Datasheet STPS1H100 Datasheet (STMicroelectronics)

®

HIGH VOLTAGE POWER SCHOTTKY RECTIFIER

Table 1: Main Product Characteristics

I

F(AV)

V

RRM

Tj (max) 175°C

(max) 0.62 V

V

F

1 A

100 V

STPS1H100

FEATURES AND BENEFITS

■ Negligible switching losses

■ High junction temperature capability

■ Low leakage cuurent

■ Good trade-off between leakage current and

(JEDEC DO-214AC)

SMA

STPS1H100A

SMB

(JEDEC DO-214AA)

STPS1H100U

forward voltage drop

■ Avalanche capability specified

DESCRIPTION

Schottky rectifiers designed for high frequency
miniature Switched Mode Power Supplies such as
adaptators and on board DC/DC converters.

Table 2: Order Codes

Part Number Marking

STPS1H100A S11
STPS1H100U G11

Packaged in SMA or SMB.

Table 3: Absolute Ratings (limiting values)

Symbol Parameter Value Unit

V

RRM

I

F(RMS)

I

F(AV)

I

FSM

I

RRM

I

RSM

P

ARM

T

T

Repetitive peak reverse voltage 100 V

RMS forward voltage 10 A

Average forward current

TL = 160°C δ = 0.5

Surge non repetitive forward current tp = 10ms sinusoidal 50 A

Repetitive peak reverse current tp = 2µs F = 1kHz square 1 A

Non repetitive peak reverse current tp = 100µs square 1 A

Repetitive peak avalanche power tp = 1µs Tj = 25°C 1500 W

Storage temperature range -65 to + 175 °C

stg

Maximum operating junction temperature * 175 °C

j

1A

dV/dt Critical rate of rise of reverse voltage 10000 V/µs

dPtot

* : thermal runaway condition for a diode on its own heatsink

---------------

dTj

1

--------------- ----------->

Rth j a–()

August 2004

REV. 5

1/7

STPS1H100

Table 4: Thermal Resistance

Symbol Parameter Value Unit

R

th(j-l)

Junction to lead

Table 5: Static Electrical Characteristics

Symbol Parameter Tests conditions Min. Typ Max. Unit

= 25°C

T

IR *

Reverse leakage current

j

Tj = 125°C

Tj = 25°C

VF **

Forward voltage drop

Pulse test: * tp = 5 ms, δ < 2%

** tp = 380 µs, δ < 2%

To evaluate the conduction losses use the following equation: P = 0.54 x I

Tj = 125°C

= 25°C

T

j

T

= 125°C

j

V

= V

R

IF = 1A

IF = 2A

F(AV)

SMA 30
SMB 25

RRM

0.58 0.62

0.65 0.7

+ 0.08 I

F2(RMS)

°C/W

4

0.2 0.5

0.77

0.86

µA

mA

V

Figure 1: Average forward power dissipation
versus average forward current

P (W)

F(AV)

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0.0

0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2

δ = 0.05

δ = 0.1

I (A)

F(AV)

δ = 0.2

δ = 0.5

δ

=tp/T

δ = 1

T

tp

Figure 3: Normalized avalanche power
derating versus pulse duration

P(t)

ARM p

P (1µs)

ARM

1

0.1

0.01

t (µs)

0.001

0.10.01 1

p

10 100 1000

Figure 2: Average forward current versus
ambient temperature (δ = 0.5)

I (A)

F(AV)

1.2

R=R

1.0

0.8

0.6

0.4

0.2

0.0
0 20 40 60 80 100 120 140 160 180

δ

T

=tp/T

R =120°C/W

th(j-a)

R =100°C/W

th(j-a)

T (°C)

tp

amb

th(j-a) th(j-I)

Figure 4: Normalized avalanche power
derating versus junction temperature

P(t)

ARM p

P (25°C)

ARM

1.2

1

0.8

0.6

0.4

0.2

0

25 50 75 100 125 150

T (°C)

j

2/7

STPS1H100

Figure 5: Non repetitive surge peak forward
current versus overload duration (maximum
values) (SMA)

I (A)

M

8

7

6

T =25°C

5

4

3

2

IM

1

0

1E-3 1E-2 1E-1 1E+0

t

δ

=0.5

t(s)

a

T =75°C

a

T =110°C

a

Figure 7: Relative variation of thermal
impedance junction to ambient versus pulse
duration (epoxy printed circuit board,
e(Cu)=35µm, recommended pad layout) (SMA)

Z/R

th(j-c) th(j-c)

1.00

δ = 0.5

Figure 6: Non repetitive surge peak forward
current versus overload duration (maximum
values) (SMB)

I (A)

M

10

9

8

7

6

5

4

3

I

M

2

1

0

1E-3 1E-2 1E-1 1E+0

t

δ

=0.5

t(s)

T =25°C

a

T =75°C

a

T =110°C

a

Figure 8: Relative variation of thermal
impedance junction to ambient versus pulse
duration (epoxy printed circuit board,
e(Cu)=35µm, recommended pad layout) (SMB)

Z/R

th(j-c) th(j-c)

1.00

= 0.5

δ

δ = 0.2

δ = 0.1

0.10

δ

=tp/T

T

tp

Single pulse

t (s)

0.01
1E-3 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2

p

Figure 9: Reverse leakage current versus
reverse voltage applied (typical values)

I (µA)

R

2E+2
1E+2

1E+1

1E+0

1E-1

1E-2

1E-3

0 102030405060708090100

T =125°C

j

T =25°C

j

V (V)

R

= 0.2

δ

= 0.1

δ

0.10

Single pulse

t (s)

0.01
1E-3 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2

p

δ

=tp/T

T

tp

Figure 10: Junction capacitance versus
reverse voltage applied (typical values)

C(pF)

100

F=1MHz
T =25°C

j

50

20

V (V)

10

1 10 100

R

3/7

STPS1H100

Figure 11: Forward voltage drop versus
forward current (maximum values)

I (A)

FM

2E+1

1E+1

T =125°C

j

T =25°C

1E+0

1E-1

V (V)

1E-2

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6

FM

j

Figure 13: Thermal resistance junction to
ambient versus copper surface under each
lead (Epoxy printed circuit board FR4, copper
thickness: 35µm) (SMB)

R (°C/W)

th(j-a)

120

110

100

90

80

70

60

50

40

30

20

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

S(Cu)(cm²)

Figure 12: Thermal resistance junction to
ambient versus copper surface under each
lead (Epoxy printed circuit board FR4, copper
thickness: 35µm) (SMA)

R (°C/W)

th(j-a)

140

130

120

110

100

90

80

70

60

50

40

30

20

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

S(Cu)(cm²)

4/7

Figure 14: SMA Package Mechanical Data

STPS1H100

DIMENSIONS

E1

D

E

A1

C

L

A2

Figure 15: SMA Foot Print Dimensions

(in millimeters)

REF.

Millimeters Inches

Min. Max. Min. Max.

A1 1.90 2.03 0.075 0.080

A2 0.05 0.20 0.002 0.008

b 1.25 1.65 0.049 0.065

c 0.15 0.41 0.006 0.016

E 4.80 5.60 0.189 0.220

E1 3.95 4.60 0.156 0.181

b

D 2.25 2.95 0.089 0.116

L 0.75 1.60 0.030 0.063

1.45 1.45

2.40

1.65

5/7

STPS1H100

Figure 16: SMB Package Mechanical Data

DIMENSIONS

E1

D

E

A1

C

L

A2

Figure 17: SMB Foot Print Dimensions

(in millimeters)

REF.

Millimeters Inches

Min. Max. Min. Max.

A1 1.90 2.45 0.075 0.096

A2 0.05 0.20 0.002 0.008

b 1.95 2.20 0.077 0.087

c 0.15 0.41 0.006 0.016

E 5.10 5.60 0.201 0.220

E1 4.05 4.60 0.159 0.181

b

D 3.30 3.95 0.130 0.156

L 0.75 1.60 0.030 0.063

1.52 2.75

2.3

1.52

6/7

STPS1H100

Table 6: Ordering Information

Ordering type Marking Package Weight Base qty Delivery mode

STPS1H100A S11 SMA 0.068 g 5000 Tape & reel
STPS1H100U G11 SMB 0.107 g 2500 Tape & reel

■ Band indicates cathode

■ Epoxy meets UL94, V0

Table 7: Revision History

Date Revision Description of Changes

Jul-2003 4A Last update.

Aug-2004 5

SMA package dimensions update. Reference A1 max.
changed from 2.70mm (0.106inc.) to 2.03mm (0.080).

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by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.

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