Table 1. Main features
Symbol Value Unit
TN1515-600B
15 A standard SCR
A
I
T(RMS)
V
DRM/VRRM
I
GT (Q1)
15 A
600 V
15 mA
G
K
Description
Specifically designed to control motor in hand
tools application, the TN15 SCR is available in
DPAK package, providing a high robustness
against stalled rotor operating conditions in a
small SMD package
Table 2. Order code
Part number Marking
TN1515-600B-TR TN15 15600
TN1515-600B TN15 15600
Table 3. Absolute maximum ratings
Symbol Parameter Value Unit
I
T(RMS)
I
T(AV)
I
TSM
²
tI
I
dI/dt
I
GM
P
G(AV)
T
stg
T
V
RGM
RMS on-state current (180° conduction angle) Tc = 109° C 15 A
Average on-state current (180° conduction angle) Tc = 109° C 9.5 A
Non repetitive surge peak on-state current
²
t Value for fusing tp = 10 ms
Critical rate of rise of on-state current
I
= 2 x IGT , tr ≤ 100 ns
G
Peak gate current tp = 20 µs Tj = 125° C 4 A
Average gate power dissipation Tj = 125° C 1 W
Storage junction temperature range
Operating junction temperature range
j
Maximum peak reverse gate voltage 5 V
= 8.3 ms
t
p
= 10 ms 150
t
p
F = 120 Hz T
A
G
A
K
DPAK
TN1515
165
T
= 25° C
j
= 25° C
T
j
= 125° C 50 A/µs
j
113 A
- 40 to + 150
- 40 to + 125
A
°C
²
s
July 2007 Rev 2 1/7
www.st.com
7
Characteristics TN1515-600B
1 Characteristics
Table 4. Electrical characteristics (Tj = 25° C, unless otherwise specified)
Symbol Test conditions Values Unit
MIN. 2
I
GT
V
GT
V
GD
I
I
dV/dt V
V
TM
V
TO
R
I
DRM
I
RRM
Table 5. Thermal resistance
V
= 12 V, RL = 33 Ω Tj = 25° C
out
V
= 12 V, RL = 33 Ω
out
V
= V
out
DRM, RL
IT = 500 mA MAX. 40 mA
H
IG = 1.2 I
L
= 67% V
D
= 33 Ω Tj = 125° C MIN. 0.2 V
GT
gate open Tj = 125° C MIN. 200 V/µs
DRM,
MAX. 15
MAX. 1.3 V
MAX. 60 mA
ITM = 30 A, tp = 380 µs Tj = 25° C MAX. 1.6 V
Threshold voltage Tj = 125° C MAX. 0.85 V
Dynamic resistance Tj = 125° C MAX. 25 mΩ
D
Tj = 25° C
V
DRM
= V
RRM
Tj = 125° C 2 mA
MAX.
5µA
Symbol Parameter Value Unit
mA
R
R
th(j-c)
th(j-a)
Junction to case (DC) 1.2 °C/W
Junction to ambient S = 0.5 cm
Figure 1. Maximum power dissipation
versus average on-state current
(
)
P
W
14
α=180°
12
10
8
6
4
2
0
012345678910
I (A)
T(AV)
360°
2
70 °C/W
Figure 2. Average and DC on-state current
versus case temperature
I (A)
T(AV)
16
14
12
10
8
6
4
2
0
0 25 50 75 100 125
D.C.
α=180°
TC(°C)
2/7
TN1515-600B Characteristics
Figure 3. Average and DC on-state
current versus ambient
temperature, PCB FR4, copper
thickness 35 µm
I (A)
T(AV)
2.5
D.C.
α=180°
T
amb
(°C)
2.0
1.5
1.0
0.5
0.0
0 25 50 75 100 125
SCU=0.5cm²
Figure 5. Relative variation of gate trigger
current, holding current and
latching current versus junction
temperature (typical values)
IGT,IH,IL[Tj]/IGT,IH,IL[Tj=25°C]
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
I
GT
IH& I
L
Tj(°C)
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100110 120130
Figure 4. Thermal impedance, junction to
ambient, versus pulse duration,
PCB FR4, copper thickness 35 µm
)
(
Z
°C/W
th(j-a)
100
SCU= 0.5 cm²
10
tP(s)
1
1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Figure 6. Surge peak on-state current versus
number of cycles
I
(A)
TSM
180
160
tp=10ms
One cycle
Repetitive
T
=109°C
C
Non repetitive
initial=25°C
T
j
Number of cycles
140
120
100
80
60
40
20
0
1 10 100 1000
Figure 7. Non-repetitive surge peak
on-state current for a sinusoidal
pulse with width t
corresponding value of I
I
(A), I²t (A²s)
TSM
1.E+04
dI/dt limitation
1.E+03
1.E+02
0.01 0.10 1.00 10.00
tP(ms)
< 10 ms and
p
I
TSM
2
Tjinitial=25°C
I²t
Figure 8. On-state characteristics (maximum
values)
t
(
)
I
A
TM
100.0
10.0
Tj=125°C
1.0
0.1
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
3/7
Tj=25°C
VTM(V)
Tjmax. :
V
to
R
D
= 0.85 V
= 25 mΩ
Ordering information scheme TN1515-600B
Figure 9. Junction to ambient thermal
resistance versus copper
surface under tab, PCB FR4,
copper thickness 35µm
R
(°C/W)
th(j-a)
100
80
60
40
20
0
0 5 10 15 20 25 30 35 40
SCU(cm²)
2 Ordering information scheme
Figure 10. Ordering information scheme
SCR series
RMS Current
15 = 15 A
Sensitivity
15 = 15 mA
Voltage
600 = 600 V
Package
B = DPAK
Packing mode
Blank = Tube
-TR = Tape and reel
TN 15 15 - 600 B (-TR)
4/7
TN1515-600B Package information
3 Package information
● Epoxy meets UL94, V0
Table 6. DPAK dimensions
DIMENSIONS
E
B2
L2
H
L4
B
G
0.60 MIN.
A1
A2
V2
A
C2
D
R
R
C
Figure 11. DPAK footprint (dimensions in mm)
REF.
Millimeters Inches
Min. Max Min. Max.
A 2.20 2.40 0.086 0.094
A1 0.90 1.10 0.035 0.043
A2 0.03 0.23 0.001 0.009
B 0.64 0.90 0.025 0.035
B2 5.20 5.40 0.204 0.212
C 0.45 0.60 0.017 0.023
C2 0.48 0.60 0.018 0.023
D 6.00 6.20 0.236 0.244
E 6.40 6.60 0.251 0.259
G 4.40 4.60 0.173 0.181
H 9.35 10.10 0.368 0.397
L2 0.80 typ. 0.031 typ.
L4 0.60 1.00 0.023 0.039
V2 0° 8° 0° 8°
6.7 3 3
6.7
1.6
2.3
2.3
1.6
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
5/7
Ordering information TN1515-600B
4 Ordering information
Table 7. Ordering information
Part number Marking Package Weight Base qty Delivery mode
TN1515-600B-TR TN15 15600 DPAK 0.3 g 2500 Tape and reel
TN1515-600B TN15 15600 DPAK 0.3 g 75 Tube
5 Revision history
Table 8. Revision history
Date Revision Changes
13-Mar-2006 1 Initial release.
11-Jul-2007 2 Added pin out labels to package illustration on cover page.
6/7
TN1515-600B
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