STMicroelectronics STP6NK90Z, STP6NK90ZFP, STB6NK90Z, STW7NK90Z Technical data

STP6NK90Z - STP6NK90ZFP
3
STB6NK90Z - STW7NK90Z
N-channel 900V - 1.56Ω - 5.8A - TO-220/TO-220FP/D2PA K/ TO -2 4 7
Zener-protected SuperMESH™ Power MOSFET
V
Type
DSS
(@Tjmax)
R
DS(on)
I
D
STP6NK90Z 900 V < 2 5.8 A
STP6NK90ZFP 900 V < 2 5.8 A
STB6NK90Z 900 V < 2 5.8 A
STW7NK90Z 900 V < 2 5.8 A
Extremely high dv/dt capability
100% avalange tested
Gate charge minimized
Very low intrinsic capacitances
Very good manufacturing repeatibility
Description
The SuperMESH™ series is obtained through an extreme optimization of ST’s well established strip-based PowerMESH™ layout. In addition to pushing on-resistance significantly down, special care is taken to ensure a very good dv/dt capability for the most demanding applications. Such series complements ST full range of high voltage MOSFETs including revolutionary MDmesh™ products.
TO-220
D2PAK
3
1
TO-220FP
TO-247
Internal schematic diagram
2
1
Applications
Switching application
Order codes
Part number Marking Package Packaging
STP6NK90Z P6NK90Z TO-220 Tube
STP6NK90ZFP P6NK90ZFP TO-220FP Tube
STB6NK90ZT4 B6NK90Z
STW7NK90Z W7NK90Z TO-247 Tube
August 2006 Rev 4 1/18
2
PA K
D
Tape e reel
www.st.com
18
Contents STP6NK90Z - STP6NK90ZFP - STB6NK90Z - STW7NK90Z
Contents
1 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1 Protection features of gate-to-source zener diodes . . . . . . . . . . . . . . . . . . 4
2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.1 Electrical characteristics (curves) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3 Test circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
4 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5 Packaging mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
2/18
STP6NK90Z - STP6NK90ZFP - STB6NK90Z - STW7NK90Z Electrical ratings

1 Electrical ratings

Table 1. Absolute maximum ratings

Symbol Parameter Value Unit
Drain-source voltage (VGS = 0) 900 V
DS
Gate-source voltage ± 30 V
GS
Drain current (continuous) at TC = 25°C 5.8 5.8
I
D
Drain current (continuous) at TC = 100°C 3.65 3.65
I
D
(2)
Drain current (pulsed) 23.2 23.2
Total dissipation at TC = 25°C 140 30 W
TOT
I
DM
P
V
V
Derating factor 1.12 0.24 W/°C
(3)
dv/dt
Peak diode recovery voltage slope 4.5 V/ns
Insulation withstand voltage (RMS) from
V
all three leads to external heat sink
ISO
(t=1s; Tc= 25°C)
Max operating junction temperature
T
j
T
1. Limited only by maximum temperature allowed
2. Pulse width limited by safe operating area
3. ISD ≤ 5.8 A, di/dt ≤ 200A/µs, VDD ≤ V
Storage temperature
stg
(BR)DSS
, Tj ≤ T
JMAX.
TO-220/
2
D
PA K/ TO2 47
TO220FP
- 2500 V
-55 to 150
(1)
(1)
(1)
A
A
A
°C °C

Table 2. Thermal data

Symbol Parameter Value Unit
2
D
PAK
TO-220FP TO-247
0.39 4.2 0.89 °C/W
60 °C/W
62.5 50 °C/W
300 °C
R
thj-case
R
thj-pcb
R
thj-amb
Thermal resistance junction­case max
Thermal resistance junction­case max
Thermal resistance junction­ambient max
Maximum lead temperature for
T
l
soldering purpose
TO-220
3/18
Electrical ratings STP6NK90Z - STP6NK90ZFP - STB6NK90Z - STW7NK90Z

Table 3. Avalanche characteristics

Symbol Parameter Value Unit
I
AR
E
Avalanche current, repetitive or not-repetitive (pulse width limited by Tj Max)
Single pulse avalanche energy
AS
(starting Tj=25°C, Id=Iar, Vdd=50V)
5.8 A
300 mJ

Table 4. Gate-source zener diode

Symbol Parameter Test conditions Min. Typ. Max. Unit
BV
Gate-source breakdown voltage Igs=± 1mA (Open Drain) 30 V
GSO

1.1 Protection features of gate-to-source zener diodes

The built-in back-to-back Zener diodes have specifically been designed to enhance not only the device’s ESD capability, but also to make them safely absorb possible voltage transients that may occasionally be applied from gate to source. In this respect the Zener voltage is appropriate to achieve an efficient and cost-effective intervention to protect the device’s integrity. These integrated Zener diodes thus avoid the usage of external components.
4/18
STP6NK90Z - STP6NK90ZFP - STB6NK90Z - STW7NK90Z Electrical characteristics

2 Electrical characteristics

(T
=25°C unless otherwise specified)
CASE

Table 5. On/off states

Symbol Parameter Test conditions Min. Typ. Max. Unit
V
(BR)DSS
I
DSS
I
GSS
V
GS(th)
R
DS(on)
Drain-source Breakdown voltage
Zero gate voltage Drain current (V
GS
= 0)
Gate-body leakage Current (V
DS
= 0)
Gate threshold voltage
Static drain-source on resistance
=1mA, VGS = 0
I
D
= Max Rating
V
DS
= Max Rating, TC = 125°C
V
DS
VGS = ± 20 V
= VGS, ID = 100 µA
V
DS
VGS = 10 V, ID = 2.9 A
900 V
1
50µAµA
± 10 µA
33.754.5 V
1.56 2

Table 6. Dynamic

Symbol Parameter Test conditions Min. Typ. Max. Unit
g
C
oss eq.
(1)
fs
C
C
C
Forward transconductance
Input capacitance
iss
Output capacitance
oss
Reverse transfer capacitance
rss
(2)
Equivalent output capacitance
= 15v, ID = 2.9 A
V
DS
= 25 V, f = 1 MHz,
V
DS
= 0
V
GS
VDS =0V, VDS = 0V to 720V
5S
1350
130
26
70 pF
pF pF pF
t
d(on)
t
r(off)
Q
Q
Q
T
r(Voff)
T
1. Pulsed: pulse duration=300µs, duty cycle 1.5%
2. C increases from 0 to 80% V
Turn-on delay time
t
Rise time
r
Turn-off delay time Fall time
t
r
g
Total gate charge Gate-source charge
gs
Gate-drain charge
gd
Off-voltage rise time
T
Fall time
r
Cross-over time
c
is defined as a constant equivalent capacitance giving the same charging time as C
oss eq.
DSS
.
= 450 V, ID = 3 A,
V
DD
R
= 4.7 Ω, V
G
GS
(see Figure 20)
= 720 V, ID = 5.8 A,
V
DD
= 10 V
V
GS
= 720 V, ID = 5.8 A,
V
DD
= 4.7 Ω, V
R
G
GS
(see Figure 22)
= 10 V
= 10 V
17 45 20 20
46.5
8.5 25
11 12 20
60.5 nC
when VDS
oss
ns ns ns ns
nC nC
ns ns ns
5/18
Electrical characteristics STP6NK90Z - STP6NK90ZFP - STB6NK90Z - STW7NK90Z

Table 7. Source drain diode

Symbol Parameter Test conditions Min. Typ. Max. Unit
I
SD
I
SDM
V
SD
t
rr
Q
rr
I
RRM
1. Pulsed: pulse duration=300µs, duty cycle 1.5%
2. Pulse width limited by safe operating area
Source-drain current
(1)
Source-drain current (pulsed)
(2)
Forward on voltage
Reverse recovery time Reverse recovery charge Reverse recovery current
= 5.8 A, VGS = 0
I
SD
= 5.8 A, di/dt = 100
I
SD
A/µs
= 36 V, Tj = 150°C
V
DD
(see Figure 22)
840
5880
14
5.8
23.2AA
1.6 V
ns µC A
6/18
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