4 x 50 W MOSFET quad bridge power amplifier plus HSD
Features
■ High output power capability:
–4 x 50W/4Ω max.
–4 x 30W/4Ω @ 14.4V, 1KHz, 10%
–4 x 80W/2Ω max.
–4 x 55W/2Ω @ 14.4V, 1KHz, 10%
■ MOSFET output power stage
■ Excellent 2Ω driving capability
■ Hi-fi class distortion
■ Low output noise
■ St-by function
■ Mute function
■ Automute at min. supply voltage detection
■ Low external component count:
– Internally fixed gain (26dB)
– No external compensation
– No bootstrap capacitors
■ On board 0.35A high side driver
Protections:
■ Output short circuit to GND, to V
load
■ Very inductive loads
■ Overrating chip temperature with soft thermal
limiter
■ Output DC offset detection
■ Load dump voltage
■ Fortuitous open gnd
■ Reversed battery
Table 1.Device summary
, across the
s
TDA7850A
Flexiwatt27
(vertical)
Flexiwatt27
(horizontal)
■ ESD
Description
The TDA7850A is a breakthrough MOSFET
technology class AB audio power amplifier in
Flexiwatt27 package designed for high power car
radio. The fully complementary P-Channel/NChannel output structure allows a rail to rail
output voltage swing which, combined with high
output current and minimized saturation losses
sets new power references in the car-radio field,
with unparalleled distortion performances.
Figure 5.Output power vs. supply voltage (R
Figure 6.Output power vs. supply voltage (R
Figure 7.Distortion vs. output power (R
Figure 8.Distortion vs. output power (R
Figure 9.Distortion vs. frequency (R
Figure 10.Distortion vs. frequency (R
Figure 14.Power dissipation & efficiency vs. output power (R
Figure 15.Power dissipation & efficiency vs. output power (R
Figure 16.Power dissipation vs. output power (R
Figure 17.Power dissipation vs. output power (R
Besides its contribution to the ripple rejection, the SVR capacitor governs the turn ON/OFF time
sequence and, consequently, plays an essential role in the pop optimization during ON/OFF
transients. To conveniently serve both needs,
4.2 Input stage
The TDA7850A's inputs are ground-compatible and can stand very high input signals
(± 8Vpk) without any performance degradation.
If the standard value for the input capacitors (0.1µF) is adopted, the low frequency cut-off
will amount to 16 Hz.
4.3 Stand-by and muting
Its minimum recommended value is 10µF
.
STAND-BY and MUTING facilities are both CMOS compatible. In absence of true CMOS
ports or microprocessors, a direct connection to Vs of these two pins is admissible but a
470kΩ equivalent resistance should be present between the power supply and the muting
and stand-by pins.
R-C cells have always to be used in order to smooth down the transitions for preventing any
audible transient noises.
About the stand-by, the time constant to be assigned in order to obtain a virtually pop-free
transition has to be slower than 2.5V/ms.
4.4 DC offset detector
The TDA7850A integrates a DC offset detector to avoid that an anomalous DC offset on the
inputs of the amplifier may be multiplied by the gain and result in a dangerous large offset on
the outputs which may lead to speakers damage for overheating.
The feature works with the amplifier unmuted and no signal at the inputs.
The DC offset detection can be available at 2 different pins:
–Pin 2 (always enabled)
–Pin 26. Only enabled if Vmute (pin23) is set higher than 8V. If not (Vmute < 6 V)
pin 26 will revert to the original HSD function.
4.5 Heatsink definition
Under normal usage (4 Ohm speakers) the heatsink's thermal requirements have to be
deduced from Figure 16, which reports the simulated power dissipation when real
music/speech programmes are played out. Noise with gaussian-distributed amplitude was
employed for this simulation. Based on that, frequent clipping occurrence (worst-case) will
cause P
heatsink's thermal resistance should be approximately 2°C/W. This would avoid any thermal
shutdown occurrence even after long-term and full-volume operation.
= 26W. Assuming T
diss
= 70°C and T
amb
= 150°C as boundary conditions, the
CHIP
12/16
TDA7850APackage information
5 Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect. The category of
second Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Figure 19. Flexiwatt27 (vertical) mechanical data and package dimensions
(1): dam-bar protusion not included; (2): molding protus ion included
mminch
MIN. TYP. MAX. MIN. TYP. MAX.
OUTLINE AND
MECHANICAL DATA
Flexiwatt27
(Horizontal)
14/16
7399738 A
TDA7850ARevision history
6 Revision history
Table 5.Document revision history
DateRevisionChanges
9-Oct-20071Initial release.
15/16
TDA7850A
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