ST VND1NV04, VNN1NV04, VNS1NV04 User Manual

VND1NV04 VNN1NV04 - VNS1NV04

OMNIFET II fully autoprotected Power MOSFET

Features

Parameter

Symbol

Value

 

 

 

Max on-state resistance (per ch.)

RON

250 mΩ

Current limitation (typ)

ILIMH

1.7 A

Drain-source clamp voltage

VCLAMP

40 V

Linear current limitation

Thermal shutdown

Short circuit protection

Integrated clamp

Low current drawn from input pin

Diagnostic feedback through input pin

ESD protection

Direct access to the gate of the Power MOSFET (analog driving)

Compatible with standard Power MOSFET

3

1

TO-252 (DPAK)

2

3

2

1

SOT-223 SO-8

Description

The VND1NV04, VNN1NV04, VNS1NV04 are monolithic devices designed in STMicroelectronics® VIPower® M0-3 Technology, intended for replacement of standard Power MOSFETs from DC up to 50 KHz applications. Built in thermal shutdown, linear current limitation and overvoltage clamp protect the chip in harsh environments.

Fault feedback can be detected by monitoring the voltage at the input pin.

Table 1.

Device summary

 

 

 

 

Package

 

 

Order codes

 

 

 

 

 

 

Tube

Tube (lead free)

 

Tape and reel

Tape and reel (lead free)

 

 

 

 

 

 

 

 

 

TO-252 (DPAK)

VND1NV04

VND1NV04-E

 

VND1NV0413TR

VND1NV04TR-E

 

 

 

 

 

 

SOT-223

VNN1NV04

-

 

VNN1NV0413TR

-

 

 

 

 

 

 

 

SO-8

 

VNS1NV04

-

 

VNS1NV0413TR

-

 

 

 

 

 

December 2011

 

Doc ID 7381 Rev 3

1/33

 

 

 

 

 

 

 

www.st.com

Contents

VND1NV04 - VNN1NV04 - VNS1NV04

 

 

Contents

1

Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . .

. 5

2

Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

. 6

 

2.1

Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

6

 

2.2

Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

7

 

2.3

Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

7

 

2.4

Electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

12

3

Protection features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

16

4

Package and PCB thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

17

 

4.1

DPAK thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

17

 

4.2

SOT-223 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

19

 

4.3

SO-8 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

22

5

Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

25

 

5.1

DPAK mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

25

 

5.2

SOT-223 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

27

 

5.3

SO8 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

27

 

5.4

DPAK packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

29

 

5.5

SOT-223 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

30

 

5.6

SO8 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

31

6

Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

32

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List of tables

 

 

List of tables

Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Table 2. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Table 3. Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Table 4. Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Table 5. DPAK thermal parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Table 6. SOT-223 thermal parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Table 7. SO-8 thermal parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Table 8. DPAK mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Table 9. SO-8 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Table 10. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

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List of figures

VND1NV04 - VNN1NV04 - VNS1NV04

 

 

List of figures

Figure 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Figure 2. Configuration diagram (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Figure 3. Current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Figure 4. Switching time test circuit for resistive load . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Figure 5. Test circuit for diode recovery times . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Figure 6. Unclamped inductive load test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Figure 7. Input charge test circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Figure 8. Unclamped inductive waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Figure 9. Source-drain diode forward characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Figure 10. Static drain-source on resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Figure 11. Derating curve . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Figure 12. Static drain-source on resistance vs. input voltage (part 1/2) . . . . . . . . . . . . . . . . . . . . . . . 12 Figure 13. Static drain-source on resistance vs. input voltage (part 2/2) . . . . . . . . . . . . . . . . . . . . . . . 12 Figure 14. Transconductance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Figure 15. Static drain-source on resistance vs. Id . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Figure 16. Transfer characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Figure 17. Turn-on current slope (part 1/2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Figure 18. Turn-on current slope (part 2/2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Figure 19. Input voltage vs. input charge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Figure 20. Turn-off drain source voltage slope (part 1/2). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Figure 21. Turn-off drain-source voltage slope (part 2/2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Figure 22. Capacitance variations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Figure 23. Switching time resistive load (part 1/2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Figure 24. Switching time resistive load (part 2/2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Figure 25. Output characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Figure 26. Normalized on resistance vs. temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Figure 27. Normalized input threshold voltage vs. temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Figure 28. Normalized current limit vs. junction temperature. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Figure 29. Step response current limit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Figure 30. DPAK PC board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Figure 31. DPAK Rthj-amb vs. PCB copper area in open box free air condition . . . . . . . . . . . . . . . . . 17 Figure 32. DPAK thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Figure 33. DPAK thermal fitting model of a single channel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Figure 34. SOT-223 PC board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Figure 35. SOT-223 Rthj-amb vs. PCB copper area in open box free air condition . . . . . . . . . . . . . . 20 Figure 36. SOT-223 thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . . . . . 20 Figure 37. SOT-223 thermal fitting model of a single channel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Figure 38. SO-8 PC board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Figure 39. SO-8 Rthj-amb vs. PCB copper area in open box free air condition . . . . . . . . . . . . . . . . . 22 Figure 40. SO-8 thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Figure 41. SO-8 thermal fitting model of a single channel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Figure 42. DPAK package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Figure 43. SOT-223 mechanical data & package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Figure 44. SO-8 package dimension . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Figure 45. SOT-223 tape and reel shipment (suffix “TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 Figure 46. SO-8 tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 Figure 47. SO-8 tape and reel shipment (suffix “TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

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Block diagram and pin description

 

 

1 Block diagram and pin description

Figure 1. Block diagram

 

 

 

DRAIN

 

 

 

2

 

 

 

Overvoltage

 

 

 

Clamp

INPUT

 

Gate

 

 

1

 

 

Control

 

 

 

 

 

 

 

Linear

 

 

Over

Current

 

 

Limiter

 

 

Temperature

 

 

 

 

3

 

 

 

SOURCE

Figure 2. Configuration diagram (top view)

SOURCE

1

8

DRAIN

SOURCE

 

 

DRAIN

SOURCE

 

 

4

5

DRAIN

 

 

INPUT

DRAIN

 

 

 

 

 

 

1. For the pins configuration related to SOT-223 and DPAK see outline at page 1.

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Electrical specifications

VND1NV04 - VNN1NV04 - VNS1NV04

 

 

2 Electrical specifications

Figure 3. Current and voltage conventions

 

ID

 

VDS

 

DRAIN

I

RIN

IN

INPUT

 

 

SOURCE

VIN

 

2.1Absolute maximum ratings

The rating listed in Table 2: Absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the operating sections of this specification is not implied. Exposure to Absolute maximum rating conditions for extended periods may affect device reliability.

Table 2.

Absolute maximum ratings

 

 

 

 

Symbol

Parameter

 

Value

 

Unit

 

 

 

SOT-223

SO-8

DPAK

 

 

 

 

 

 

 

 

 

VDSn

Drain-source voltage (VINn=0 V)

Internally clamped

V

VINn

Input voltage

Internally clamped

V

IINn

Input current

 

+/-20

 

mA

RIN MINn

Minimum input series impedance

 

330

 

Ω

IDn

Drain current

Internally limited

A

IRn

Reverse DC output current

 

-3

 

A

VESD1

Electrostatic discharge (R=1.5 KΩ, C=100 pF)

 

4000

 

V

VESD2

Electrostatic discharge on output pins only

 

16500

 

V

(R=330 Ω, C=150 pF)

 

 

 

 

 

 

 

 

 

 

 

 

 

Ptot

Total dissipation at Tc=25 °C

7

8.3

35

W

Tj

Operating junction temperature

Internally limited

°C

Tc

Case operating temperature

Internally limited

°C

Tstg

Storage temperature

 

-55 to 150

 

°C

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Electrical specifications

 

 

2.2Thermal data

Table 3.

Thermal data

 

 

 

 

Symbol

Parameter

Maximum value

Unit

 

 

 

SOT-223

SO-8

DPAK

 

 

 

 

 

 

 

 

 

Rthj-case

Thermal resistance junction-case

18

 

3.5

°C/W

Rthj-lead

Thermal resistance junction-lead

 

15

 

°C/W

Rthj-amb

Thermal resistance junction-ambient

70(1)

65(1)

54(1)

°C/W

1.When mounted on a standard single-sided FR4 board with 50 mm2 of Cu (at least 35 μm thick) connected to all DRAIN pins

2.3Electrical characteristics

Table 4.

Electrical characteristics

 

 

 

 

Symbol

Parameter

 

Test conditions

Min.

Typ.

Max.

Unit

 

 

 

 

 

 

 

Off (-40 °C<Tj<150 °C, unless otherwise specified)

 

 

 

 

 

 

 

 

 

 

 

 

 

VCLAMP

Drain-source clamp

VIN=0 V; ID=0.5 A

40

45

55

V

voltage

VCLTH

Drain-source clamp

VIN=0 V; ID=2 mA

36

 

 

V

threshold voltage

 

 

VINTH

Input threshold

VDS=VIN; ID=1 mA

0.5

 

2.5

V

voltage

 

IISS

Supply current from

VDS=0 V; VIN=5 V

 

100

150

µA

input pin

 

VINCL

Input-source clamp

IIN=1 mA

6

6.8

8

V

voltage

IIN=-1 mA

-1.0

 

-0.3

 

 

 

 

 

 

 

Zero input voltage

VDS=13 V; VIN=0 V; Tj=25 °C

 

 

30

µA

IDSS

drain current

 

 

 

 

 

 

VDS=25 V; VIN=0 V

 

 

75

 

 

 

(VIN=0 V)

 

 

 

On (-40 °C<Tj<150 °C, unless otherwise specified)

 

 

 

 

 

 

 

 

 

 

 

 

RDS(on)

Static drain-source on

VIN=5 V; ID=0.5 A; Tj=25 °C

 

 

250

resistance

VIN=5 V; ID=0.5 A

 

 

500

 

 

 

 

 

 

 

Dynamic (Tj=25 °C, unless otherwise specified)

 

 

 

 

g

(1)

Forward

V

=13 V; I =0.5 A

 

2

 

S

transconductance

 

 

 

fs

DD

D

 

 

 

 

 

 

 

 

 

 

 

COSS

Output capacitance

VDS=13 V; f=1 MHz; VIN=0 V

 

90

 

pF

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Electrical specifications

VND1NV04 - VNN1NV04 - VNS1NV04

 

 

 

 

 

 

 

 

 

 

Table 4.

Electrical characteristics (continued)

 

 

 

 

 

 

Symbol

Parameter

Test conditions

 

Min.

Typ.

Max.

Unit

 

 

 

 

 

 

 

 

 

 

Switching (Tj=25 °C, unless otherwise specified)

 

 

 

 

 

 

td(on)

Turn-on delay time

 

 

 

70

200

ns

 

 

 

VDD=15 V; ID=0.5 A

 

 

 

 

 

 

tr

Rise time

Ω

 

170

500

ns

 

Vgen=5 V; Rgen=RIN MIN=330

 

 

td(off)

Turn-off delay time

 

350

1000

ns

 

(see Figure 4)

 

 

 

tf

Fall time

 

 

 

200

600

ns

 

td(on)

Turn-on delay time

 

 

 

0.25

1.0

µs

 

 

 

VDD=15 V; ID=0.5 A

 

 

 

 

 

 

tr

Rise time

 

 

1.3

4.0

µs

 

Vgen=5 V; Rgen=2.2 KΩ

 

 

 

td(off)

Turn-off delay time

 

 

1.8

5.5

µs

 

(see Figure 4)

 

 

 

tf

Fall time

 

 

 

1.2

4.0

µs

 

(dI/dt)on

Turn-on current slope

VDD=15 V; ID=1.5 A

 

 

5

 

A/µs

 

Vgen=5 V; Rgen=RIN MIN=330

Ω

 

 

 

 

 

 

 

 

 

 

Qi

Total input charge

VDD=12 V; ID=0.5 A; VIN=5 V

 

 

5

 

nC

 

Igen=2.13 mA (see Figure 7)

 

 

 

 

 

 

 

 

 

 

 

 

Source drain diode (Tj=25 °C, unless otherwise specified)

 

 

 

 

 

 

(1)

Forward on voltage

ISD=0.5 A; VIN=0 V

 

 

0.8

 

V

 

VSD

 

 

 

 

trr

Reverse recovery

 

 

 

205

 

ns

 

time

ISD=0.5 A; dI/dt=6 A/µs

 

 

 

 

 

Reverse recovery

 

 

 

 

 

 

Qrr

VDD=30 V; L=200 µH

 

 

100

 

nC

 

charge

 

 

 

 

 

 

(see Figure 5)

 

 

 

 

 

 

IRRM

Reverse recovery

 

 

0.7

 

A

 

 

 

 

 

 

current

 

 

 

 

 

Protections (-40 °C<Tj<150 °C, unless otherwise specified)

 

 

 

 

 

 

Ilim

Drain current limit

VIN=5 V; VDS=13 V

 

1.7

 

3.5

A

 

tdlim

Step response

VIN=5 V; VDS=13 V

 

 

2.0

 

µs

 

current limit

 

 

 

 

Tjsh

Overtemperature

 

 

150

175

200

°C

 

shutdown

 

 

 

Tjrs

Overtemperature

 

 

135

 

 

°C

 

reset

 

 

 

 

 

Igf

Fault sink current

VIN=5 V; VDS=13 V; Tj=Tjsh

 

10

15

20

mA

 

 

 

Starting Tj=25 °C; VDD=24 V

 

 

 

 

 

 

Eas

Single pulse

VIN=5 V Rgen=RIN MIN=330 Ω;

55

 

 

mJ

 

avalanche energy

L=50 mH

 

 

 

 

 

 

(see Figure 6 and Figure 8)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

1. Pulsed: pulse duration = 300 µs, duty cycle 1.5 %

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Electrical specifications

 

 

Figure 4. Switching time test circuit for resistive load

 

 

VD

 

 

Rgen

 

 

Vgen

ID

 

 

 

90%

 

tr

10%

tf

td(on)

 

t

 

t

Vgen

 

d(off)

 

 

 

 

t

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Electrical specifications

VND1NV04 - VNN1NV04 - VNS1NV04

 

 

Figure 5. Test circuit for diode recovery times

 

 

A

 

 

A

D

 

 

 

 

 

 

 

I

 

FAST

 

L=100uH

OMNIFET

 

DIODE

 

 

 

 

S

B

 

 

B

 

 

 

 

330Ω

 

 

 

D

 

 

 

 

 

 

Rgen

 

VDD

 

 

I

 

 

 

 

OMNIFET

 

 

 

 

Vgen

 

 

 

S

 

 

 

 

 

 

 

 

8.5 Ω

Figure 6. Unclamped inductive load test circuits

RGEN

VIN

PW

10/33

Doc ID 7381 Rev 3

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