Konformitätserklärung

Der Hersteller,
Studer Professional Audio AG,

CH-8105 Regensdorf,
erklärt in eigener Verantwortung, dass das Produkt

Studer D424, 2-Channel Professional MO-Disk Recorder,

(ab Serie-Nr. 101),

auf das sich diese Erklärung bezieht, entsprechend den Be­stimmungen der EU-Richtlinien und Ergänzungen

• Elektromagnetische Verträglichkeit (EMV):
89/336/EWG + 92/31/EWG + 93/68/EWG

• Niederspannung:
73/23/EWG + 93/68/EWG

mit den folgenden Normen und normativen Dokumenten
übereinstimmt:

• Sicherheit:
Schutzklasse 1, EN 60950:1992 + A1/A2:1993

•EMV:
EN 50081-1:1992, EN 50082-1:1992

Regensdorf, 18. Juli 1996

area is likely to cause harmful interference in which case the
user will be required to correct the interference at his own
expense.

Caution:
Any changes or modifications not expressly approved by the
manufacturer could void the user's authority to operate the
equipment. Also refer to relevant information in this man­ual.

CE Declaration of Conformity

The manufacturer,
Studer Professional Audio AG,

CH-8105 Regensdorf,
declares under his sole responsibility that the product

Studer D424, 2-Channel Professional MO-Disk Recorder,

(on from serial No. 101),

to which this declaration relates, according to following
regulations of EU directives and amendments

• Electromagnetic Compatibility (EMC):
89/336/EEC + 92/31/EEC + 93/68/EEC

• Low Voltage (LVD):
73/23/EEC + 93/68/EEC

is in conformity with the following standards or other nor­mative documents:

• Safety:
Class 1, EN 60950:1992 + A1/A2:1993

•EMC:
EN 50081-1:1992, EN 50082-1:1992

Regensdorf, July 18, 1996

B. Hochstrasser, President, International Sales

P. Fiala, Leiter QS

B. Hochstrasser, President, International Sales

P. Fiala, Manager QA

XI

D424 MO Recorder

CONTENTS

1 General......................................................................................................................................................................... E1/1

1.1 MO Recording................................................................................................................................................... E1/1

1.2 The Medium – Magneto-Optical Disks.............................................................................................................. E1/2

1.2.1 Disk Standards................................................................................................................................................E1/2

1.2.2 Disk Formatting..............................................................................................................................................E1/3

1.2.3 Disk Capacities...............................................................................................................................................E1/3

1.2.4 Disk Handling.................................................................................................................................................E1/4

1.3 File Systems, File Formats, Audio Files............................................................................................................ E1/5

1.3.1 Takes, Indices, and Sequences........................................................................................................................E1/5

1.3.2 Non-Destructive Editing.................................................................................................................................E1/7

1.4 Utilization for the Purpose Intended.................................................................................................................. E1/8

1.5 Copyright........................................................................................................................................................... E1/8

1.6 First Steps.......................................................................................................................................................... E1/8

1.6.1 Unpacking and Inspection ..............................................................................................................................E1/8

1.6.2 Installation......................................................................................................................................................E1/8

1.6.3 Adjustments, Repair........................................................................................................................................E1/9

1.6.4 Accessories, Options.......................................................................................................................................E1/9

1.6.5 Connector Field ............................................................................................................................................E1/10

1.6.6 Connector Pin Assignments..........................................................................................................................E1/11

1.7 Technical Specifications.................................................................................................................................. E1/13

1.7.1 Drive System ................................................................................................................................................E1/13

1.7.2 Recording Formats........................................................................................................................................E1/13

1.7.3 Audio Processing..........................................................................................................................................E1/13

1.7.4 Audio Input/ Output......................................................................................................................................E1/13

1.7.5 Synchronization............................................................................................................................................E1/14

1.7.6 Timecode......................................................................................................................................................E1/14

1.7.7 Control Interfaces.........................................................................................................................................E1/14

1.7.8 Power Supply................................................................................................................................................E1/15

1.7.9 Operating Conditions....................................................................................................................................E1/15

1.7.10 Standards ......................................................................................................................................................E1/15

1.7.11 Physical Dimensions.....................................................................................................................................E1/15

1.8 Syntax Used in this Manual............................................................................................................................. E1/16

2 Operating elements..................................................................................................................................................... E2/1

2.1 General............................................................................................................................................................... E2/2

2.2 Transport Section............................................................................................................................................... E2/2

2.3 Editing Section................................................................................................................................................... E2/3

2.4 Keyboard and Register Section.......................................................................................................................... E2/3

2.5 Display and Menu Section ................................................................................................................................. E2/4

2.6 Additional Functions (Desktop Controller only)................................................................................................ E2/4

Date printed: 06.03.02 SW V 1.6 Contents E0/1

D424 MO Recorder

3 Getting Started Quickly..............................................................................................................................................E3/1

3.1 Recording New Takes From an Analog Source.................................................................................................E3/1

3.1.1 Installation and Settings................................................................................................................................. E3/1

3.1.2 Start Recording...............................................................................................................................................E3/1

3.2 Recording New Takes From a Digital Source....................................................................................................E3/2

3.2.1 Installation and Settings................................................................................................................................. E3/2

3.2.2 Start Recording...............................................................................................................................................E3/2

3.3 Playing Pre-Recorded Disks...............................................................................................................................E3/3

3.3.1 Installation and Settings................................................................................................................................. E3/3

3.3.2 Position .......................................................................................................................................................... E3/3

3.3.3 PLAY and STOP............................................................................................................. ............................... E3/3

3.3.4 Skip to Take and Index Markers....................................................................................................................E3/3

3.3.5 CUE and SHUTTLE ...................................................................................................................................... E3/3

3.3.6 LOCATE........................................................................................................................................................ E3/4

3.3.7 Setting Markers.............................................................................................................................................. E3/4

3.4 Editing................................................................................................................................................................E3/5

3.4.1 Before You Start Editing................................................................................................................................ E3/5

3.4.2 Cut Out or Erase an Element – Cut/ Erase Editing......................................................................................... E3/5

3.4.3 Move or Duplicate an Element – Insert Editing............................................................................................. E3/6

3.5 Insert Recording.................................................................................................................................................E3/7

3.5.1 Before You Start Recording........................................................................................................................... E3/7

3.5.2 Manual Insert Recording................................................................................................................................ E3/7

3.5.3 Auto Insert Recording.................................................................................................................................... E3/7

3.6 Working with Sequences....................................................................................................................................E3/8

3.6.1 Change the Current Sequence ........................................................................................................................ E3/8

3.6.2 Create a New Sequence.................................................................................................................................. E3/8

3.6.3 Modify a Sequence......................................................................................................................................... E3/8

3.6.4 Copy a Sequence............................................................................................................................................ E3/9

3.6.5 Delete a Sequence.......................................................................................................................................... E3/9

3.7 CD Transfer and Disk Copies...........................................................................................................................E3/10

3.7.1 Before you Start the Transfer....................................................................................................................... E3/10

3.7.2 Creating a CD with an External SCSI CD Writer (e.g. Studer D741).......................................................... E3/10

3.7.3 Copying a CD to the D424.................................................................................................. ......................... E3/11

3.7.4 Copying to/ from Other MO Disks............................................................................................................... E3/11

3.8 Working with Timecode...................................................................................................................................E3/12

3.8.1 Recording Timecode.................................................................................................................................... E3/12

3.8.2 Playing Back Timecode ............................................................................................................................... E3/12

3.8.3 Chasing to Timecode....................................................................................................................................E3/12

3.9 The Desktop Controller ....................................................................................................................................E3/13

3.9.1 Installation and Settings............................................................................................................................... E3/13

3.9.2 Operation Enhancements.............................................................................................................................. E3/13

3.10 The Parallel Port with Fader Start Operation...................................................................................................E3/14

3.10.1 Signal List.................................................................................................................................................... E3/14

3.10.2 Fader Start.................................................................................................................................................... E3/14

3.11 The Setup Menu...............................................................................................................................................E3/15

E0/2 Contents SW V 1.6 Date printed: 06.03.02

D424 MO Recorder

4 Operation..................................................................................................................................................................... E4/1

4.1 System Configuration ........................................................................................................................................ E4/1

4.1.1 Recording Formats..........................................................................................................................................E4/1

4.1.2 Audio Input.....................................................................................................................................................E4/2

4.1.3 Reference Clock Source..................................................................................................................................E4/2

4.1.4 Other Parameters ............................................................................................................................................E4/3

4.2 Display and Register Functions ......................................................................................................................... E4/4

4.2.1 Display Information and Formats...................................................................................................................E4/4

4.2.2 Using General Purpose Registers....................................................................................................................E4/6

4.3 Basic Transport Operation................................................................................................................................. E4/7

4.3.1 The Current Position.......................................................................................................................................E4/7

4.3.2 Playback and Stop ..........................................................................................................................................E4/9

4.3.3 Skipping to Take and Index Markers..............................................................................................................E4/9

4.3.4 The CUE and SHUTTLE Modes....................................................................................................................E4/9

4.3.5 Locating to a Random Position.....................................................................................................................E4/10

4.4 Recording......................................................................................................................................................... E4/11

4.4.1 The D424 Recording Modes.........................................................................................................................E4/11

4.4.2 Channel Assignments....................................................................................................................................E4/12

4.4.3 Rehearse Mode.............................................................................................................................................E4/12

4.4.4 Meters...........................................................................................................................................................E4/13

4.4.5 Adjusting the Analog Input Level.................................................................................................................E4/13

4.4.6 Before You Start Recording... ......................................................................................................................E4/13

4.4.7 Assemble Recording........................................................................................................ .............................E4/14

4.4.8 Insert Recording ...........................................................................................................................................E4/14

4.4.9 Auto Insert Recording...................................................................................................................................E4/15

4.5 Editing ..................................................................................................................... ........................................ E4/16

4.5.1 Setting IN and OUT Points...........................................................................................................................E4/16

4.5.2 The CUT Function........................................................................................................................................E4/17

4.5.3 The ERASE Function...................................................................................................................................E4/18

4.5.4 The INSERT Function..................................................................................................................................E4/18

4.5.5 Combined Editing Processes ........................................................................................................................E4/19

4.5.6 The PREVIEW Function..............................................................................................................................E4/19

4.6 Sequence Editing............................................................................................................................................. E4/21

4.6.1 Selecting a Sequence ....................................................................................................................................E4/21

4.6.2 Creating a New Sequence.............................................................................................................................E4/21

4.6.3 Deleting a Sequence .....................................................................................................................................E4/21

4.6.4 Editing a Sequence .......................................................................................................................................E4/22

4.7 CD Transfer and Disk Copies.......................................................................................................................... E4/24

4.7.1 Configuration................................................................................................................................................E4/24

4.7.2 Transfer to a CD Writer................................................................................................... .............................E4/24

4.7.3 Copying a CD to the D424 ...........................................................................................................................E4/26

4.7.4 Copying to/from Other Disks........................................................................................................................E4/27

4.7.5 Transfer Parameters......................................................................................................................................E4/28

4.7.6 SCSI Addresses............................................................................................................................................E4/29

4.8 Backup Copies................................................................................................................................................. E4/30

4.8.1 Sequence Backup..........................................................................................................................................E4/30

4.8.2 Disk Backup ............................................................................................................... ..................................E4/31

4.9 Data Exchange with SADiE

®

Workstations..................................................................................................... E4/32

4.9.1 DAW Configuration .....................................................................................................................................E4/32

4.9.2 Importing D424 Disks to the DAW..............................................................................................................E4/32

4.9.3 Importing SADiE

®

Disks to the D424..........................................................................................................E4/33

Date printed: 06.03.02 SW V 1.6 Contents E0/3

D424 MO Recorder

4.10 Setup Menu ......................................................................................................................................................E4/34

4.10.1 Accessing and Modifying Menu Items......................................................................................................... E4/34

4.10.2 Overview...................................................................................................................................................... E4/35

4.10.3 Menu 1, CONFIG (System Configuration).................................................................................................. E4/36

4.10.4 Menu 2, REF & INP (Reference & Input Parameters)................................................................................. E4/37

4.10.5 Menu 3, AUDIO (Audio Parameters) .......................................................................................................... E4/38

4.10.6 Menu 4, TRANSPORT (Transport & Display Parameters)......................................................................... E4/39

4.10.7 Menu 5, DISK (Disk & Sequence Utilities)................................................................................................. E4/40

4.10.8 Menu 6, COPY (Copy Utilities)................................................................................................................... E4/42

4.10.9 Menu 7, SERVICE (Service Utilities)..........................................................................................................E4/44

4.11 Desktop Controller...........................................................................................................................................E4/45

4.11.1 Configuration............................................................................................................................................... E4/45

4.11.2 Operation...................................................................................................................................................... E4/45

4.12 Parallel Port and Fader Start Operation............................................................................................................E4/46

4.12.1 Specifications............................................................................................................................................... E4/46

4.12.2 Signal Description ........................................................................................................................................ E4/46

4.12.3 Fader Start.................................................................................................................................................... E4/47

4.13 Serial Remote Operation..................................................................................................................................E4/48

4.13.1 Command List.............................................................................................................................................. E4/48

5 Troubleshooting...........................................................................................................................................................E5/1

5.1 Error Messages...................................................................................................................................................E5/1

5.2 Modifying the D424 SCSI Address....................................................................................................................E5/3

6 D424 - Circuits, Jumper Setting.................................................................................................................................E6/1

6.1 Motherboard.......................................................................................................................................................E6/1

6.1.1 Clock Regeneration........................................................................................................................................ E6/1

6.1.2 Time Code...................................................................................................................................................... E6/2

6.1.3 Audio.............................................................................................................................................................. E6/2

6.1.4 Desktop Controller......................................................................................................................................... E6/3

6.1.5 Power Supply................................................................................................................................................. E6/3

6.1.6 Jumper and DIP Switch Settings.................................................................................................................... E6/3

6.2 Core....................................................................................................................................................................E6/4

6.2.1 Jumper and DIP Switch Settings.................................................................................................................... E6/4

6.3 A/D-D/A Board..................................................................................................................................................E6/5

6.3.1 Level Setting ................................................................................................................................................. E6/5

6.4 Keyboard ...........................................................................................................................................................E6/5

6.5 Display Board ....................................................................................................................................................E6/5

6.6 Connector Pin Assignments ...............................................................................................................................E6/6

7 Desktop Controller - Circuits, Jumper Setting.........................................................................................................E7/1

7.1 Remote Keyboard ..............................................................................................................................................E7/1

7.2 Remote Control PCB .........................................................................................................................................E7/1

7.3 Display PCB ......................................................................................................................................................E7/1

E0/4 Contents SW V 1.6 Date printed: 06.03.02

D424 MO Recorder

8 Diagrams..............................................................................................................................................................................

9 Appendix...................................................................................................................................................................... E9/1

9.1 Serial Remote Protocol...................................................................................................................................... E9/1

9.1.1 RS422 9-pin Protocol (Sony-Compatible)......................................................................................................E9/1

9.1.2 Communication Format..................................................................................................................................E9/1

9.1.3 Hardware Layer..............................................................................................................................................E9/2

9.1.4 Messages.........................................................................................................................................................E9/2

9.1.5 Command List.................................................................................................................................................E9/4

9.1.6 Command Messages .......................................................................................................................................E9/5

9.2 Drive Installation Instructions............................................................................................................................ E9/7

9.2.1 MO Drive Kit 2.6 GB (ISO)...........................................................................................................................E9/7

9.2.2 MO Drive Kit 5.2 GB (ISO)...........................................................................................................................E9/8

9.3 Hardware Configuration (Jumper and DIP Switch Settings) ............................................................................. E9/9

9.3.1 Motherboard...................................................................................................................................................E9/9

9.3.2 Core ................................................................................................................................................................E9/9

Date printed: 06.03.02 SW V 1.6 Contents E0/5

1 GENERAL

1.1 MO Recording

D424 MO Recorder

For a long time, analog tape recording has been the standard recording
technology in the professional audio industry. The step into the digital
audio era has been done a few years ago with the introduction of digital
tape recorders, such as DASH and R-DAT machines. Another important
evolution was pushed by the computer industry: Hard disk-based worksta­tions record on fast, direct-access media that are also capable for later ed­iting without destroying the original information.

Beginning with the consumer format CD, a removable medium with ex­cellent price and archiving characteristics, the optical disk became in the
meantime a reliable recording media standard, in audio and computer in­dustry.

Taking the advantages of the above approaches:

• Well accepted and easy-to-understand surface of a dedicated audio re­corder,

• Versatile and future-proof technology, based on standard data storage de­vices (SCSI-2),

• Removable medium with very good archiving characteristics and the capa­bility for direct access editing,
the Studer D424-2 MO recorder has been designed to be integrated into
today's and future environments, combined with analog and digital audio
processing and automation. It is ready to follow the rapid evolution of re­cording technology, without neglecting the needs of the professional user.

Date printed: 22.02.02 SW V 1.6 General E1/1

D424 MO Recorder

1.2 The Medium – Magneto-Optical Disks

1.2.1 Disk Standards

The D424 MO recorder with ISO drive is equipped with a 5.25" MO drive
capable of reading and writing to the standard double-sided 5.25" disk
types listed below. Only high-quality disks should be used for the D424
application. Please contact your Studer representative for information on
the recommended suppliers.

1.2 GB (512 bytes/sector) available on request

2.3 GB (512 bytes/sector) available on request

1.3 GB (1024 bytes/sector) available on request

2.6 GB (1024 bytes/sector) Order No. 15.622.260.13

4.8 GB (1024 bytes/sector) available on request

5.2 GB (2048 bytes/sector) available on request

The D424 will automatically recognize the type of the disk being inserted.
Direct-overwrite (LIM-DOW) type disks are only supported when the
D424 is equipped with a F-541-DW drive.

1.2.2 Disk Formatting

New disks are preformatted from the manufacturer. This process is called
“low-level formatting”. It is only useful after having cleaned a disk that
had numerous defective blocks. Low-level formatting will then re-check
every bit on the disk for validity, which can take up to 40 minutes.
In order to start recording, the D424 only has to add the basic system files.
Building up a DOS system and installing the basic D424 files is called
“high-level formatting”, or simply “formatting”. This process takes only a
few seconds.
After inserting a new, empty disk for the first time, the D424 will auto­matically ask for formatting. Any prerecorded disk may be re-formatted at
any time. This is a fast and direct way to delete the whole contents of a
disk.

E1/2 General SW V 1.6 Date printed: 22.02.02

1.2.3 Disk Capacities

Notes: All 5.25" disks are double-sided. Each side provides the stereo capacity

D424 MO Recorder

Depending on disk type, sampling rate, and recording format, the record­ing capacity will vary. The following table shows some examples of the
recording capacities (stereo, per side):

Disk type 44.1 kHz / 16 bit 48 kHz / 16 bit 48 kHz / 24 bit

1.2 GB ISO 55 min 50 min 34 min

1.3 GB ISO 60 min 55 min 37 min

2.3 GB ISO 1 h 45 min 1 h 37 min 1 h 5 min

2.6 GB ISO 2 h 1 h 50 min 1 h 15 min

4.8 / 5.2 GB ISO 3 h 15 min 3 h 2 h

listed above.
Because of the DOS operating system, a maximum of 2 GB can be used;

4.8 and 5.2 GB disks are automatically formatted with a maximum parti­tion.
With 1.2 and 1.3 GB disks, the insert recording modes are limited to 16
and 20 bit resolution. For assemble recording and editing there is no such
limitation.

Date printed: 22.02.02 SW V 1.6 General E1/3

D424 MO Recorder

1.2.4 Disk Handling

Disks can be write-protected by sliding the appropriate tab to the “ data
protect” position (see manufacturer's information).

DATA PROTECT

The magneto-optical medium is very reliable. Nevertheless, there are some
recommendations for disk storage and handling:

• Always store a disk in its case.

• Keep the disk cartridges away from sources of heat, excessive dust, or
moisture.
Please, follow also the information of the disk manufacturer.

After being exposed to a dusty environment, some blocks may be marked
as defective during recording. The MO drive will automatically assign
spare blocks for storing the affected audio information.
The D424 will check a disk when set to RECORD READY. A warning
message will be displayed if more than 60 grown defective sectors were
found.
When starting with a new production, empty disks should not report any
defective blocks. It is therefore recommended to clean empty disks with
appropriate tools when encountering such warning messages. After a sub­sequent low-level formatting process, the disk will again be in perfect
shape for further recordings.
If the number of reported defective blocks is increasing notably, any fur­ther recording and editing should be avoided. Backup your data before re­suming your session.
Please contact your disk supplier or Studer for detailed information on
accessories as disk cleaning kits.

E1/4 General SW V 1.6 Date printed: 22.02.02

1.3 File Systems, File Formats, Audio Files

The D424 MO-recorder is based on a SCSI-controlled magneto-optical
drive, and standard ISO disks as storage medium. The same drives and
disks are used in computer applications for storing and archiving.
By using the same file system and formats as MS-DOS based computer
platforms, disks that were recorded with a D424 can be played by all DOS
based systems – from simple multimedia computers to fully professional
audio workstations.
The D424 is storing all audio information to sound files in standard Micro­soft Wave format (*.WAV), including all relevant recording parameters, as
sampling rate, word length, and number of channels.
All further information on the structure of a session as well as all editing
information are kept in separate sequence files (*.seq), also known under
the name Edit Decision List (EDL).

1.3.1 Takes, Indices, and Sequences

D424 MO Recorder

When working with the D424, you don't have to care for sound files, di­rectories, or disk structures and the like; the following definitions, how­ever, are important for your recording, editing, and playback work.

The recorded material is subdivided into takes and indices.

• Every time you start recording, a new take is created.

• Place additional take markers during a long recording session. In a concert
you may mark the begin of a new song. This will save time for creating the
definitive markers when editing later.

• Store additional index markers at positions to be edited. Later, you will be
able to address them directly, without the need for searching.

• During the subsequent editing session, all markers having been previously
set can be deleted or moved. New ones can be set in order to prepare your
project for transferring to a CD, with all desired take and index markers.

When you start working with a new project, all settings and editing infor­mation will be stored to the currently selected sequence. Only one se­quence can be active at a time, this is called the “Current Sequence” .

• When you start recording on a new disk, a first sequence will be created.
You will stay with this first sequence until you switch to a new one.

• Create a new, empty sequence for a different project. Start recording and
do your editing session in a separate environment. It is very easy to switch
between different sequences.

• You can have several sequences for a single project – do your basic editing
first, copy the current sequence to a new one, and continue with your ses­sion. You will have access to the basic version at any time.

• Make different versions of an original recording. You can decide at the
end of your projects, which one you would like to keep – or keep all of
them. Sequences do not require much storage capacity.

Date printed: 22.02.02 SW V 1.6 General E1/5

D424 MO Recorder

Takes, Indices: Insert a new, empty disk, set the channels ready, and press REC+PLAY.

The first take in the initial sequence 1 will be recorded. Each time you start
recording, a new take is created, which is given a numbered take marker at
its beginning automatically.
After having recorded three audio takes, the contents of the disk will look
like this:

12 3

take 1 take 2 take 3

The current sequence now consists of three takes. Simply record one more
take, and you will end up with:

12 34

take 1 take 2 take 3 take 4

Whenever there is a need for marking certain points within a take, or to
subdivide a single take into smaller parts, you can create indices by freely
placing index or take markers anywhere within your sequence, either on­line during recording, or later when editing.

Take 2 can be divided into two separate takes by placing an additional
marker. The new take marker gets number 5, which is the next free number
in the current sequence. In addition, a certain position in take 4 is marked
with an index.

125 34.14.2

take 1 take 2 take 5 take 3 take 4

After having placed these markers, you can not only skip from one original
take to the next one, like with a CD player, but also skip to the new mark­ers.
In the example above, the skip sequence is: 1 – 2 – 5 – 3 – 4.1 – 4.2

All the markers can simply be deleted if they are not required anymore. In
case of deleting the take markers 3 and 5 in the above example, the takes 2,
5, and 3 would be joined to a new take. The result would be like this:

12 4.14.2

take 1 take 2 take 4

Finally, markers can be moved, to adjust the take structure of the existing
source material, e.g. to define the position of the tracks and indices of a
CD, or to prepare precise start positions for on-air broadcasting.

After moving the begin of take 2, the above sequence will look like this:

12 4.14.2

take 1 take 2 take 4

E1/6 General SW V 1.6 Date printed: 22.02.02

D424 MO Recorder

Sequences: If it is necessary to make another production with the same recorded mate-

rial, a new sequence is defined. In the following example, only the takes 2,
3, and 4 should be edited, but in reverse order.

12 34

take 1 take 2 take 3 take 4

For this purpose, create a new sequence with the Sequence Editing feature,
insert the required takes in their new order (takes 4, 3, and 2), and the new
sequence will be:

432

take 4 take 3 take 2

You can now start with further editing, like changing markers, renumber­ing, cutting or re-arranging audio information, or adjusting levels.
With a few keystrokes you can switch to another available sequence on the
disk, and start playing, recording, or editing.

Note: Creating new sequences does not need additional audio file capacity on a

disk. There is only a new small EDL file, describing how to play the same
audio data in a different way.

1.3.2 Non-Destructive Editing

The D424 is providing non-destructive editing. Because all editing proc­esses are simply instructions on how to play the original sound files, the
original audio data remain untouched during the whole editing process.

The following processes therefore only modify the sequence data, not the
original audio data:

• Creating, deleting or moving markers.

• Deleting, erasing and inserting audio elements.

• Changing the order of takes.

• Adjusting output levels.
It is possible to have several sequences on the same disk representing dif­ferent variations of the same basic audio material. Each sequence stores
the editing data into its own sequence file, but will make use of the same
audio files.
Without explicitly deleting sound files, which has to be done with a sepa­rate menu utility, the original data can be re-used at any time. It is hardly
possible to delete audio data by accident.

Date printed: 22.02.02 SW V 1.6 General E1/7

D424 MO Recorder

1.4 Utilization for the Purpose Intended

The Studer D424 is a Disk recorder intended for professional use. It is
designed for recording on MO disks.

It is presumed that the unit is operated only by trained personnel. Servic­ing is reserved to skilled technicians.
The electrical connections may be connected only to the voltages and sig­nals designed in this manual.

1.5 Copyright

Copies of pre-recorded Material:
Please consider that copying pre-recorded information is only allowed
with the approval of the authorized copyright holders of the original mate­rial.

1.6 First Steps

1.6.1 Unpacking and Inspection

Your new MO recorder is shipped in a special packing which protects the
unit against mechanical shock during transit. Care should be exercised
when unpacking so that its surfaces do not get marred.
Verify that the content of the packing agrees with the items listed on the
enclosed shipping list.
Check the condition of the equipment for signs of shipping damage. If
there should be any complaints you should immediately notify the for­warding agent and your nearest Studer distributor.
Please retain the original packing material because it offers the best pro­tection in case your equipment ever needs to be transported.

1.6.2 Installation

Power Connection: The attached female IEC 320/C 13 mains cable socket has to be connected

to an appropriate mains cable by a trained technician with respect to your
local regulations. Refer to the “Installation, Operation, and Waste Dis­posal” section at the beginning of this manual.

Maintenance work inside the unit must be performed by a trained techni­cian.

Humidity: Do not use the unit near any source of moisture or in excessively humid

environments.

Cooling: To allow for reliable operation, the maximum temperature of the disk car-

tridge must never exceed 55° C (131° F), no matter in which operating
mode. When installing the unit in a rack or any other location, be sure that
there is sufficient ventilation. The maximum ambient temperature for op­erating the unit is 35° C.
A unit operated outside a rack must be placed on a rigid, flat surface. The
air vents must never be covered completely or partially.

E1/8 General SW V 1.6 Date printed: 22.02.02

When operating the unit inside a rack, sufficient cross-sections must be
provided above and below the unit for air convection. The air inlet below
the unit must have a minimum cross-section of 8 × 420 mm. Above the
unit, a free area of minimum 43 mm (1U) with an air outlet of
40 × 420 mm must be provided.
During operation, the temperature of the incoming air (from the front of
and from below the unit) must never exceed 35° C.

1.6.3 Adjustments, Repair

Danger: All internal adjustments as well as repair work on this product are to be

performed by skilled technicians!
During service work dangerous laser radiation can occur, so the appro­priate precautions must be taken.

Primary Fuse: The primary fuse (F 4 A H 250 V, 5 × 20 mm) is located inside the unit.

Therefore only skilled technicians are authorized to replace the fuse.

D424 MO Recorder

1.6.4 Accessories, Options

Accessories Shipped with the D424: 1 Operating manual (English) Order No. 10.27.3803

1 Female mains connector (IEC 320/C 13) Order No. 54.42.1050
1 MO Disk
1 Hexagon pin spanner 2.5 mm Order No. 98.00.2023
2 Fuses F 4 A, 250 V Order No. 51.01.0156

D424 Options: Desktop Controller Order No. 20.866.500.00

Recording Media: MO Disk 2.6 GB ISO Order No. 15.622.260.13

(Other capacities available on request)

Date printed: 22.02.02 SW V 1.6 General E1/9

D424 MO Recorder

1.6.5 Connector Field

[3] [11] [9] [5] [6][8]

OUT 1

LINE

OUT 2

IN 1

LINE

IN 2

SCSI-2

SERIAL

CONTROLLER

CONTROLLER

PARALLEL

VIDEOIN OUT

75 Ω

Ω

ΩΩ

OFF

WORDCLOCKIN OUT

75

ΩΩΩΩ

OFF

IN OUTSYNC AES/EBU TCIN OUTAES/EBU

CAUTION

RISK OF ELECTRIC SHOCK

DO NOT OPEN

ATTENTION

RISQUE DE CHOC ELECTRIQUE

NE PAS OUVRIR

ACHTUNG

GEFAHR: ELEKTRISCHER SCHLAG

NICHT ÖFFNEN

[2] [10] [4] [7] [1]

[1] AC PLUG AC power connector IEC 320/C 14

for mains supply 100...240 V, 50...60 Hz

[2] AES/EBU IN/OUT AES/EBU digital audio I/O

Input (XLR-3, female) and output (XLR-3, male)

[3] ANALOG IN/OUT Analog audio I/O

(optional) Input CH1/CH2 (XLR-3 female) and output CH1/CH2 (XLR-3 male)

100 - 240 V

~

[4] SYNC AES/EBU AES-11 digital audio reference

Input (XLR-3, female)

[5] VIDEO REFERENCE Composite Video Reference, 75 Ω termination selectable

Input and output (loop through), BNC connectors

[6] WORD CLOCK Digital word clock, 75 Ω termination selectable

Input and output, BNC connectors

[7] TIME CODE SMPTE/EBU longitudinal timecode

Input (XLR-3 female), and output (XLR-3 male)

[8] SERIAL Serial remote RS-422, Input

(SONY 9-pin compatible)

[9] CONTROLLER Desktop Controller, input and output (loop through)

For Desktop Controller operation and multi-machine configurations

[10] PARALLEL Parallel GPI port, input/output

[11] SCSI-2 SCSI-2 port

For external drive configurations and SCSI data transfer

E1/10 General SW V 1.6 Date printed: 22.02.02

1.6.6 Connector Pin Assignments

D424 MO Recorder

INPUT/OUTPUT LEFT/RIGHT

AES/EBU DIGITAL IN/OUT

SERIAL 9 pin D-type, female

IN OUT

1

2

3

1 2

3

XLR-3f XLR-3m

IN OUT

1

2

3

1 2

3

XLR-3f XLR-3m

Pin Signal Function

1

FGND

2

15

69

TXA

3

RXB

4

RXC

5

VCC

6

TXC

7

TXB

8

RXA

9

FGND

Pin Signal

1

Ground

2

Line A ("hot")

3

Line B ("cold")

Pin Signal

1

Ground

2

Line A ("hot")

3

Line B ("cold")

Frame ground
Transmit A (inverted)
Receive B
Receive common
Supply voltage +24 V, switchable
Transmit common
Transmit B
Receive A (inverted)
Frame ground

CONTROLLER 15 pin D-type, female

Pin Signal Function

1

PHL–

2

PHR–

3

AGND

4

REMT

5

8 1

915

Date printed: 22.02.02 SW V 1.6 General E1/11

6
7
8

9
10
11
12
13
14
15

REMR
STSTR
SYNCBUS
DGND
PHL+
PHR+
+24 V
IREMT
IREMR
ISTSTR
ISYNCBUS

Phones left, inverted
Phones right, inverted
Analog ground
Rem bus transmit
Rem bus receive
Start signal
Sync bus
Digital ground
Phones left
Phones right
Supply voltage
Rem bus transmit, inverted
Rem bus receive, inverted
Start signal, inverted
Sync bus, inverted

D424 MO Recorder

PARALLEL 15 pin D-type, female

Pin Signal Function

1
2
3
4

81

5
6
7
8

915

9
10
11
12
13
14
15

B_TAKE
B_INDEX
B_PLAY
S_STOP
S_PLAY
S_PLOC
FADER1
GND
B_STOP
B_READY
VCC
S_PREV
S_NEXT
FADER2
KEY

Take pulse
Index pulse
Play tally
Stop command
Play command
Ploc command
Fader start input 1
Ground
Stop tally
D424 ready
Supply voltage, switchable 5/24 V
Previous command
Next command
Fader start input 2
Key

E1/12 General SW V 1.6 Date printed: 22.02.02