ST VND5004A-E, VND5004ASP30-E User Manual

VND5004A-E VND5004ASP30-E

Double 4mΩ high side driver with analog current sense for automotive applications

Features
Max transient supply voltage	VCC	41V
Operating voltage range	VCC	4.5 to 27V		PQFN - 12x12 Power lead-less
Max On-State resistance (per ch.)	RON	4 mΩ		MultiPowerSO-30
Current limitation (typ)	ILIMH	100A
Off state supply current	I	2 µA(1)
	S

1. Typical value with all loads connected

Application

■General

–Inrush current active management by power limitation

–Very low stand-by current

–3.0V CMOS compatible input

–Optimized electromagnetic emission

–Very low electromagnetic susceptibility

–In compliance with the 2002/95/EC European directive

■Diagnostic functions

–Proportional load current sense

–Current sense disable

–Thermal shutdown indication

■Protection

–Undervoltage shut-down

–Overvoltage clamp

–Load current limitation

–Thermal shut down

–Self limiting of fast thermal transients

–Protection against loss of ground and loss of VCC

–Reverse battery protection with self switch on of the PowerMOS (see Application schematic on page 18)

–Electrostatic discharge protection

Table 1. Devices summary

■All types of resistive, inductive and capacitive loads

■Suitable for power management applications

Description

The VND5004ATR-E and VND5004ASP30-E are devices made using STMicroelectronics VIPower technology. They are intended for driving resistive or inductive loads with one side connected to ground. Active VCC pin voltage clamp and load dump protection circuit protect the devices against transients on the Vcc pin (see ISO7637 transient compatibility table). These devices integrate an analog current sense which delivers a current proportional to the load current (according to a known ratio) when CS_DIS is driven low or left open. When CS_DIS is driven high, the CURRENT SENSE pin is high impedance. Output current limitation protects the devices in overload condition. In case of long duration overload, the devicesa limit the dissipated power to a safe level up to thermal shut-down intervention. Thermal shut-down with automatic restart allows the device to recover normal operation as soon as a fault condition disappears.

	Package		Order codes
		Tube	Tape and Reel	Tray
	PQFN-12x12 Power lead-less	-	VND5004ATR-E	VND5004A-E
	MultiPowerSO-30	VND5004ASP30-E	VND5004ASP30TR-E	-
	December 2007	Rev 5		1/34

www.st.com

Contents	VND5004A-E / VND5004ASP30-E

Contents

1	Block diagram and pin configurations . . . . . . . . . . . . . . . . . . . . . . . . .		. 5
2	Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .		7
	2.1	Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	7
	2.2	Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	8
	2.3	Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	9
	2.4	Electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	15
3	Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .		18
	3.1	MCU I/Os protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	18
	3.2	Load dump protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	18
	3.3	Maximum demagnetization energy (VCC = 13.5V) . . . . . . . . . . . . . . . . .	19
4	Package and PC board thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . .		20
	4.1	MultiPowerSO-30 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	20
	4.2	PQFN - 12x12 Power lead-less thermal data . . . . . . . . . . . . . . . . . . . . . .	23
5	Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . .		26
	5.1	ECOPACK® packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	26
	5.2	MultiPowerSO-30 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	26
	5.3	PQFN - 12x12 Power lead-less mechanical data . . . . . . . . . . . . . . . . . . .	28
	5.4	MultiPowerSO-30 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . .	30
	5.5	PQFN - 12x12 Power lead-less packing information . . . . . . . . . . . . . . . .	31
6	Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .		33

2/34

VND5004A-E / VND5004ASP30-E	List of tables

List of tables

Table 1. Devices summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Table 2. Pin functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Table 3. Suggested connections for unused and n.c. pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Table 4. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Table 5. Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Table 6. Power section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Table 7. Switching (VCC = 13V; Tj = 25°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Table 8. Logic input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Table 9. Protection and diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Table 10. Current sense (8V<VCC<16V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Table 11. Truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Table 12. Electrical transient requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Table 13. Thermal parameters for MultiPowerSO-30 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Table 14. Thermal parameters for PQFN - 12x12 Power lead-less . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Table 15. MultiPowerSO-30 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Table 16. PQFN - 12x12 Power lead-less mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Table 17. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

3/34

List of figures	VND5004A-E / VND5004ASP30-E

List of figures

Figure 1.	Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	. 5
Figure 2.	Configuration diagram (not in scale) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	. 6
Figure 3.	Current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	. 7
Figure 4.	Current sense delay characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	11
Figure 5.	Switching characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	12
Figure 6.	Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	14
Figure 7.	Off state output current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	15
Figure 8.	High level input current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	15
Figure 9.	Input clamp voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	15
Figure 10.	Input low level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	15
Figure 11.	Input high level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	15
Figure 12.	Input hysteresis voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	15
Figure 13.	On state resistance vs. Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	16
Figure 14.	On state resistance vs. VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	16
Figure 15.	Undervoltage shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	16
Figure 16.	Turn-On voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	16
Figure 17.	ILIMH vs. Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	16
Figure 18.	Turn-Off voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	16
Figure 19.	CS_DIS high level voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	17
Figure 20.	CS_DIS clamp voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	17
Figure 21.	CS_DIS low level voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	17
Figure 22.	Application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	18
Figure 23.	Maximum turn off current versus inductance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	19
Figure 24.	MultiPowerSO-30 PC board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	20
Figure 25.	Rthj-amb Vs. PCB copper area in open box free air condition (one channel ON) . . . . . . .	20
Figure 26.	MultiPowerSO-30 thermal impedance junction ambient single pulse (one channel ON) . .	21
Figure 27.	Thermal fitting model of a double channel HSD in MultiPowerSO-30 . . . . . . . . . . . . . . . .	21
Figure 28.	12x12 Power lead-less package PC board. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	23
Figure 29.	Rthj-amb Vs. PCB copper area in open box free air condition (one channel ON) . . . . . . .	23
Figure 30. PQFN - 12x12 Power lead-less package thermal impedance junction ambient single pulse
(one channel ON) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .		24
Figure 31.	Thermal fitting model of a double channel HSD in PQFN - 12x12 Power lead-less . . . . . 24
Figure 32.	MultiPowerSO-30 outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	26
Figure 33.	PQFN - 12x12 Power lead-less outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	28
Figure 34.	MultiPowerSO-30 tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	30
Figure 35.	MultiPowerSO-30 tape and reel shipment (suffix “TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . .	30
Figure 36.	PQFN - 12x12 Power lead-less tray shipment (no suffix). . . . . . . . . . . . . . . . . . . . . . . . . .	31
Figure 37.	PQFN - 12x12 Power lead-less tape and reel shipment (suffix “TR”). . . . . . . . . . . . . . . . .	32

4/34

VND5004A-E / VND5004ASP30-E	Block diagram and pin configurations

1 Block diagram and pin configurations

Figure 1.	Block diagram
					VCC
	VCC	Under
	clamp	voltage	PwCLAMP
			DRIVER		OUTPUT1
GND
				ILIM
	Reverse		Overtemp.
	battery
	protection	PwrLIM	IOUT1		CURRENT
				K
					SENSE1
			CS_DIS
INPUT1		LOGIC	PwCLAMP
			DRIVER		OUTPUT2
INPUT2				ILIM
			Overtemp.
		PwrLIM	IOUT2	K	CURRENT
CS_DIS					SENSE2
			CS_DIS

	Table 2.	Pin functions
		Name	Function
		VCC	Battery connection
	OUTPUT1,2		Power output
		GND	Ground connection
	INPUT1,2		Voltage controlled input pin with hysteresis, CMOS compatible. Controls
			output switch state
	CURRENT SENSE1,2		Analog current sense pin, delivers a current proportional to the load current
	CS_DIS		Active high CMOS compatible pin, to disable the current sense pins

5/34

Block diagram and pin configurations	VND5004A-E / VND5004ASP30-E

Figure 2. Configuration diagram (not in scale)

										1 NC
			12							2 NC
		11								3 NC
		10						15		4 GND
		9								5 CS_DIS
										6 CURRENT SENSE 2
PQFN -12x12 Power		8								7 CURRENT SENSE 1
lead - less		7		13		14				8 INPUT 2
		6								9 INPUT 1
(bottom view)
		5								10 NC
										11 NC
		4
								16		12 NC
		3								13 FOR TEST ONLY
		2								14 VCC
			1							15 OUTPUT 1
										16 OUTPUT 2

VCC 1

NC FOR TEST ONLY NC NC GND

CS_DIS CURRENT SENSE 2

CURRENT SENSE 1 INPUT 2

INPUT 1 NC FOR TEST ONLY NC

VCC 15

30									VCC
									OUTPUT 2
									OUTPUT 2
									OUTPUT 2
									OUTPUT 2
									OUTPUT 2
		VCC							OUTPUT 2	MultiPowerSO-30
									NC
		Heat Slug1							OUTPUT 1	(top view)
									OUTPUT 1
									OUTPUT 1
									OUTPUT 1
									OUTPUT 1
									OUTPUT 1
16									VCC

Table 3.	Suggested connections for unused and n.c. pins
Connection /		Current	N.C.	Output	Input	CS_DIS	For test
Pin		Sense					only
Floating		N.R.(1)	X	X	X	X	X
To ground		Through 1kΩ	X	N.R.	Through 10kΩ	Through 10kΩ	N.R.
		resistor			resistor	resistor

1. Not recommended.

6/34

VND5004A-E / VND5004ASP30-E	Electrical specifications

2 Electrical specifications

Figure 3. Current and voltage conventions

			IS
		VCC	VCC
ICSD	CS_DIS	OUTPUT1,2	IOUT1,2
IIN1,2	INPUT1,2		VOUT1,2
VCSD			ISENSE1,2
		CURRENT
		SENSE1,2
VIN1,2		GND	VSENSE1,2
		IGND

2.1Absolute maximum ratings

Stressing the device above the ratings listed in the “Absolute maximum ratings” tables may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the Operating sections of this specification is not implied. Exposure to the conditions in this section for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant quality documents.

	Table 4.	Absolute maximum ratings
	Symbol	Parameter	Value	Unit
	VCC	DC supply voltage	27	V
	VCCPK	Transient supply voltage (T<400ms, Rload>0.5Ω)	41	V
	-VCC	Reverse DC supply voltage	16	V
	IOUT	DC output current	Internally limited	A
	- IOUT	Reverse DC output current	70	A
	IIN	DC input current	-1 to 10	mA
	ICSD	DC current sense disable input current	-1 to 10	mA
	VCSENSE	Current sense maximum voltage (Vcc>0V)	Vcc-41	V
			+Vcc	V
	EMAX	Maximum switching energy (single pulse)	342	mJ
		(L=0.3mH; RL=0Ω; Vbat=13.5V; Tjstart=150ºC; IOUT = IlimL(Typ.) )
	VESD	Electrostatic discharge (Human Body Model: R=1.5kΩ;	2000	V
		C=100pF)
	VESD	Charge device model (CDM-AEC-Q100-011)	750	V

7/34

Electrical specifications			VND5004A-E / VND5004ASP30-E
	Table 4.	Absolute maximum ratings (continued)
	Symbol	Parameter		Value	Unit
	Tj	Junction operating temperature		-40 to 150	°C
	TSTG	Storage temperature		-55 to 150	°C

2.2Thermal data

Table 5.	Thermal data
Symbol	Parameter	Value			Unit
		MultiPowerSO-30		12x12 PLLP
Rthj-case	Thermal resistance junction-case (MAX)	0.35		0.35	°C/W
	(with one channel ON)
Rthj-amb	Thermal resistance junction-ambient (MAX)	58(1)		39(2)	°C/W

1.PCB FR4 area 58mmX58mm , PCB thickness 2mm, Cu thickness 35 m, minimum pad layout.

2.PCB FR4 area 78mmX78mm , PCB thickness 2mm, Cu thickness 35 m, minimum pad layout.

8/34

VND5004A-E / VND5004ASP30-E	Electrical specifications

2.3Electrical characteristics

Values specified in this section are for 8V<VCC<24V, -40°C<Tj<150 °C, unless otherwise stated.

Table 6.	Power section
Symbol	Parameter			Test conditions		Min.	Typ.	Max.	Unit
VCC	Operating supply					4.5	13	27	V
	voltage
VUSD	Undervoltage shutdown						3.5	4.5	V
VUSDhyst	Undervoltage shut-down						0.5		V
	hysteresis
	On-state resistance(1)	IOUT=15A; Tj=25°C						4	mΩ
R		I	OUT	=15A; T	=150°C			8	mΩ
ON				j
		IOUT=15A; VCC=5V; Tj=25°C						6	mΩ
RON REV	Rdson in reverse battery	VCC=-13V; IOUT=-15A; Tj=25°C						4	mΩ
	condition
Vclamp	VCC clamp voltage	ICC=20 mA; IOUT1,2=0A				41	46	52	V
		Off state; VCC=13V; Tj=25°C;					2(2)	5(2)
IS	Supply current	VIN=VOUT=VSENSE=VCSD=0V							µA
		On state; VCC=13V; VIN=5V; IOUT=0A					3.5	6	mA
IL(off)	Off-state output	VIN=VOUT=0V; VCC=13V; Tj=25°C				0	0.01	3	µA
	(1)	VIN=VOUT=0V; VCC=13V; Tj=125°C				0		5
	current

1.For each channel.

2.PowerMOS leakage included.

Table 7.	Switching (VCC = 13V; Tj = 25°C)
Symbol		Parameter	Test conditions	Min.	Typ.	Max.	Unit
td(on)		Turn-on delay time	RL=0.87Ω (see Figure 5.)		25		µs
td(off)		Turn-on delay time	RL=0.87Ω (see Figure 5.)		35		µs
			RL=0.87Ω		See		V/ µs
(dVOUT/dt)on		Turn-on voltage slope			Figure
					16.
			RL=0.87Ω		See		V/ µs
(dVOUT/dt)off		Turn-off voltage slope			Figure
					18.
WON		Switching energy	RL=0.87Ω (see Figure 5.)		5.4		mJ
		losses during twon
WOFF		Switching energy	RL=0.87Ω (see Figure 5.)		2.3		mJ
		losses during twoff

9/34

Electrical specifications

VND5004A-E / VND5004ASP30-E

Table 8.

Logic input

Symbol

Parameter

Test conditions

Min.

Typ.

Max.

Unit

VIL1,2

Input low level voltage

0.9

V

IIL1,2

Low level input current

VIN=0.9V

1

A

VIH1,2

Input high level voltage

2.1

V

IIH1,2

High level input current

VIN=2.1V

10

A

VI(hyst)1,2

Input hysteresis

0.25

V

voltage

VICL1,2

Input clamp voltage

IIN=1mA

5.5

7

V

IIN=-1mA

-0.7

V

VCSDL

CS_DIS low level

0.9

V

voltage

ICSDL

Low level CS_DIS

VCSD=0.9V

1

A

current

VCSDH

CS_DIS high level

2.1

V

voltage

ICSDH

High level CS_DIS

VCSD=2.1V

10

A

current

VCSD(hyst)

CS_DIS hysteresis

0.25

V

voltage

VCSCL

CS_DIS clamp voltage

ICSD=1mA

5.5

7

V

ICSD=-1mA

-0.7

V

Table 9.

Protection and diagnostics(1)

Symbol

Parameter

Test conditions

Min.

Typ.

Max.

Unit

IlimH

Short circuit current

VCC=13V

70

100

140

A

5V<VCC<24V

140

A

Shortcircuitcurrent

IlimL

during thermal

VCC=13V; TR<Tj<TTSD

40

A

cycling

TTSD

Shutdown

150

175

200

°C

temperature

TR

Reset temperature

TRS+1

TRS+5

°C

TRS

Thermal reset of

135

°C

STATUS

THYST

Thermal hysteresis

7

°C

(TTSD-TR)

VDEMAG

Turn-off output

IOUT=2A; VIN=0; L=6mH

VCC-27

VCC-30

VCC-33

V

voltage clamp

1.To ensure long term reliability under heavy overload or short circuit conditions, protection and related diagnostic signals must be used together with a proper software strategy. If the device is subjected to abnormal conditions, this software must limit the duration and number of activation cycles.

10/34

VND5004A-E / VND5004ASP30-E				Electrical specifications
	Table 10.	Current sense (8V<VCC<16V)
	Symbol	Parameter	Test conditions	Min.	Typ.	Max.	Unit
			IOUT=15A; VSENSE=4V; VCSD=0V;
	K1	IOUT/ISENSE	Tj=-40°C	11530	16000	19340
			Tj=25°C...150°C	12730	16000	19270
			IOUT=30A; VSENSE=4V; VCSD=0V;
	K2	IOUT/ISENSE	Tj=-40°C	13430	16150	17880
			Tj=25°C...150°C	14500	16150	17880
		Analog sense	IOUT=0A; VSENSE=0V;
	ISENSE0		VCSD=5V; VIN=0V; Tj=-40°C to 150°C	0		5	µA
		current
			VCSD=0V; VIN=5V; Tj=-40°C to 150°C	0		400	µA
	VSENSE	Max analog sense	IOUT=45A; VCSD=0V; RSENSE=3.9kΩ	5			V
		output voltage
		Analog sense
	VSENSEH	output voltage in	VCC=13V; RSENSE=3.9kΩ		9		V
		overtemperature
		condition
		Analog sense
	ISENSEH	output current in	Vcc=13V; VSENSE=5V		8		mA
		overtemperature
		condition
		Delay response	VSENSE<4V, 5A<Iout<30A
		time from falling
	tDSENSE1H		ISENSE=90% of ISENSE max		50	100	µs
		edge of CS_DIS
		pin	(see Figure 4.)
		Delay response	VSENSE<4V, 5A<Iout<30A
		time from rising
	tDSENSE1L		ISENSE=10% of ISENSE max		5	20	µs
		edge of CS_DIS
		pin	(see Figure 4.)
		Delay response	VSENSE<4V, 5A<Iout<30A				µs
	tDSENSE2H	time from rising	ISENSE=90% of ISENSE max		270	600
		edge of INPUT pin	(see Figure 4.)
		Delay response	VSENSE<4V, 5A<Iout<30A				µs
	tDSENSE2L	time from falling	ISENSE=10% of ISENSE max		100	250
		edge of INPUT pin	(see Figure 4.)

Figure 4. Current sense delay characteristics

INPUT

CS_DIS

LOAD CURRENT

SENSE CURRENT

tDSENSE2H tDSENSE1L	t	DSENSE1H	t
			DSENSE2L

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