STMicroelectronics TDA7850, TDA7850H Service Manual

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Quad bridge power amplifier plus HSD
Features
4 x 50W/4Ω Max. 4 x 30W/4Ω @ 14.4V, 1KHz, 10% 4 x 80W/2Ω Max. 4 x 55W/2Ω @ 14.4V, 1KHz, 10%
MOSFET Output power stage
Excellent 2Ω driving capability
HI-FI class distortion
Low output noise
ST-BY Function
Mute function
Automute at min. supply voltage detection
Low external component count:
– Internally fixed gain (26dB) – No external compensation – No bootstrap capacitors
On board 0.35A high side driver
Protections:
Output short circuit to GND, to V
load
Very inductive loads
Overrating chip temperature with soft thermal
limiter
Output DC offset detection
Load dump voltage
Fortuitous open GND
Reversed battery
ESD
, across the
s
TDA7850
4 x 50W MOSFET
Flexiwatt25
(Vertical)
Flexiwatt25
(Horizontal)
Description
The TDA7850 is a breakthrough MOSFET technology class AB audio power amplifier in Flexiwatt 25 package designed for high power car radio. The fully complementary P-Channel/N­Channel output structure allows a rail to rail output voltage swing, which, combined with high output current and minimised saturation losses, sets new power references in the car-radio field, with unparalleled distortion performances.
The TDA7850 integrates a DC offset detector.
Order codes
Part number Package Packing
TDA7850 Flexiwatt25 (Vertical) Tube
TDA7850H Flexiwatt25 (Horizontal) Tube
November 2006 Rev 1 1/14
www.st.com
1
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Contents TDA7850
Contents
1 Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2 Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3 Application hints (ref. to the circuit of Figure 3) . . . . . . . . . . . . . . . . . 10
3.1 SVR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.2 Input stage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.3 Stand-by and muting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.4 DC offset detector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.5 Heatsink definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
4 Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
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TDA7850 List of tables
List of tables
Table 1. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Table 2. Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Table 3. Electrical characteristcs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Table 4. Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
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List of figures TDA7850
List of figures
Figure 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 2. Pin connection (Top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 3. Standard test and application circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Figure 4. P.C.B. and component layout of the Figure 3... . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Figure 5. Flexiwatt25 (vertical) mechanical data & package dimensions. . . . . . . . . . . . . . . . . . . . . . 11
Figure 6. Flexiwatt25 (horizontal) mechanical data & package dimensions . . . . . . . . . . . . . . . . . . . 12
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TDA7850 Block diagram and pin description

1 Block diagram and pin description

Figure 1. Block diagram

Vcc1 Vcc2
ST-BY
MUTE
IN1
0.1μF
IN2
0.1μF
IN3
0.1μF
IN4
0.1μF
AC-GND
0.47μF47μF
SVR TAB S-GND

Figure 2. Pin connection (Top view)

TAB
P-GND2
OUT2-
ST-BY
OUT2+
V
OUT1-
P-GND1
OUT1+
SVR
IN1
IN2
S-GND
IN4
IN3
AC-GND
OUT3+
P-GND3
OUT3-
V
OUT4+
MUTE
OUT4-
P-GND4
HSD
CC
CC
1
25
D94AU159A
Ver tic al
TAB
P-GND2
OUT2-
ST-BY
OUT2+
V
OUT1-
P-GND1
OUT1+
SVR
IN1
IN2
S-GND
IN4
IN3
AC-GND
OUT3+
P-GND3
OUT3-
V
OUT4+
MUTE
OUT4-
P-GND4
HSD
100nF470μF
HSD
CC
CC
HSD/V
OUT1+
OUT1-
PW-GND
OUT2+
OUT2-
PW-GND
OUT3+
OUT3-
PW-GND
OUT4+
OUT4-
PW-GND
D94AU158D
1
25
OFF_DET
D06AU1655
Horizontal
5/14
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Electrical specifications TDA7850

2 Electrical specifications

Table 1. Absolute maximum ratings

Symbol Parameter Value Unit
V
V
CC (DC)
V
CC (pk)
Operating supply voltage 18 V
CC
DC Supply voltage 28 V
Peak supply voltage (for t = 50ms) 50 V
Output peak current
I
P
T
T

Table 2. Thermal data

repetitive (duty cycle 10% at f = 10Hz)
O
non repetitive (t = 100μs)
Power dissipation Tcase = 70°C 80 W
tot
Junction temperature 150 °C
j
Storage temperature -55 to 150 °C
stg
9
10
Symbol Parameter Value Unit
Thermal resistance junction to case Max. 1 °C/W
Table 3.
R
th j-case
Electrical characteristcs
(Refer to the test and application diagram, VS = 13.2V; RL = 4Ω; Rg = 600Ω; f = 1KHz; T 25°C; unless otherwise specified).
Symbol Parameter Test condition Min. Typ. Max. Unit
I
Quiescent current RL = 100 180 280 mA
q1
V
dV
Output offset voltage Play Mode ±60 mV
OS
During mute ON/OFF output offset voltage
OS
During St-By ON/OFF output offset voltage
±60 mV
±60 mV
A A
amb
=
Voltage gain 25 26 27 dB
G
v
dG
Channel gain unbalance ±1 dB
v
= 13.2V; THD = 10%
V
S
= 13.2V; THD = 1%
V
S
= 14.4V; THD = 10%
V
S
VS = 14.4V; THD = 1%
Output power
P
o
= 13.2V; THD = 10%, 2Ω
V
S
VS = 13.2V; THD = 1%, 2Ω
= 14.4V; THD = 10%, 2Ω
V
S
= 14.4V; THD = 1%, 2Ω
V
S
P
o max.
Max. output power
(1)
VS = 14.4V; RL = 4Ω
= 14.4V; RL = 2Ω
V
S
6/14
23 16 28 20
42 32 50 40
25 19 30 23
45 34 55 43
50 80
W W W W
W W W W
W W
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TDA7850 Electrical specifications
Table 3.
Electrical characteristcs
(continued) (Refer to the test and application diagram, VS = 13.2V; RL = 4Ω; Rg = 600Ω; f = 1KHz; T 25°C; unless otherwise specified).
Symbol Parameter Test condition Min. Typ. Max. Unit
P
= 4W
THD Distortion
e
Output noise
No
o
= 15W; RL = 2Ω
P
o
"A" Weighted Bw = 20Hz to 20KHz
SVR Supply voltage rejection f = 100Hz; V
f
High cut-off frequency PO = 0.5W 100 300 KHz
ch
Input impedance 80 100 120 KΩ
R
i
f = 1KHz P f = 10KHz P
V
y = 1.5V 20 μA
St-B
V
y = 0 10 μA
St-B
= 1.5V to 3.5V ±10 μA
St-By
= 4W 80 90 dB
Oref
I
I
pin5
V
SB out
V
SB in
A
V
M out
V
C
Cross talk
T
St-By Current consumption
SB
St-by pin current V
St-By Out threshold voltage (Amp: ON) 3.5 V
St-By in threshold voltage (Amp: OFF) 1.5 V
Mute attenuation P
M
Mute out threshold voltage (Amp: Play) 3.5 V
Mute in threshold voltage (Amp: Mute) 1.5 V
M in
(Amp: Mute)
V
AM in
VS automute threshold
Att 80dB; P (Amp: Play) Att < 0.1dB; P
V
I
pin23
Muting pin current
V
MUTE
MUTE
HSD section
= 1Vrms 50 70 dB
r
= 4W
O
= 4W
O
= 4W
Oref
= 0.5W
O
= 1.5V (Sourced current) 7 12 18 μA
= 3.5V -5 18 μA
60
6.5
0.006
0.015
35 50
70 60
7
7.5 8
0.05
0.07%%
5070μV
-
-
amb
μV
dB dB
=
V
V
V
dropout
I
Dropout Voltage IO = 0.35A; VS = 9 to 16V 0.25 0.6 V
Current Limits 400 800 mA
prot
Offset detector (Pin 25)
V
M_ON
V
M_OFF
V
V
V
1. Saturated square wave output.
Mute voltage for DC offset detection enabled
Detected differential output offset V
OFF
Pin 25 Voltage for detection = TRUE
25_T
Pin 25 Voltage for detection = FALSE
25_F
V
= 5V
stby
V V
V V
stby
stby
OFF
stby
OFF
= 5V; V
= 5V; V
> ±4V
= 5V; V
> ±2V
= 8V ±2 ±3 ±4 V
mute
= 8V
mute
mute
= 8V
01.5V
12 V
7/14
8V
6V
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Electrical specifications TDA7850

Figure 3. Standard test and application circuit

ST-BY
MUTE
IN1
IN2
IN3
IN4
R1
10K
R2
47K
C1
0.1μF
C2 0.1μF
C3 0.1μF
C4 0.1μF
C9
1μF
C10 1μF
S-GND
C8
0.1μF
4
22
11
12
15
14
13
16 10 25 1
C5
0.47μF
C7
2200μF
Vcc1-2
SVR TAB
C6
47μF
Vcc3-4
620
17
18
19
21
24
23
HSD
9
8
7
5
2
3
D95AU335B
OUT1
OUT2
OUT3
OUT4
8/14
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TDA7850 Electrical specifications

Figure 4. P.C.B. and component layout of the Figure 3..

Components &
top copper layer
Bottom copper layer
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Application hints (ref. to the circuit of Figure 3) TDA7850

3 Application hints (ref. to the circuit of Figure 3)

3.1 SVR

Besides its contribution to the ripple rejection, the SVR capacitor governs the turn ON/OFF time sequence and, consequently, plays an essential role in the pop optimization during ON/OFF transients. To conveniently serve both needs, Its minimum recommended value
is 10μF.

3.2 Input stage

The TDA7850's inputs are ground-compatible and can stand very high input signals (± 8Vpk) without any performance degradation. If the standard value for the input capacitors (0.1μF) is adopted, the low frequency cut-off will amount to 16 Hz.

3.3 Stand-by and muting

STAND-BY and MUTING facilities are both CMOS compatible. In absence of true CMOS ports or microprocessors, a direct connection to Vs of these two pins is admissible but a 470 kOhm equivalent resistance should be present between the power supply and the muting and stand-by pins. R-C cells have always to be used in order to smooth down the transitions for preventing any audible transient noises. About the stand-by, the time constant to be assigned in order to obtain a virtually pop-free transition has to be slower than 2.5V/ms.

3.4 DC offset detector

The TDA7850 integrates a DC offset detector to avoid an anomalous DC offset on the inputs of the amplifier which may be multiplied by the gain, and result in a dangerous large offset on the outputs, which may lead to speaker damage through overheating.
The feature is enabled by the MUTE pin and works with the amplifier unmuted and with no signal on the inputs. The DC offset detection is signaled out on the HSD pin.

3.5 Heatsink definition

Under normal usage (4 Ohm speakers) the heatsink's thermal requirements have to be deduced from fig. 18, which reports the simulated power dissipation when real music/speech programmes are played out. Noise with gaussian-distributed amplitude was employed for this simulation. Based on that, frequent clipping occurence (worst-case) will cause Pdiss = 26W. Assuming T heatsink's thermal resistance should be approximately 2°C/W. This would avoid any thermal shutdown occurence even after long-term and full-volume operation.
10/14
= 70°C and T
amb
= 150°C as boundary conditions, the
CHIP
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TDA7850 Package Information

4 Package Information

In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.

Figure 5. Flexiwatt25 (vertical) mechanical data & package dimensions

DIM.
A 4.45 4.50 4.65 0.175 0.177 0.183 B 1.80 1.90 2.00 0.070 0.074 0.079 C 1.40 0.055 D 0.75 0.90 1.05 0.029 0.035 0.041 E 0.37 0.39 0.42 0.014 0.015 0.016
F (1) 0.57 0.022
G 0.80 1.00 1.20 0.031 0.040 0.047
G1 23.75 24.00 24.25 0.935 0.945 0.955
H (2) 28.90 29.23 29.30 1.139 1 .150 1.1 53
H1 17.00 0.669 H2 12.80 0.503 H3 0.80 0.031
L (2) 22.07 22.47 22.87 0.869 0.884 0.904
L1 18.57 18.97 19.37 0.731 0.747 0.762
L2 (2) 15.50 15.70 15.90 0.610 0.618 0.626
L3 7.70 7.85 7.95 0.303 0.309 0.313 L4 5 0.197 L5 3.5 0.138
M 3.70 4.00 4.30 0.145 0.157 0.169
M1 3.60 4.00 4.40 0.142 0.157 0.173
N 2.20 0.086 O 2 0.079
R 1.70 0.067 R1 0.5 0.02 R2 0.3 0.12 R3 1.25 0.049 R4 0.50 0.019
V5˚ (Tp.) V1 3˚ (Typ.) V2 20˚ (Typ.) V3 45˚ (Typ.)
(1): dam-bar protusion not included (2): molding pr otusion included
mm inch
MIN. TYP. MAX. MIN. TYP. MAX.
V
B
H
V3
OL3 L4
L2
H1
H3
OUTLINE AND
MECHANICAL DATA
Flexiwatt25 (vertical)
C
V
H2
R3
R4
N
R2
R
L
L1
V2
A
V1
V1
Pin 1
R2
G
G1
F
FLEX25ME
R1
R1 R1
L5
D
E
M1
M
7034862
11/14
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Package Information TDA7850

Figure 6. Flexiwatt25 (horizontal) mechanical data & package dimensions

DIM.
A 4 .45 4.50 4.65 0.175 0.177 0.183 B 1 .80 1.90 2.00 0.070 0.074 0.079 C 1.40 0.055 D 2.00 0.079 E 0 .37 0.39 0.42 0.014 0.015 0.016
F (1) 0.57 0.022
G 0.75 1.00 1.25 0.029 0 .040 0.049
G1 23.70 24.00 24.3 0 0.933 0.945 0.957
H (2) 28.90 29.23 29.3 0 1.139 1.150 1.153
H1 17.00 0.669 H2 12.80 0.503 H3 0.80 0.031
L (2) 21 .64 22.04 22.44 0.852 0.868 0.883
L1 10.15 10.5 10.85 0.40 0.413 0.427
L2 (2) 15.50 15.70 15.90 0.610 0.618 0.626
L3 7.70 7.85 7.95 0.303 0.309 0.3 13 L4 5 0.197 L5 5.15 5.45 5.85 0.203 0.214 0. 23 L6 1.80 1.95 2.10 0.070 0.077 0.0 83
M 2.75 3.00 3.50 0.108 0.118 0.138 M1 4.73 0.186 M2 5.61 0.220
N 2.20 0.086 P 3 .20 3.50 3.80 0.126 0.138 0.15
R 1.70 0.067 R1 0.50 0.02 R2 0.30 0.12 R3 1.25 0.049 R4 0.50 0.02
V5˚ (Typ.) V1 3˚ (Typ.) V2 20˚ (Typ.) V3 45˚ (Typ.)
(1): dam-bar protusion not included; (2): molding protus ion included
mm inch
MIN. TYP. MAX . MIN. TYP. MAX.
OUTLINE AND
MECHANICAL DATA
Flexiwatt25 (Horizontal)
12/14
7399733 A
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TDA7850 Revision history

5 Revision history

Table 4. Revision History

Date Revision Description of Changes
22-Nov-2006 1 First issue
13/14
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TDA7850
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