ST TPDV640RG, TPDV840RG, TPDV1240RG User Manual

TPDVxx40

40 A high voltage Triacs

Features

On-state current (IT(RMS)): 40 A

Max. blocking voltage (VDRM/VRRM): 1200 V

Gate current (IGT): 200 mA

Commutation @ 10 V/µs: up to 142 A/ms

Noise immunity: 500 V/µs

insulated package:

– 2,500 V rms (UL recognized: E81734).

Description

The TPDVxx40 series use a high performance alternistor technology.

Featuring very high commutation levels and high surge current capability, this family is well adapted to power control on inductive load (motor, transformer...)

A2

G

A1

A1

A2

G

TOP3 insulated

Table 1.

Device summary

 

 

 

 

Parameter

 

TPDV640RG

TPDV840RG

TPDV1240RG

 

 

 

 

 

Blocking voltage VDRM/VRRM

 

600 V

800 V

1200 V

On-state current IT(RMS)

 

 

40 A

 

Gate current IGT

 

 

200 mA

 

March 2011

Doc ID 18270 Rev 1

1/7

www.st.com

Characteristics

 

 

 

 

 

 

 

 

TPDVxx40

 

 

 

 

 

 

 

 

 

 

 

 

 

 

1

 

 

Characteristics

 

 

 

 

 

 

 

 

 

Table 2.

 

Absolute ratings (limiting values)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Symbol

 

 

 

Parameter

 

 

 

 

Value

Unit

 

 

 

 

 

 

 

 

 

 

 

 

IT(RMS)

 

 

On-state rms current (180° conduction angle)

Tc = 75 °C

 

 

40

A

 

 

 

 

Non repetitive surge peak on-state

tp = 2.5 ms

 

 

 

 

590

 

 

ITSM

 

 

tp = 8.3 ms

Tj = 25 °C

 

 

370

A

 

 

 

current

 

 

 

 

 

 

 

 

 

tp = 10 ms

 

 

 

 

350

 

 

I2t

 

 

I2t value for fusing

tp = 10 ms

Tj = 25 °C

 

 

610

A2S

 

dI/dt

 

 

Critical rate of rise of on-state current

Repetitive F = 50 Hz

 

 

20

A/µs

 

 

 

 

 

 

 

 

 

 

 

 

 

 

IG = 500 mA , dIG/dt = 1 A/µs

Non repetitive

 

 

 

 

100

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

TPDV640

 

 

 

 

600

 

 

VDRM

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Repetitive peak off-state voltage

TPDV840

Tj = 125 °C

 

 

800

V

 

VRRM

 

 

 

 

 

 

 

 

 

TPDV1240

 

 

 

 

1200

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Tstg

 

 

Storage junction temperature range

 

 

 

 

 

- 40 to + 150

°C

 

Tj

 

 

Operating junction temperature range

 

 

 

 

 

- 40 to + 125

 

 

TL

 

 

Maximum lead temperature for soldering during 10s at 2mm from case

 

 

260

°C

VINS(RMS)(1)

 

Insulation rms voltage

 

 

 

 

 

 

2500

V

1. A1, A2, gate terminals to case for 1 minute

 

 

 

 

 

 

 

 

 

Table 3.

 

Electrical Characteristics (Tj = 25 °C, unless otherwise specified)

 

 

 

Symbol

 

 

 

Test conditions

 

 

 

Quadrant

 

 

 

Value

Unit

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

IGT

VD = 12 V DC, RL = 33 Ω

 

 

 

I - II - III

MAX.

 

200

mA

VGT

 

 

 

MAX.

 

1.5

V

 

 

 

 

 

 

 

 

 

VGD

VD = VDRM

RL = 3.3 kΩ

 

Tj = 125 °C

 

I - II - III

MIN.

 

0.2

V

 

tgt

VD = VDRM IG = 500 mA dIG/dt = 3 A/µs

 

 

 

I - II - III

TYP.

 

2.5

µs

I

(1)

I

= 500 mA

Gate open

 

 

 

 

MAX.

 

50

mA

 

H

T

 

 

 

 

 

 

 

 

 

 

 

 

 

IL

IG = 1.2 x IGT

 

 

 

I - III

TYP.

 

100

mA

 

 

 

 

 

 

 

 

 

 

 

II

 

200

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

dV/dt

Linear slope up to:

 

Tj = 125 °C

 

 

MIN.

 

500

V/µs

VD = 67 % VDRM Gate open

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

(1)

ITM = 35 A

tp = 380 µs

 

 

 

 

MAX.

 

1.8

V

VTM

 

 

 

 

 

I

 

 

 

 

 

 

Tj = 25 °C

 

 

 

 

 

20

µA

DRM

VDRM = VRRM

 

 

 

 

MAX.

 

 

 

IRRM

 

Tj = 125 °C

 

 

 

8

mA

 

 

 

 

 

 

 

 

 

 

(dI/dt)c (1)

(dV/dt)c = 200 V/µs

 

Tj = 125 °C

 

 

MIN.

 

35

A/ms

(dV/dt)c = 10 V/µs

 

 

 

 

142

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

1. For either polarity of electrode A2 voltage with reference to electrode A1.

2/7

Doc ID 18270 Rev 1

ST TPDV640RG, TPDV840RG, TPDV1240RG User Manual

TPDVxx40

 

 

Characteristics

 

 

 

 

 

Table 4.

Gate characteristics (maximum values)

 

 

 

 

 

 

 

 

Symbol

Parameter

 

Value

Unit

 

 

 

 

 

PG(AV)

Average gate power dissipation

 

1

W

PGM

Peak gate power dissipation

tp = 20 µs

40

W

IGM

Peak gate current

tp = 20 µs

8

A

VGM

Peak positive gate voltage

tp = 20 µs

16

V

Table 5.

Thermal resistance

 

 

 

 

 

 

 

 

Symbol

Parameter

 

Value

Unit

 

 

 

 

 

Rth(j-a)

Junction to ambient

 

50

°C/W

Rth(j-c) DC

Junction to case for DC

 

1.2

°C/W

Rth(j-c) AC

Junction to case for 360 °Conduction angle (F = 50 Hz)

 

0.9

°C/W

Figure 1.

Max. rms power dissipation versus Figure 2.

Max. rms power dissipation and

 

on-state rms current (F = 50 Hz).

max. allowable temperatures

 

 

(curves limited by (dI/dt)c)

(Tamb and Tcase) for various Rth

P(W)

 

 

 

 

 

 

 

 

P(W)

 

 

 

 

 

 

Tcase(°C)

60

 

 

 

 

 

 

 

 

60

 

 

 

 

 

 

 

 

 

 

 

 

 

α = 180°

 

 

 

 

 

Rth = 0.25°C/W

 

 

50

 

 

 

 

 

 

 

 

50

 

 

 

 

 

 

75

 

 

 

 

 

 

 

 

 

 

Rth = 0.75°C/W

 

 

 

Rth = 0°C/W

 

 

 

 

 

 

 

α = 120°

 

 

 

 

 

 

 

 

 

 

40

 

 

 

 

 

 

 

40

Rth = 0.5°C/W

 

 

 

 

85

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

α = 90°

 

 

 

 

 

 

 

 

 

 

 

95

30

 

 

 

 

 

 

 

 

30

 

 

 

 

 

 

 

 

 

α = 60°

 

 

 

 

 

 

 

 

 

 

 

 

 

20

 

 

 

 

 

 

 

 

20

 

 

 

 

 

 

105

 

 

α = 30°

 

 

 

 

180°

 

 

 

 

 

 

 

 

 

10

 

 

 

 

 

 

α

 

10

 

 

 

 

 

 

115

 

 

 

 

 

 

α

 

 

 

 

Tamb(°C)

 

 

 

 

 

 

 

IT(RMS)(A)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

125

0

 

 

 

 

 

 

 

 

0

 

 

 

 

 

 

0

5

10

15

20

25

30

35

40

0

20

40

60

80

100

120

140

Figure 3. On-state rms current versus case Figure 4.

Relative variation of thermal

temperature

impedance versus pulse duration

IT(RMS)(A)

 

 

 

 

 

K=[Zth(j-c)/Rth(j-c)]

 

 

 

 

50

 

 

 

 

 

1.00

 

 

 

 

 

 

 

 

 

α = 180°

 

 

 

Zth(j-c)

 

 

 

 

 

40

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

0.10

 

 

 

 

 

 

30

 

 

 

 

 

 

 

 

 

 

 

 

20

 

 

 

 

 

 

 

 

Zth(j-a)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

0.01

 

 

 

 

 

 

10

 

 

 

 

 

 

 

 

 

 

 

 

0

 

 

Tcase(°C)

 

 

0.0

 

 

tp(s)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

0

25

50

75

100

125

1E-3

1E-2

1E-1

1E+0

1E+1

1E+2

1E+3

Doc ID 18270 Rev 1

3/7

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