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TYN606 |
® |
TYN1006 |
|
|
STANDARD
6A SCRS
Table 1: Main Features
Symbol |
Value |
Unit |
|
|
|
IT(RMS) |
6 |
A |
VDRM/VRRM |
600 and 1000 |
V |
IGT |
15 |
mA |
DESCRIPTION
The TYN606 and TYN1006 family of Silicon Controlled Rectifiers are high performance glass passivated technology.
This general purpose Family of Silicon Controlled Rectifiers is designed for power supply up to 400Hz on resistive or inductive load.
A
G
K
A
K
A
G
TO-220AB
Table 2: Order Codes
Part Numbers |
Marking |
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|
TYN606RG |
TYN606 |
|
|
TYN1006RG |
TYN1006 |
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|
Table 3: Absolute Ratings (limiting values)
Symbol |
Parameter |
|
|
|
Value |
Unit |
|
|
|
|
|
|
|
|
|
IT(RMS) |
RMS on-state current (180° conduction angle) |
Tc = 110°C |
6 |
A |
|||
IT(AV) |
Average on-state current (180° conduction angle) |
Tc = 110°C |
3.8 |
A |
|||
ITSM |
Non repetitive surge peak on-state |
|
tp = 8.3 ms |
Tj = 25°C |
|
73 |
A |
current |
tp = 10 ms |
|
70 |
||||
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|
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I²t |
I²t Value for fusing |
tp = 10 ms |
Tj = 25°C |
24.5 |
A2S |
||
dI/dt |
Critical rate of rise of on-state current |
|
Tj = 125°C |
50 |
A/µs |
||
IG = 100 mA , dIG/dt = 0.1 A/µs |
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IGM |
Peak gate current |
tp = 20 µs |
Tj = 125°C |
4 |
A |
||
PG(AV) |
Average gate power dissipation |
|
Tj = 125°C |
1 |
W |
||
PGM |
Maximum gate power |
tp = 20 µs |
Tj = 125°C |
10 |
W |
||
VDRM |
Repetitive peak off-state voltage |
|
TYN606 |
Tj = 125°C |
|
600 |
V |
VRRM |
|
TYN1006 |
|
1000 |
|||
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Tstg |
Storage junction temperature range |
|
|
|
- 40 to + 150 |
°C |
|
Tj |
Operating junction temperature range |
|
|
|
- 40 to + 125 |
||
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TL |
Maximum lead temperature for soldering during 10s at 2mm from case |
260 |
°C |
February 2006 |
REV. 2 |
1/6 |
TYN606 / TYN1006
Tables 4: Electrical Characteristics (Tj = 25°C, unless otherwise specified)
Symbol |
|
|
|
|
Test Conditions |
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|
|
Value |
|
Unit |
|||
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IGT |
|
VD = 12 V (D.C.) |
RL = 33 Ω |
|
|
|
MAX. |
15 |
|
mA |
||||
VGT |
|
|
|
|
MAX. |
1.5 |
|
V |
||||||
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|
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VGD |
|
VD = VDRM |
RL = 3.3 kΩ |
|
|
Tj = 110°C |
MIN. |
0.2 |
|
V |
||||
tgt |
|
VD = VDRM |
IG = 40 mA dIG/dt = 0.5 A/µs |
|
TYP. |
2 |
|
|
µs |
|||||
IH |
|
IT = 100 mA |
Gate open |
|
|
|
MAX. |
30 |
|
mA |
||||
IL |
|
IG = 1.2 x IGT |
|
|
|
|
TYP. |
50 |
|
mA |
||||
dV/dt |
|
Linear slope up to: |
|
|
|
Tj = 110°C |
MIN. |
200 |
|
V/µs |
||||
|
VD = 67 % VDRM Gate open |
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VTM |
|
ITM = 12 A |
tp = 380 µs |
|
|
|
MAX. |
1.6 |
|
V |
||||
I |
|
|
|
|
|
|
|
Tj = 25°C |
|
|
10 |
|
µA |
|
DRM |
|
VDRM = VRRM |
|
|
|
|
MAX. |
|
|
|
|
|
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IRRM |
|
|
|
|
Tj = 110°C |
|
2 |
|
|
mA |
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||||
tq |
|
VD = 67 % VDRM |
ITM = 12 A |
VR = 25 V |
Tj = 110°C |
TYP. |
70 |
|
µs |
|||||
|
|
dITM/dt = 30 A/µs |
dVD/dt = 50 V/µs |
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Table 5: Thermal Resistance |
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Symbol |
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Parameter |
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Value |
Unit |
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Rth(j-c) |
|
Junction to case (D.C.) |
|
|
|
|
|
|
2.5 |
|
°C/W |
|||
Rth(j-a) |
|
Junction to ambient |
|
|
|
|
|
|
60 |
|
°C/W |
Figure 1: Maximum average power dissipation versus average on-state current
P(W) |
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7 |
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6 |
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DC |
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α = 180° |
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α = 120° |
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5 |
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α = 90° |
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α = 60° |
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4 |
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3 |
α = 30° |
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2 |
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360° |
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1 |
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0 |
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IT(AV)(A) |
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α |
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0.0 |
0.5 |
1.0 |
1.5 |
2.0 |
2.5 |
3.0 |
3.5 |
4.0 |
4.5 |
5.0 |
Figure 2: Correlation between maximum average power dissipation and maximum allowable temperature (Tamb and Tlead)
P(W) |
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|
|
|
|
Tlead(°C) |
|
7 |
|
|
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|
|
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|
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α = 180° |
|
Rth = 15°C/W |
|
Rth = 10°C/W |
Rth = 5°C/W |
Rth = 0°C/W |
|
6 |
|
|
|
|
|
|
110 |
5 |
|
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4 |
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115 |
3 |
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2 |
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120 |
1 |
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0 |
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Tamb(°C) |
|
|
125 |
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0 |
20 |
40 |
60 |
80 |
100 |
120 |
140 |
2/6