Studer D21m Product Information

Studer D21m

I/O System Components

Product Information

(January 2009, 12th Edition)

Prepared and edited by Copyright by Studer Professional Audio GmbH Studer Professional Audio GmbH Printed in Switzerland Technical Documentation Order no. BD10.275102-12 (0109) Althardstrasse 30 CH-8105 Regensdorf – Switzerland http://www.studer.ch Subject to change

Studer is a registered trade mark of Studer Professional Audio GmbH, Regensdorf

A Safety Information

To reduce the risk of electric shock, do not remove covers. No userserviceable parts inside. Refer servicing to qualified service personnel (i.e., persons having appropriate technical training and experience necessary to be aware of hazards to which they are exposed in performing a repair action, and of measures to minimize the danger of themselves).

This symbol alerts the user to the presence of un-insulated dangerous voltage within the equipment that may be of sufficient magnitude to constitute a risk of electric shock to a person.

This symbol alerts the user to important instructions for operating and maintenance in this documentation.

Safety Information

CLASS I

LED PRODUCT

CLASS I

LASER PRODUCT

A1 First Aid

Assemblies or sub-assemblies of this product can contain opto-electronic devices. As long as these devices comply with Class I of laser or LED products according to EN 60825-1:1994, they will not be expressly marked on the product. If a special design should be covered by a higher class of this standard, the device concerned will be marked directly on the assembly or sub-assembly in accordance with the above standard.

In Case of Electric Shock: Separate the person as quickly as possible from the electric power

source:

• By switching off the equipment,

• By unplugging or disconnecting the mains cable, or

• By pushing the person away from the power source, using dry, insulating material (such as wood or plastic).

• After having suffered an electric shock, always consult a doctor.

Warning! Do not touch the person or his clothing before the power is turned

off, otherwise you stand the risk of suffering an electric shock as well!

If the Person is Unconscious: • Lay the person down

• Turn him to one side

• Check the pulse

• Reanimate the person if respiration is poor

• Call for a doctor immediately.

Installation/Maintenance/ESD

B General Installation Instructions

Please consider besides these general instructions also any product-specific

B1 Unpacking

Check the equipment for any transport damage. If the unit is mechanically

B2 Installation Site

Install the unit in a place where the following conditions are met:

• The temperature and the relative humidity of the environment must be

• Condensation must be avoided. If the unit is installed in a location with

• Unobstructed air flow is essential for proper operation. Air vents of the

• The unit must not be heated up by external sources of heat radiation

B3 Earthing and Power Supply

instructions in the “Installation” chapter of this manual.

damaged, if liquids have been spilled or if objects have fallen into the unit,

it must not be connected to the AC power outlet, or it must be immediately disconnected by unplugging the power cable. Repair must only be per-

formed by trained personnel in accordance with the applicable regulations.

within the specified limits during operation of the unit. Relevant values are the ones at the air inlets of the unit.

large variation of ambient temperature (e.g. in an OB-van), appropriate precautions must be taken before and after operation (for details on this subject, refer to Appendix 1).

unit are a functional part of the design and must not be blocked in any way during operation (e.g. by objects placed upon them, placement of the unit on a soft surface, or installation of the unit within a rack or piece of furniture).

(sunlight, spot lights).

Earthing of units with mains supply (class I equipment) is performed via

the protective earth (PE) conductor integrated in the mains cable. Units with battery operation (< 60 V, class III equipment) must be earthed separately.

Earthing the unit is one of the measures for protection against electrical

shock hazard (dangerous body currents). Hazardous voltage may not only be caused by a defective power supply insulation, but may also be introduced by the connected audio or control cables.

If the unit is installed with one or several external connections, its earthing

must be provided during operation as well as while the unit is not operated. If the earthing connection can be interrupted, for example, by unplugging the mains plug of an external power supply unit, an additional, permanent earthing connection must be installed using the provided earth terminal.

Avoid ground loops (hum loops) by keeping the loop surface as small as

possible (by consequently guiding the earth conductors in a narrow, parallel way), and reduce the noise current flowing through the loop by inserting an additional impedance (common-mode choke).

ESD/Repair

Class I Equipment (Mains Operation)

Should the equipment be delivered without a matching mains cable, the

latter has to be prepared by a trained person using the attached female plug (IEC320/C13 or IEC320/C19) with respect to the applicable regulations in your country.

Before connecting the equipment to the AC power outlet, check that the

local line voltage matches the equipment rating (voltage, frequency) within the admissible tolerance. The equipment fuses must be rated in accordance with the specifications on the equipment.

Equipment supplied with a 3-pole appliance inlet (protection conforming to

class I equipment) must be connected to a 3-pole AC power outlet so that the equipment cabinet is connected to the protective earth.

For information on mains cable strain relief please refer to Appendix 2.

Female Plugs (IEC320), Front-Side View:

European Standard

(CENELEC)

Brown L (Live) Black

Blue N (Neutral) White

Green/Yellow PE (Protective Earth) Green (or Green/Yellow)

North American Standard

(NAS)

Class III Equipment (Battery Operation up to 60 V

)

Equipment of this protection class must be earthed using the provided earth

terminal, if one or more external signals are connected to the unit (see explanation at the beginning of this paragraph).

B4 Electromagnetic Compatibility (EMC)

The unit conforms to the protection requirements relevant to electromag-

netic phenomena that are listed in guidelines 89/336/EC and FCC, part 15.

• The electromagnetic interference generated by the unit is limited in such a way that other equipment and systems can be operated normally.

• The unit is adequately protected against electromagnetic interference so that it can operate properly.

The unit has been tested and conforms to the EMC standards of the speci-

fied electromagnetic environment, as listed in the following declaration. The limits of these standards ensure protection of the environment and corresponding noise immunity of the equipment with appropriate probability. However, a professional installation and integration within the system are imperative prerequisites for operation without EMC problems.

For this purpose, the following measures must be followed:

• Install the equipment in accordance with the operating instructions. Use the supplied accessories.

• In the system and in the vicinity where the equipment is installed, use only components (systems, equipment) that also fulfill the EMC standards for the given environment.

• Use a system grounding concept that satisfies the safety requirements (class I equipment must be connected with a protective ground conduc-

III

Installation/Maintenance/ESD

tor) and that also takes into consideration the EMC requirements. When deciding between radial, surface, or combined grounding, the advantages and disadvantages should be carefully evaluated in each case.

• Use shielded cables where shielding is specified. The connection of the shield to the corresponding connector terminal or housing should have a large surface and be corrosion-proof. Please note that a cable shield connected only single-ended can act as a transmitting or receiving antenna within the corresponding frequency range.

• Avoid ground loops or reduce their adverse effects by keeping the loop surface as small as possible, and reduce the noise current flowing through the loop by inserting an additional impedance (e.g. commonmode choke).

• Reduce electrostatic discharge (ESD) of persons by installing an appropriate floor covering (e.g. a carpet with permanent electrostatic filaments) and by keeping the relative humidity above 30%. Further measures (e.g. conducting floor) are usually unnecessary and only effective if used together with corresponding personal equipment.

• When using equipment with touch-sensitive operator controls, please take care that the surrounding building structure allows for sufficient capacitive coupling of the operator. This coupling can be improved by an additional, conducting surface in the operator’s area, connected to the equipment housing (e.g. metal foil underneath the floor covering, carpet with conductive backing).

C Maintenance

All air vents and openings for operating elements (faders, rotary knobs)

must be checked on a regular basis, and cleaned in case of dust accumulation. For cleaning, a soft paint-brush or a vacuum cleaner is recommended.

Cleaning the surfaces of the unit is performed with a soft, dry cloth or a

soft brush.

Persistent contamination can be treated with a cloth that is slightly humidi-

fied with a mild cleaning solution (soap-suds).

For cleaning display windows, commercially available computer/TV

screen cleaners are suited. Use only a slightly damp (never wet) cloth.

Never use any solvents for cleaning the exterior of the unit! Liquids must

never be sprayed or poured on directly!

For equipment-specific maintenance information please refer to the corre-

sponding chapter in the Operating and Service Instructions manuals.

D Electrostatic Discharge during Maintenance and Repair

Caution: Observe the precautions for handling devices sensitive to electrostatic dis-

charge!

Many semiconductor components are sensitive to electrostatic discharge

(ESD). The life-span of assemblies containing such components can be drastically reduced by improper handling during maintenance and repair work. Please observe the following rules when handling ESD sensitive components:

• ESD sensitive components should only be stored and transported in the packing material specifically provided for this purpose.

• When performing a repair by replacing complete assemblies, the removed assembly must be sent back to the supplier in the same packing

ESD/Repair

material in which the replacement assembly was shipped. If this should not be the case, any claim for a possible refund will be null and void.

• Unpacked ESD sensitive components should only be handled in ESD protected areas (EPA, e.g. area for field service, repair or service bench) and only be touched by persons who wear a wristlet that is connected to the ground potential of the repair or service bench by a series resistor. The equipment to be repaired or serviced as well as all tools and electrically semi-conducting work, storage, and floor mats should also be connected to this ground potential.

• The terminals of ESD sensitive components must not come in uncontrolled contact with electrostatically chargeable (voltage puncture) or metallic surfaces (discharge shock hazard).

• To prevent undefined transient stress of the components and possible damage due to inadmissible voltages or compensation currents, electrical connections should only be established or separated when the equipment is switched off and after any capacitor charges have decayed.

E Repair

Removal of housing parts, shields, etc. exposes energized parts. For this

reason the following precautions must be observed:

• Maintenance may only be performed by trained personnel in accordance with the applicable regulations.

• The equipment must be switched off and disconnected from the AC power outlet before any housing parts are removed.

• Even if the equipment is disconnected from the power outlet, parts with hazardous charges (e.g. capacitors, picture tubes) must not be touched until they have been properly discharged. Do not touch hot components (power semiconductors, heat sinks, etc.) before they have cooled off.

• If maintenance is performed on a unit that is opened and switched on, no un-insulated circuit components and metallic semiconductor housings must be touched, neither with your bare hands nor with un-insulated tools.

Certain components pose additional hazards:

• Explosion hazard from lithium batteries, electrolytic capacitors and power semiconductors (watch the component’s polarity. Do not short battery terminals. Replace batteries only by the same type).

• Implosion hazard from evacuated display units.

• Radiation hazard from laser units (non-ionizing), picture tubes (ioniz- ing).

• Caustic effect of display units (LCD) and components containing liquid electrolyte.

Such components should only be handled by trained personnel who are

properly protected (e.g. safety goggles, gloves).

Repair/Disposal

E1 SMD Components

Studer has no commercially available SMD components in stock for ser-

vice purposes. For repair, the corresponding devices have to be purchased locally. The specifications of special components can be found in the service manual.

SMD components should only be replaced by skilled specialists using ap-

propriate tools. No warranty claims will be accepted for circuit boards that have been damaged. Proper and improper SMD soldering joints are illustrated below.

Copper

Track

Dismounting

Soldering

Iron

SMD

Component

Adhesive

Desoldering

Iron

Solder

PCB

Desolder

Wick

Mounting

Solder Ø 0.5...0.8 mm

Heating Time < 3 s per Side

Soldering Iron

Desolder

Wick

Heat and Remove Cleaning

Examples

F Disposal

Disposal of Packing Materials The packing materials have been selected with environmental and disposal

issues in mind. All packing material can be recycled. Recycling packing saves raw materials and reduces the volume of waste.

If you need to dispose of the transport packing materials, please try to use

recyclable means.

Disposal of Used Equipment Used equipment contains valuable raw materials as well as materials that

must be disposed of professionally. Please return your used equipment via an authorized specialist dealer or via the public waste disposal system, ensuring any material that can be recycled is.

Please take care that your used equipment cannot be abused. To avoid

abuse, delete sensitive data from any data storage media. After having disconnected your used equipment from the mains supply, make sure that the mains connector and the mains cable are made useless.

Conformity

G Declarations of Conformity

G1 Class A Equipment - FCC Notice

This equipment has been tested and found to comply with the limits for a

Class A digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide a reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference, in which case the user will be required to correct the interference at his own expense.

Caution: Any changes or modifications not expressly approved by the manufacturer

G2 CE Declaration of Conformity

vant information in this manual.

We,

Studer Professional Audio GmbH, CH-8105 Regensdorf,

declare under our sole responsibility that the product

Studer D21m, Digital I/O System (starting with serial no. 0001)

to which this declaration relates, according to following regulations of EU

directives and amendments

• Low Voltage (LVD):

73/23/EEC + 93/68/EEC

• Electromagnetic Compatibility (EMC):

89/336/EEC + 92/31/EEC + 93/68/EEC is in conformity with the following standards or normative documents:

• Safety:

EN 60950-1:2000 (Class I equipment)

• Safety of laser products:

EN 60825-1:2004 + A11 + A2, EN60825-2:2000

• EMC:

EN 55103-1/-2:1996, electromagnetic environments E2 and E4.

Regensdorf, November 12, 2004

B. Hochstrasser, President M. Lienert, Manager R&D

VII

Appendix

Appendix 1: Air Temperature and Humidity

General

Normal operation of the unit or system is warranted under the following

ambient conditions defined by EN 60721-3-3, set IE32, value 3K3.

This standard consists of an extensive catalogue of parameters, the most

important of which are: ambient temperature +5...+40 °C, relative humidity

5...85% (i.e., no formation of condensation or ice); absolute humidity

1...25 g/m³; rate of temperature change < 0.5 °C/min. These parameters are dealt with in the following paragraphs.

Under these conditions the unit or system starts and works without any

problem. Beyond these specifications, possible problems are described in

Ambient Temperature

Units and systems by Studer are generally designed for an ambient tem-

• The admissible ambient temperature range for operation of the semi-

• The air flow through the installation must provide that the outgoing air

• Average heat increase of the cooling air shall be about 20 K, allowing

• In order to dissipate 1 kW with this admissible average heat increase, an

Example: A rack dissipating P = 800 W requires an air flow of 0.8 * 2.65 m³/min

• If the cooling function of the installation must be monitored (e.g. for fan

Frost and Dew

the following paragraphs.

perature range (i.e. temperature of the incoming air) of +5...+40 °C. When rack mounting the units, the intended air flow and herewith adequate cooling must be provided. The following facts must be considered:

conductor components is 0 °C to +70 °C (commercial temperature range for operation).

is always cooler than 70 °C.

for an additional maximum 10 K increase at the hot components.

air flow of 2.65 m³/min is required.

which corresponds to 2.12 m³/min.

failure or illumination with spot lamps), the outgoing air temperature must be measured directly above the modules at several places within the rack. The trigger temperature of the sensors should be 65 to 70 °C.

The unsealed system parts (connector areas and semiconductor pins) allow

for a minute formation of ice or frost. However, formation of dew visible with the naked eye will already lead to malfunctions. In practice, reliable operation can be expected in a temperature range above –15 °C, if the following general rule is considered for putting the cold system into operation:

If the air within the system is cooled down, the relative humidity rises. If it

reaches 100%, condensation will arise, usually in the boundary layer between the air and a cooler surface, together with formation of ice or dew at sensitive areas of the system (contacts, IC pins, etc.). Once internal condensation occurs, trouble-free operation cannot be guaranteed, independent of temperature.

Before putting into operation, the system must be checked for internal for-

mation of condensation or ice. Only with a minute formation of ice, direct

VIII

Appendix

evaporation (sublimation) may be expected; otherwise the system must be heated and dried while switched off.

A system without visible internal formation of ice or condensation should

be heated up with its own heat dissipation, as homogeneously (and subsequently as slow) as possible; the ambient temperature should then always be lower than the one of the outgoing air.

If it is absolutely necessary to operate the cold system immediately within

warm ambient air, this air must be dehydrated. In such a case, the absolute humidity must be so low that the relative humidity, related to the coldest system surface, always remains below 100%.

Ensure that the enclosed air is as dry as possible when powering off (i.e.

before switching off in winter, aerate the room with cold, dry air, and remove humid objects as clothes from the room).

These relationships are visible from the following climatogram. For a con-

trolled procedure, thermometer and hygrometer as well as a thermometer within the system will be required.

Example 1: An OB-van having an internal temperature of 20 °C and relative humidity

of 40% is switched off in the evening. If temperature falls below +5 °C, dew or ice will be forming.

Example 2: An OB-van is heated up in the morning with air of 20 °C and a relative

humidity of 40%. On all parts being cooler than +5 °C, dew or ice will be forming.

Appendix

Appendix 2: Mains Connector Strain Relief

For anchoring connectors without a mechanical lock (e.g. IEC mains con-

nectors), we recommend the following arrangement:

Procedure: The cable clamp shipped with your unit is auto-adhesive. For mounting

please follow the rules below:

• The surface to be adhered to must be clean, dry, and free from grease, oil, or other contaminants. Recommended application temperature range is +20...+40 °C.

• Remove the plastic protective backing from the rear side of the clamp and apply it firmly to the surface at the desired position. Allow as much time as possible for curing. The bond continues to develop for as long as 24 hours.

• For improved stability, the clamp should be fixed with a screw. For this purpose, a self-tapping screw and an M4 bolt and nut are included.

• Place the cable into the clamp as shown in the illustration above and firmly press down the internal top cover until the cable is fixed.

Appendix

Appendix 3: Software License

Use of the software is subject to the Studer Professional Audio Software

License Agreement set forth below. Using the software indicates your acceptance of this license agreement. If you do not accept these license terms, you are not authorized to use this software.

Under the condition and within the scope of the following Terms and Con-

ditions, Studer Professional Audio AG (hereinafter “Studer”) grants the right to use programs developed by Studer as well as those of third parties which have been installed by Studer on or within its products. References to the license programs shall be references to the newest release of a li-

Programs Covered by the Agreement

License Programs of Studer The following Terms and Conditions grant the right to use all programs of

Using the software indicates your acceptance of this license agreement. If

Programs of Third Parties Programs of third parties are all programs which constitute part of the Sys-

• The right to use third parties’ programs is governed by the License

• Studer shall accept no responsibility or liability for, and gives no war-

Right of Use

cense program installed at the Customer’s site.

Studer that are part of the System and/or its options at the time of its delivery to the Customer, as well as the installation software on the original data disk and the accompanying documentation (“License Material”). In this Agreement the word “Programs” shall have the meaning of programs and data written in machine code.

you do not accept these license terms, you are not authorized to use this software.

tem and/or its options at the time of delivery to the Customer but have not been developed by Studer. The following conditions are applicable to programs of third parties:

Agreement attached hereto (if applicable), which is an integral part of this Agreement. The Customer shall sign any and all License Agreements for all further programs of third parties installed on the system. The Customer shall be deemed to have received all License Agreements upon delivery of the system and/or its options.

ranties (express or implied) as to the programs of third parties. The Customer waives any and all claims versus Studer for any consequential damages, which might occur due to defects of these programs.

Principle Studer grants the Customer the non-exclusive right to use the License Ma-

terial in one copy on the system and/or its options as laid down by the Sales Agreement concluded between the parties and all Terms and Conditions which shall be deemed to form and be read and construed as part of the Sales Agreement. This right is assignable according to the “Assignability” paragraph hereinafter.

Customized Configurations The Customer is not entitled to alter or develop further the License Mate-

rial except within the expressly permitted configuration possibilities given by the software installed on the system or elsewhere. All altered programs, including but not limited to the products altered within the permitted configuration possibilities, are covered by this License Agreement.

Appendix

Reverse Engineering Reverse engineering is only permitted with the express consent of Studer.

The consent of Studer can be obtained but is not limited to the case in which the interface-software can not be provided by Studer. In any case Studer has to be informed immediately upon complete or partial reverse engineering.

Copying the License Material The Customer is entitled to make one copy of all or parts of the License

Material as is necessary for the use according to this Agreement, namely for backup purposes. The Customer shall apply the copyright of Studer found on the License Material onto all copies made by him. Records shall be kept by the Customer regarding the amount of copies made and their place of keeping. The responsibility for the original program and all copies made lies with the Customer. Studer is entitled to check these records on first request. Copies not needed anymore have to be destroyed immediately.

Disclosure of License Material The License Material is a business secret of Studer. The Customer shall not

hand out or in any way give access to parts or the complete License Material to third parties nor to publish any part of the License Material without prior written consent of Studer. The Customer shall protect the License Material and any copies made according to the paragraph above by appropriate defense measures against unauthorized access. This obligation of non-disclosure is a perpetual obligation.

Third parties are entitled to have access to the License Material if they use

the License Material at the Customer’s site in compliance with this Agreement.

Under no circumstance are third parties entitled to have access to the instal-

lation software on the original data media. The Customer shall safeguard the original data media accordingly.

Assignability The rights granted to the Customer according to this License Agreement

shall only be assignable to a third party together with the transfer of the

Rights to License Material

system and/or its options and after the prior written consent of Studer.

With the exception of the right of use granted by this License Agreement

all proprietary rights to the License Material, especially the ownership and the intellectual property rights (such as but not limited to patents and copyright) remain with Studer even if alterations, customized changes or amendments have been made to the License Material.

Studer’s proprietary rights are acknowledged by the Customer. The Cus-

tomer shall undertake no infringements and make no claims of any patent, registered design, copyright, trade mark or trade name, or other intellectual property right.

Warranty, Disclaimer, and Liability

For all issues not covered herewithin, refer to the “General Terms and

Conditions of Sales and Delivery” being part of the sales contract.

XII

D21m System

1 General .............................................................................................................................................................................1-1

1.1 Utilization for the Purpose Intended ...........................................................................................................................1-1

1.2 First Steps.................................................................................................................................................................... 1-1

1.2.1 Unpacking and Inspection..................................................................................................................................1-1

1.2.2 Installation..........................................................................................................................................................1-1

1.2.3 Adjustments, Repair, Cleaning ..........................................................................................................................1-2

2 Introduction .....................................................................................................................................................................2-1

2.1 System Philosophy......................................................................................................................................................2-1

2.2 The Frame and its Cards .............................................................................................................................................2-3

2.3 Hub Frame...................................................................................................................................................................2-4

2.4 Remote I/O Frame....................................................................................................................................................... 2-4

2.5 Vista Surveyor Software .............................................................................................................................................2-4

3 Applications......................................................................................................................................................................3-1

3.1 Local I/O Only (Located Close to Core)..................................................................................................................... 3-1

3.2 One I/O Box Within Long Distance............................................................................................................................3-1

3.3 Multiple I/O Boxes, Long Distance ............................................................................................................................3-2

3.4 Multiple Hubs, Multiple I/O Boxes, Long Distance...................................................................................................3-3

3.5 Shared I/O ...................................................................................................................................................................3-4

4 System Examples .............................................................................................................................................................4-1

4.1 System with Remote and Local I/O ............................................................................................................................4-1

4.2 System with Remote MIDI Connection......................................................................................................................4-2

5 Additional Information ................................................................................................................................................... 5-1

5.1 Mapping of I/O Cards to MADI and HD Link Channels ...........................................................................................5-1

5.2 Special Case: Microphone/Line Input Card................................................................................................................5-2

5.3 Analog Insert Cards ....................................................................................................................................................5-2

5.4 96 kHz Operation ........................................................................................................................................................ 5-3

5.5 Input/Output Delays....................................................................................................................................................5-4

5.5.1 Additional SFC Delay........................................................................................................................................ 5-5

5.5.2 Additional Processing Delay..............................................................................................................................5-5

5.6 The MADI Interface: 64 or 56 Channels?...................................................................................................................5-5

5.7 Standalone D21m I/O System.....................................................................................................................................5-6

5.8 Connection to the Performa Core................................................................................................................................5-8

Date printed: 30.08.07

Contents 0-1

D21m System

6 D21m Modules .................................................................................................................................................................6-1

6.1 Available Cards ...........................................................................................................................................................6-1

6.2 Analog I/O Cards ........................................................................................................................................................6-2

6.2.1 Mic/Line In Card .....................................................................................................1.949.427..........................6-2

6.2.2 Analog Insert Card ..................................................................................................1.949.428..........................6-4

6.2.3 Line In Card ............................................................................................................1.949.421.......................... 6-6

6.2.4 Line Out Card .........................................................................................................1.949.420..........................6-8

6.3 Digital I/O Cards.......................................................................................................................................................6-10

6.3.1 AES/EBU I/O Cards ...........................................................1.949.422, 1.949.423, 1.949.424........................6-10

6.3.2 MADI I/O Cards .................................................................1.949.430, 1.949.431, 1.949.433........................6-13

6.3.3 ADAT I/O Cards ...................................................................................1.949.425, 1.949.429........................6-17

6.3.4 TDIF I/O Card .........................................................................................................1.949.426........................6-19

6.3.5 SDI InputCard..........................................................................................................1.949.441........................6-21

6.3.6 SDI I/O Card............................................................................................................1.949.442........................ 6-23

6.3.7 Dolby

6.3.8 CobraNet® Card .......................................................................................................1.949.445........................6-30

6.3.9 Aviom A-Net® Card .................................................................................................1.949.446........................6-32

6.3.10 EtherSound® Card ............................................................................................................................................ 6-34

E/Digital Decoder Cards ...........................................................1.949.443, 1.949.444........................6-25

6.4 Non-Audio I/O Cards................................................................................................................................................6-36

6.4.1 GPIO Card ..............................................................................................................1.949.435........................6-36

6.4.2 GPIO Card w. Relay Outputs ..................................................................................1.949.436........................6-38

6.5 HD Cards...................................................................................................................................................................6-40

6.5.1 HD Card S ...............................................................................................................1.949.412........................ 6-40

6.5.2 HD/RS422 Card ......................................................................................................1.949.415........................ 6-42

6.5.3 MADI HD Cards .................................................................1.949.411, 1.949.413, 1.949.414........................6-44

6.6 Serial/Merger Cards ..................................................................................................................................................6-48

6.6.1 Serial Card ..............................................................................................................1.949.437........................6-48

6.6.2 Serial Merger Card ..................................................................................................1.949.438........................6-50

6.6.3 Serial RJ45 Card .....................................................................................................1.949.439........................6-52

6.6.4 Dual Merger Card ...................................................................................................1.949.440........................6-54

6.7 Power Supply/Miscellaneous....................................................................................................................................6-56

6.7.1 Primary Power Supply .............................................................................................1.949.403........................ 6-56

6.7.2 LED/PSII PCB.........................................................................................................1.949.402........................ 6-57

6.7.3 Air Deﬂ ector/Filter Unit ...........................................................................................1.949599........................6-58

6.7.4 Fan Unit ...................................................................................................................1.949.597........................6-58

6.7.5 Break-Out Boxes..............................................................................................................................................6-59

6.7.5.1 XLR Break-Out Box............................................................................................................................... 6-59

6.7.5.2 AES/EBU on BNC Break-Out Box ................................................................1.949.586........................6-59

6.7.5.3 GPIO Break-Out Box......................................................................................1.949.588........................6-60

6.7.6 Cables...............................................................................................................................................................6-61

6.8 Discontinued Components ........................................................................................................................................6-62

6.8.1 HD Card (not available for new systems)................................................................1.949.410........................ 6-62

Disclaimer

The information in this document has been carefully checked and is believed

to be accurate at the time of publication. However, no responsibility is taken by us for inaccuracies, errors, or omissions, nor is any liability assumed for any loss or damage resulting either directly or indirectly from use of the information contained within it.

0-2 Contents

Date printed: 30.08.07

D21m System

1 GENERAL

1.1 Utilization for the Purpose Intended

The D21m system is intended for professional use. It is presumed that the unit is operated only by trained personnel. Servicing

is reserved to skilled technicians.

The electrical connections may be connected only to the voltages and signals

designated in this manual.

1.2 First Steps

1.2.1 Unpacking and Inspection

Your new system is shipped in a special packing which protects the units

against mechanical shock during transit. Care should be exercised when unpacking so that the surfaces do not get marred.

Check the condition of the equipment for signs of shipping damage. If there

should be any complaints you should immediately notify the forwarding agent and your nearest Studer distributor.

Please retain the original packing material because it offers the best protection

in case your equipment ever needs to be transported.

1.2.2 Installation

Primary Voltage: The power supply unit is auto-ranging; it can be used for mains voltages in

a range of 100 to 240 V

Power Connection : The attached female IEC 320/C13 mains cable socket has to be connected

to an appropriate mains cable by a trained technician, respecting your local regulations. Refer to the “Installation, Operation, and Waste Disposal” chapter at the beginning of this manual.

Earthing : This equipment must be earthed, due to the mains input ﬁ lter network be ing

connected to the mains earth .

Some consideration must be given to the earthing arrangement of the sy stem,

at the center of which is the frame. The frame is earthed to the mains earth via the power supply . Ground loops may occur where signal processing equipment, patched to the frame, has its signal earth commoned to the equip ment chassis.

Temperature Regulations: The unit must not be used in conditions of excessive heat or cold, near any

source of moisture, in excessively humid environments, or in positions where it is likely to be subjected to vibration or dust. The ambient temperature range for normal operation of the unit is +5...+40° C.

Under standard circumstances (open 19” frame) and an ambient temperature

between +5 and +40° C, the power dissipations listed below must not be exceeded. Please note that these ﬁ gures may change for special environments, such as air-conditioned machine rooms, etc.

(continued on next page)

, 50 to 60 Hz.

Date printed: 11.07.07

General 1-1

D21m System

Closed Passive, 2 Vents Active, 1 Fan, 1 Vent

Rear Rear

Air

D21mD21m D21m

Air

RearFront Front Front

Operating Mode Total Height Max. Power Dissipation

Closed 3 U 40 W

Passive, w. Vents 5 U 80 W

Active, w. Fan and Vent 5 U 200 W

Card No. Card Name Power Dissipation (approx.)

Backplane with power supply 10 W

1.949.427 Mic/Line in card 11 W

1.949.428 Analog insert card 2 W

1.949.421 Line In card 7 W

1.949.420 Line out card 7 W

1.949.422 AES/EBU card 3.5 W

1.949.423 AES/EBU card with input SFC 4.5 W

1.949.424 AES/EBU card with input/output SFC 5.5 W

1.949.430 MADI card, multi-mode ﬁ bre 4 W

1.949.431 MADI card, single-mode ﬁ bre 4 W

1.949.433 MADI card, twisted pair 4 W

1.949.425 ADAT I/O card 1.7 W

1.949.429 ADAT card, long-distance option 1.7 W

1.949.426 TDIF I/O card 1 W

1.949.441 SDI input card (16 channels) 4 W

1.949.442 SDI input/output card (8 channels) 4 W

1.949.443 Dolby

1.949.444 Dolby

1.949.445 CobraNet

1.949.446 Aviom A-Net

E/Digital decoder card, single 2.5 W

E/Digital decoder card, dual 4 W

card 4.5 W

card 2 W

1.949.435 GPIO card 3 W

1.949.436 GPIO card with relay outputs 2 W

1.949.412 HD card S 5 W

1.949.415 HD RS422 card 5 W

1.949.411 MADI HD card, multi-mode ﬁ bre 5.5 W

1.949.413 MADI HD card, single-mode ﬁ bre 5.5 W

1.949.414 MADI HD card, twisted pair 5.5 W

1.949.437 Serial card 0.2 W

1.949.438 Serial Merger card 0.6 W

1.949.439 Serial RJ45 card 0.2 W

1.949.440 Dual Merger card 1.2 W

- Ethersound card 3 W

Air

1.2.3 Adjustments, Repair, Cleaning

Danger: All internal adjustments as well as repair work on this product must be per-

formed by expert technicians!

Replacing the Supply Unit: The primary fuse is located within the power supply module and cannot be

changed. In case of failure, the complete power supply unit must be r eplaced. Please ask your nearest Studer representative.

Cleaning: Do not use any liquids to clean the exterior of the unit. A soft, dry cloth or

brush will usually do.

For cleaning the display windows, most of the commercially available window

or computer/TV screen cleaners are suited. Use only a slightly damp (never

wet) cloth. Never use any solvent!

1-2 General

Date printed: 11.07.07

D21m System

2 INTRODUCTION

The D21m I/O system provides very cost-effective inputs and outputs with

maximum ﬂ exibility while maintaining the well-known Studer sound quality. It is the ﬁ rst Studer I/O system providing full 96 kHz operation. Different I/O modules can be plugged into a frame, providing I/O systems tailor-made to customer needs. And all this comes with an unequalled form factor. Full redundancy is available starting from power supplies going up to redundant interconnections and DSP cards.

Note: The examples in this document use the SCore. Although most applications

refer to this usage, the majority is also valid for use with the Performa core.

2.1 System Philosophy

When using the D21m I/O system the DSP core itself does not provide I/O,

but is connected to the ﬁ rst D21m frame within the system (acting as a hub) by using Studer proprietary “HD Link” technology. On the DSP core side, the connection is made to the DSP card(s) directly. Link distance is limited to 10 m, so the ﬁ rst I/O box should be located close to the DSP core. From that frame it is possible to run optical-ﬁ ber MADI links to multiple places, up to several kilometers away. By using this “star” architecture it is ensured that a possible problem with one of the remote I/O boxes will not lead to a general breakdown of the whole I/O system. A maximum of six remote I/O boxes (stage boxes) may be connected to one hub frame. Should more I/O channels be required then multiples of the “local frames” (hubs) may be used within the system.

D21m Remote IO D21m Remote IO D21m Remote IO

MADI

D21m Hub & IO

Studer Proprietary HD Link

SCore &

I/O Frame

MADI

RS422 Link to Desk

Redundancy issues are regarded as highly important. It is therefore possible

to run any MADI links with redundant cables. The system is automatically switching to the redundant connection in case the primary connection should fail. For 96 kHz operation the second link can be used as a channel count extension, transferring a total of 64 MADI channels even at 96 kHz sampling frequency. The “redundant” MADI link may also be used for sharing an I/O box between two consoles.

The MADI link between the ﬁ rst D21m frame (hub) and the remote I/O boxes,

in addition, carries all control signals needed to control the microphone ampliﬁ er cards, to interrogate the state (health) of any remote I/O card and to display it within the console’s system surveyor page. This is without sacriﬁ cing

Introduction 2-1Date printed: 11.07.07

D21m System

any audio channels within the MADI link. Additionally, an RS422 signal can be “tunneled” through the MADI connection. In this way e.g. a MIDI device can be connected to the remote I/O box and ﬁ nd the “extension” connector on the hub frame next to the core again.

Notes: Unlike the Studer D19m I/O system, the D21m system is engineered as an

I/O system for use together with a Studer digital console, i.e., using the D21m system as a “standalone” analog-to-digital or digital-to-analog converter only works if MADI I/O is used on the digital side; for more information on this subject please Line input card and getting the A/D-converted signal out of the AES/EBU card directly is not possible. This can be done only if the audio is routed with a DSP core. Since the MADI signal to the D21m remote I/O box is used to synchronize the unit, a stable, low-jitter MADI signal is necessary in order to reach maximum audio quality. This is guaranteed by Studer equipment.

However, two I/O boxes can be interconnected using MADI, where one of

them must be switched to “Master” mode. In such a case up to 64 audio channels may be transmitted between two frames (applicable for MADI HD cards

1.949.411.23, 1.949.413.22, 1.949.414.20, or newer).

refer to chapter 5.7. Inserting, e.g., an AES/EBU card and a

2-2 Introduction Date printed: 11.07.07

2.2 The Frame and its Cards

D21m System

Front View:

Rear View:

I/O Example:

3 Dual Card Slots

1...2 HD Link Cards (Link to DSP Core)

I/O Example:

1 Dual-Slot Card

4 Single-Slot Cards

RS422 Serial

I/O Card

Main and Redundant

Power Supply

The 3 U frame provides 12 slots for I/O card insertion. Each card may provide

a different number of I/O channels, depending on its capabilities (e.g. a microphone card provides four channels of microphone inputs, while an ADAT card provides 16 channels of inputs and outputs simultaneously). Some cards are mechanically occupying two slots, and therefore a maximum of 6 doublewidth cards may be inserted into a frame. An overview of the dif ferent cards currently available is given in chapter 6.1.

The frame hosts one or two “High Density Link” cards (short: HD Link),

providing the main audio connection to the DSP core. From the HD card(s) the signals are redirected to the different types of I/O cards in the frame. Therefore at least one HD card must be inserted in the frame.

The frame may be equipped with redundant power supplies, the status of

which can be displayed in the Vista console’s system surveyor page.

Please note that the rack mounting brackets may be installed either on the

front (as shown on the opposite page) or on the rear of the frame.

Introduction 2-3Date printed: 11.07.07

D21m System

2.3 Hub Frame

The difference between a D21m frame acting as a hub or as a remote I/O

box is the type of HD Link and RS422 cards inserted. The HD Link card in the hub frame hosts four RJ45 connectors for connection to the DSP core, providing 192 channels (96 in case of the Performa core) of audio coming from the DSP core through 2 cables into the frame (audio outputs), as well as 192 channels from the frame through 2 cables into the DSP core (audio inputs). The length of the high-density link cables must not exceed 10 meters (30 feet).

If multiple remote I/O boxes are connected to one hub frame, more channels

need to be transferred to the DSP core. In this case it is possible to insert a second HD card into the hub frame, expanding its capabilities to handle 384 inputs and outputs to the DSP core (192 outputs in case of the Performa core).

CARDS

POWER SUPPLY

FAIL

IN FAILIN

CARD 1

PRI 1

CARD 2

PRI 2

CARD 3

DIGITAL

CARD 4

ANALOG

3 U

(133.5 mm)

426 mm

19" (482.4 mm)

CARD 5 CARD 6 HD CARD HD CARD CARD 7 CARD 8 CARD 9

SYSTEM CLOCK

CARD 10

96kHz 48kHz

CARD 11 CARD 12

RECONFIG

Connector area, approx.

380 mm

50 mm

* Rack mounting brackets may be installed on front or rear of frame, depending on user's preference.

2.4 Remote I/O Frame

The frame placed remotely is equipped with a special MADI HD card. This

version of the card is not equipped with the Studer proprietary high-density link but with standard MADI optical interfaces. This format allows transferring 64 channels of inputs and outputs between the remote I/O box and the hub frame simultaneously.

Frame dimensions are the same as shown in 2.3 above.

2.5 Vista Surveyor Software

The surveyor on the graphic controller (GC) screen of the Vista consoles will

indicate the whole I/O system, including the health state of each I/O card and the power supplies. If the hardware found at startup time is not identical to what the system expects, the user is asked whether the expectations should permanently be changed or whether the user has temporarily changed the I/O conﬁ guration (such as having moved a remote I/O box to another place for the current production). In both cases the surveyor application indicates “green”, unless the user tells it to wait for the missing I/O components.

There is no need to tell the system which channel has a microphone preampli-

ﬁ er included, since this detection is done automatically. However , it is necessary to deﬁ ne which HD link of the hub frame is going to which PED21m card within the Performa DSP core. This is done in a software menu accessible for system administrators only.

2-4 Introduction Date printed: 11.07.07

3 APPLICATIONS

oRS422 from Desk for oSurveyor Information

p4...6 AES/EBU Outputs

mto Monitoring Frame

3.1 Local I/O Only (Located Close to Core)

I/O Frame

(One or

Multiple)

D21m System

96 Ch In

96 Ch Out

SCore &

I/O Frame

3.2 One I/O Box within Long Distance

Remote

I/O Box

0...64 Ch Optical MADI

Hub

(and I/O)

96 Ch Out

96 Ch In

0...64 Ch Optical MADI

96 Ch In

96 Ch Out

(Redundancy)

96 Ch Out

Standard Dual Optical MADI Cable with SC Type Connectors. Max. 64 Channels, Includes Mic Control Signals.

Studer Proprietary HD Link (max. Distance 10 m)

I/O frame with Different Types of I/O Cards

RS422 from Desk f Surveyor Informati and Mic Control

4...6 AES/EBU Out to Monitoring Fra

Studer Proprietary HD Link

96 Ch In

(max. Distance 10 m)

96 Ch Out

SCore &

I/O Frame

96 Ch In

96 Ch Out

96 Ch In

4 × HD Link

96 Ch Out

96 Ch In

96 Ch Out

Notes: Both the remote I/O box and the local hub frame are standard D21m frames,

providing the possibility to insert any I/O cards available for the D21m I/O system. The hub frame may therefore also be used for any audio I/O located close to the DSP core.

Applications 3-1Date printed: 11.07.07

D21m System

The channel count of the MADI link may be set in steps of eight channels

using card-internal DIP switches. In order to provide synchronization and surveyor information it is necessary to provide a MADI link to and from the remote I/O boxes at all times, even if the channel count should be set to 0.

The protocol switch on the front panel of the MADI I/O card may be set to

“64 channel” to allow maximum usage of the available channels. This switch may only have to be set to “56 channel” protocol for operation with thirdparty MADI devices (in case no remote I/O box is connected to the MADI I/O card).

If 64 channels of MADI transmission are required when working at 96 kHz,

the redundant MADI line can be used as a “channel extension” for transmitting the MADI channels 33-64 (29-56). This must be set accordingly with a DIP switch on the MADI I/O card inserted in the hub frame.

3.3 Multiple I/O Boxes, Long Distance

I/O Frames with Different

Remote I/O Box 1 ... ... Remote I/O Box 5

Types of I/O Cards

Remote

I/O Boxes

Hub

(and I/O)

SCore &

I/O Frame

0...64 Ch Optical MADI

RS422 from Desk for Surveyor Information and Mic Control

96 Ch In

96 Ch Out

(Redundancy)

96 Ch In

96 Ch Out

. . . .

Studer Proprietary HD Link (max. Distance 10 m)

96 Ch In

96 Ch Out

Standard Dual Optical MADI Cable with SC Type Connectors. Max. 64 Channels, Includes Mic Control Signals.

and Surveillance Information.

RS422 from Desk for Surveyor Information and Mic Control

4...6 AES/EBU Outputs to Monitoring Frame

Notes: Both the remote I/O box and the local hub frames are standard D21m frames,

providing the possibility to insert any I/O card available for the D21m I/O system. The hub frame may therefore also be used for any audio I/O located close to the DSP core.

Up to 5 remote I/O boxes can be connected to one hub frame. The last slot is

occupied with one ADAT card (or AES/EBU card in case of operation with the Performa core) in order to provide I/O for monitoring and talkback of the desk.

The channel count of the MADI link may be set in steps of eight channels

3-2 Applications Date printed: 11.07.07

D21m System

The protocol switch on the front panel of the MADI I/O card may be set to

“64 channel” allowing maximum usage of the available channels. This switch may only have to be set to “56 channel” protocol for operation with thirdparty MADI devices (in case no remote I/O box is connected to the MADI I/O card).

If 64 channels of MADI transmission are required when working at 96 kHz,

3.4 Multiple Hubs, Multiple I/O Boxes, Long Distance

I/O Frames with Different

Remote I/O Box 1 ... ... Remote I/O Box 5

Types of I/O Cards

Remote

I/O Boxes

Hub 1

(and I/O)

SCore &

I/O Frame

Hub 2

(and I/O)

0...64 Ch MADI

96 Ch In

96 Ch Out

96 Ch In

96 Ch Out

96 Ch In

96 Ch Out

96 Ch In

96 Ch Out

96 Ch In

96 Ch Out

96 Ch In

96 Ch Out

. . . .

Studer Proprietary HD Link

96 Ch In

(max. Distance 10 m)

96 Ch Out

Studer Proprietary HD Link (max. Distance 10 m)

96 Ch In

96 Ch Out

0...64 Ch MADI

RS422 from Desk for Surveyor Information and Mic Control

4...6 AES/EBU Outputs to Monitoring Frame

RS422 from Desk for Surveyor Information and Mic Control

0...64 Ch MADI

Remote

I/O Boxes

Remote I/O Box 6 ... ... Remote I/O Box 11

I/O Frames with Different

Types of I/O Cards

. . . .

Notes: Both the remote I/O box and the local hub frames are standard D21m frames,

providing the possibility to insert any I/O card available for the D21m I/O system. The hub frame may therefore also be used for any audio I/O located close to the DSP core.

Up to 6 remote I/O boxes can be connected per hub frame, except in the ﬁ rst

hub frame, where one slot is occupied with one ADAT card (or AES/EBU

Applications 3-3Date printed: 11.07.07

D21m System

card in case of operation with the Performa core) in order to provide I/O for monitoring and talkback of the desk.

The RS422 link for the second hub may be taken from the Vista desk by using

a further RS422 port.

The channel count of the MADI link may be set in steps of eight channels

The protocol switch on the front panel of the MADI I/O card may be set to

If 64 channels of MADI transmission are required when working at 96 kHz,

3.5 Shared I/O

Input Switch

on Front Panel of

MADI HD Card

Remote I/O Box

RS422 RS422

96 Ch In

96 Ch Out

0...64 Ch Optical MADI

96 Ch In

96 Ch Out

redundant

0...64 Ch Optical MADI

Hubs

(and I/O)

96 Ch In

96 Ch Out

SCores &

I/O Frames

"Redundancy"

96 Ch In

96 Ch Out

96 Ch In

96 Ch Out

96 Ch In

96 Ch Out

96 Ch In

96 Ch Out

It is possible to connect one remote I/O box to two hubs or consoles at the

same time. This allows sharing of one box between two consoles. While the audio inputs are fed to both consoles, the outputs on that I/O box may only be fed by one of the two consoles at a time. An input selector switch on the MADI HD card determines from which console the audio outputs are fed. At the same time only the currently selected console will be able to display health information in the surveyor. If the switch is set to “redundant”, the remote I/O box jumps freely onto the second input in case the signal is lost on the main input. Unless the signal is interrupted on the redundant input, too, the system will not switch back to the main input in order to avoid undeﬁ ned switching in case of a bad MADI connection.

3-4 Applications Date printed: 11.07.07

4 SYSTEM EXAMPLES

4.1 System with Remote and Local I/O

Remote

I/O Box

D21m System

Remote I/O Box, equipped w. e.g.:

• 44 Mic Inputs

• 8 Line Outputs (Returns) or e.g.:

• 40 Mic Inputs

• 8 Line Inputs

• 8 Line Outputs (Returns) or e.g.:

• 36 Mic Inputs

• 16 Ch ADAT In, 16 Ch Out

• 8 Line Inputs

• 8 Line Outputs

Hub

(and I/O)

96 Ch In

96 Ch Out

0...64 Ch Optical MADI

96 Ch In

96 Ch Out

(Redundancy)

0...64 Ch Optical MADI

96 Ch In

96 Ch Out

RS422 for Mic Control

4...6 AES/EBU Outputs to Monitoring Frame

Local I/O Hub, equipped with e.g.:

• 0...64 Ch MADI In/Out for Stage Box Link

• 0...56 Ch MADI In/Out for e.g. Multi-Track Recorder

• 16 AES/EBU In/Out (1 In and 5 Outs used for Monitoring)

• 32 Ch ADAT In/Out (Spare)

• 8 Mic Inputs

• 8 Line Inputs

• 8 Line Outputs

SCore &

I/O Frame

Notes: Some of the I/O cards are “double-width”, of which a maximum of 6 may be

ﬁ tted in one D21m frame. When only using single-width cards, a maximum of 12 can be ﬁ tted. Therefore, e.g. a maximum of 48 microphone inputs may be ﬁ tted in one (full) frame. If outputs are required as well, up to 44 microphone inputs are possible since then at least one slot is used for an 8-channel line output card.

Input and Output cards may be inserted in any order. The system is ﬁ lling

up the MADI channels automatically, starting from the leftmost card subsequently to the right.

Since the MADI bandwidth can only be adjusted in steps of 8 channels, an

odd number of microphone cards (providing 4 inputs each) will result in 4 MADI channels without audio.

The MADI HD card versions 1.949.411.21/1.949.413.21 and newer support

operation with two MADI HD cards in one frame, extending the total channel count between the hub frame and the remote I/O box to 128. The same channel count is reached in 96 kHz mode. For details please

r efer to chapter

6.5.3.

System Examples 4-1Date printed: 11.07.07

D21m System

4.2 System with Remote MIDI Connection

I/O Frames with Different

Remote I/O Box 1 ... ... Remote I/O Box 5

Types of I/O Cards

Remote

I/O Boxes

Hub

(and I/O)

SCore &

I/O Frame

0...64 Ch Optical MADI

96 Ch In

96 Ch Out

(Redundancy)

0...64 Ch Optical MADI

96 Ch In

96 Ch Out

. . . .

0...64 Ch Optical MADI, incl. MIDI

RS422 for Mic Control

4...6 AES/EBU Outputs to Monitoring Frame

96 Ch In

96 Ch Out

MIDI Signal into "AUX" RS422 of Remote I/O Box

MIDI Signal into "AUX" RS422 of MADI I/O Card

Any serial signal, such as MIDI or Sony 9-pin (machine control) may be

transmitted through a MADI connection without losing any audio bandwidth or microphone control of the remote I/O box. An RS422 connector labeled “Aux” can be found on the MADI I/O card (hub frame side) as well as on the serial card of the remote I/O frame. This card is located between slot 12 and the power supplies. The required baud rate is set on the MADI I/O (local) and MADI HD (remote) cards.

4-2 System Examples Date printed: 11.07.07

D21m System

5 ADDITIONAL INFORMATION

5.1 Mapping of I/O Cards to MADI and HD Link Channels

The HD card is redirecting the audio channels from the different I/O cards

into the Studer proprietary HD link format (in case of a hub) or MADI (in case of a remote I/O box). In order to design a complete I/O system, it is mandatory to know which channels of the I/O cards end up being redirected to which one of e.g. the 64 MADI channels. This will inﬂ uence the way the conﬁ guration editor software is used and the labels are selected when starting the operation of a new system.

General rule: The HD card ﬁ lls in all channels starting from the left side of

the frame (slot 1) to the right. Input and output cards may therefore be mixed, but their order dictates the “ﬁ lling up” of MADI outputs from the frame. In the same way the order of outputs from left to right is deﬁ ning which MADI inputs are being redirected to that card. The same rule applies for the Studer proprietary HD link format.

The following example illustrates the rules within a complex I/O system:

AES I/O

Input Ch

Output Ch

MADI

Channel

1...16 AES/EBU

17...32 ADAT

33...40 Line In

41...48 Mic/Line In

Output Ch

16 16

From I/O Card

Input Ch

Line In

Line Out

ADAT I/O

AES I/O

Mic/Line In 4

16 16

MADI HD

Mic/Line In 4

48 Ch MADI

40 Ch MADI

MADI I/O

Mic/Line In 4

48 40

Remote I/O Box

Mic/Line In 4

MADI

Channel

1...16 AES/EBU

17...32 ADAT

33...40 Line Out

HD S

To I/O Card

Line Out

Line In

PSU

(Red. PSU)

Hub Frame

PSU

(Red. PSU)

HD Link

Channel

1...16 AES/EBU

17...24 Mic/Line In

25...72 MADI

73...80 Line In

From Hub I/O Card

HD Link (1)

Channel

17...48 MADI 1-32

HD Link (2)

80 Ch HD Link

Channel

72 Ch HD Links

SCore

To Hub I/O Card

1...16 AES/EBU

1...8 MADI 33-64

9...24 Line Out

Additional Info 5-1Date printed: 11.07.07

D21m System

5.2 Special Case: Microphone/Line Input Card

The smallest modularity of channels used up within the MADI and Core link

is eight. If an odd number of Mic/Line input cards is used, they should be inserted in pairs, with the last card in an odd slot (no. 1, 3, 5...) This single card will allocate 8 channels but only 4 of them will have audio. If a Mic/Line input card pair uses Analog Insert cards, they should be placed in the next double slot on the right, as shown in chapter 5.3.

For clearness, see the following examples:

Example 1:

10 Mic/Line Input cards (40 channels) 1...40

2 Line Input cards (16 channels) 41...56

Example 2:

9 Mic/Line Input cards (36 channels) 1...36 (37...40 no audio)

2 Line Input cards (16 channels) 41...56

Example 3:

9 Mic/Line Input cards (36 channels) 1...36 (37...40 no audio)

3 Line Input cards (24 channels) 41...64

Input Cards MADI Channel Usage

5.3 Analog Insert Cards

If you plan to equip the I/O box with Analog Insert cards, it is wise to avoid

channels without signal by installing two Mic/Line Input cards next to each other, followed by two Analog Insert cards to their right. The Analog Insert cards will be connected to “their” Mic/Line Input card by a ribbon cable. After that, more Mic/Line Input cards may be inserted. This way all channels within the hub-to-core link will be carrying audio, since there is always a group of 8 channels inserted next to each other. The two Analog Insert cards will not use any channels within the link. The ribbon cables are lead through slots provided in both the Mic/Line Input and Analog Insert cards.

(Front Panels)

Mic/Line Input

5-2 Additional Info Date printed: 11.07.07

Analog Insert

+ 68 hidden pages

Studer D21m Product Information

Specifications and Main Features

Frequently Asked Questions

User Manual

CONTENTS