Dedicated to dataline protection, this device provides a tripolar protection function. It ensures the
same protection capability with the same breakdown voltage in both common and differential
modes.
DESCRIPTION
The TPN3021 is a low capacitance transient
surge arrestor designed for protection of high
debit rate communication network. Its low capacitance avoids distorsion of the signal as it
has been designed for T1/E1 and Ethernet networks.
FOR NETWORK INTERFACES
SO-8
SCHEMATIC DIAGRAM
Rx+ / Tx+
1
8
NC
BENEFITS
Trisil technology is not subject to ageing and provides a fail safe mode in short circuit for a better
protection. They are used to help equipment to
meet main standards such as UL1950, IEC950 /
CSA C22.2 and UL1459. Theyhave UL94 V0 approved resin. SO8 package is JEDEC registered.
Trisils comply with the following standards
GR-1089Core,ITU-T-K20/K21,VDE0433,
VDE0878, IEC61000-4-2.
TM: ASDisa trademark of STMicroelectronics.
NC
NC
Rx- / Tx-
NC
2
3
4
7
GND
6
NC
5
September 2001 - Ed : 3
1/6
TPN3021
IN COMPLIANCES WITH THE FOLLOWING STANDARDS
Standard
Peak surge
voltage (V)
Voltage
waveform
Required peak
current (A)
Current
waveform
Minimum se-
rial resistor to
meet standard
)
(
GR-1089 Core
First level
GR-1089 Core
2500
1000
15002/10 µs1002/10 µs0
Intrabuilding
ITU-T-K20/K21
ITU-T-K20
(IEC61000-4-2)
VDE0433
VDE0878
IEC61000-4-5
100010/700 µs255/310 µs0
6000
8000
4000
2000
4000
2000
2000
2000
ELECTRICAL CHARACTERISTICS (T
SymbolParameter
V
RM
V
BO
V
BR
I
H
I
BO
I
RM
I
PP
C
Stand-off voltage
Breakover voltage
Breakdown voltage
Holding current
Breakover current
Leakage current at V
Peak pulse current
Capacitance
RM
2/10 µs
10/1000 µs
500
100
1/60 nsESD contact discharge
ESD air discharge
10/700 µs100
50
1.2/50 µs100
50
amb
=25°C)
10/700 µs
1.2/50 µs
50
50
2/10 µs
10/1000 µs
5/310 µs40
1/20 µs0
5/310 µs
8/20 µs
I
I
PP
I
BO
I
I
H
R
I
RM
V
RM
7.5
25
-
-
0
0
0
0
V
V
V
BR
V
BO
R
2/6
V
R
I
R
Continous reverse voltage
Leakage current at V
R
TPN3021
ABSOLUTE RATINGS (T
amb
=25°C)
SymbolParameterValueUnit
I
I
TSM
pp
Peak pulse pulse current: tr / tp
Non repetitive surge peak on-state current
One cycle
Non repetitive surge peak on-state current
F=50Hz
T
stg
Tj
T
L
Storage temperature range
Maximum junction temperature
Maximum lead temperature for soldering during 10s
Repetitive peak pulse current
10/1000 µs
8/20 µs
10/560 µs
5/310 µs
10/160 µs
1/20 µs
2/10 µs
50 Hz
60 Hz
0.2 s
%I
PP
100
2s
30
100
40
50
75
100
200
8
9
3
1.5
-55to+150
150
260°C
tr: rise time (µs)
tp: pulse duration time (µs)
50
A
A
A
°C
°C
ex: pulse waveform
10/1000 µstr = 10 µstp = 1000 µs
0
t
t
p
r
t
THERMAL RESISTANCES
SymbolParameterValueUnit
R
th(j-a)
Junction to ambient
ELECTRICAL PARAMETERS (T
TypeIRM@V
max.
amb
RM
= 25°C)
V
max
max@I
BO
note 1
BO
note 2
170°C/W
I
H
min.
note 3
typ.
µAVVmAmApF
TPN3021428383003016
Note 1 : See test circuit 1
Note 2 : See functional holding current test circuit 2
Note 3 : VR= 0V bias, V
Thisisa GO-NOGO testwhich allows toconfirmthe holding current(I
Test procedure:
1- Adjust the current level at the I
2- Fire the DUT with a surge current I
3- DUT must come back in off state within maximum 50ns.
value by short circuiting the DUT.
H
= 10A, 10/1000 µs.
PP
D.U.T
Surge generator
)levelin a functionaltestcircuit.
H
4/6
TPN3021
Fig. 1: Non repetitive surge peak on-state current
versus overload duration (
ITSM(A)
12
10
8
6
4
2
0
1E-21E-11E+01E+11E+21E+3
t(s)
Tj initial = 25°C)
F=50Hz
Fig. 3: Relative variation of holding current versus
junction temperature.
IH[Tj] / IH[Tj=25°C]
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
-40-20020406080100120
Tj(°C)
Fig. 2: Variation of junction capacitanceversus re-
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