– 5 V to 26 V (operating range)
– 30 V (absolute maximum rating)
■ 2 channels of ternary PWM (stereo mode) (2 x
20 W into 8 Ω at 18 V)
■ 2.0 channels of 24-bit FFX
dynamic range
■ Selectable 32 to 192 kHz input sample rates
2
■ I
C control with selectable device address
■ Digital gain/attenuation +48 dB to -80 dB with
0.5 dB/step resolution
■ Soft volume update with programmable ratio
■ Individual channel and master gain/attenuation
■ Individual channel and master soft/hard mute
■ Automatic zero-detect mute
■ Automatic invalid input-detect mute
■ 2-channel I
■ Advanced AM interference frequency
2
S input data interface
switching and noise suppression modes
■ Selectable high- or low-bandwidth
noise-shaping topologies
■ Variable max power correction for lower
full-power THD
■ Selectable clock input ratio
100 dB SNR and
STA335W
PowerSSO-36 (slug down)
■ 96 kHz internal processing sample rate, 24 to
28-bit precision
■ Thermal overload and short-circuit protection
embedded
■ Video apps: 576 x Fs input mode supported
■ Fully compatible with STA335BW (on the
common registers).
Table 1.Device summary
Order codePackagePackaging
STA335WPowerSSO-36 slug downTube
STA335W13TRPowerSSO-36 slug downTape and reel
August 2009 Rev 11/43
www.st.com
3
STA335W
2/43
STA335W
3/43
Description FFXSTA335W
1 Description FFX
The STA335W is an integrated solution of digital audio processing, digital amplifier control,
and FFX -power output stage, thereby creating a high-power single-chip FFX solution
comprising high-quality, high-efficiency, all digital amplification.
STA335W is based on FFX (Full Flexible Amplification) processor.
The STA335W is part of the Sound Terminal
streaming to the speaker, offering cost effectiveness, low power dissipation and sound
enrichment.
The STA335W power section consists of two full-bridges. The two channels can provide up
to 2 x 20 W of power.
The serial audio data input interface accepts all possible formats, including the popular I
format. Two channels of FFX processing are provided. This high-quality conversion from
PCM audio to FFX PWM switching waveform provides over 100 dB SNR and dynamic
range.
1.1 Block diagram
TM
family that provides full digital audio
2
S
Figure 1.Block diagram
I2C
I2S
interface
Power
Volume
control
PLL
FFX
control
Protection
current/thermal
Logic
Regulators
Bias
Channel
1A
Channel
1B
Channel
2A
Channel
2B
PowerDigital DSP
4/43
STA335WPin connections
2 Pin connections
2.1 Connection diagram
Figure 2.Pin connection PowerSSO-36 (Top view)
GND_SUB
SA
TEST_MODE
VSS
VCC_REG
OUT2B
GND2
VCC2
OUT2A
OUT1B
VCC1
GND1
OUT1A
GND_REG
VDD
CONFIG
NC
NC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
D05AU1638
VDD_DIG
GND_DIG
SCL
SDA
INT_LINE
RESET
SDI
LRCKI
BICKI
XTI
GND_PLL
FILTER_PLL
VDD_PLL
PWRDN
GND_DIG
VDD_DIG
NC
NC
2.2 Pin description
Table 2.Pin description
PinTypeNameDescription
1GNDGND_SUBSubstrate ground
2I SAI
3ITEST_MODEThis pin must be connected to ground (pull-down)
4I/OVSSInternal reference at Vcc-3.3 V
5I/OVCC_REGInternal Vcc reference
6OOUT2BOutput half bridge 2B
7GNDGND2Power negative supply
8PowerVCC2Power positive supply
9OOUT2AOutput half bridge 2A
10OOUT1BOutput half bridge 1B
2
C select address (pull-down)
5/43
Pin connectionsSTA335W
Table 2.Pin description (continued)
PinTypeNameDescription
11PowerVCC1Power positive supply
12GNDGND1Power negative supply
13OOUT1AOutput half bridge 1A
14GNDGND_REGInternal ground reference
15PowerVDDInternal 3.3 V reference voltage
16ICONFIGParalleled mode command
17ON.C.Not to be connected
18ON.C.Not to be connected
19ON.C.Not to be connected
20I/ON.C.Not to be connected
21PowerVDD_DIGDigital supply voltage
22GNDGND_DIGDigital ground
23IPWRDNPower down (pull-up)
24PowerVDD_PLLPositive supply for PLL
25IFILTER_PLLConnection to PLL filter
26GNDGND_PLLNegative supply for PLL
27IXTIPLL input clock
2
28IBICKII
29ILRCKII
30ISDII
S serial clock
2
S left/right clock
2
S serial data channels 1 and 2
31IRESETReset (pull-up)
32OINT_LINEFault interrupt
2
33I/OSDAI
34ISCLI
C serial data
2
C serial clock
35GNDGND_DIGDigital ground
36PowerVDD_DIGDigital supply voltage
6/43
STA335WElectrical specifications
3 Electrical specifications
3.1 Absolute maximum ratings
Table 3.Absolute maximum ratings
Symbol Parameter MinTypMaxUnit
V
VDD_DIG Digital supply voltage-0.3 4 V
VDD_PLL PLL supply voltage-0.34
T
T
Power supply voltage (VCCxA, VCCxB) -0.330 V
cc
Operating junction temperature -20150 °C
op
Storage temperature -40 150 °C
stg
Warning:Stresses beyond those listed in Table 3 may cause
permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any
other conditions beyond those indicated under
“Recommended operating conditions” are not implied.
Exposure to absolute-maximum-rated conditions for
extended periods may affect device reliability. In the real
application, power supplies with nominal values rated within
the recommended operating conditions, may experience
some rising beyond the maximum operating conditions for a
short time when no or very low current is sinked (amplifier in
mute state). In this case the reliability of the device is
guaranteed, provided that the absolute maximum ratings are
not exceeded.
3.2 Thermal data
Table 4.Thermal data
R
th j-case
T
th-sdj
T
th-w
T
th-sdh
R
th j-amb
1. See Section 7: Package thermal characteristics on page 39 for details.
3.4 Electrical specifications for the digital section
Table 6.Electrical specifications - digital section
Symbol Parameter ConditionsMinTypMaxUnit
Low level input current without
I
il
pull-up/down device
I
V
V
V
V
I
R
High level input current without
ih
pull-up/down device
Low level input voltage
il
High level input voltage
ih
Low level output voltageIol=2 mA
ol
High level output voltageIoh=2 mA
oh
Pull-up/down current2566125µA
pu
Equivalent pull-up/down
pu
resistance
Vi = 0 V110 µA
Vi = VDD_DIG
= 3.6 V
0.8 *
VDD_DIG
0.8 *
VDD_DIG
110µA
0.2 *
VDD_DIG
V
V
0.4 *
VDD_DIG
V
V
50kΩ
8/43
STA335WElectrical specifications
3.5 Electrical specifications for the power section
The specifications given in this section are valid for the operating conditions: VCC=18V,
f=1kHz, f
Table 7.Electrical specifications - power section
SymbolParameter ConditionsMin Typ Max Unit
= 384 kHz, T
sw
= 25° C and RL = 8 Ω, unless otherwise specified.
amb
PoOutput power BTL
THD = 1%16
THD = 10%20
R
dsON
Power Pchannel/Nchannel MOSFET
(total bridge)
= 1.5 A 180250 mΩ
l
d
gPPower Pchannel RdsON matchingld = 1.5 A95%
gNPower Nchannel RdsON matchingl
= 1.5 A95%
d
IdssPower Pchannel/Nchannel leakageVCC = 20 V10μA
(1)
(1)
(1)
(1)
8 15 ns
15 30 ns
10 18 ns
10 18 ns
I
LDT
I
HDT
V
Low current dead time (static) Resistive load
High current dead time (dynamic) Iload = 1.5 A
Rise time Resistive load
t
r
Fall time Resistive load
t
f
Supply voltage operating voltage 5 26V
cc
Supply current from Vcc in power down PWRDN = 0 0.11mA
PCM Input signal = -
I
vcc
Supply current from Vcc in operation
60 dBfs,
Switching frequency
52 60mA
= 384 kHz,
No LC filters
I
vdd
Supply current FFX processing (reference
only)
IlimOvercurrent limit
Internal clock =
49.152 MHz
(2)
5570mA
3.03.8A
W
Isc Short circuit protectionHi-Z output4.04.2A
UVLUnder voltage protection 3.54.3 V
t
min
Output minimum pulse width No load 20 30 60 ns
DRDynamic range100dB
Signal to noise ratio, ternary modeA-Weighted100dB
SNR
Signal to noise ratio binary mode90dB
FFX stereo mode,
<5 kHz
PSSRPower supply rejection ratio
V
RIPPLE
= 1 V RMS
80dB
Audio input =
dither only
FFX stereo mode,
THD+NTotal harmonic distortion + noise
Po = 1 W
0.2%
f=1kHz
9/43
Electrical specificationsSTA335W
Table 7.Electrical specifications - power section (continued)
SymbolParameter ConditionsMin Typ Max Unit
FFX stereo mode,
<5 kHz
X
TA L K
Crosstalk
Peak efficiency, FFX mode
η
Peak efficiency,binary modes
1. Refer to Figure 5: Test circuit 1.
2. Limit current if the register (OCRB par 6.1.3.3) overcurrent warning detect adjustment bypass is enabled. When disabled
refer to the Isc.
One channel driven
at 1 W
Other channel
measured
Po = 2 x 20 W
into 8 Ω
Po = 2 x 9 W into 4 Ω
+ 1 x 20 W into 8 Ω
80dB
90
%
87
10/43
STA335WElectrical specifications
3.6 Power on/off sequence
Figure 3.Power-on sequence
VCC
VCC
VCC
VCC
VCC
VDD_Dig
VDD_Dig
VDD_Dig
VDD_Dig
VDD_Dig
XTI
XTI
XTI
XTI
XTI
Reset
Reset
Reset
Reset
Reset
2
2
2
2
2
C
C
C
C
C
I
I
I
I
I
PWDN
PWDN
PWDN
PWDN
PWDN
Note: no specific VCC and
VDD_DIG turn
is required
Don’t care
Don’t care
Don’t care
Don’t care
Don’t care
Don’t care
Don’t care
−
on sequence
TR
TR
TR
TR
TR
Don’t care
Don’t care
Don’t care
Don’t care
Don’t care
TC
TC
TC
TC
TC
CMD0CMD1CMD2
CMD0CMD1CMD2
CMD0CMD1CMD2
CMD0CMD1CMD2
CMD0CMD1CMD2
TR = minimum time between XTI master clock stable and Reset removal: 1 msec
TC = minimum time between Reset removal and I
Note:clock stable means: f
max
- f
< 1 MHz
min
2
C program, sequence start: 1msec
Note:see Chapter 5.2.3: Serial data first bit, for additional info.
Figure 4.Power-off sequence for pop-free turn-off
VCC
VCC
VDD_Dig
VDD_Dig
XTI
XTI
Soft Mute
Soft Mute
Reg. 0x07
Reg. 0x07
Data 0xFE
Data 0xFE
Soft EAPD
Soft EAPD
Reg. 0x05
Reg. 0x05
Bit 7 = 0
Bit 7 = 0
Don’t care
Don’t care
FE
FE
Note: no specific VCC and
VDD_DIG turn
is required
Don’t care
Don’t care
Don’t care
Don’t care
−
off sequence
Don’t care
Don’t care
Don’t care
Don’t care
11/43
Electrical specificationsSTA335W
3.7 Testing
3.7.1 Functional pin definition
Table 8.Functional pin definition
Pin name NumberLogic value IC status
PWRDN 23
TWARN 20
EAPD 19
Figure 5.Test circuit 1
Low current dead time = MAX(DTr, DTf)
Duty cycle = 50%
INxY
0 Low consumption
1 Normal operation
0
A temperature warning is indicated by the external power
stage
1 Normal operation
0
Low consumption for power stage
All internal regulators are switched off
1 Normal operation
OUTxY
+Vcc
DTrDTf
M58
OUTxY
M57
gnd
R 8
Ω
V67
+
vdc = Vcc/2
Vcc
(3/4)Vcc
(1/2)Vcc
(1/4)Vcc
t
Figure 6.Test circuit 2
High Current Dead time for Bridge application = ABS(DTout(A)-DTin(A))+ABS(DTOUT(B)-DTin(B))
Duty cycle=ADuty cycle=B
M58
DTin(A)
INA
M57
Duty cycle A and B: Fixed to have DC output current of 4A in the direction shown in figure
12/43
Q1
Q3
OUTA
Iout=1.5A
DTout(A)
C69
470nF
+V
CC
Rload=4Ω
C71 470nF
M64
OUTB
Q2
M63
Q4
DTout(B)DTin(B)
L68 10μL67 10μ
Iout=1.5A
C70
470nF
INB
D06AU1651
STA335WI2C bus specification
4 I2C bus specification
The STA335W supports the I2C protocol via the input ports SCL and SDA_IN (master to
slave) and the output port SDA_OUT (slave to master). This protocol defines any device
that sends data on to the bus as a transmitter and any device that reads the data as a
receiver. The device that controls the data transfer is known as the master and the other as
the slave. The master always starts the transfer and provides the serial clock for
synchronization. STA335W is always a slave device in all of its communications. It supports
up to 400 kb/s rate (fast-mode bit rate). STA335W I
4.1 Communication protocol
4.1.1 Data transition or change
Data changes on the SDA line must only occur when the SCL clock is low. SDA transition
while the clock is high is used to identify a START or STOP condition.
4.1.2 Start condition
START is identified by a high to low transition of the data bus SDA signal while the clock
signal SCL is stable in the high state. A START condition must precede any command for
data transfer.
2
C is a slave only interface.
4.1.3 Stop condition
STOP is identified by low to high transition of the data bus SDA signal while the clock signal
SCL is stable in the high state. A STOP condition terminates communication between
STA335W and the bus master.
4.1.4 Data input
During the data input the STA335W samples the SDA signal on the rising edge of clock
SCL. For correct device operation the SDA signal must be stable during the rising edge of
the clock and the data can change only when the SCL line is low.
4.2 Device addressing
To start communication between the master and the STA335W, the master must initiate with
a start condition. Following this, the master sends onto the SDA line 8-bits (MSB first)
corresponding to the device select address and read or write mode.
The seven most significant bits are the device address identifiers, corresponding to the I
bus definition. In the STA335W the I
the SA port configuration, 0x38 when SA = 0, and 0x3A when SA = 1.
The eighth bit (LSB) identifies read or write operation RW, this bit is set to 1 in read mode
and to 0 for write mode. After a START condition the STA335W identifies on the bus the
device address and if a match is found, it acknowledges the identification on SDA bus
during the 9th bit time. The byte following the device identification byte is the internal space
address.
2
C interface has two device addresses depending on
2
C
13/43
Loading...
+ 30 hidden pages
You need points to download manuals.
1 point = 1 manual.
You can buy points or you can get point for every manual you upload.