Features
■ Peak pulse power:
– 1500 W (10/1000 µs)
– 10 kW (8/20 µs)
■ Breakdown voltage range: from 6.8 V to 220 V
■ Unidirectional and bidirectional types
■ Low leakage current:
– 0.2 µA at 25 °C
– 1 µA at 85 °C
■ Operating T
■ High power capability at T
– 1250 W (10/1000 µs)
■ JEDEC registered package outline
j max
: 150 °C
jmax
:
SM15T
Transil™
A
K
Unidirectional Bidirectional
SMC
(JEDEC DO-214AB)
Complies with the following standards
■ IEC 61000-4-2 level 4
– 15 kV (air discharge)
– 8 kV (contact discharge)
■ IEC 61000-4-5
– See Ta b le 3 for surge level
■ MIL STD 883G, method 3015-7: class 3B
– 25 kV HBM (human body model)
■ UL 497B file number: QVGQ2.E136224
■ Resin meets UL 94, V0
■ MIL-STD-750, method 2026 soldererabilty
■ EIA STD RS-481 and IEC 60286-3 packing
■ IPC 7531 footprint
Description
The SM15T Transil series has been designed to
protect sensitive equipment against electrostatic
discharges according to IEC 61000-4-2, and
MIL STD 883, method 3015, and electrical over
stress according to IEC 61000-4-4 and 5. These
devices are more generally used against surges
below 1500 W (10/1000 µs).
Planar technology makes these devices suitable
for high-end equipment and SMPS where low
leakage current and high junction temperature are
required to provide reliability and stability over
time.
SM15T are packaged in SMC (SMC footprint in
accordance with IPC 7531 standard).
TM: Transil is a trademark of STMicroelectronics
September 2009 Doc ID 3080 Rev 6 1/10
www.st.com
10
Characteristics SM15T
1 Characteristics
Table 1. Absolute maximum ratings (T
amb
= 25 °C)
Symbol Parameter Value Unit
P
T
T
Peak pulse power dissipation
PP
Storage temperature range -65 to + 150 °C
stg
Operating junction temperature range -55 to + 150 °C
T
j
Maximum lead temperature for soldering during 10 s. 260 °C
L
1. For a surge greater than the maximum values, the diode will fail in short-circuit.
Table 2. Thermal parameter
(1)
T
j initial
= T
amb
1500 W
Symbol Parameter Value Unit
R
R
th(j-l)
th(j-a)
Junction to leads 15 °C/W
Junction to ambient on printed circuit on recommended pad layout 90 °C/W
Figure 1. Electrical characteristics - definitions
I
I
I
I
PP
PP
I
I
R
R
I
I
RM
RM
RM
RM
I
I
VRMVBRV
VRMVBRV
RM
RM
I
I
R
R
Bidirectional
I
I
PP
PP
V
V
CL
CL
Symbol Parameter
V Stand-off voltage
RM
V Breakdown voltage
BR
V Clamping voltage
CL
I Leakage current @ V
RM RM
I Peak pulse current
PP
T Voltage temperature coefficient
α
V Forward voltage drop
F
R Dynamic resistance
D
Unidirectional
VCLVBRV
VCLVBRV
I
I
I
I
F
F
V
V
V
F
V
RM
RM
F
I
I
RM
RM
I
I
R
R
I
I
PP
PP
VCLVBRV
VCLVBRV
Figure 2. Pulse definition for electrical characteristics
%I
PP
100
50
0
t
t
r
p
2/10 Doc ID 3080 Rev 6
Pulse waveform
tr = rise time (µs)
tp = pulse duration time (µs)
t
SM15T Characteristics
Table 3. Electrical characteristics, parameter values (T
I
RM
max@V
RM
VBR @IR
(1)
VCL @IPP
10/1000 µs
amb
= 25 °C)
R
D
10/1000
µs
V
CL
@IPP
8/20 µs
R
D
8/20 µsαT
Order code
25 °C 85 °C min typ max max max max
µA V V mA V
(3)A(4)
Ω V
(3)A(4)
Ω 10-4/ °C
SM15T6V8A/CA 500 2000 5.8 6.45 6.8 7.14 10 10.5 143 0.023 13.4 746 0.008 5.7
SM15T7V5A/CA 250 1000 6.4 7.13 7.5 7.88 10 11.3 132 0.026 14.5 690 0.010 6.1
SM15T10A/CA 10 50 8.55 9.5 10 10.5 1 14.5 103 0.039 18.6 538 0.015 7.3
SM15T12A/CA 0.2 1 10.2 11.4 12 12.6 1 16.7 90 0.046 21.7 461 0.020 7.8
SM15T15A/CA 0.2 1 12.8 14.3 15 15.8 1 21.2 71 0.076 27.2 368 0.031 8.4
SM15T18A/CA 0.2 1 15.3 17.1 18 18.9 1 25.2 59.5 0.106 32.5 308 0.044 8.8
SM15T22A/CA 0.2 1 18.8 20.9 22 23.1 1 30.6 49 0.153 39.3 254 0.064 9.2
SM15T24A/CA 0.2 1 20.5 22.8 24 25.2 1 33.2 45 0.178 42.8 234 0.075 9.4
SM15T27A/CA 0.2 1 23.1 25.7 27 28.4 1 37.5 40 0.228 48.3 207 0.096 9.6
SM15T30A/CA 0.2 1 25.6 28.5 30 31.5 1 41.5 36 0.278 53.5 187 0.12 9.7
SM15T33A/CA 0.2 1 28.2 31.4 33 34.7 1 45.7 33 0.333 59.0 169 0.14 9.8
(2)
SM15T36A/CA 0.2 1 30.8 34.2 36 37.8 1 49.9 30 0.403 64.3 156 0.17 9.9
SM15T39A/CA 0.2 1 33.3 37.1 39 41.0 1 53.9 28 0.461 69.7 143 0.20 10.0
SM15T68A/CA 0.2 1 58.1 64.6 68 71.4 1 92 16.3 1.26 121 83 0.60 10.4
SM15T75A/CA 0.2 1 64.1 71.3 75 78.8 1 103 14.6 1.66 134 75 0.74 10.5
SM15T100A/CA 0.2 1 85.5 95.0 100 105 1 137 11 2.91 178 56 1.30 10.6
SM15T150A/CA 0.2 1 128 143 150 158 1 207 7.2 6.81 265 38 2.82 10.8
SM15T200A/CA 0.2 1 171 190 200 210 1 274 5.5 11.6 353 28 5.11 10.8
SM15T220A/CA 0.2 1 188 209 220 231 1 328 4.6 21.1 388 26 6.04 10.8
1. Pulse test : tp < 50 ms
2. To calculate V
3. To calculate maximum clamping voltage at other surge level, use the following formula: V
4. Surge capability given for both directions for unidirectional and bidirectional types.
versus junction temperature, use the following formula: V
BR
@ TJ = V
BR
@ 25°C x (1 + αT x (TJ – 25)).
BR
= RD x IPP + V
CL
BRmax.
Doc ID 3080 Rev 6 3/10
Characteristics SM15T
Figure 3. Peak pulse power dissipation
versus initial junction temperature
Figure 4. Peak pulse power versus
exponential pulse duration
(printed circuit board)
Ppp(W)
2000
1500
1000
500
Tj(°C)
0
0 25 50 75 100 125 150 175
10/1000 µs
P (kW)
PP
100.0
10.0
1.0
t (ms)
p
0.1
1.0E-03 1.0E-02 1.0E-01 1.0E+00 1.0E+01
Figure 5. Clamping voltage versus peak pulse current (maximum values)
IPP(A)
1000.0
Tjinitial=25 °C
Tjinitial = 25 °C
100.0
10.0
1.0
0.1
10A
8A
6V
15T
M
S
15T
M
S
30A
15T
M
S
8/20 µ s
22A
15T
M
S
68A
10/1000 µs
10 ms
15T
M
S
VCL(V)
150A
15T
M
S
220A
15T
M
S
1 10 100 1000
4/10 Doc ID 3080 Rev 6
SM15T Characteristics
Figure 6. Capacitance versus reverse applied
voltage (typical values, SM15TxxA)
C (nF)
10.00
SM15T6V8A
1.00
0.10
0.01
1 10 100 1000
SM15T15A
V (V)
R
SM15T30A
SM15T68A
F=1 MHz
V
=30 mV
osc
Tj=25 °C
SM15T200A
RMS
Figure 8. Peak forward voltage drop versus
forward current (typical values)
I (A)
FM
100.0
Figure 7. Capacitance versus reverse applied
voltage (typical values,
SM15TxxCA)
C (nF)
10.0
SM15T6V8CA
SM15T15CA
1.0
V (V)
0.1
1 10 100 1000
R
SM15T30CA
SM15T68CA
F=1 MHz
=30 mV
V
osc
Tj=25 °C
SM15T200CA
RMS
Figure 9. Relative variation of thermal
impedance junction to ambient
versus pulse duration
Z
th(j-a)/Rth(j-a)
1.00
Recommended pad layout
10.0
1.0
0.1
0.0 0.5 1.0 1.5 2.0 2.5
Tj=125 °C
Tj=25 °C
V (V)
FM
Figure 10. Thermal resistance junction to
ambient versus copper surface
under each lead
th(j-a)
(°C/ W)
printed circuit board FR4,
copper thickness = 35 µm
SCu(cm²)
R
100
90
80
70
60
50
40
30
20
10
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
0.10
0.01
1.0E-03 1.0E-02 1.0E-01 1.0E+00 1.0E+01 1.0E+02 1.0E+03
tP(s)
Figure 11. Leakage current versus junction
temperature (typical values)
(n A)
I
R
1.0E+04
1.0E+03
1.0E+02
1.0E+01
1.0E+00
VR=V
RM
VRM< 10 V
VR=V
RM
VRM≥ 10 V
25 50 75 100 125 150
T (°C)
j
Doc ID 3080 Rev 6 5/10
Ordering information scheme SM15T
2 Ordering information scheme
Figure 12. Ordering information scheme
SM 15 T 100 CA
Surface mount
Surge rating
15 = 1500 W Transil in SMC
Breakdown voltage
100 = 100 V
Types
CA = Bidirectional
A = Unidirectional
6/10 Doc ID 3080 Rev 6
SM15T Package information
3 Package information
● Case: JEDEC DO-214AB molded plastic over planar junction
● Terminals: solder plated, solderable as per MIL-STD-750, Method 2026
● Polarity: for unidirectional types the band indicates cathode
● Flammability: epoxy is rated UL 94, V0
● RoHS package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com
ECOPACK
Table 4. SMC dimensions
C
®
packages, depending on their level of environmental compliance. ECOPACK®
®
is an ST trademark.
E1
D
E
A1
LE2
A2
Figure 13. SMC footprint dimensions in mm
(inches)
Dimensions
Ref.
Millimeters Inches
Min. Max. Min. Max.
A1 1.90 2.45 0.075 0.096
A2 0.05 0.20 0.002 0.008
b 2.90 3.20 0.114 0.126
c 0.15 0.40 0.006 0.016
D 5.55 6.25 0.218 0.246
E 7.75 8.15 0.305 0.321
b
E1 6.60 7.15 0.260 0.281
E2 4.40 4.70 0.173 0.185
L 0.75 1.50 0.030 0.059
Figure 14. Marking layout
.
(1)
1.545.111.54
(0.061) (0.201)
8.19
(0.322)
1. Marking layout can vary according to assembly location.
(0.061)
3.14
(0.124)
Doc ID 3080 Rev 6 7/10
Cathode bar (
x x x
y w w
z
unidirectional
e
devices only )
e: ECOPACK compliance
XXX: Marking
Z: Manufacturing location
Y: Year
WW: week
Package information SM15T
Table 5. Marking
Order code Marking Order code Marking
SM15T6V8A MDE SM15T6V8CA BDE
SM15T7V5A MDG SM15T7V5CA BDG
SM15T10A MDP SM15T10CA BDP
SM15T12A MDT SM15T12CA BDT
SM15T15A MDX SM15T15CA BDX
SM15T18A MEE SM15T18CA BEE
SM15T22A MEK SM15T22CA BEK
SM15T24A MEM SM15T24CA BEM
SM15T27A MEP SM15T27CA BEP
SM15T30A MER SM15T30CA BER
SM15T33A MET SM15T33CA BET
SM15T36A MEV SM15T36CA BEV
SM15T39A MEX SM15T39CA BEX
SM15T68A MFP SM15T68CA BFP
SM15T75A MFO SM15T75CA BFO
SM15T100A MFX SM15T100CA BFX
SM15T150A MGK SM15T150CA BGK
SM15T200A MGV SM15T200CA BGV
SM15T220A MGX SM15T220CA BGX
8/10 Doc ID 3080 Rev 6
SM15T Ordering information
4 Ordering information
Table 6. Ordering information
Order code Marking Package Weight Base qty Delivery mode
(1)
SM15TxxxA/CA
1. Where xxx is nominal value of VBR and A or CA indicates unidirectional or bidirectional version. See
Table 3 for list of available devices and their order codes
See Table 5 on page 8 SMC 0.25 g 2500 Tape and reel
5 Revision history
Table 7. Document revision history
Date Revision Description of changes
September-2001 3B Last issue
19-Feb-2007 4 Peak pulse power Figure 4 on page 4 updated.
Updated ECOPACK statement. Added R
04-Feb-2009 5
Ta bl e 3 . Updated characteristic curves, Figure 3 to
Figure 11.
17-Sep-2009 6 Document updated for low leakage current.
columns in
D
Doc ID 3080 Rev 6 9/10
SM15T
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10/10 Doc ID 3080 Rev 6
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