Datasheet TN100 Datasheet (ST)

Features

VFQFPN2-48

■ Single-chip solution for ISM 2.45 GHz RF

transceiver

■ Built-in ranging capability for link distance

estimation

■ Modulation technique: chirp spread spectrum

(CSS)

■ FDMA support: 7 channels, 3 non-overlapping

■ Data rates: 2 and 1 Mbps; 500, 250 and 125

kbps

■ Adjustable output power from -33 dBm to

0dBm

■ Receiver sensitivity: -97 dBm @ 250 kbps,

FEC, and BER=10-3

■ In-band carrier-to-interference C/I = 0 to 3 dB

@ 250 kbps & C=-80 dBm

■ Supports external power amplifier to increase

output power

■ High precision ranging: 2 m indoors and 1 m

outdoors

■ Supply voltage range from 2.3 V to 2.7 V

■ Current consumption: 27 mA (RX), 30 mA (TX)

@ 0 dBm

■ Standby current with active RTC: 2 µA

■ RSSI sensitivity: -95 dBm

■ 32.768 kHz clock available for external MCU

■ Integrated fast SPI interface (27 Mbps)

■ Integrated MAC controller with FEC, CRC

checking

■ CSMA/CA, FDMA, and TDMA modes

■ Automatic retransmission and

acknowledgement

■ Automatic address matching

■ Industrial temperature range from -40°C to

+85°C

■ VFQFPN2-48 ECOPACK® package

TN100

High performance CSS transceiver

enabling location awareness

Preliminary Data

Description

The TN100 transceiver is a highly integrated
mixed signal chip that uses the wireless
communication technology CSS (chirp spread
spectrum) developed by Nanotron Technologies.

With its unique ranging capability, TN100 can
measure the link distance between two nodes.
Thus, TN100 supports location awareness
applications including location based services
(LBS) and asset tracking (2D/3D RTLS). Ranging
is performed during regular data communication
and does not require additional infrastructure,
power, and/or bandwidth.

For an even better ranging accuracy, a high
precision mode is provided. SDS-TWR algorithm
(symmetrical double-sided two-way ranging)
allows superior accuracy even with the use of low
cost crystals for the oscillators.

September 2008 Rev 1 1/235

This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to
change without notice.

www.st.com

1

Contents TN100

Contents

1 Summary description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

2 TN100 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

3 Key features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

3.1 Built-in ranging capability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

3.2 Channelization using FDMA for improved coexistence . . . . . . . . . . . . . . 15

3.3 Incorporated digital dispersive delay-line (DDDL) . . . . . . . . . . . . . . . . . . 15

3.4 Selectable symbol durations and symbol rates . . . . . . . . . . . . . . . . . . . . 15

4 Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

4.1 Analog part - TX and RX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

4.2 Digital part - programming interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

4.2.1 Digital part – ON Section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

4.2.2 Digital part – PWD section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

4.3 Signal flow . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

4.4 Commonly used set of register default values . . . . . . . . . . . . . . . . . . . . . 17

4.5 Programmable pull-resistors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

5 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

5.1 Input and/or output pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

5.2 Configuring the digital I/O pins – D0 to D3 (pins 19 to 22) . . . . . . . . . . . . 21

5.3 Configuring the IRQ Pin – µCIRQ (pin 27) . . . . . . . . . . . . . . . . . . . . . . . . 22

5.4 Power-on reset – /POnReset (pin 30) . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

6 Memory map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

6.1 Selecting a memory address . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

6.2 128-byte programmable register block . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

6.2.1 Accessing a register address location . . . . . . . . . . . . . . . . . . . . . . . . . . 25

6.2.2 Setting a shadow variable for the RAM access register . . . . . . . . . . . . . 26

6.3 Correlator RAM access . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

6.4 Chirp sequencer RAM access . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

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7 Clocking structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

7.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

7.2 32.786 kHz real-time clock (RTC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

7.2.1 Updating and reading the RTC through software . . . . . . . . . . . . . . . . . 28

7.2.2 Manually or automatically updating the RTC using TimeB packets . . . . 29

7.2.3 Using the RTC as wake-up event . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

7.3 SPI clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

7.4 32-MHz baseband clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

7.4.1 Stopping / enabling the 32-MHz baseband clock . . . . . . . . . . . . . . . 32

7.5 CSQ (Chirp Sequencer) clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

7.5.1 Stopping / enabling the Chirp Sequencer clock (CSQ) . . . . . . . . . . . . . 33

7.5.2 Using the default matrix for transmission . . . . . . . . . . . . . . . . . . . . . . . . 33

8 Power management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

8.1 Power management states . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

8.2 Power management module – ON and PWD sections . . . . . . . . . . . . . . . 34

8.3 Power management state model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

8.4 Power management fields . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

8.5 PowerDownModeFull state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

8.6 PowerDownModePad state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38

8.7 PowerUp state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

8.8 Standby state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

8.9 Ready state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

8.10 Powering off the chip . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

9 Programming interface (SPI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

9.1 SPI controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

9.1.1 SPI controller and power management . . . . . . . . . . . . . . . . . . . . . . . . . 42

9.1.2 SPI controller and registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

9.2 SPI bit ordering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

9.3 SPI signals: SpiClk, SpiSsn, SpiTxD, SpiRxD . . . . . . . . . . . . . . . . . . . . . 43

9.4 SPI TxD output driver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44

9.5 SPI bus timing values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

9.6 SPI transfer rate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

9.6.1 Maximum transfer rate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

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Contents TN100

9.6.2 Bytes per transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

9.7 SPI interface connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

9.7.1 Four-wire configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

9.7.2 Three-wire configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46

9.7.3 Multiple slave configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46

9.8 Read timing of the SPI bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46

9.9 Write timing of the SPI bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

9.10 SPI address format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48

9.10.1 Byte 1: instruction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49

9.10.2 Byte 2: address . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49

9.10.3 N Bytes: data payload . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49

9.11 SPI read operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

9.12 SPI write operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

9.12.1 Write access example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51

10 Chirp sequencer (CSQ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53

10.1 Purpose of the Chirp sequencer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53

10.2 Formatting the I and Q values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54

10.3 CSQ writing example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55

11 Packet and MACFrames . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56

11.1 General packet format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56

11.2 General packet types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56

11.3 Preamble field . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57

11.4 SyncWord field . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57

11.5 MACFrame field . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57

11.5.1 MACFrame of a data packet . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60

11.5.2 MACFrame of an acknowledgement (Ack) Packet . . . . . . . . . . . . . . . . 61

11.5.3 MACFrame of a broadcast (Brdcast) packet . . . . . . . . . . . . . . . . . . . . . 61

11.5.4 Time beacon packet (TimeB) MACFrame . . . . . . . . . . . . . . . . . . . . . . . 62

11.5.5 Request to send (Req2S) packet MACFrame . . . . . . . . . . . . . . . . . . . . 63

11.5.6 Clear to send (Clr2S) packet MACFrame . . . . . . . . . . . . . . . . . . . . . . . 63

11.6 Tail field . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64

12 Frame control scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65

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12.1 Logical channels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65

12.1.1 Link control channel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65

12.1.2 User data channel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66

12.2 Link control management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66

13 MACFrame configuration (Auto/Transparent) . . . . . . . . . . . . . . . . . . . . 67

13.1 Field for setting MACFrame auto and transparent mode . . . . . . . . . . . . . 67

13.2 MACFrame auto mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67

13.2.1 Setting MACFrame auto mode (default) . . . . . . . . . . . . . . . . . . . . . . . . 68

13.3 MACFrame transparent mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68

13.3.1 Setting MACFrame transparent mode . . . . . . . . . . . . . . . . . . . . . . . . . . 68

14 Baseband RAM configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69

14.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69

14.1.1 Configurable spaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69

14.2 Memory usage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70

14.3 Auto/Duplex mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70

14.3.1 Setting Auto/Duplex mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71

14.3.2 Start addresses of the RX/TX data buffers . . . . . . . . . . . . . . . . . . . . . . 71

14.4 Auto/Simplex mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71

14.4.1 Setting Auto/Simplex mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72

14.4.2 Start addresses of the RX/TX data buffer . . . . . . . . . . . . . . . . . . . . . . . 72

14.5 Transparent/Duplex mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72

14.5.1 Setting Transparent/Duplex mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73

14.5.2 Start addresses of the RX/TX data buffers . . . . . . . . . . . . . . . . . . . . . . 73

14.6 Transparent/Simplex mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74

14.6.1 Setting Transparent/Simplex mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74

14.6.2 Start addresses of the RX/TX data buffer . . . . . . . . . . . . . . . . . . . . . . . 75

15 Buffer configuration (simplex/duplex) . . . . . . . . . . . . . . . . . . . . . . . . . 76

15.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76

15.2 Field for setting duplex and simplex mode . . . . . . . . . . . . . . . . . . . . . . . . 76

15.3 Duplex mode (default) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76

15.3.1 Configuring the baseband RAM for Duplex mode . . . . . . . . . . . . . . . . . 76

15.4 Simplex mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77

15.4.1 Configuring the baseband RAM for Simplex mode . . . . . . . . . . . . . . . . 77

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16 Buffer swapping between TX and RX buffers . . . . . . . . . . . . . . . . . . . . 78

16.1 Enabling buffer swapping (duplex mode only) . . . . . . . . . . . . . . . . . . . . . 78

16.2 Buffer swapping in auto / duplex mode . . . . . . . . . . . . . . . . . . . . . . . . . . 79

16.3 Buffer swapping in transparent / duplex mode . . . . . . . . . . . . . . . . . . . . . 79

16.4 Buffer swapping and frame forwarding . . . . . . . . . . . . . . . . . . . . . . . . . . . 79

16.5 Buffer swapping and short MACFrames . . . . . . . . . . . . . . . . . . . . . . . . . . 80

17 Buffer control timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81

17.1 Transmit buffer control timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81

17.2 Receive buffer control timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82

18 Buffer access synchronization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83

18.1 Flags and commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83

18.2 Receive and transmit flags . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83

18.3 Receive and transmit commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84

19 Bit processing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86

19.1 Bit stream processes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86

19.2 Cyclic redundancy check (CRC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86

19.2.1 CRC1 field . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86

19.2.2 CRC2 field . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87

19.2.3 CRC types 1, 2, and 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87

19.3 Bit scrambling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87

19.4 Forward error correction (FEC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88

19.5 Encryption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88

20 Chirp modulation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89

20.1 Chirp spread spectrum (CSS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89

20.2 Secondary modulation systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89

20.2.1 Upchirp/downchirp modulation system . . . . . . . . . . . . . . . . . . . . . . . . . 89

20.2.2 Upchirp/off modulation system . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90

20.2.3 Downchirp/off modulation system . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90

20.2.4 Physical channels and the on-off keying modulation systems . . . . . . . . 91

21 Local oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92

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21.1 Purpose of the local oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92

21.2 Calibrating the local oscillator frequency . . . . . . . . . . . . . . . . . . . . . . . . . 92

21.2.1 Fields for updating the local oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . 93

22 RF transmitter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94

22.1 Adjusting the baseband filter frequency . . . . . . . . . . . . . . . . . . . . . . . . . . 94

22.2 Setting the power amplifier bias current . . . . . . . . . . . . . . . . . . . . . . . . . . 95

22.3 Adjusting the transmitter output power . . . . . . . . . . . . . . . . . . . . . . . . . . . 95

22.3.1 Output power control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95

22.3.2 Fields for adjusting the RF Transmitter . . . . . . . . . . . . . . . . . . . . . . . . . 97

23 Media access control methods . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98

23.1 Symbol definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98

23.2 Direct access (DA) mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98

23.3 Random access (CSMA/CA) mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98

23.3.1 General description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98

23.3.2 Carrier sensing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100

23.3.3 Backoff time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101

23.3.4 Retransmissions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101

23.3.5 Three-way handshake . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102

23.3.6 Three-way handshake and ARQ mode . . . . . . . . . . . . . . . . . . . . . . . . 103

23.3.7 Adjusting transmit power levels for three-way handshakes . . . . . . . . . 105

23.3.8 Prioritized access . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105

23.4 Time slotted access (TDMA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106

23.4.1 General description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106

23.4.2 Time slots . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106

23.4.3 Logical channels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107

23.4.4 Real-time clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108

23.5 FDMA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109

23.5.1 Field for enabling FDMA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109

24 Data transmission control methods . . . . . . . . . . . . . . . . . . . . . . . . . . 110

24.1 Symbol definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110

24.2 Error correction (ARQ scheme) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110

24.3 Retransmit filtering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112

24.4 Fragmentation control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113

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Contents TN100

24.5 Unconfirmed data transmission . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114

25 Address formats . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115

25.1 General address format / addressing . . . . . . . . . . . . . . . . . . . . . . . . . . . 115

25.2 Addressing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116

26 Chip registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118

26.1 Chip register mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118

26.2 Description of chip registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125

26.2.1 0x00 – SPI bit order and IRQ pad configuration . . . . . . . . . . . . . . . . . 125

26.2.2 Configuring SPI transfers when the bit order is unknown . . . . . . . . . . 126

26.2.3 0x01 – Digital controller version number and wake-up time byte . . . . . 127

26.2.4 0x02 – Digital controller revision number and wake-up time . . . . . . . . 127

26.2.5 0x03 – Battery management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128

26.2.6 0x04 – Digital I/O controllers and digital I/O alarm status . . . . . . . . . . 129

26.2.7 0x05 – Write enable digital I/O port . . . . . . . . . . . . . . . . . . . . . . . . . . . 131

26.2.8 0x06 – Power management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132

26.2.9 0x07 – Reset digital baseband/baseband clock and power down . . . . 133

26.2.10 0x08 – Power on/off baseband crystal and clock . . . . . . . . . . . . . . . . . 134

26.2.11 0x09 – Setting SPI pads as pull-up or pull-down . . . . . . . . . . . . . . . . . 135

26.2.12 0x0A – Setting additional pads as pull-up or pull-down . . . . . . . . . . . . 136

26.2.13 0x0B – Writing pull-up/pull-down settings to pads . . . . . . . . . . . . . . . . 138

26.2.14 0x0E – Baseband memory access . . . . . . . . . . . . . . . . . . . . . . . . . . . 138

26.2.15 0x0F – LO, BBTimer, RX/TX IRQ event status and enabling . . . . . . . . 139

26.2.16 0x10 – TX raw interrupt status and reset [Index] . . . . . . . . . . . . . . . . . 141

26.2.17 0x11 – RX Raw Interrupt Status and Reset [Index] . . . . . . . . . . . . . . . 142

26.2.18 0x12 – LO and BBTimer raw interrupt status and reset [Index] . . . . . . 143

26.2.19 0x13 – Enable transmitter interrupts [Index] . . . . . . . . . . . . . . . . . . . . 144

26.2.20 0x14 – Receiver interrupt enable [Index] . . . . . . . . . . . . . . . . . . . . . . . 145

26.2.21 0x15 – Local oscillator interrupt enable [index] . . . . . . . . . . . . . . . . . . 147

26.2.22 0x16 to 0x18 – RF local oscillator RX capacitors . . . . . . . . . . . . . . . . 147

26.2.23 0x19 to 0x1B – RF local oscillator TX capacitors . . . . . . . . . . . . . . . . 148

26.2.24 RF local oscillator controls . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 148

26.2.25 0x1D to 0x1E – RF local oscillator target value . . . . . . . . . . . . . . . . . . 149

26.2.26 0x1F – AGC threshold 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150

26.2.27 0x20 – AGC threshold 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150

26.2.28 0x21 – AGC hold frame/bit synchronization controls . . . . . . . . . . . . . . 151

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26.2.29 0x22 – AGC change gain length . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 151

26.2.30 0x23 to 0x24 – AGC integration time . . . . . . . . . . . . . . . . . . . . . . . . . . 152

26.2.31 0x25 – AGC value . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 152

26.2.32 0x26 – RF AGC controls . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 153

26.2.33 0x27 – RC oscillator tuning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 153

26.2.34 0x28 to 0x29 – Baseband timer start value . . . . . . . . . . . . . . . . . . . . . 154

26.2.35 0x2A to 0x2B – ToaOffset for received Ack packet . . . . . . . . . . . . . . . 155

26.2.36 0x2C to 0x2D – Round trip time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 155

26.2.37 0x2E – Phase offset for RX data and Ack packets . . . . . . . . . . . . . . . 155

26.2.38 0x2F to 0x30 – ToaOffset for received data packet (read only) . . . . . . 156

26.2.39 0x2A to 0x31 – Transceiver SyncWord (write only) . . . . . . . . . . . . . . . 156

26.2.40 0x31 – Receiver mode controls (read only) . . . . . . . . . . . . . . . . . . . . . 157

26.2.41 0x32 – Receive correlator error controls . . . . . . . . . . . . . . . . . . . . . . . 158

26.2.42 0x33 to 0x34 – Transmit time slot start (write only) . . . . . . . . . . . . . . . 158

26.2.43 0x35 to 0x36 – Transmit time slot end (write only) . . . . . . . . . . . . . . . . 159

26.2.44 0x33 – Receiver encryption (read only) . . . . . . . . . . . . . . . . . . . . . . . . 159

26.2.45 0x34 to 0x35 – Receive FEC single bit error count (read only) . . . . . . 160

26.2.46 0x37 – Transmitter and receiver time slot control (TDMA) . . . . . . . . . . 161

26.2.47 0x38 to 0x39 – RX packet slot (read only) . . . . . . . . . . . . . . . . . . . . . . 161

26.2.48 0x38 to 0x39 – RX time slot start and packet slot (write only) . . . . . . . 162

26.2.49 0x3A to 0x3B – RX time slot end . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 162

26.2.50 0x3C – ARQ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 163

26.2.51 0x3D – RF chirp generator controls . . . . . . . . . . . . . . . . . . . . . . . . . . . 163

26.2.52 0x3F – Correlator controls . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 164

26.2.53 0x40 – Frame synchronization and bit synchronization . . . . . . . . . . . . 165

26.2.54 0x41 – Bit synchronization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 166

26.2.55 0x42 – Local oscillator, chirp sequencer and external PA controls . . . 166

26.2.56 0x43 – RF Rx low noise amplifier and TX power amplifier bias . . . . . . 167

26.2.57 0x44 – Transmitter output power (Data, TimeB, and BrdCast) . . . . . . 168

26.2.58 0x45 – Transmitter output power (Ack, Req2S, and Clr2S) . . . . . . . . . 168

26.2.59 0x46 – Quantization threshold for I . . . . . . . . . . . . . . . . . . . . . . . . . . . 169

26.2.60 0x47 – Quantization threshold for Q . . . . . . . . . . . . . . . . . . . . . . . . . . 169

26.2.61 0x48 – Symbol duration, symbol rate, and modulation system . . . . . . 169

26.2.62 0x49 – CRC2, CRC2 encryption, FEC, and encryption clock mode . . 170

26.2.63 0x4A – Baseband buffer and MACFrame configuration . . . . . . . . . . . . 172

26.2.64 0x4B to 0x4C – Transceiver chirp matrix . . . . . . . . . . . . . . . . . . . . . . . 173

26.2.65 0x4D – TX underrun, CIFS waiting, and preamble/tail sequences . . . 174

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26.2.66 0x4E – Media access control for transmitter . . . . . . . . . . . . . . . . . . . . 175

26.2.67 0x4F – Back-off seed for back-off time . . . . . . . . . . . . . . . . . . . . . . . . 178

26.2.68 0x50 – Transmission encryption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 178

26.2.69 0x51 – Transmit scrambler . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 179

26.2.70 0x52 to 0x53 – TX data size in transparent mode . . . . . . . . . . . . . . . . 180

26.2.71 0x54 – Packet type for auto mode and TX source address . . . . . . . . . 180

26.2.72 0x55 – Start/stop transmissions and TX buffer fill command . . . . . . . . 181

26.2.73 0x56 – Start/stop receptions and RX buffer fill command . . . . . . . . . . 182

26.2.74 0x57 – Receiver decryption sequence reset . . . . . . . . . . . . . . . . . . . . 182

26.2.75 0x58 to 0x59 – RX data size in transparent mode . . . . . . . . . . . . . . . . 183

26.2.76 0x5A – RX ES and IS address matching, CRC1, CRC2, and ARQ . . . 183

26.2.77 0x5B – RX Data, Brdcast, TimeB, address mode, and ranging pulses 185

26.2.78 0x5C – Delay detection tuning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 187

26.2.79 0x5D – Receive bit detector controls (bit detectors) . . . . . . . . . . . . . . 188

26.2.80 0x5E – Bit detection gate size and adjustment . . . . . . . . . . . . . . . . . . 188

26.2.81 0x5F – Bit synchronization/unsynchronization thresholds . . . . . . . . . . 190

26.2.82 0x60 – Real-time clock TimeB transmission delay adjustment . . . . . . 190

26.2.83 0x61 – Real-time clock TimeB reception delay adjustment . . . . . . . . . 191

26.2.84 0x62 – Real-time clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 191

26.2.85 0x63 – AGC amplitude . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 192

26.2.86 0x64 – Alternative AGC and AGC range offset . . . . . . . . . . . . . . . . . . 193

27 Baseband registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 194

27.1 Baseband register mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 194

27.1.1 Auto/duplex mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 194

27.1.2 Auto/simplex mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 196

27.1.3 Transparent/duplex mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 196

27.1.4 Transparent/simplex mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 197

27.2 Description of baseband registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 197

27.2.1 Auto/duplex [Pg 0] 0x80 to 0x85 – source station address 0 . . . . . . . . 197

27.2.2 Auto/duplex [Pg 0] 0x88 to 0x8D – source station address 1 . . . . . . . 197

27.2.3 Auto/duplex [Pg 0] 0x90 to 0x95 – TX destination address . . . . . . . . . 198

27.2.4 Auto/duplex [Pg 0] 0x98 to 0x99 – TX data length and bits for sw usage .
198

27.2.5 Auto/duplex [Pg 0] 0xA8 to 0xAD – RX destination address . . . . . . . . 199

27.2.6 Auto/duplex [Pg 0] 0xB0 to 0xB5 – RX source address . . . . . . . . . . . . 199

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27.2.7 Auto/duplex [Pg 0] 0xB8 to 0xB9 – RX data length and bits for SW usage
200

27.2.8 Auto/duplex [Pg 0] 0xE0 to 0xE5 – TX Real-time clock buffer . . . . . . . 200

27.2.9 Auto/duplex [Pg 0] 0xE8 to 0xED – RX Real-Time Clock buffer . . . . . 201

27.2.10 Auto/duplex [Pg 0] 0xF0 to 0xFF – RX Real-Time Clock buffer . . . . . . 201

27.2.11 Auto/duplex [Pg 1] 0x100 to 0x17F – register (mirrored) . . . . . . . . . . . 202

27.2.12 Auto/duplex [Pg 1] 0x180 to 0x1BF – encryption key . . . . . . . . . . . . . 202

27.2.13 Auto/duplex [Pg 1] 0x1C0 to 0x1CF – TX encryption clock value . . . . 202

27.2.14 Auto/duplex [Pg 1] 0x1E0 to 0x1EF – RX decryption clock value . . . . 203

27.2.15 Auto/duplex [Pg 2] 0x200 to 0x27F – register (mirrored) . . . . . . . . . . . 203

27.2.16 Auto/duplex [Pg 2] 0x280 to 0x2FF – RX data buffer . . . . . . . . . . . . . . 203

27.2.17 Auto/duplex [Pg 3] 0x300 to 0x37F – register (mirrored) . . . . . . . . . . . 204

27.2.18 Auto/duplex [Pg 3] 0x380 to 0x3FF – TX data buffer . . . . . . . . . . . . . . 204

27.2.19 Auto/simplex [Pg 0] 0x80/0x0FF – same as auto/duplex [Pg 0] . . . . . . 204

27.2.20 Auto/simplex [Pg 1] 0x180/0xEFF – same as auto/duplex [Pg 1] . . . . 205

27.2.21 Auto/simplex [Pg 2/3] 0x280 to 0x3FF – TX/RX data buffer . . . . . . . . 206

27.2.22 Transparent/duplex page [Pg 0/1] 0x080 to 0x1FF – RX data buffer . . 206

27.2.23 Transparent/duplex page [Pg 2/3] 0x280 to 0x3FF – TX data buffer . . 207

27.2.24 Transparent/simplex [Pg 0/1/2/3] 0x080/0x3FF – RX/TX data buffer . . 208

28 Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 209

29 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 210

29.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 210

29.2 Nominal conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 210

29.3 General DC parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 212

29.4 Transmitter (TX) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 213

29.4.1 General parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 213

29.4.2 Programmable RAM for chirp sequencer . . . . . . . . . . . . . . . . . . . . . . . 214

29.4.3 Chirp specification (CSS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 214

29.5 Receiver (RX) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 214

29.5.1 General parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 214

29.5.2 Radio signal strength indicator (RSSI) . . . . . . . . . . . . . . . . . . . . . . . . . 215

29.6 Dynamic performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 215

29.7 Quartz controlled oscillator for reference frequency . . . . . . . . . . . . . . . . 216

29.8 Quartz-controlled oscillator for real-time clock (RTC) . . . . . . . . . . . . . . 216

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Contents TN100

29.9 Local oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 217

29.10 Digital interface to sensor/actor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 218

29.11 Interface to digital controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 218

29.12 Power supply for the external digital microcontroller . . . . . . . . . . . . . . . 218

30 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 219

Appendix A Attributes and constants. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 221

Appendix B Default register settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 224

Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 234

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TN100 Summary description

1 Summary description

The TN100 transceiver IC is designed to build robust, short distance wireless networks
operating in the 2.45 GHz ISM band with extremely low power consumption over a wide
range of operating temperatures.

The TN100 supports 7-frequency channels with 3 non-overlapping channels. This provides
support for multiple physically independent networks and improved coexistence
performance with existing 2.4 GHz wireless technologies. Data rates are selectable between

31.25 kbps and 2 Mbps. Due to the chip's unique chirp pulse, adjustment of the antenna is
not critical. This significantly simplifies the system's installation and maintenance (“pick-and­place”).

The TN100 transceiver includes a sophisticated MAC controller with CSMA/CA and TDMA
support as well as forward error correction (FEC) and 128-bit hardware encryption. It also
provides scrambling, automatic address matching, and packet retransmission, thus
minimizing the requirements for microcontroller and software.

Through its high-speed standard SPI interface, the TN100 can be interfaced with a wide
range of external microcontrollers. It includes a 4-Kbit frame buffer which allows even very
slow microcontrollers to work with the transceiver. This means that several receive and
transmit frames can be stored simultaneously in the buffers. This solution eliminates the
problems of different peak data rates between air and microcontroller interfaces.

In order to meet environmental requirements, ST offers these devices in ECOPACK
packages. ECOPACK

®

packages are lead-free. The category of second Level Interconnect

is marked on the package and on the inner box label, in compliance with JEDEC Standard
JESD97. The maximum ratings related to soldering conditions are also marked on the inner
box label.

®

ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.

Target applications

Target applications for the TN100 include:

● Asset tracking

● Enabling 2D/3D real-time location systems

● Security

● Industrial monitoring and control

● Medical applications

Development environment

● Simple API access to chip registers

● Easy-to-use evaluation boards for testing the TN100 in any environment

● Ready-to-customize development boards for quick application development

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TN100 block diagram TN100

VDDA_ADC

SpiRxD

SpiTxD

SpiSSn

SpiClk

VDD1V2Cap

µCIRQ

µCReset

POnReset

Te st

TestRxN

TestRxP

TestCom

AnalogueVcc

AnalogueGND

DigitalVcc

Xtal32kN

Xtal32kP

D0

D1

D2

D3

RRef

Xtal32MN

Xtal32MP

VDDA_DCO

VBalun

DigitalGND

TxP

TxN

Tx/Rx

RxP

TxP

µCVcc

MCU

Chirp

Pulse

Sequencer

Digital

Processing

Battery

Digital I/O

Synthesizer

32 kHz

Osc

RTC

DAC

DAC

ADC

ADC

LPF

LPF

LPF

LPF

IQ DEMOD

IQ DEMOD

I

Q

I

Q

VGA

VGA VGA

VGA

LNA

PA

2 TN100 block diagram

Figure 1. Simplified TN100 block diagram

14/235

TN100 Key features

3 Key features

The TN100 transceiver incorporates robust wireless communication capabilities including:

● Built-in precise ranging capabilities

● Channelization using FDMA for improved coexistence

● Different symbol durations and symbol rates

● Standard set of default register values set into chip

● Digital Dispersive Delay Line (DDDL) incorporated in the chip

● Programmable pull resistors

3.1 Built-in ranging capability

The TN100 transceiver provides a built-in ranging capability. The chip can be enabled to
provide Round Trip of Flight (RToF) information using a special Data / Ack packet
transmission. Because the processing time for generating a hardware acknowledgment is
known and the time of transmission a data packet is known, these two values can be used to
calculate a ranging distance between the two TN100 stations.

3.2 Channelization using FDMA for improved coexistence

Channelization is the subdividing of the available frequency band (in this case, the 83 MHz
ISM band) into many narrow frequency bands, which for the TN100 transceiver is 22 MHz
channels. This increases coexistence with devices sharing the same ISM band. The TN100
transceiver channelizes the 2.4 GHz ISM band into multiple 22 MHz frequency channels
using Frequency Division Multiple Access (FDMA). With register settings, the chip can be
set to 80 MHz or 22 MHz signal bandwidth. The chip is set by default to use FDMA on
startup and can be programmed to use one of multiple 22 MHz channels in the ISM band.

3.3 Incorporated digital dispersive delay-line (DDDL)

The TN100 transceiver incorporates a Digital Dispersive Delay Line (DDDL), which in
previous chips was an external component. Reference values for I and Q can be stored in
Baseband RAM. These values are used to detect incoming signals generated by another
transceiver chip. The detectable signals can be one of the following:

● An Upchirp (linear frequency modulation, where frequency increases in time)

● A Downchirp (linear frequency modulation, where frequency decreases in time)

● An OffChirp, which is the absence of a chirp

Note: For more details, see Section 20: Chirp modulation on page 89.

3.4 Selectable symbol durations and symbol rates

The TN100 transceiver provides selectable symbol durations and symbol rates.

● Symbol durations include: 0.5 µs, 1 µs, 2 µs, and 4 µs

● Symbol rates include: 2 Mbps, 1 Mbps, 0.5 Mbps and 0.25 Mbps

Note: See Section 26.2.61: 0x48 – Symbol duration, symbol rate, and modulation system on

page 169.

15/235

Architecture TN100

4 Architecture

The TN100 is a extremely low power, highly integrated mixed signal chip incorporating both
an analog and a digital part in one silicon die. This section provides a brief overview of the
digital and analog parts of the chip.

4.1 Analog part - TX and RX

For transmission, the analog part of the chip converts data obtained from the digital part into
chirp pulses and sends packets over the air using an RF link. For reception, it detects
received chirp pulses into a form that can be used by the digital part.

4.2 Digital part - programming interface

The digital part of the chip provides an SPI interface for reading and writing to chip registers.
Application data is written to chip buffers in the digital part, which is then provided to the
analog part of the chip for transmission over the air. Data received from the analog part is
provided to an application via buffers in the digital part. To achieve maximum power savings,
the digital part of the TN100 transceiver is divided into two sections called an ON section
(that is, always powered) and a PWD section (that is, powered during operating mode).

4.2.1 Digital part – ON Section

The ON section, which is always powered, contains the minimum number of required
controls that are used to maintain the chip settings. It also is connected to the digital I/O pins
as these pins are used for power management.

4.2.2 Digital part – PWD section

The PWD section, which is powered up only during operating mode, contains the remaining
controls that are used when the chip is required for data transmission and reception.

16/235

TN100 Architecture

Analog

Application

data sent

and
received
over SPI
interface

ON PWD

Always powered

Only powered when

chip is in

operating mode

Packets
sent and
received

over an RF

Link

PINS

PINS

PINS

4.3 Signal flow

Figure 2 illustrates the signal flow within the chip.

Figure 2. Signal flow in the TN100 transceiver

4.4 Commonly used set of register default values

The chip has been set with a number of default values that would be required for most
standard applications to reduce the time required for chip initialization.

Note: A full listing of register default values is provided in Appendix B: Default register settings on

page 224.

4.5 Programmable pull-resistors

The TN100 transceiver uses programmable pull-resistors to lower the cost of the bill of
materials. The following pads can now be set as either pull-up or pull-down:

● SpiClk (pin 15)

● SpiSsn (pin 16)

● SpiTxd (pin 17)

● SpiRxd (pin 18)

● POnReset (pin 30)

● TxRx (pin 9)

● µCIRQ (pin 27)

● µCReset (pin 28)

● Digital IO pads (pins 19 to 22)

17/235

Pin description TN100

1

2

3

4

5

6

7

8

9

10

11

12

15 18 19 21 22 23 242016 171413

31

30

29

28

27

26

25

35

34

33

32

36

48 43 42 40 39 38 3741454647 44

VDDA

RRfef

VSSA

VDDA_DCO

Xtal32kP
Xtal32kN

Xtal32MP

Xtal32MN

Tx/Rx

VSSD
VSSD

VDDD

VDDD

VSSD

SpiClk

/SpiSsn

SpiTxD

SpiRxD

D0D1D2

D3

VSSD

VDDD

VSSD

µCReset

µCIRQ

VDD1V2_Cap

µCVcc

/POnReset

VSSD

VDDA_ADC

nc

VSSA

VDDA

VDDA

nc

nc

VSSA

VSSA

RxN

RxP

VSSA

TxN

TxP

VSSA

VBalun

VDDA

Pin 1 Identification

GND

Exposed die

attach pad

5 Pin description

This section provides a brief overview of the location and function of each pin.

Figure 3. Pinout

18/235

Table 1. Pin descriptions

Pin Signal Direction Description

1 VDDA Supply Power supply for analog parts

2 RRef Analog IO Pin for external reference resistor

3 VSSA Supply Power supply for analog parts

4 VDDA_DCO Supply Power supply for DCO

5 Xtal32kP Analog IO

6 Xtal32kN Analog IO Crystal 32768 Hz

7 Xtal32MP Analog IO

8 Xtal32MN Analog IO 32.0 MHz crystal oscillator

9 Tx/Rx Digital output Output signal to distinguish between transmit and receive

10 VSSD Supply Power supply for digital parts

11 VSSD Supply Power supply for digital parts

Crystal 32768 Hz, input from external 32768 Hz frequency
reference

32.0 MHz crystal oscillator, input from external 32 MHz
frequency reference

TN100 Pin description

Table 1. Pin descriptions (continued)

Pin Signal Direction Description

12 VDDD Supply Power supply for digital parts

13 VDDD Supply Power supply for digital parts

14 VSSD Supply Power supply for digital parts

15 SpiClk Digital input SPI clock

16 SpiSSn Digital input SPI slave selected

17 SpiTxD Digital output SPI transmit data (MISO)

18 SpiRxD Digital Input SPI receive data (MOSI)

19 D0 Digital IO Digital input or output line 0

20 D1 Digital IO Digital input or output line 1

21 D2 Digital IO Digital input or output line 2

22 D3 Digital IO Digital input or output line 3

23 VSSD Supply Power supply for digital parts

24 VDDD Supply Power supply for digital parts

25 Test Digital IO Pin for digital tests

26 µCReset Digital output Reset for external microprocessor

27 µCIRQ Digital output Interrupt request to external microprocessor

28 VDD1V2_CAP Supply 1.2 V digital power supply decoupling.

29 µCVCC Supply Switchable power supply for external microcontroller

30 POnReset Digital input Power on reset line

31 VSSD Supply Power supply for digital parts

32 VDDA_ADC Supply Power supply for analog parts (Rx ADC)

33 TestCom LF signal Test pin for analogue signals

34 VSSA Supply Power supply for analog parts

35 VDDA Supply Power supply for analog parts

36 VDDA Supply Power supply for analog parts

37 TestRxP LF Signal Test pin for RX signals

38 TestRxN LF Signal Test pin for RX signals inverted

39 VSSA Supply Power supply for analog parts

40 VSSA Supply Power supply for analog parts

41 RxN RF input Differential receiver input (inverted)

42 RxP RF input Differential receiver input

43 VSSA Supply Power supply for analog parts

44 TxN RF output Differential transmitter output (inverted)

45 TxP RF output Differential transmitter output

46 VSSA Supply Power supply for analog parts

Power supply for external balun (DC for TxP/TxN; needs to

47 VBalun Supply

48 VDDA Supply Power supply for analog parts

be blocked with an external capacitor in the 27pF to 47pF
range close to the balun)

19/235

Pin description TN100

5.1 Input and/or output pins

Ta bl e 2 describes the digital pins and analog pins of the TN100 transceiver.

Table 2. Digital input pins

Pin Pin no. Direction Description

Analog pin. 32.768 kHz crystal oscillator pin 1 or input

Xtal32kP 5 Input

Xtal32kN 6 Output Analog pin. 32.768 kHz crystal oscillator pin 2.

Xtal32MP 7 Input

Xtal32MN 8 Output Analog pin. 32 MHz kHz crystal oscillator pin 2.

/POnReset 30 Input Power on reset signal.

SpiClk 15 Input

/SpiSSn 16 Input

for an external 32.768 kHz clock generator. Used to
connect crystal or active frequency reference.

Analog pin. 32 MHz crystal oscillator pin 1 or input for
an external 32 MHz clock generator. Used to connect
crystal or active frequency reference.

The SPI Clock is generated by the microcontroller
(master) and synchronizes data movement in and out of
the device through the pins SpiRxD and SpiTxD.

SPI Slave Select (low active) is externally asserted
before the microcontroller (master) can exchange data
with the TN100 transceiver. Must be low before data
transactions and must stay low for the duration of the
transaction.

SpiRxD 18 Input SPI Receive Data (MOSI).

SpiTxD 17 Output SPI Transmit Data (MISO).

Distinguishes between the TX and RX phase. Can also

Tx/Rx 9 Output

µCReset 26 Output Reset for external microprocessor.

µCIRQ 27 Output Interrupt request to external microprocessor.

D0 19 Input/Output

D1 20 Input/Output

D2 21 Input/Output

D3 22 Input/Output

µCVcc 29 Output Analog pin. Power supply for external microprocessor.

be used to provide an external power amplifier control.
Active Low during TX, otherwise High.

Digital Input or Output (programmable, see
configuration bits below), line 0.

Digital Input or Output (programmable, see
configuration bits below), line 1.

Digital Input or Output (programmable, see
configuration bits below), line 2

Digital Input or Output (programmable, see
configuration bits below), line 3. Note that a 32.768 kHz
clock operates on this pin after reset/power up.

20/235

TN100 Pin description

5.2 Configuring the digital I/O pins – D0 to D3 (pins 19 to 22)

Each digital I/O pin can be configured as either an input or an output pin. Signal levels or an
alarm occurrence can be reported at a digital I/O pin that has been set as input. Ta bl e 3 lists
the fields are used for configuring digital I/O pins.

Table 3. Digital I/O pin configuration

Field Offset R/W Description

DioDirection 0x04 WO

DioOutValueAlarmEnable 0x04 WO

DioAlarmStart 0x04 WO

DioAlarmPolarity 0x04 WO

DioUsePullup 0x04 WO

DioUsePulldown 0x04 WO

Controls the direction of Digital I/O port. Set it
as either an input or an output pin.

When a Digital I/O port is configured as input,
this bit selects to be reported either the signal
level at the port or the occurrence of an
alarm.

Starts the alarm, and is set after the digital I/O
port is configured to report the occurrence of
an alarm.

When the digital I/O port is configured as an
input that should report the occurrence of an
alarm, then this bit is used to select the edge
which should trigger the alarm.

When the digital I/O port is configured as an
output, then this bit selects whether the value
programmed in DioOutValueAlarmEnable or
the feature clock should be driven out of the
digital I/O port.

When set to true, a pull-up resistor is
connected to the corresponding digital I/O
pad.

When set to true, a pull-down resistor is
connected to the corresponding digital I/O
pad only, but when DioUsePullup is false.

Each digital I/O pin has one write strobe, as listed in Tab l e 4 .

Table 4. Digital I/O pin write strobe

Field Offset R/W Description

DioPortWe 0x04 WO

Writes the settings of the 6 configuration bits
to the digital I/O controller.

Each digital I/O pin has one status bit, as listed in Tab l e 5 .

Table 5. Digital I/O pin status

Field Offset R/W Description

Each bit reports the signal level or the
occurrence of an alarm at one of the four

DioInValueAlarmStatus 0x04 RO

21/235

digital I/O ports, where bit 0 belongs to D0, bit
1 belongs to D1, bit 2 belongs to D2, and bit 3
belongs to D3.

Pin description TN100

V level

Start of

internal reset

Time

t

min

t

delay

Stop

Threshold

levels

High ≥ V

DDD

* 0.7

Low

# V

DDD

* 0.2

5 µs

≥ 400 µs

IC Ready

5.3 Configuring the IRQ Pin – µCIRQ (pin 27)

The IRQ pin (µCIRQ) can be configured with either a high or low active polarity and can be
driven as either push-pull or open-drain. The source of the interrupt can also be set.

The following fields are used to configure the IRQ pins as either low or high active, as well
as either push-pull or open-drain:

Table 6. IRQ pin configuration

Field Offset R/W Default

IrqPolarity

(high/low active)

IrqDriver

(push-pull/open-drain)

0x00 RW

0x00 RW

Defines the polarity of the IRQ signal as either high or
low active. The default is low active.

Switches between push-pull or open-drain for IRQ
output driver. The default is open-drain.

The following fields are used to drive the interrupt of the IRQ pin by either a transmitter
interrupt, a receiver interrupt, a baseband timer interrupt, or a local oscillator interrupt:

Table 7. Interrupts driving the IRQ pin

Field Offset R/W Description

TxIrqEnable

RxIrqEnable

BbTimerIrqEnable

LoIrqEnable

0x0F RW

0x0F RW

0x0F RW

0x0F RW

The transmitter interrupt can be enabled to drive the
interrupt line. Default is disabled.

The receiver interrupt can be enabled to drive the
interrupt line. Default is disabled.

The baseband timer can be enabled to drive the
interrupt line. Default is disabled.

The Local Oscillator interrupt can be enabled to drive
the interrupt line. Default is disabled.

5.4 Power-on reset – /POnReset (pin 30)

/POnReset signal is active low. Figure 4 shows a timing diagram for /POnReset.

Figure 4. /POnReset timing diagram

22/235

TN100 Memory map

Address

Memory

Typ e

Page

Select

Register

Select

Bits 6-0

11-10 9-8 7

Hex FFF

11

11

1 Correlator RAM Page 3

0

Register Block

10

1 Correlator RAM Page 2

0 Register Block

01

1 Correlator RAM Page 1

0 Register Block

00

1 Correlator RAM Page 0

Hex C00 0 Register Block

Hex BFF

10

11

1 Chirp Sequencer Page 3

0 Register Block

10

1 Chirp Sequencer Page 2

0 Register Block

01

1 Chirp Sequencer Page 1

0 Register Block

00

1 Chirp Sequencer Page 0

Hex 800 0

Register Block

Hex 7FF

01

Hex 400

Hex 3FF

00

11

1 Baseband Page 3

0 Register Block

10

1 Baseband Page 2

0 Register Block

01

1 Baseband Page 1

0 Register Block

00

1 Baseband Page 0

Hex 000 0

Register Block

Correlator RAM

Chirp Sequencer

Baseband RAM

Unused

6 Memory map

This section describes the memory map of the TN100 transceiver. Procedures are provided
for accessing the chip’s programmable Register Block, as well the Baseband RAM, Chirp
Sequencer RAM, and Correlator RAM. Figure 5 shows the memory map of the TN100
transceiver.

Figure 5. Memory map

23/235

Memory map TN100

Ta bl e 8 lists the sections provided in the memory map.

Table 8. Memory map section

Address Memory type Description

0x000 to

0x3FF

0x800 to

0xBFF

0xC00 to

0xFFF

0x000 to

0x07F

Baseband RAM

Chirp Sequencer

RAM

Correlator RAM

Register Block

512 bytes of Baseband RAM stores both data payload and MAC
header values, depending on buffer configuration settings.

Delivers two sequences of 6-bit values that synthesize the I and Q
signals of a symbol.

Stores the reference and threshold values for detection. It is are
initialized with the FDMA, 4 µs default detector matrix. When other
symbols are needed this register must be programmed with the
appropriate values. The threshold must be programmed with the
appropriate value in any case (even for the default matrix).

128-byte programmable chip register block provides chip
configuration settings and is mapped to the entire memory of the
TN100 transceiver.

Note: For a description of the Chirp sequencer, see Section 10: Chirp sequencer (CSQ) on

page 53. The Correlator RAM is described in Section 6.3: Correlator RAM access on
page 26. The Register Block is described in Section 6.2: 128-byte programmable register
block on page 25.

6.1 Selecting a memory address

There are two ways to access the TN100 transceiver memory map: direct and indirect
access. The Register block is accessed using a direct access model. The Baseband, Chirp
Sequencer and Correlator RAM blocks are accessed using an indirect access model.

To access one of these RAM blocks using an indirect access model through register 0x0E –

Baseband memory access:

1. Select the memory type (Baseband, Chirp Sequencer or Correlator) using bits
DeviceSelect.

2. Select the page pointer using bits RamIndex.

3. A Read or Write operation can now be performed.

For example to write a value to the Chirp Sequencer RAM at location 0x185, write in register

0x0E – Baseband memory access:

1. Write DeviceSelect = 0x2 to select the Chirp Sequencer

2. Write RamIndex = 0x1 to select the RAM column 1.

3. Write to address 0x85.

For example to read a value from the Correlator RAM location at 0x280, write in register

0x0E – Baseband memory access:

1. Write DeviceSelect = 0x03 to select the Correlator RAM.

2. Write RamIndex = 0x02 to select the Threshold.

3. Read from address 0x80.

Note: For a Read or Write operation at an address higher than 0x7F, the absolute address is

always relative to the value stored in register 0x0E.

24/235

TN100 Memory map

Baseband RAM 3

Register

128 bytes

0x300

0x37F

0x380

0x3FF

128 bytes

Baseband RAM 2

Register

128 bytes

0x200

0x27F

0x280

0x2FF

128 bytes

Baseband RAM 1

Register

128 bytes

0x100

0x17F

0x180

0x1FF

128 bytes

Baseband RAM 0

Register

128 bytes

0x000

0x07F

0x080

0x0FF

128 bytes

≅

Page 0

Page 1

Page 2

Page 3

First mapping of register
block

Second mapping of register
block

Third mapping of register
block

Register block

6.2 128-byte programmable register block

The TN100 transceiver provides a 128-byte programmable register block for chip
configuration settings. The address space for the register is from 0x00 to 0xFF. However, it
is mapped to three additional mapped registers within the 1024-byte memory space of the
baseband RAM, where:

● Page 1 begins at offset 0x100

● Page 2 begins at offset 0x200

● Page 3 begins at offset 0x300.

These three mapped registers are logically equivalent to the register memory locations 0x00
to 0x7F. Figure 6 illustrates this mapping.

Figure 6. Register mapping in the 1024-byte TN100 memory space

Note: All user accessible registers in this register block is fully described in Section 26.2:

Description of chip registers on page 125.

6.2.1 Accessing a register address location

To access a memory location in the register only one SPI transfer is required, where:

● SPI Address[7] = 0

● SPI Address[6:0] = <offset address in register>

Note: A wraparound SPI burst transfer leads to unpredictable behavior. A wraparound SPI burst is

Either an SPI single byte operation or an SPI burst transfer can be used to access chip
memory. The lower 7 bits of a given memory location are identical with the start address in
the selected segment. SPI burst transfers are limited to 128 bytes (which is the segment
size).

when the number of bytes to be accessed is greater than the number of bytes from the start
address to the end of the segment.

25/235

Memory map TN100

6.2.2 Setting a shadow variable for the RAM access register

When bit 7 of the 10 bit memory address is 1, the RamIndex field must be set with the two
highest bits of this address (shifting right by 8 positions). The lower 8 bits are directly used in
the next SPI access, which writes this data.

To reduce the overhead caused by writing the RamIndex field for each memory access, it is
recommended that an RamIndex shadow variable be maintained in software. This variable
can be used to back up the last value of the RamIndex field. If address locations in the
same segment are accessed sequentially, write operations to the RamIndex field can be
eliminated by comparing the RamIndex value with the shadow variable.

6.3 Correlator RAM access

The Correlator RAM contains the reference sequences of the detector and the detection
thresholds. Use Correlator Memory I for programming the In-Phase values of the detector
and use Correlator Memory Q for Quadrature-Phase values. Use Correlator Memory
Thresholds to set the thresholds for In-Phase and Quadrature-Phase detection.

A Correlator RAM page is selected by setting DeviceSelect and RamIndex as shown in

Ta bl e 9 .

Table 9. Selecting a correlator RAM page

DeviceSelect setting RAMIndex setting Selected correlator memory page

RamIndex = 0x0 (default value) I (RamD3IPatI)

DeviceSelect =

0x3

RamIndex = 0x1 Q (RamD3IPatQ)

RamIndex = 0x2 Thresholds (RamD3IThresholds)

RamIndex = 0x3 Unused

6.4 Chirp sequencer RAM access

The Chirp Sequencer (CSQ) RAM space contains the values for I and Q, which are used to
calculate Upchirps and Downchirps. The CSQ is set with a default matrix that has a symbol
duration of 4 µs (4000 ns) and a 22 MHz bandwidth.

A Chirp Sequencer RAM page is selected by setting DeviceSelect and RamIndex as
shown in Ta bl e 1 0.

Table 10. Selecting a correlator RAM page

DeviceSelect setting RAMIndex setting Selected correlator memory page

RamIndex = 0x0 (default value) Column 0

DeviceSelect =

0x2

RamIndex = 0x1 Column 1

RamIndex = 0x2 Column 2

RamIndex = 0x3 Unused

Note: For more details about the Chirp Sequencer, see Section 10: Chirp sequencer (CSQ) on

page 53.

26/235

TN100 Clocking structure

Digital IO Control

ON PWD

DDDL Memory

SPI Controller

Real-Time Clock

CSQ Memory

Others

Baseband Control

Radio Control

Power Management

(4 kHz)

D[3:0]

Tx/Rx

SPI

µCirq

µCReset

µCVcc

Protection

32.786 kHz clock:
SPI clock:

32 MHz Baseband clock:

CSQ (Chirp Sequencer) clock:

7 Clocking structure

This section describes the four clocks provided by the TN100 transceiver: 32.768 kHz clock,
SPI clock, 32 MHz baseband clock, and the Chirp Sequencer (CSQ) clock.

7.1 Overview

The TN100 transceiver provides the following four clocks:

32.786 kHz clock – Used to run the real-time clock and power management.

SPI clock – Used for the SPI Controller and for the Digital IO Control used for

running the four digital IO pins. The frequency of the SPI clock is dependent on the

frequency required by the microcontroller. The maximum frequency is 27 MHz.

32 MHz baseband clock – Used for baseband control, radio control, and other
baseband uses. The frequency of the baseband clock for the TN100 transceiver is

32 MHz and can be enabled or disabled by software.

CSQ (Chirp Sequencer) Clock – Used by the Chirp Sequencer (CSQ) Memory.
The frequency of the CSQ clock is determined by dividing the Local Oscillator (LO)

frequency by 10. The CSQ clock can be enabled or disabled by software.

Figure 7. Clock structure

7.2 32.786 kHz real-time clock (RTC)

This real-time clock (RTC) runs at 32.768 kHz. It can be set or read through software using
a 48-bit real-time clock value. As this clock is part of the ON section of the chip’s digital part,
it is always powered (unless the chip is completely powered off) and can, therefore, be used
for creating a wake-up time event.

27/235

Clocking structure TN100

ON PWD

Real-Time Clock

Power Management

(4 kHz)

D[3:0]

Tx/Rx

SPI

µCIRQ

µCReset

µCVcc

Protection

32.786 kHz Clock:

The real-time clock is also used to generate a 4 kHz clock (the Power Management clock)
for use by the Power Management module in the ON section. Like the real-time clock, this
slow clock is always available during power down mode to protect the connections between
the SPI and the SPI Controller.

Figure 8 shows the real-time clock and Power Management modules that use the 32.768

kHz RTC.

Figure 8. 32.786 kHz real-time clock

7.2.1 Updating and reading the RTC through software

The 48-bit real-time clock is set and read through software. Since the real-time clock is
updated every 1/(32.768 kHz), it is not directly accessible by the user. A RAM buffer
RamRtcReg is used to hold the value of the internal real-time clock after it has been read.
This buffer is also used to hold a value that will be written to the real-time clock.

Fields for updating RTC by software

Ta bl e 1 1 lists the fields used for updating the real-time clock with software.

Table 11. RTC and TimeB packets

Field Offset R/W Description

RtcCmdWr 0x62 WO Writes the 48-bit RTC value.

RtcCmdRd 0x62 WO Reads the 48-bit RTC value

48-bit RTC value read from the RTC by software or
written to the RTC by software

RamRtcReg 0xF0 RW

Updating the value of the RTC

To update the value of the real-time clock, do the following

1. Write a 48-bit value for the real-time clock to the buffer RamRtcReg.

2. Write this buffer to the real-time clock using the write command RtcCmdWr.

28/235

TN100 Clocking structure

Reading the value of the RTC

To read the value of the real-time clock, do the following:

1. Read the real-time clock using the read command RtcCmdRd to place the 48-bit value
of the real-time clock in the buffer RamRtcReg.

2. Read out the buffer RamRtcReg.

7.2.2 Manually or automatically updating the RTC using TimeB packets

The real-time clock can also be updated from TimeB packets that have been sent from a
base station or other stations in a network. This updating can be performed automatically or
manually.

If the updating is performed automatically, then when a TimeB packet is received, the RTC
value in the packet is automatically written to the real-time clock.

If the updating is performed manually, then when a TimeB packet is received, the RTC value
in the packet must be manually updated as described in Section 7.2.1: Updating and

reading the RTC through software on page 28.

Fields for updating RTC by TimeB packets

Ta bl e 1 2 lists the fields used for updating the real-time clock by TimeB packets.

Table 12. RTC and TimeB packets

Field Offset R/W Description

RtcTimeBAutoMode 0x62 WO

RtcTimeBRxAdj 0x61 WO Adjusts the RTC value for receiver delay.

RtcTimeBTxAdj 0x60 WO Adjusts the RTC value for transmitter delay

RamRtcTx 0xE0 RW

RamRtcRx 0xE8 RW

When set to 1, the RTC value is transferred in TimeB
packets

The 48-bit RTC value that is to be transmitted
(loaded/written) in a TimeB packet

The 48-bit RTC value that has been received in a
TimeB packet

Manually updating the RTC

To manually update the real-time clock through the RTC value in a TimeB packet, enable
Manual mode for TimeB packets by setting:

RtcTimeBAutoMode = NA_RtcTimeBAutoModeOff_BC_C (0x0)

This causes the 48-bit RTC value in the received TimeB packets to be stored in the real-time
clock buffer RamRtcReg, where it can then be written to the real-time clock using the write
command RtcCmdWr.

Automatically updating the RTC

To automatically update the real-time clock through from the RTC value in a TimeB packet,
enable Auto mode for TimeB packets by setting:

RtcTimeBAutoMode = NA_RtcTimeBAutoModeOn_BC_C (0x1)

This causes the RTC values in received TimeB packets to be automatically stored in the
real-time clock.

29/235

Clocking structure TN100

47 31 8

023

70

3 12

RtcWakeUpTime

(RTC)

Wake Uptim e

WakeUpti meB yte We

WakeUptimeByte

0

7.2.3 Using the RTC as wake-up event

The real-time clock can be used to create a wake-up time event at a predefined time. The
field EnableWakeUpRtc enables the real-time clock to be used as a wake-up event.

The RTC wake-up time is set in RtcWakeUpTime but can only be accessed through the use
of WakeUpTimeByte and WakeUpTimeWe.

The wake-up time is a 24-bit value split into 3 bytes. The field WakeUpTimeByte is used to
set each of the three segments of the wake-up time (the segment to write is selected using
the a byte-selector field WakeUpTimeWe). This wake-up time value is then compared to bits
31 to 8 of the real-time clock. When these values match, a wake-up event is then triggered.
This process is shown in Figure 9.

Figure 9. Using real-time clock as wake-up event

Fields for setting RTC as wake-up event

Ta bl e 1 3 lists the fields using the real-time clock as a wake-up time event.

Table 13. Wake-up time fields

Field Offset R/W Description

Stores a one byte value for the wake-up time, which

WakeUpTimeByte 0x01 WO

WakeUpTimeWe 0x02 WO

EnableWakeUpRtc 0x06 RW Enable real-time clock as Wake-Up Source

is programed to the wake-up time RtcWakeUpTime
using WakeUpTimeWe.

Loads the value of RtcWakeUpTimeByte to the
appropriate byte of the wake-up time in the wake-up
time circuitry.

7.3 SPI clock

The SPI Clock is an externally delivered clock provided to the chip through an SPI signal
from a master device, such as a microcontroller. The frequency of the SPI clock is
dependent on the frequency of the master device. The maximum frequency of the SPI clock,
however, is 27 MHz. It is provided as one of the four signals of the SPI interface: SpiClk.

Figure 10 shows the Digital IO Control and DDDL Memory modules as well as the SPI

Controller that use the SPI clock.

30/235

TN100 Clocking structure

Digital IO Control

ON PWD

DDDL Memory

SPI Controller

D[3:0]

Tx/Rx

SPI

µCIRQ

µCReset

µCVcc

SPI Clock:

ON PWD

Others

Baseband Control

Radio Control

32-MHz Baseband clock:

D[3:0]

Tx/Rx

SPI

µCIRQ

µCReset

µCVcc

Figure 10. SPI clock

This clock is used to run the SPI Controller. As the Digital I/O Control is run by the SPI
Controller, the SPI Clock is also used to run the four digital I/O pins: D0, D1, D2 and D3. It
also runs all registers that are written by the SPI Controller.

7.4 32-MHz baseband clock

The baseband clock distribution obtains its frequency from the internal quartz oscillator. In
the TN100 transceiver, the internal quartz oscillator provides a 32-MHz frequency. This
clock is used for baseband control, radio control, and other baseband uses.

Figure 11. 32-MHz baseband clock

Note: The baseband clock can be enabled and disabled by software.

As the baseband clock is within the PWD section, this clock and all its modules run by this
clock are powered off when the chip goes into PowerDownModeFull. Consequently, the
contents of all chip registers are also lost.

31/235

Clocking structure TN100

IC boundary

Crystal

Oscillator

Clock

gate

Internal power

supply bus

Step 3: EnableBbCrystal

Xtal32MP

Xtal32MN

32 MHz

Step 2: ResetBbClockGate

Step 1: EnableBbClock

RST

RST

D

Enable

Clock

Q

1

Baseband

clock

Table 14. Baseband clock related fields

Field Offset R/W Description

ResetBbClockGate 0x07 RW Resets the baseband clock distribution circuitry.

ResetBbRadioCtrl 0x07 RW

Resets the digital baseband and radio control
circuitries.

EnableBbCrystal 0x08 RW Powers on the internal baseband oscillator.

EnableBbClock 0x08 RW Enable the baseband clock distribution.

7.4.1 Stopping / enabling the 32-MHz baseband clock

To reduce power consumption without losing the contents of chip registers, the baseband
clock distribution can be stopped and the quartz oscillator circuitry can be powered down.

Figure 12 shows the 32-MHz baseband clock and baseband quartz oscillator circuitry.

Figure 12. Switching on/off the baseband clock

Keeping clock switcher in stable state

The clock switcher is kept in a stable state during warm-up and shut down of the quartz
oscillator by using ResetBbClockGate.

Stopping the 32-MHz baseband clock distribution

To stop the baseband clock distribution, do the following:

1. Set EnableBbClock = 0 to switch off the baseband clock distribution.

2. Set ResetBbClockGate = 1 to enable active reset of the baseband clock circuitry.

3. Set EnableBbCrystal = 0 to power off the internal baseband quartz oscillator.

Enabling the 32-MHz baseband clock distribution

To enable the baseband clock distribution, do the following:

1. Set EnableBbCrystal = 1 to power on the internal baseband quartz oscillator.

2. Set ResetBbClockGate = 0 to inactivate the reset of the baseband clock circuitry.

3. Set EnableBbClock = 1 to switch on the baseband clock distribution.

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TN100 Clocking structure

ON PWD

CSQ Memory

CSQ (Chirp Sequencer) Clock:

D[3:0]

Tx/Rx

SPI

µCIRQ

µCReset

µCVcc

7.5 CSQ (Chirp Sequencer) clock

The Chirp Sequencer clock (CSQ) is required for programming the Chirp Sequencer RAM
memory. The frequency of the CSQ clock is determined by dividing the Local Oscillator (LO)
frequency by 10 (see Section 21.2: Calibrating the local oscillator frequency on page 92).
The CSQ clock can be enabled or disabled by software using EnableCsqClock.

Figure 13 shows the CSQ Memory module that uses the Chirp Sequencer clock.

Figure 13. Chirp sequencer clock

Table 15. Chirp sequencer clock related fields

Field Offset R/W Description

EnableCsqClock 0x42 RW Enables the Chirp Sequencer (CSQ) clock.

7.5.1 Stopping / enabling the Chirp Sequencer clock (CSQ)

Enabling the Chirp sequencer clock

1. LOenable=1

2. LODiv10enable=1

3. EnableCsqClock=1

Disabling the Chirp sequencer clock

1. EnableCsqClock=0

2. LODiv10enable=0

3. LOenable=1

7.5.2 Using the default matrix for transmission

To use the default matrix for transmission, set CsqUseRam = 0.

Note: ‘0’ is the default value of CsqUseRam.

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Power management TN100

8 Power management

This section describes the five power management states of the TN100 transceiver, which
are PwrDownModeFull, PwrDownModePad, PowerUp, Standby, and Ready.

The TN100 transceiver is designed to efficiently use the power required to operate the chip.
Modules required during transmission and reception, such as the baseband memory, CSQ
memory, the SPI Controller, and other modules are located in a section of the chip that can
be powered down when not in use. To keep the chip operational, the minimum required
modules are located in a section of the chip that uses minimal power to maintain a
connection with the microcontroller.

8.1 Power management states

Ta bl e 1 6 shows the current consumption and activation time of the power management

states.

Table 16. Power management states

State

PwrDownModeFull under 2.5 µA

PwrDownModePad # 600 µA

PowerUp # 700 µA

StandBy # 2.5 mA Ready (without reconfiguration) 6 µs

Ready # 4 mA n./a.

1. Current consumption values are typical values only.

2. @ 4 Mbit/s SPI.

Current

consumption

(1)

PowerUp: between 1 and 32 ms (programmable) + boot
time of the external microcontroller

PowerUp: between 1 and 32 ms (programmable) + boot
time of the external microcontroller

StandBy: # 5 ms (depending on the speed of the
baseband quartz oscillator)

Activation time into state

(2)

8.2 Power management module – ON and PWD sections

The Power Management module is located within a section called the “ON section.” It is
provided with a clock frequency of 4 kHz by the 32.768 kHz RTC. Figure 14 shows the ON
and PWD sections of the TN100 transceiver, with the modules contained within each
section. The connections between the pins and the ON and PWD sections are shown as
dashed lines, while connections protected by the Power Management module protects are
shown by the light lines.

34/235

TN100 Power management

Digital IO Control

ON PWD

DDDL Memory

SPI Controller

Real-Time Clock

CSQ Memory

Others

Baseband Control

Radio Control

Power Management

(4 kHz)

D[3:0]

Tx/Rx

SPI

µCIRQ

µCReset

µCVcc

Protection

Figure 14. Power management module

The Power Management module is responsible for maintaining the pull-up and pull-down
states of the SPI interface during all power down modes. This includes the pins: SpiClk,
SpiSSn, SpiRxD, and SpiTxD. This module is also responsible for maintaining the pull-up
and pull-down states of several additional input/output pins, including:

● /POnReset, an input pin which provides a signal to the power up reset line.

● TxRx, an output pin which is used to control an external power amplifier.

● µCReset, an output pin which resets an external microcontroller.

● µCIRQ, an output pin which sends interrupt requests to an external microcontroller.

The Digital IO pins are always powered as they can be programmed to provide a wake-up
event to bring the PWD section back to powered up state.

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Power management TN100

Receive Mode

Internal baseband

clock distribution off

Internal baseband

clock distribution on

Configuration of

Wake Up Timers or

of alarm Events

Configuration of

Wake Up Timers or

of alarm Events

TX-INIT

TX RF-INIT

Calibrate-TX

Transmit Mode

RX-INIT

RX RF-INIT

Calibrate-RX

Station-INIT

Ready Mode

Standby Mode

Baseband quartz

clock off

Baseband quartz

clock on

Powerup Mode

Wake-up timer

or alarm events

Wake-up timer

or alarm events

Powerdown

PAD Mode

Powerdown
FULL Mode

8.3 Power management state model

The power management states model of the TN100 transceiver is shown in Figure 15.

Figure 15. Power management state model

8.4 Power management fields

36/235

Ta bl e 1 7 lists the fields used for Power Management.

Table 17. Power management related fields

Field Offset Description

EnableWakeUpRtc 0x06 RTC wake-up event brings the chip into the power up state.

Alarm event (rising/falling edge) at a digital IO configured as a

EnableWakeUpDio 0x06

wake-up source (see register 0x4) brings the chip into the power up
state.

PowerUpTime 0x06

PowerDownMode 0x06

PowerDown 0x07

Configures duration of the power-up time (duration of active
µCReset).

Selects the power down mode to use when the chip enters the
powered down state

Brings the chip to the configured power-down state. This bit will be
automatically cleared when the chip is powered-up.

TN100 Power management

Digital IO Control

ON PWD

DDDL Memory

SPI Controller

Real-Time Clock

CSQ Memory

Others

Baseband Control

Radio Control

Power Management

(4 kHz)

Protection

Powered =

D[3:0]

Tx/Rx

SPI

µCIRQ

µCReset

µCVcc

8.5 PowerDownModeFull state

When the chip is in PowerDownModeFull, it consumes less power but after power up the
chip will need to be reconfigured. The pins and registers of the chip are powered off but
reconfiguration of the registers is required after wake-up. Also leakage current is the lowest
possible in this mode.

Figure 16. PowerDownModeFull showing powered sections

Current Consumption

The current consumption

(a)

during PowerDownModeFull is under 2.5 µA.

Chip State

The chip is in the following state during PowerDownModeFull:

Table 18. PowerDownModeFull state

Module State

External Microcontroller (µcVcc) Powered down

PWD section Powered down (all register settings lost)

ON section Powered

Real-time clock Running

Wake-up timer Running

Digital IO Control Running

Power Management module Running

Setting PowerDownModeFull

To s e t PowerDownModeFull, do the following:

1. Set PowerDownMode = NA_PowerDownModeFull_C (0x0)

2. Set PowerDown = 1

a. Current consumption values are typical values only and are values without an external microcontroller and

where digital IO pads are tri-state or inputs and no external pull-up resistors soldered on pads.

37/235

Power management TN100

Digital IO Control

ON PWD

DDDL Memory

SPI Controller

Real-Time Clock

CSQ Memory

Others

Baseband Control

Radio Control

Power Management

(4 kHz)

Protection

Powered =

D[3:0]

Tx/Rx

SPI

µCIRQ

µCReset

µCVcc

Bringing to PowerUp State

Either an internal wake-up timer or an external event on a Digital IO pin brings the chip out
of PowerDownModeFull into PowerUp state. This activation time is programmable using the
field PowerUpTime in a range between 1 and 32 ms + boot time of the external
microcontroller. After the chip is in PowerUp mode, the external microcontroller can then
initialize and (optionally) calibrate the chip.

8.6 PowerDownModePad state

When the chip is in PowerDownModePad, it consumes more power than
PowerDownModeFull but after it has been powered up, it does not need to be reconfigured.
In this state, all output pads are disabled and all bi-directional pads are switched to input, but
all transceiver registers are still powered. Reconfiguration of the chip registers is not
required, but leakage current is higher.

Figure 17. PowerDownModePad showing powered sections

Current Consumption

The current consumption during PowerDownModePad state is approximately 600 µA.

Chip State

The chip is in the following state during PowerDownModePad:

Table 19. PowerDownModePad state

Module State

External Microcontroller (µcVcc) Powered down

PWD section Powered (all register settings maintained)

ON section Powered

Real-time clock Running

Wake-up timer Running

Digital IO Control Running

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Power Management module Running

TN100 Power management

Digital IO Control

ON PWD

DDDL Memory

SPI Controller

Real-Time Clock

CSQ Memory

Others

Baseband Control

Radio Control

Power Management

(4 kHz)

Protection

Powered =

D[3:0]

Tx/Rx

SPI

µCIRQ

µCReset

µCVcc

Setting PowerDownModePad

To set PowerDownModePad, do the following:

1. Set PowerDownModePAD = NA_PowerDownModePad_C (0x1)

2. Set PowerDown = 1

Bringing to PowerUp State

Either an internal wake-up timer or an external event on a Digital IO pin brings the chip out
of PowerDownModePad. The chip then goes into PowerUp state. The activation time is
programmable using the field PowerUpTime in a range between 1 and 32 ms + boot time of
the external microcontroller. After the chip is set in Ready state, the external microcontroller
can then initialize and calibrate the chip.

8.7 PowerUp state

The chip enters PowerUp state from either PowerDownModeFull or PowerDownModePad
through on of the following: internal wake-up timer, external event on a Digital IO pin, or an
external reset

Figure 18. PowerUp state

Current Consumption

The current consumption during Powerup state is approximately 700 µA.

Chip State

When the chip is brought to PowerUp state, the following occurs:

Table 20. PowerUp state

Module State

External Microcontroller (µcVcc) Powered

From PowerDownModeFull to PowerUp PWD section powered and all pins are enabled

From PowerDownModePad to PowerUp

All output pins are enabled and digital IO pins are
switched to bi-directional

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Power management TN100

Digital IO Control

ON PWD

DDDL Memory

SPI Controller

Real-Time Clock

CSQ Memory

Others

Baseband Control

Radio Control

Power Management

(4 kHz)

Protection

Powered =

D[3:0]

Tx/Rx

SPI

µCIRQ

µCReset

µCVcc

Table 20. PowerUp state (continued)

Module State

Real-time clock, Wake-up timer, and Power
Management module

Internal baseband quartz oscillator

Internal baseband modules

Running

Powered on and then baseband clock distribution is
switched off

Initiailzed with default settings and can now be
programmed via the SPI interface

Bringing to Standby state

When the chip is brought from PowerUp state into Standby state, all blocks are powered up
except the baseband distribution, which remains switched off. The activation time to bring
the chip into Standby state from PowerUp state is approximately 5 ms, depending on the
speed of the baseband quartz oscillator.

Wake-Up Sources for PowerUp state

The chip is brought to PowerUp state by a wake-up source. This is either a RTC wake-up
event or an alarm event (a rising or falling edge) at one of the digital IOs configured as a
wake-up source. Ta bl e 2 1 lists the fields used to set a wake-up event.

Table 21. Fields for setting a wake-up event

Field Offset Description

EnableWakeUpRtc 0x06

EnableWakeUpDio 0x06 Enable a digital IO pin as a wake-up source. Default is disabled.

Enable the Real-time clock as a wake-up source. Default is
disabled.

8.8 Standby state

When the chip is In Standby state, only the baseband clock distribution is switched off. All
other blocks of the chip are fully powered.

Figure 19. Standby state

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TN100 Power management

Digital IO Control

ON PWD

DDDL Memory

SPI Controller

Real-Time Clock

CSQ Memory

Others

Baseband Control

Radio Control

Power Management

(4 kHz)

D[3:0]

Pamp

SPI

µCirq

µCReset

µCVcc

Protection

Powered =

Current Consumption

The current consumption during Standby state is approximately 2.5 mA.

Bringing to Ready state

To bring the chip into Ready state, the baseband clock distribution is switched on. Activation
time to bring the chip into Standby mode from PowerUp mode is 6 µs @ 4 Mbit/s SPI
(without reconfiguration).

8.9 Ready state

When the chip is In Ready state, the baseband clock distribution is switched on and the
microcontroller can immediately initiate a packet transmission or reception.

Figure 20. Ready state

Current Consumption

The current consumption during Ready mode is approximately 4 mA.

8.10 Powering off the chip

When the chip is completely powered off, which is when the power source is disconnected
from the chip, both the ON and PWD sections are powered off and all chip settings are lost.
The connection between the microcontroller (master device) and the chip (slave device) are
lost and the Local Oscillator will require recalibration.

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Programming interface (SPI) TN100

ON PWD

D[3:0]

SPI

Others

Baseband Control

Radio Control

SPI Controller

Digital IO Control

Real-Time Clock

SPI Requests

Power Management

(4 kHz)

Protection

9 Programming interface (SPI)

This section describes the programming interface (SPI) to the TN100 transceiver, including
descriptions of the SPI Controller, signals, interface connections, timing, and address
format.

The TN100 transceiver is programmed through the use of a synchronous Serial Peripheral
Interface (SPI) interface. This SPI interface is used to write control bits into memory
locations in the chip register and baseband RAM locations. The SPI communicates via the
SPI bus between a master device, such as a microcontroller, and one or more slave devices,
including the TN100 transceiver and any serial memory devices.

9.1 SPI controller

All SPI requests are distributed through the SPI Controller, whether in the PWD section or
the ON section of the TN100 transceiver. In particular, the SPI Controller, which uses the
SPI clock, directs SPI requests to the appropriate registers. All registers written by the SPI
Controller are run with SPI clock, with the exception of Read Only registers.

Note: SPI requests are only possible when the PWD section of the chip is powered, as the SPI

Controller is located in this section. See Section 9.1.1: SPI controller and power

management on page 42.

Figure 21 shows the flow of SPI requests in the PWD and On sections.

Figure 21. SPI Controller

9.1.1 SPI controller and power management

PowerdownModeFull: When the chip is in PowerdownModeFull state the PWD section is

completely powered down to reduce chip power consumption, which means all register
settings are lost. However, the ON section retains a small amount of power to save specific
chip settings related to the Digital IO pins, the real-time clock, and Power Management.
Also, the connections between a microcontroller and the SPI Controller is protected to
enable the chip to quickly wake-up and to be fully operational in a very short time.

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TN100 Programming interface (SPI)

PowerDownModePad: When the chip is in PowerDownModePad state, the PWD section

remains powered, which means all register settings are maintained.

PowerUp: When the chip is in PowerUp state, the connection between the microcontroller
and the SPI Controller over the SPI bus is quickly reestablished. Then, depending on what
power down state was set, the microcontroller then initializes the registers in the PWD
section and (optionally) calibrates the Local Oscillator frequency.

9.1.2 SPI controller and registers

The SPI Controller contains a mirror of the registers in the ON part. This is done to save
power as less connections are maintained between the ON and PWD parts, especially for
those registers relating to Digital IO control.

The SPI Controller also include those registers that must be accessible when the baseband
clock is off, including:

● Pad controls – For example, registers for the SPI direction (MSB/LSB).

● Clock controls – For example, registers for enabling for baseband clock.

● Constants – For example, registers for the chip version and revision number.

9.2 SPI bit ordering

The SPI bit order of the TN100 transceiver is configurable, either LSB (Least Significant Bit
First) or MSB (Most Significant Bit First). To set the bit order for the SPI bus, use the field
SpiBitOrder, where:

● SpiBitOrder = 1: the first bit transmitted over the SPI is MSB.

● SpiBitOrder = 0: the first bit transmitted over the SPI is LSB.

The default bit order after reset or power-up is LSB first. Tab le 2 2 lists the field used to set
the SPI bit order.

Table 22. Bit order fields

Field Offset Description

SpiBitOrder (MSB/LSB first) 0x00 Sets the bit order for the SPI bus. Default is LSB.

Note: The byte order always remains the same.

9.3 SPI signals: SpiClk, SpiSsn, SpiTxD, SpiRxD

The SPI interface works as a half-duplex channel and uses the following four signals:

● SPI Clock – SpiClk

This is a clock signal applied by the microcontroller (master device).

● SPI Slave Select – /SpiSsn

This signal is used by the microcontroller (master device) to select the TN100
transceiver (slave device) for communication.

Note: This signal is specific to only one slave.

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Programming interface (SPI) TN100

● Data Transmit – SpiTxD

This signal is MISO (Master – Input; Slave – Output). With this signal, data is sent from
a slave device (such as the TN100 transceiver or other slave devices) to a master
device (microcontroller).

SpiTxD is programmable as either push-pull or open-drain pin. When more than one
slave device is connected to the SPI bus, the SpiTxD pin should be set to open drain
mode. See also Section 9.4: SPI TxD output driver on page 44.

Note: In open drain mode an external pull up resistor is required.

● Data Receive – SpiRxD

This signal is MOSI (Master – Output; Slave – Input). With this signal, data is sent from
a master device (microcontroller) to a slave device (such as the TN100 transceiver or
other slave devices).

9.4 SPI TxD output driver

The SPI TxD Output Driver can be set as either push-pull or open-drain by using
SpiTxDriver.

Open-Drain: In this setting, the pad is driven only when a logic 0 is sent from the TN100
transceiver to the SPI master. Otherwise, the output is in high-impedance state. Do the
following to set the SPI TxD output driver to open-drain:

● SpiTxDriver = 0

Push-Pull: The pad is driven in push-pull mode, but only when data is sent from the TN100
transceiver to the SPI master. Otherwise, the output is in high-impedance state. Do the
following to set the SPI TxD output driver to push-pull:

● SpiTxDriver = 1

Default value: The default value is SpiTxDriver = 0 (false).

Ta bl e 2 3 lists the field used to switch the TxD output driver between push-pull and open-

drain.

Table 23. SPI TxD output driver field

Field Offset Description

SpiTxDriver 0x00

Switches between push-pull and open-drain for the TxD output driver
(SpiTxD - pin 17).

44/235

TN100 Programming interface (SPI)

TN100
(Slave)

Microcontroller

(Master)

CLK

TxD

RxD

/CS1 (SSN)

SpiClk

SpiRxD

/SpiSSn

SpiT xD

MOSI

MISO

9.5 SPI bus timing values

Ta bl e 2 4 lists the timing values for the SPI bus.

Table 24. SPI bus timing values

Parameter Minimum Maximum Description

f

max

t

LC

t

HC

t

SS

t

HS

t

SRxD

t

HRxD

t

PDTxD

t

HTxD

t

PTxDZ

– 27 MHz SpiClk

18.5 ns – Low time SpiClk

18.5 ns – High time SpiClk

4 ns – /SpiSsn Setup

2 ns - /SpiSsn Hold

4 ns – SpiRxD Setup

2 ns – SpiRxD Hold

– 18.5 ns SpiTxD Propagation Delay Drive

2.5 ns – SpiTxD Hold

– 18.5 ns SpiTxD Propagation Delay High Impedance

9.6 SPI transfer rate

9.6.1 Maximum transfer rate

The maximum transfer rate for communication between the microcontroller (the master
device) and the TN100 transceiver (the slave device) is 27 MBit/s.

9.6.2 Bytes per transfer

For each SPI transfer, between 3 and 130 bytes (1-128 data bytes) can be sent per transfer.

9.7 SPI interface connections

The TN100 transceiver can be wired with an SPI master device with a four-wire, a three­wire, or multiple-slave configuration.

9.7.1 Four-wire configuration

Four-wire configuration is the standard configuration between the TN100 transceiver (slave)
and a microcontroller (master). It requires all four lines of the SPI interface, as illustrated in

Figure 22.

Figure 22. Four-wire option of the SPI

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Programming interface (SPI) TN100

9.7.2 Three-wire configuration

If only a single TN100 transceiver (slave) is connected to the microcontroller (master), then
the SpiSSn input pin can be connected to GND.

This configuration saves one pin on the SPI master device or makes the pin available for
other functions. This saves space on a circuit board, which is significant since many
applications using the TN100 transceiver require a small form factor. Also, if the SpiSSn pin
is driven with an active-low voltage level permanently, the power consumption of the TN100
transceiver is not increased.

9.7.3 Multiple slave configuration

If multiple slave devices (for example, multiple TN100 transceivers) are controlled by a
single master device, the /SpiSSn pin of each slave device is connected to the SSN pin on
the master device.

9.8 Read timing of the SPI bus

The read timing of the SPI bus is as follows:

1. After receiving the last address bit, the TN100 transceiver begins to switch the data bits
to SpiTxD.

2. On each falling edge of SpiClk, a new data bit is assigned.

3. The output starts driving with the first read data bit.

4. The timing of the SpiRxD pin that is used for length and address during read is
identical to the timing of the SpiRxD pin that is used during writing.

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TN100 Programming interface (SPI)

t

HS

/SpiSsn

t

LCtHC

t

SS

t

SRxD

t

HTxD

t

HD

. . .

SpiRxD = SpiMOSI

Address

bit 7

SpiTxD = SpiMISO

Bit 0

N-1 N

. . .

HiZHiZ

Address

SpiClk

Address

bit 6

Address

bit 5

t

PDTXD

. . .

Legend

Low

High

High impedance

Data bit

Don’t

care

Figure 23 shows the read timing of the SPI bus.

Figure 23. Read timing of the SPI bus

9.9 Write timing of the SPI bus

The write timing of the SPI bus is as follows:

1. On the first falling edge of the clock signal (SpiClk), with the master device SPI slave
select (/SpiSsn) being low, the first data bit is switched (sent) to SpiRxD.

2. As long as /SpiSsn is activated, the TN100 transceiver latches one data bit onto each
rising edge of the clock signal (SpiClk).

3. If several slave devices share the SPI bus, then the master device must control the
communication with slave-dedicated chip selects (/SpiSsn(n)).

4. To complete an operation to a specific SPI slave, the /SpiSsn signal must be set to
high after the last data bit has been transmitted.

47/235

Programming interface (SPI) TN100

SpiClk

. . .

t

HS

/SpiSsn

t

LC

t

HC

t

SS

t

SRxD

t

HRxD

t

HD

. . .

SpiRxD

31 ns

Bit 0

Bit N

Legend

Low

High

High impedance

Data bit Don’t care

. . .

Length

Start Address

Data

Byte 1: <Instruction>

Byte 2: <Address>

Byte N: 3 ≤ <N byte data> ≤ 130

RW

Figure 24 shows the write timing of the SPI bus.

Figure 24. Write timing of the SPI bus

9.10 SPI address format

The SPI of the TN100 transceiver implements a burst capable address mode with automatic
address increment. The SPI protocol has a variable data payload. Figure 25 shows the SPI
transfer format.

Figure 25. SPI transfer format

48/235

TN100 Programming interface (SPI)

9.10.1 Byte 1: instruction

The <Instruction> field has a fixed length of one byte and contains the command type
(read[0] / write[1]) as well as the number of data bytes:

MSB LSB

7 6 5 4 3 2 1 0

Direction Bit Data Bytes Size

● Bit 7 is the “direction bit” and is used to differentiate between read or write access,

where:

– Write access = 1

– Read access = 0

● Bits 0 to 6 provides the data byte size. This is the size of data that will be sequentially

written to the TN100 transceiver or read from the TN100 transceiver in an access
operation. The maximum length is 128 bytes, which is indicated by a 0x00 value.

9.10.2 Byte 2: address

The <Address> field has a fixed length of one byte and contains the first address to be
accessed. Additional data bytes are accessed at the addresses that follow the address
provided here.

MSB LSB

7 6 5 4 3 2 1 0

If the data payload is greater than one, the interface is used in burst mode with automatic
address increment.

9.10.3 N Bytes: data payload

The <Data Payload> field has a size (N) and can vary from one byte to 128 bytes. It
contains the data that is to be written to or read from the target register(s).

MSB LSB

7 6 5 4 3 2 1 0

Address Byte

Data Payload

...

Data Payload

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Programming interface (SPI) TN100

Length R

07 70

ADDR

SpiT xD

SpiRxD

70 70 70

Data 0 Data 1

. . .

/SpiSsn

Legend

Low

High

High impedance

Data bit Don’t care

9.11 SPI read operations

To read data from the TN100 transceiver, do the following:

1. In the <Instruction> field, set the direction bit to the value 0 (read data) and set the
data size, where the maximum size is 128.

2. In the <Address> field, set the source address.

3. Send the <Instruction> and <Address> data to the slave device(s).

4. Read in the resultant data from the slave device(s).

Figure 26 shows the timing of a read operation.

Figure 26. Read access (LSB first)

Note: The SpiTxD pin is activated into push-pull or open-drain mode only if the data payload

bytes are transmitted and if the slave device is selected through SpiSsn. Otherwise, the
SpiTxD pin is always in the high impedance state.

9.12 SPI write operations

To write data to the TN100 transceiver, do the following:

1. In the <Instruction> field, set the direction bit to the value 1 (write data) and set the
data size, where the maximum size is 128.

2. In the <Address> field, set destination address.

3. In the <Data Payload> field, set the data that will be written to the slave device(s).

4. Send the <Instruction>, <Address>, and <Data Payload> data to the slave
device(s).

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TN100 Programming interface (SPI)

Length W

07 70707070

ADDR Data 0 Data 1

/SpiSsn

SpiRxD

. . .

Legend

Low

High

High impedance

Data bit Don’t care

<0x83><0x23><0x11><0x22><0x33>

Instruction

field

Address

field

Data payload

field

The timing of a write operation is shown in the following figure:

Figure 27. Write access (LSB first)

Note: During a write operation the SpiTxD pin is always in the high impedance state.

9.12.1 Write access example

The following shows a write access example where three bytes (0x11, 0x22 and 0x33) are
written to three registers that start at the address location 0x23:

Instruction field

First, the chip needs to know if this request is a read or write command, and how many
bytes of data will be written to the register(s). In this example, the <Instruction> field has
a value of <0x83>, which has a binary value of 10000011, as shown below:

MSB LSB

7 6 5 4 3 2 1 0

1 0 0 0 0 0 1 1

Write

Access

Number of Bytes = 3

The bit direction is set to write with three bytes of data to follow that are to be written.

Address field

Next, the chip needs to know to where in the register these three bytes of data are to be
written (that is, which offset address to point to). In this example, the <Address> field has a
value of <0x23>, which has a binary value of 00100011, as shown below:

MSB LSB

7 6 5 4 3 2 1 0

0 0 1 0 0 0 1 0

Address location = 0x23

The data bytes are be written beginning at the offset address 0x23.

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Programming interface (SPI) TN100

0xFF

0x23

0x00

Start Address

00110011

00100010

00010001

...

256 bytes

0x24

0x25

...

N data fields (3 bytes)

Finally, include the data to be written beginning at the offset address 0x23. In this example,
the <Data Payload> field has the values 0x11, 0x22, and 0x33, which have the binary
values 00010001, 00100010, and 00110011, respectively, as shown in the following
diagram:

MSB LSB

7 6 5 4 3 2 1 0

0 0 0 1 0 0 0 1

0 0 1 0 0 0 1 0

0 0 1 1 0 0 1 1

The three values 00010001, 00100010, and 00110011 will be written to the chip registers
beginning at offset address 0x23, that is offset addresses 0x23, 0x24, and 0x25.

Figure 28 shows the location of the three registers in the chip register where the data

provided has been written.

Figure 28. Write access example memory map

52/235

TN100 Chirp sequencer (CSQ)

Column 2: RamIndex = 2

Column 1: RamIndex = 1

Column 0: RamIndex = 0

0723

Q Value 1

Q Value 0

I Value 0

0523

I Value 1

Programming Usage

1117

15

10 Chirp sequencer (CSQ)

This section describes in more detail the Chirp Sequencer RAM (CSQ) and how to program
it, if required. Normally the CSQ is pre-programmed.

10.1 Purpose of the Chirp sequencer

The Chirp Sequencer (CSQ) memory space contains the values for I and Q, which are used
to calculate Upchirps and Downchirps. The CSQ is set with a default matrix that has a
symbol duration of 4 µs (4000 ns) and a 22 MHz bandwidth.

Note: This section is provided for information purposes only and can be skipped if the Chirp

Sequencer will not be modified.

The output of the Chirp Sequencer delivers two sequences of 6-bit values that synthesize
the I and Q signals of a symbol. The Chirp Sequencer uses a table of two 6 bit wide columns
of 122 rows each. Both columns are read out simultaneously for each symbol that is
transmitted. These signals are then processed as follows:

1. Converted into an analog signal.

2. Low pass filtered.

3. Modulated onto the carrier frequency.

4. Transmitted over the air.

The Chirp Sequencer table is programmable and must be initialized over the SPI interface
by an initialization routine when the default matrix is not used. The use of a 6 bit value for
each row in the table can cause additional overhead because 8 bit values are used in the
SPI protocol and memory usually consist of bytes. Therefore, to avoid additional time for
data transactions and unnecessary increased code size, the Chirp Sequencer memory is
equipped with an 8 bit programming interface.

Three columns of 8 bits each are used for programming the CSQ, while four columns of 6
bits each are used by the TN100 transceiver to calculate the Upchirps and Downchirps.

Figure 29 illustrates these columns.

Figure 29. Programming and usage of the chirp sequencer RAM

53/235

Chirp sequencer (CSQ) TN100

Q

0

Q

1

Q

2

Q

3

Q

4

Q

5

Q

6

Q

7

Q

119

Q

120

Q

121

I

0

I

1

I

2

I

3

I

4

I

5

I

6

I

7

I

120

I

121

I

0

I

1

I

2

I

3

Q

0

Q

1

Q

2

Q

3

Q

4

Q

5

Q

6

Q

7

Q

121

Q

120

Q

119

I

4

I

5

I

7

I

121

I

120

I

6

8 bit8 bit8 bit 6 bit 6 bit

61

122

I/Q-Sequence-Format

Chirp Sequencer Programming Interface Format

Byte 2 Byte 1 Byte 0

On this programming interface, the Chirp Sequencer memory is translated into a table
containing three columns of 8 bits each with each column having 61 rows (see Figure 30).

Figure 30. Chirp sequencer programming interface format

Usually the I and Q sequences are given in two lists of 6 bit values. Before the data from
both lists can be written into the Chirp Sequencer memory, they must be formatted for the 8
bit programming interface. This can be done prior to the compilation because the I and Q
sequences are not commonly changed during the lifetime a software version.

10.2 Formatting the I and Q values

The I and the Q values are formatted for the programming interface as follows:

1. Read in 122 elements of both lists (I and Q) into two separate arrays (I and Q array).

2. Allocate a two dimensional array of 3 columns by 61 rows.

3. Get the first and second I-value from the I-array.

4. Shift the second I-value 6 bits to the left, while discarding the upper 4 bits and merge it
with the first I-value to an 8 bit value.

5. Write this 8 bit value to the first row of the least significant column (byte 0) of the two
dimensional array.

6. Proceed this way (repeat steps 3 to 5) with the next I-values until the I-array is
exhausted and the byte-0-column is filled up.

7. Get the second I-value from the I-array and the first Q-value from the Q-array.

8. Shift the second I-value 2 bits to the right, while discarding the lower 2 bits, shift the first
Q-value 4 bits to the left, while discarding the higher 2 bits and merge both to an 8 bit
value.

54/235

9. Write this 8 bit value to the first row of the middle column (byte 1) of the two
dimensional array.

TN100 Chirp sequencer (CSQ)

I1 = 11.1111b
I

2

= 10.0111b

Q

1

= 10.1000b

Q

2

= 10.0001b

+ : Means operation or

4. I

1

= 0011.1111b = 0011.1111b

I

2

<< 6 = 0010.0111b << 6 = 1100.0000b +

-------------------------------------------­row[0]column[0] = 1111.1111b

8. I

2

>> 2 = 0010.0111b >> 2 = 0000.1001b

Q

1

<< 4 = 0010.1000b << 4 = 1000.0000b +

-------------------------------------------­row[0]column[1] = 1000.1000b

12. Q

1

>> 4 = 0010.1000b >> 4 = 0000.0010b

Q

2

<< 2 = 0010.0001b << 2 = 1000.0100b +

-------------------------------------------­row[0]column[2] = 1000.0110b

10. Proceed this way (repeat steps 7 to 9) with the next odd I-value and the next even Q­value until both arrays are exhausted and the byte-1-column is filled up.

11. Get the first and second Q-value from the Q-array.

12. Shift the first Q-value 4 bits to the right while discarding the lower 4 bits, and then shift
the second Q-value 2 bits to the left and merge both to an 8 bit value.

13. Write this 8 bit value to the first row of the most significant column (byte 2) of the two
dimensional array.

14. Proceed this way (repeat steps 11 to 13) with the next Q-values until the Q-array is
exhausted and the byte-2-column is filled up.

10.3 CSQ writing example

Note: Only first row of CSQ writing is depicted.

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Packet and MACFrames TN100

Ta ilPreamble

SyncWord

MACFrame

LSB

MSB

11 Packet and MACFrames

This section describes TN100 transceiver packets, including general packet types and the
Preamble, MACFrame, and Tail fields in a packet.

11.1 General packet format

Each packet consists of four frame fields: a Preamble, a SyncWord, a MACFrame, and a
Tail.

Figure 31. General packet format

Note: All bits in the fields are transmitted with the LSB first.

The bit and symbol size of each of these fields are described in Ta bl e 2 5 for the 2ary
modulation system, which is one bit per symbol.

Table 25. 2ary packet format

Field Bits Symbols

Preamble 30 30

SyncWord 64 64

MACFrame 80 to 114,996 80 to 114,996

Ta il – 4

11.2 General packet types

All packet types require the Preamble, the SyncWord and the Tail fields. Tab le 2 6 lists the six
different packet types defined in a TN100 transceiver system:

Table 26. TN100 defined packet types

Packet Type Name Description

Data Data The MACFrame of a Data packet can contain up to 8192 data bytes.

Acknowledgement Ack Acknowledges the successful reception of a Data packet.

Broadcast Brdcast

Time Beacon TimeB Gives all stations in range time information.

Request to Send Req2S

Clear to Send Clr2S

Give specific information to either all stations in range (a broadcast
message) or only a group of stations in range (a multicast message).

Requests a frame transmission and reserves bandwidth by a station
in a randomly accessed medium (CSMA/CA).

Confirms a requested frame transmission of a station through a
Req2S in a randomly accessed medium (CSMA/CA) and indicates
that a Data packet can be transmitted.

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TN100 Packet and MACFrames

Preamble

SyncWord

MACFrame

Ta il

30 symbols

Preamble

SyncWord

MACFrame

Ta il

64 bits

11.3 Preamble field

The Preamble field is a fixed-length sequence of length MacPreambleSymbols (30)
symbols in the 2ary modulation system and is used to facilitate AGC calibration and bit
synchronization.

Figure 32. Preamble field

Note: MacPreambleSymbols is defined in Appendix A: Attributes and constants on page 221.

The sequences of symbols in the Preamble should use following modulation system:

● Upchirp/Downchirp – an alternating sequence of Upchirp/Downchirp pulses.

11.4 SyncWord field

The SyncWord entity is a 64 bit code word derived from a 24-bit logical network ID (LNID)
and is used for frame synchronization.

Figure 33. SyncWord field

Different SyncWords can be used to facilitate frame synchronization on packets from
different stations, networks, or logical channels. They are based on a (64,30) expurgated
block code with the PN-overlay 0x03848D96BBCC54FC to get good auto correlation
properties. A Hamming distance of 14 is guaranteed between SyncWords based on different
LNIDs to allow frame synchronization with the presence of bit errors.

The following steps describe how the SyncWord is generated:

1. The information sequence is generated by appending 6 bits to the 24 bit LNID. If the
MSB of the LNID equals the value “0”, then the appended bits are 010101. If the MSB
of the LNID is the value “1”, then the appended bits are 101010.

2. The information sequence is pre-scrambled by XORing it with the bits 34 to 63 of the
pseudo-random noise (PN) sequence (0x03848D96BBCC54FC).

3. The parity bits are created through polynomial division of the information sequence by
the generator polynomial 260534236651 (in octal notation). Parity bits are the rest of
the division.

11.5 MACFrame field

The contents of the MACFrame field defines the packet type. The size of the MACFrame can
range from 80 bits for an Ack packet to 114,996 bits for a Data packet using FEC. The
MACFrame field can consist of up to 10 fields depending on the packet type, as shown in

Figure 34.

57/235

Packet and MACFrames TN100

Preamble

SyncWord

MACFrame

Ta il

80 bit to 114,996 bits

Data

(1…MacDataLengthMax) *

8 bits

CRC1

16 bits

Frame

Control

3 bits

Length

13 bits

Address2

48 bits

Address1

48 bits

Type
Code

4 bits

Crypt

4 bits

ScInit

7 bits

CryptEn

1 bit

CryptId

2 bits

CryptSeqN

1 bit

CRC2

16 bits

or

32 bits

1

bit

Packet body = 24 bits to 114,744 bits

Packet header = 144 bits

= undefined

Figure 34. MACFrame field

Note: FEC can be performed over all fields of the MACFrame.

The following provides a detailed description of all possible fields in a MACFrame entity.

ScrInit (ScramblerInit)

The ScramblerInit (ScrInit) field is used to initialize the bit scrambler at the beginning of
the receive cycle. The transmitter must set this field with the initial value of the
scrambler since this value is not known at the receiver. This value can be changed for
every packet.

The receiver uses the ScramblerInit value for descrambling the MACFrame. Scrambling
is performed over all fields of the MACFrame (except the ScramblerInit field) to
randomize the data using highly redundant patterns so that the probability of large zero
patterns is minimized.

Crypt (EncryptionControl)

The EncryptionControl (Crypt) field is 4 bits in length and consists of the encryption
enable switch (CryptEn), the encryption ID (CryptID), and the sequential numbering
scheme (CryptSeqN) for encryption.

The CryptEn bit is used to indicate that encryption is used.

The 2 bit CryptID field, which is used for encrypted Data, Brdcast and TimeB packets,
selects one of four secret keys (CryptKey, CryptClock) which are found in page one of
RAM.

The CryptSeqN bit, which always starts with zero, increments CryptClock if the current
CryptSeqN bit is unequal to the previous bit.

TypeCode

The TypeCode field is 4 bits in length. It identifies the packet type. Possible values
include Data, Ack, Brdcast, TimeB, Req2S, and Clr2S.

A device that receives a frame with an invalid TypeCode will discard the packet without
indication to the sending station or to the LLC.

Address1

The Address1 field is 48 bits in length and contains the destination address in all packet
types, with the exception of the TimeB packet where the Address1 field contains a real­time clock value.

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TN100 Packet and MACFrames

FragC

1 bit

Frame

Control

3 bits

SeqN

1 bit

LCh

1 bit

Address2

The Address2 field is 48 bits in length and contains the source address in Data,
Brdcast, TimeB and Req2S packet types.

Length

The Length field is 13 bits in length and specifies the number of bytes of the Data field.
It exists only in the Data, Brdcast, TimeB, Req2S and Clr2S packet types.

All bits set to “0” indicate a Data field of 8192 bytes. The maximum Length value
allowed in a subset of this specification is defined by the MacDataLengthMax attribute.
A station receiving a MACFrame with a value greater than the MacDataLengthMax
(Data packet) or the MacBrdCastLengthMax (Brdcast packet) discards the packet
without indication to the sender or to the LLC.

Note: MacDataLengthMax and MacBrdCastLengthMax are defined in Appendix A: Attributes and

constants on page 221.

FrameControl

The FrameControl field is 3 bits in length and is transparent for the TN100 transceiver.
For TX, these bits are loaded from RAM together with the TxLength field and sent in the
MACFrame. For RX, these bits are stored in RAM together with the RxLength field
received in the MACFrame where they can be read and used by an application.

In several applications the FrameControl field is used on the software level to
implement functions such as Link Control Channel (where the third bit is defined as a
logical channel bit LCh), a sequential numbering scheme (where the second bit is
defined as a sequence numbering bit SeqN), and/or a packet fragmentation scheme
(where the first bit is defined as a fragmentation control bit FragC). These bits are as
shown in Figure 35.

Figure 35. FrameControl field used for Network Protocol

CRC1

The CRC1 field is 16 bits in length and performs a Cyclic Redundancy Check over the
MACFrame header information. The CRC1 allows a checking of the integrity of the
protocol information (such as addresses and length) in the MACFrame so that the
MACFrame header information is immediately verified and is independent of the CRC
mode of the data packet.

The CRC1 is calculated on the following MACFrame fields: EncryptionControl,
TypeCode, Address1, Address2, and Length.

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Packet and MACFrames TN100

Data

(1…MacDataLengthMax) * 8

bits

CRC1

16 bits

Frame

Control

3 bits

Length

13 bits

Address2

48 bits

Address1

48 bits

Type

Code

4 bits

Crypt

4 bits

ScInit

7 bits

CRC2

16 or

32 bits

1

bit

= undefined

Data

The Data field is a variable length field that contains the data for the logical channels. It
exists only in the Data and Brdcast packets. The Length field specifies the length in
bytes of the Data field.

The minimum length is one byte. The maximum length is defined by the
MacDataLengthMax and MacBrdcastLengthMax attributes, which is 8192 bytes.

Note: MacDataLengthMax and MacBrdCastLengthMax are defined in Appendix A: Attributes and

constants on page 221.

CRC2

The CRC2 field is 16 or 32 bits in length and performs a cyclic redundancy check on
the Data field of Data and Brdcast packets. Different polynomials of 16 or 32 bit lengths
are defined and can be selected.

11.5.1 MACFrame of a data packet

The MACFrame of a Data packet contains up to 8192 data bytes. A Data packet MACFrame
is shown in Figure 36.

Figure 36. MACFrame format of Data packet

The following fields have information that is specific to the Data packet:

TypeCode Contains the type code of the Data packet.

Address1 Contains the destination address (DestinationAddress).

Address2 Contains the source address (SourceAddress).

Length Contains the length of the Data packet in bytes.

FrameControl These bits are transparent to the TN100 transceiver. They are
used in Ranging Application Software, as follows:

Table 27. Ranging Data Packets

Ranging Data Packet Type Value

Normal Data Packet 0x00

Ranging_Start Packet 0x01

Ranging_Answer1 Packet 0x02

Ranging_Answer2 Packet 0x03

Ranging_Fast_Start Packet 0x04

Ranging_Fast_Answer1 0x05

Note: FragC bit (bit 1) = LSB. LCh bit (bit 3) = MSB.

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TN100 Packet and MACFrames

CRC1

16 bits

Address1

48 bits

Type

Code

4 bits

0x0

4 bits

ScInit

7 bits

1

bit

= undefined

Data

(1…MacDataLengthMax) * 8

bits

CRC1

16 bits

Frame

Control

3 bits

Length

13 bits

Address2

48 bits

Address1

48 bits

Type

Code

4 bits

Crypt

4 bits

ScInit

7 bits

CRC2

16 bits

or

32 bits

1

bit

= undefined

Data

The maximum length of the Data field used in an implementation subset of this
specification is defined by the MacDataLengthMax attribute.

If messages with more than MacDataLengthMax bytes have to be transmitted, they can
be fragmented into several Data packets of different lengths. If a Data packet is
received with more than MACDataLenghtMax bytes, it is discarded without indication to
the sender or to the LLC.

Note: MacDataLengthMax is defined in Appendix A: Attributes and constants on page 221.

11.5.2 MACFrame of an acknowledgement (Ack) Packet

An Ack packet is sent by the receiver to acknowledge the successful reception of a Data
packet. The MACFrame of an Ack packet is shown in Figure 37.

Figure 37. MACFrame format of an Ack packet

The following fields have information that is specific to the Ack packet:

TypeCode Contains the type code of the Ack packet.

Address1 Contains the destination address (DestinationAddress).

11.5.3 MACFrame of a broadcast (Brdcast) packet

A Brdcast packet is sent by a station to give specific information to either all stations in range
(a broadcast message) or only a group of stations in range (a multicast message). The
MACFrame of a Brdcast packet is shown in Figure 38.

Figure 38. MACFrame format of a Brdcast packet

The following fields have information that is specific to the Brdcast packet:

FrameControl

Since a Brdcast packet is sent as a broadcast to more than one station, it must not be
acknowledged by any station receiving the packet. Because of the lack of
retransmission possibilities for Brdcast packets (unacknowledged transmission)
fragmentation is impossible. Therefore, the FragC and SeqN bits must be set to the
value “0”.

Data

The maximum length of the Data field used in a implementation subset of this
specification is defined by MacBrdCastLengthMax attribute. If a Brdcast packet is

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Packet and MACFrames TN100

Data

(1…MacDataLengthMax) * 8

bits

CRC1

16 bits

Frame

Control

3 bits

Length

13 bits

Address2

48 bits

Address1

48 bits

Typ e

Code

4 bits

Crypt

4 bits

ScInit

7 bits

CRC2

16 bits

or

32 bits

1

bit

= undefined

received with more than MACBrdCastLengthMax bytes, it will be discarded without
indication to the LLC.

Note: MacBrdCastLengthMax is defined in Appendix A: Attributes and constants on page 221.

TypeCode

Contains the type code of the Brdcast packet.

Address1

Contains either a broadcast address (BroadcastAddress) or a multicast address
(MulticastAddress).

Address2

Contains the source address (SourceAddress).

Length

Contains the length of the packet in bytes.

11.5.4 Time beacon packet (TimeB) MACFrame

A TimeB packet is sent by a station to give all stations within range time information. This
packet allows synchronization of the real-time clocks of stations. Since the time beacon is
sent as a broadcast to more than one station, it must not be acknowledged by any station
receiving it. A TimeB packet MACFrame is shown in Figure 39.

Figure 39. MACFrame format of TimeB packet

The following fields have information that is specific to the TimeB packet:

Address1

The Address1 field carries a 48 bit real-time clock value (RTCvalue).

The transmitting station must adjust the RTCvalue before sending it over the physical
interface (antenna). When the last bit (MSB) of the RTCvalue appears on the antenna,
the value must be identical to the real-time clock value of the transmitting station. This
is required to compensate for transmitter delay.

Additionally, the receiving station must adjust the RTCvalue before updating its real­time clock. When the TimeB packet has been processed, the RTCvalue must be
adjusted to compensate for receiver delay.

Address2

The Address2 field contains the source address (SourceAddress) of the TimeB packet.

Data

The Data field of the TimeB packet can be used to transmit a signature to authenticate
the RTCvalue and the source address of the TimeB packet or to broadcast specific
information.

TypeCode

Contains the type code of the TimeB packet.

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TN100 Packet and MACFrames

CRC1

16 bits

Frame­Control

3 bits

Length

13 bits

Address2

48 bits

Address1

48 bits

Typ e

Code

4 bits

0x0

4 bits

ScInit

7 bits

1

bit

= undefined

CRC1

16 bits

0b000

3 bits

Length

13 bits

Address1

48 bits

Type
Code

4 bits

0x0

4 bits

ScInit

7 bits

1

bit

= undefined

Length

Contains the length of the packet in bytes.

FrameControl

Only the LCh bit is defined.

11.5.5 Request to send (Req2S) packet MACFrame

The Req2S packet requests a frame transmission and reserves bandwidth by a station. The
requested station responds with a Clear to Send packet (Clr2S) to the requesting station. A
Req2S packet MACFrame is shown in Figure 40.

Figure 40. MACFrame format of Req2S packet

The following fields have information that is specific to the Req2S packet:

Length

The Length field indicates the length of the Data packet (in bytes) of the requested
transmission.

TypeCode

Type code of the Req2S packet.

Address1

Contains the destination address (DestinationAddress).

Address2

Contains the source address (SourceAddress).

FrameControl

These fields are undefined.

11.5.6 Clear to send (Clr2S) packet MACFrame

The Clr2S packet confirms a requested frame transmission of a station through a Req2S
packet, indicating that a Data packet can be transmitted. The Addess2 and Length fields are
copied from the Req2S packet and sent back to the requesting station. A Clr2S packet
MACFrame is shown in Figure 41.

Figure 41. MACFrame format of Clr2S packet

The following fields have information that is specific to the Clr2s packet:

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Packet and MACFrames TN100

Preamble

SyncWord

MACFrame

Ta il

MACTailSymbols

TypeCode

Contains the type code of the Clr2s packet.

Address1

Contains the destination address (DestinationAddress).

Length

Contains the length of the packet in bytes.

FrameControl

These fields are undefined.

11.6 Tail field

The Tail field is used as a delimiter between the end of a packet. Tail symbols are required in
on-off-keying systems for the physical carrier sensing mechanism. For instance, consecutive
off-symbols at the end of a packet and the following interframe space interval could be
misinterpreted by stations trying to access the media as a physically idle medium.

Figure 42. Tail field

The Tail is a fixed-length sequence of MacTailSymbols (4) bits defined below for the
modulation systems:

● Upchirp/Downchirp – an alternating sequence of Upchirp and Downchirp pulses.

● Upchirp/Off – a continuous sequence of Upchirp pulses.

● Downchirp/Off – a continuous sequence of Downchirp pulses.

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TN100 Frame control scheme

LCh = 1FragC

1 bit

Data

(1…MacDataLengthMax) * 8

bits

CRC1

16 bits

Frame

Control

3 bits

Length

13 bits

Address2

48 bits

Address1

48 bits

Type
Code

4 bits

Crypt

4 bits

ScInit

7 bits

SeqN

1 bit

1 bit

CRC2

16 bits

or

32 bits

1

bit

= undefined

LCCh

-01 Transceiver Chip

DLL

Physical Layer (PHY)

Media Access Layer (MAC)

Link Control Manager

(LCM)

Data Link Layer

-01 Transceiver Chip

Physical Layer (PHY)

Media Access Layer (MAC)

Link Control Manager

(LCM)

Data Link Layer

Station one Station two

12 Frame control scheme

This section describes a frame control scheme that can be implemented in software. This
schemes use the FrameControl field of the MACFrame, which is transparent to the TN100
transceiver.

12.1 Logical channels

The Link Control Manger should be implemented in the Data Link Layer. The following
describes the settings of the LCh bit in the FrameControl field which selects between the
Link Control Channel and the User Data Channel.

12.1.1 Link control channel

The LCh bit is used to distinguish between the two logical channels (LCCh and UDCh). A
value “0” indicates the user data channel (UDCh) while a value “1” indicates the link control
channel (LCCh).

The Link Control Channel (LCCh) carries control information that is exchanged between the
Link Control Managers (LCM) of two stations. The LCCh is indicated by the Logical Channel
bit (LCh) set to the value “1” in the FrameControl field of Data or Brdcast packets.

Figure 43. LCh field set to LCCh

Information exchanged between two stations via the Link Control Channel is shown in

Figure 44.

Figure 44. Link control channel

Note: For more details, see Section 12.2: Link control management on page 66.

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Frame control scheme TN100

LCh = 0FragC

1 bit

Data

(1…MacDataLengthMax) * 8

bits

CRC1

16 bits

Frame

Control

3 bits

Length

13 bits

Address2

48 bits

Address1

48 bits

Type
Code

4 bits

Crypt

4 bits

ScInit

7 bits

SeqN

1 bit

1 bit

CRC2

16 bits

or

32 bits

1

bit

= undefined

UDCh

-01 Transceiver Chip

DLL

Physical Layer (PHY)

Media Access Layer (MAC)

Link Control Manager

(LCM)

Data Link Layer

-01 Transceiver Chip

Physical Layer (PHY)

Media Access Layer (MAC)

Link Control Manager

(LCM)

Data Link Layer

Station one Station two

DLL Data DLL Data

12.1.2 User data channel

The User Data Channel (UDCh) carries user data that is exchanged between the Data Link
Controls (DLC) of two stations. The UDCh channel is indicated by the Logical Channel bit
(LCh) set to the value “0” in the FrameControl field of Data or Broadcast packets.

Figure 45. LCh field set to UDCh

Information exchanged between two stations via the User Data Channel is shown in

Figure 46.

Figure 46. User data channel

12.2 Link control management

Link Control Management Protocol (LCMP) messages are used for link set-up, security, and
control. They are transferred in the Data field instead of user data and are indicated by a bit
with the value “1” in the LCh of the FrameControl field. The messages are filtered out and
interpreted by the Link Control Management (LCM) on the receiving side and are not
propagated to higher layers.

LCMP messages have higher priority than user data. This means that if the LCM needs to
send a message, it is not delayed by user data traffic, although it can be delayed by many

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retransmissions of individual packets.

TN100 MACFrame configuration (Auto/Transparent)

DataCRC1

Frame

Control

LengthAddress2Address1

Type

Code

CryptScInit CRC2

= undefined

Preamble

SyncWord

MACFrame

Ta il

13 MACFrame configuration (Auto/Transparent)

This section explains how to configure the MACFrame in Auto and Transparent mode.

A transmitted or received packet contains a Preamble, a SyncWord, the MACFrame, and a
Tail, which are used by the TN100 transceiver to help process the received packet. The
MACFrame, however, contains the raw data which is used by upper layers.

Figure 47. MACFrame contents

The TN100 transceiver provides a wide range of features that can be automatically set in the
MACFrame as it is prepared for transmission, or read out when a MACFrame is received.
These include Forward Error Correction, Encryption, Address Matching, and so on.
However, the chip provides the option of allowing software to configure the MACFrame.
These two modes are Auto Mode and Transparent Mode:

● In Auto mode, for TX, the MACFrame is configured by automatically by hardware (the

TN100 transceiver) using data provided in chip register settings and buffers, while for
RX, the hardware (the TN100 transceiver) parses the received MACFrame and stores
the resultant values in chip registers and buffers for further use by software.

● In Transparent mode, for TX, software configures and prepares the MACFrame and

stores in in a buffer for transmission, while for RX, the MACFrame is “transparent” to the
chip and stores the entire MACFrame in a buffer for further use by software.

13.1 Field for setting MACFrame auto and transparent mode

The following field is used for setting MACFrame Auto and Transparent Mode.

Table 28. Wake-up time fields

Field Offset R/W Description

TxRxBbBufferMode0 0x4A

WO
brst

BbClk

Sets the TX and RX data as either two segments
(Auto) or all four segments (Transparent).

13.2 MACFrame auto mode

When the TN100 transceiver is set to Auto Mode, the MAC header values and data payload
used for TX and RX are stored in a single buffer which has been divided into an upper and a
lower part. The upper half stores MAC header data while the lower half stores the packet
payload.

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MACFrame configuration (Auto/Transparent) TN100

MAC Header

Payload

Baseband RAM buffer

Upper half

Lower half

Payload

Payload

Baseband RAM buffer

Upper half

Lower half

Figure 48. Auto mode

For TX, the digital part of the chip builds the MAC header using values stored in chip buffers
and registers, including the payload data. Additional packet requirements (Preamble,
SyncWord and Tail) are added to this completed MACFrame and the packet is transmitted.

For RX, the Preamble, SyncWord and Tail are removed and the MAC header and payload of
extracted MACFrame are stored in chip registers and buffers. Software can then read out
the resultant MAC header values and payload data.

13.2.1 Setting MACFrame auto mode (default)

To set MACFrame Auto mode, do the following:

● Set TxRxBbBufferMode0 = 0x0

Note: Auto mode is the default setting (0x0)

13.3 MACFrame transparent mode

When the TN100 transceiver is set to Transparent Mode, MAC header values and data
payload are prepared in software and a complete MACFrame must be provided to the chip.
A single buffer is used to store the MACFrame, where both the upper half and the lower half
are available for storing the complete MACFrame.

Figure 49. Transparent mode

For TX, software builds the MACFrame by assembling the MAC header and payload data.
This assembled MACFrame is placed in the a baseband RAM buffer(s). The TN100
transceiver builds the packet by using this MACFrame and additional packet requirements
(Preamble, SyncWord and Tail) after which the packet is transmitted.

For RX, the Preamble, SyncWord and Tail are removed and the MACFrame is extracted
from the packet and stored in the baseband RAM buffer. This MACFrame is read out and
provided to an application for further processing.

13.3.1 Setting MACFrame transparent mode

To set Transparent mode for the MACFrame, do the following:

● Set TxRxBbBufferMode0 = 0x1

where

0x1 = NA_TxRxBufferMode0Transparent_BC_C

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TN100 Baseband RAM configuration

Baseband RAM Page 3

Register

128 bytes

0x300

0x37F

0x380

0x3FF

128 bytes

Baseband RAM Page 2

Register

128 bytes

0x200

0x27F

0x280

0x2FF

128 bytes

Baseband RAM Page 1

Register

128 bytes

0x100

0x17F

0x180

0x1FF

128 bytes

Baseband RAM Page 0

Register

128 bytes

0x000

0x07F

0x080

0x0FF

128 bytes

≅

Page 0

Page 1

Page 2

Page 3

14 Baseband RAM configuration

This section describes the four possible configurations of the baseband RAM using the
TX/RX buffer and MACFrame modes, which are Auto/Duplex, Auto/Simplex,
Transparent/Duplex, and Transparent/Simplex.

14.1 Overview

The 1024 byte memory space of the TN100 transceiver consists of four baseband RAM
segments totaling 512 bytes.

Note: See also Section 6: Memory map on page 23.

Each of the four segments has a 128 byte register space, three of which are mappings of
the chip register space (0x00 to 0x7F). The mappings of the register space and the four
baseband RAM segments are shown in Figure 50.

Figure 50. Baseband RAM memory space

14.1.1 Configurable spaces

The chip register memory space is non-configurable. Values written to the register address
spaces (0x00 - 0x7F, 0x100 - 0x17F, 0x200 - 0x27F and 0x300 - 0x37F) always access the
same Register Block (e.g. 0x00 is equivalent to 0x100, 0x200 and 0x300).

Baseband RAM, however, is configurable. Pages 0 to 3 of the Baseband RAM is
configurable to one of four mode combinations, as described in Ta bl e 2 9.

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Baseband RAM configuration TN100

Table 29. Baseband RAM configuration modes

Mode Description

Auto/Duplex Mode

Auto/Simplex Mode

Transparent/Duplex

Transparent/Simplex

14.2 Memory usage

Each combination of MACFrame configuration modes with Baseband buffer configuration
modes results in different memory usages. Tab le 3 0 shows the four possible combinations
with the resultant memory usage:

Table 30. Baseband memory usage

Memory usage Auto Transparent

Simplex 256 bytes (1 X 256 bytes) 512 bytes (1 X 512 bytes)

Duplex 256 bytes (2 X 128 bytes) 512 bytes (2 X 256 bytes)

Two separate data buffers of 128 bytes each of the baseband RAM are
used (Page 2 and Page 3).

Two baseband RAM pages of 128 bytes each are combined for a single
data buffer for both RX and TX (Page 2 and Page 3)

Two separate buffers of 256 bytes each are used for an RX data buffer and
a TX data buffer (Page 0, Page 1, Page 2 and Page 3).

a single 512 byte RX/TX data buffer is used sequentially for either a RX
data buffer or TX data buffer (Page 0, Page 1, Page 2 and Page 3).

14.3 Auto/Duplex mode

In Auto/Duplex mode, two separate data buffers of 128 bytes each of the baseband RAM
are used. Only half of the baseband RAM is used for data (256 bytes in total) while the other
half is used for MAC header values.

Table 31. Auto/Duplex mode configuration

Baseband RAM page Size Purpose

Page 0 and 1 256 bytes Both pages are used for MAC header values.

Page 2 128 bytes

Page 3 128 bytes Single page used for data payload of packets to be transmitted.

Single page used as a buffer for the data payload of received
packets.

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TN100 Baseband RAM configuration

0x300

0x37F

0x380

0x3FF

0x200

0x27F

0x280

0x2FF

0x100

0x17F

0x180

0x1FF

0x000

0x07F

0x080

0x0FF

≅

Transmit buffer: RamTxBuffer_O

Receive buffer RamRxBuffer_O

Includes: source station addresses,
TX and R X destination station
address, TX and RX data length,

Includes:128 bit encryption keys, TX
encryption clock value, RX decryption
clock value

Baseband RAM Page 3

Register

Baseband RAM Page 2

Register

Baseband RAM Page 1

Register

Baseband RAM Page 0

Register

Figure 51 shows Auto/Duplex buffer configuration.

Figure 51. Baseband RAM memory map for Auto/Duplex mode

14.3.1 Setting Auto/Duplex mode

The following settings are made to configure the Baseband RAM for Auto / Duplex mode:

● TxRxBbBufferMode0 = 0x0 (Auto)

● TxRxBbBufferMode1 = 0x0 (Duplex)

14.3.2 Start addresses of the RX/TX data buffers

The RX data buffer (set by RamRxBuffer_O) consists of two blocks of 64 bytes each,
where:

● Start address of lower block for RX = RamRxBuffer_0

● Start address of upper block for RX = RamRxBuffer_0 + 0x040

The TX data buffer (set by RamTxBuffer_O) consists of two blocks of 64 bytes each,
where:

● Start address of lower block for TX = RamTxBuffer_0

● Start address for upper block for TX = RamTxBuffer_0 + 0x040

Note: See also Section 18: Buffer access synchronization on page 83.

14.4 Auto/Simplex mode

In Auto/Simplex mode, two baseband RAM pages of 128 bytes each are combined for a
single data buffer for both RX and TX. Only half of the baseband RAM is used for data (256
bytes in total) while the other half is used for MAC header values.

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Baseband RAM configuration TN100

0x300

0x37F

0x380

0x3FF

0x200

0x27F

0x280

0x2FF

0x100

0x17F

0x180

0x1FF

0x000

0x07F

0x080

0x0FF

≅

TX/RX Data Buffer:

RamTxRxBuffer_0

Includes: source station addresses, TX
and R X destination station address,
TX and RX data length,
RX source address, TX and RX RTC
buffer

Includes: 128 bit encryption keys, TX
encryption clock value, RX decryption
clock value

Baseband RAM Page 3

Register

Baseband RAM Page 2

Register

Baseband RAM Page 1

Register

Baseband RAM Page 0

Register

Table 32. Auto/Simplex mode configuration

Baseband RAM page Size Purpose

Page 0 and 1 256 bytes Both pages are used for MAC header values.

Page 2 and 3 256 bytes

Both pages are used as a data buffer for the data payload of
received packets or packets to be transmitted.

Figure 52 shows a memory map of Auto/Simplex buffer configuration.

Figure 52. Baseband RAM memory map for Auto/Simplex mode

14.4.1 Setting Auto/Simplex mode

The following settings are made to configure the Baseband RAM for Auto/Simplex mode:

● TxRxBbBufferMode0 = 0x0 (Auto)

● TxRxBbBufferMode1 = 0x1 (Simplex)

14.4.2 Start addresses of the RX/TX data buffer

The TX / RX data buffer (set by RamTxRxBuffer_0) consists of two blocks of 128 bytes
each, where:

● Start address of lower block for RX and TX = RamTxRxBuffer_0

● Start address of upper block for RX and TX = RamTxRxBuffer_0 + 0x100

Note: See also Section 18: Buffer access synchronization on page 83.

14.5 Transparent/Duplex mode

In Transparent/Duplex mode, two separate buffers of 256 bytes each are used for an RX
data buffer and a TX data buffer. Software is responsible for configuring and reading the
MACFrame, including MAC header values and data payload.

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TN100 Baseband RAM configuration

0x300

0x37F

0x380

0x3FF

0x200

0x27F

0x280

0x2FF

0x100

0x17F

0x180

0x1FF

0x000

0x07F

0x080

0x0FF

≅

TX Data Buffer:

RamTxTransBuffer_0

RX Data Buffer:

RamRxTransBuffer_0

Baseband RAM Page 3

Register

Baseband RAM Page 2

Register

Baseband RAM Page 1

Register

Baseband RAM Page 0

Register

Table 33. Transparent/Duplex mode configuration

Baseband RAM page Size Purpose

Page 0 and 1 256 bytes Both pages are used as a data buffer for received packets.

Page 2 and 3 256 bytes

Both pages are used as a data buffer for packets to be
transmitted.

Figure 53 shows the memory map of Transparent/Duplex buffer configuration.

Figure 53. Baseband RAM memory map for Transparent/Duplex mode

14.5.1 Setting Transparent/Duplex mode

The following settings are made to configure the baseband RAM for Transparent/Duplex
mode:

● TxRxBbBufferMode0 = 0x1 (Transparent)

● TxRxBbBufferMode1 = 0x0 (Duplex)

14.5.2 Start addresses of the RX/TX data buffers

The RX data buffer (set by RamRxTransBuffer_0) consists of two blocks of 128 bytes
each, where:

● Start address of lower block for RX = RamRxTransBuffer_0

● Start address of upper block for RX = RamRxTransBuffer_0 + 0x100

The TX data buffer (set by RamTxTransBuffer_0) consists of two blocks of 128 bytes
each, where

● Start address of lower block for TX = RamTxTransBuffer_0

● Start address of upper block for TX = RamTxTransBuffer_0 + 0x100

Note: See also Section 18: Buffer access synchronization on page 83.

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Baseband RAM configuration TN100

0x300

0x37F

0x380

0x3FF

0x200

0x27F

0x280

0x2FF

0x100

0x17F

0x180

0x1FF

0x000

0x07F

0x080

0x0FF

≅

RX/TX Data Buffer:

RamTxRxTransBuffer

Baseband RAM Page 3

Register

Baseband RAM Page 2

Register

Baseband RAM Page 1

Register

Baseband RAM Page 0

Register

14.6 Transparent/Simplex mode

In this configuration, a single 512-byte RX/TX data buffer is used sequentially for either a RX
data buffer or TX data buffer. It consists of the complete baseband RAM memory space of
four 128 byte buffers. Software is responsible for configuring and reading the MACFrame,
including MAC header values and data payload.

Table 34. Transparent/Simplex mode configuration

Baseband RAM Page Size Purpose

Page 0, 1, 2, and 3 256 bytes

All pages are used as a single data buffer for either received
packets or packets to be transmitted.

Figure 54 shows the memory map of Transparent/Simplex buffer configuration.

Figure 54. Baseband RAM memory map for Transparent/Simplex mode

14.6.1 Setting Transparent/Simplex mode

The following settings are made to configure the baseband RAM for Transparent/Simplex
mode:

● TxRxBbBufferMode0 = 0x1 (Transparent)

● TxRxBbBufferMode1 = 0x1 (Simplex)

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TN100 Baseband RAM configuration

14.6.2 Start addresses of the RX/TX data buffer

The RX/TX data buffer (set by RamRxTransBuffer_0) consists of two blocks of 256 bytes
each, where:

● For the lower block:

– Start address of lower half = RamTxRxTransBuffer_0

– Start address of upper half = RamTxRxTransBuffer_0 + 0x100

● For the upper block:

– Start address of lower half = RamTxRxTransBuffer_0 + 0x200

– Start address of upper half = RamTxRxTransBuffer_0 + 0x300

Note: See also Section 18: Buffer access synchronization on page 83.

Warning: It is important to be aware that each of the two blocks are

spread over two segments.

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Buffer configuration (simplex/duplex) TN100

TX Buffer

RX Buffer

Baseband RAM buffer

First block

Second block

15 Buffer configuration (simplex/duplex)

This section describes how to configure the TX and RX buffers in Duplex and Simplex
mode.

15.1 Overview

The TN100 transceiver can process packets for transmit and receive sequentially or
simultaneously. In sequential mode or Simplex Mode, at any given time the chip can process
either received packets or packets for transmission. In simultaneous mode or Duplex Mode,
at any given time, the chip can process both received packets and packets for transmission.
Each mode requires a configuration of the baseband RAM.

15.2 Field for setting duplex and simplex mode

The following field is used for setting Duplex or Simplex mode for the baseband TX/RX
buffer.

Table 35. Wake-up time fields

Field Offset R/W Description

TxRxBbBufferMode1 0x4A

WO
brst

BbClk

Sets the data buffer for TX and RX as either two
blocks (Duplex) or a single block (Simplex).

15.3 Duplex mode (default)

In Duplex mode, the baseband RAM buffer is split into two blocks, one for TX and one for
RX. The TX and RX buffer operations are independent of each other. However, to allow
simultaneous TX and RX buffer operations, smaller buffers are available for MACFrame data
(MAC headers and data payload). The size of these blocks are dependent on the
MACFrame mode (Auto or Transparent). Duplex mode is the default setting.

Figure 55. Baseband buffer in Duplex mode

Note: See Section 13: MACFrame configuration (Auto/Transparent) on page 67.

15.3.1 Configuring the baseband RAM for Duplex mode

To set the baseband RAM for Duplex Mode, set TxRxBbBufferMode1 = 0x0

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TN100 Buffer configuration (simplex/duplex)

Both blocks used as a

single buffer

Baseband RAM buffer

TX Buffer

RX Buffer

15.4 Simplex mode

In Simplex mode, a single baseband RAM buffer of at least two pages is used for both TX
and RX. This results in a larger buffer available for the MACFrames. The size of the buffer is
dependent on the selection of MACFrame mode (Auto or Transparent).

Figure 56. Baseband buffer in Simplex mode

Note: See Section 13: MACFrame configuration (Auto/Transparent) on page 67.

15.4.1 Configuring the baseband RAM for Simplex mode

To set the baseband RAM for Simplex mode, set TxRxBbBufferMode1 = 0x1

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Buffer swapping between TX and RX buffers TN100

16 Buffer swapping between TX and RX buffers

This section discusses the buffer swap feature of the TN100 transceiver, which exchanges
the buffers between the baseband transmitter and receiver.

When enabled, data for the transmit operation are taken from the receive buffer, while data
of the receive operation are stored in transmit buffer. Buffer swapping significantly eliminates
the overhead of data transactions over the SPI interface and improves the decoupling
between transmit or receive processes and data transactions. Also, when enabled, if a
station is set up as an intermediate station (IS) for frame forwarding, the station does not
have to move data from the RX buffer to the TX buffer.

Note: When buffer swapping is enabled, only Auto / Duplex mode and Transparent / Duplex mode

can be enabled.

16.1 Enabling buffer swapping (duplex mode only)

When buffer swapping is enabled, data for the transmit operation is taken from the receive
buffer, while data of the receive operation are stored in transmit buffer. The following field is
used for setting up buffer swapping.

Table 36. Wake-up time fields

Field Offset RW Description

RW

SwapBbBuffers 0x4A

● SwapBbBuffers = 1 (True) – data for a transmit operation is taken from the

brst

BbClk

Exchanges RX and TX Baseband Buffers.

receive buffer while the data of a receive operation is stored in the transmit buffer.
Enable only for Auto / Duplex mode and Transparent / Duplex mode.

● SwapBbBuffers = 0 (False) – data in the buffers belong to their intended direction

(default state).

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TN100 Buffer swapping between TX and RX buffers

Segment 3

Segment 2

Segment 1

Segment 0

Buffer Mode = Auto/Duplex,

TxRxBbBufferSwp = False

TX

RX

Segment 3

Segment 2

Segment 1

Segment 0

Buffer Mode = Auto/Duplex,

TxRxBbBufferSwp = True

RX

TX

Does not

swap

Default State

Buffer Swapping Enabled

Segment 3

Segment 2

Segment 1

Segment 0

Buffer Mode = Transparent/Duplex,

TxRxBbBufferSwp = False

TX

RX

Segment 3

Segment 2

Segment 1

Segment 0

Buffer Mode = Transparent/Duplex,

TxRxBbBufferSwp = True

Default State

Buffer Swapping Enabled

RX

TX

16.2 Buffer swapping in auto / duplex mode

The following shows the default state for Auto / Duplex mode and when buffer swapping has
been enabled:

Figure 57. Auto / duplex mode default state and buffer swapping enabled

16.3 Buffer swapping in transparent / duplex mode

The following shows the default state for Transparent / Duplex mode and when buffer
swapping has been enabled:

Figure 58. Auto / transparent mode default state and buffer swapping enabled

16.4 Buffer swapping and frame forwarding

To eliminate the overhead of double data transactions over the SPI interface using store and
forward algorithm Buffer Swapping can be used. This results in less time wasted with SPI
communication and saves electrical energy.

When MACFrames are to be forwarded, the value of SwapBbBuffers has to be inverted
after a reception but before the next (forwarding) transmission of the MACFrame's (payload)
data. This eliminates three operations – reading out the data from the receive buffer, storing
it in the external microcontroller, and writing it back in the transmit buffer.

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Buffer swapping between TX and RX buffers TN100

16.5 Buffer swapping and short MACFrames

Buffer swapping can be used if two short MACFrames have to be transmitted or received in
a close sequence with a short time gap and the external microcontroller is not able to deliver
or consume data in the short time gap between two frames.

The buffer swapping feature eliminates SPI interface transactions for the data of short
MACFrames. Short MACFrames in Auto baseband mode are when the payload size is less
than or equal to 128 bytes. Short MACFrames in Transparent baseband mode are when the
number of transparent bytes is less than or equal to 256 bytes.

When frames have to be transmitted or received in close sequence, the value of
SwapBbBuffers has to be inverted between the two frames in sequence. Data for both
packets can be written to memory before the first one is transmitted or two packets can be
received completely before the data of both is read out.

Note: This feature can be used in the Duplex mode and only if the payload size is 128 bytes in

Auto baseband mode or if the frame size is 256 bytes in Transparent mode.

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TN100 Buffer control timing

External Microcontroller Software

MACFrame

MACFrame (Payload) Data

Data are taken from transmit buffers

Packet Begin

Packet End

TxBuffer[0]

TxBuffer[1]

TxBuffer[0]

TxBuffer[1]

TxBuffer[0]

[0] [1]

[0]

[0]

[1] [0]

t

t

Write TxBuffer[0]

Write TxBuffer[1]

Write TxBuffer[0]

[1]

[1]

Write TxBuffer[1]

[0]

[0]

Write TxBuffer[0]

Packet transmission is started

17 Buffer control timing

This section describes the control timing for transmit and receive buffers.

17.1 Transmit buffer control timing

Before transmitting a packet, the external microcontroller software fills up both upper and
lower transmit buffer segments with data. After each data transaction, the corresponding
buffer command is issued. The software then initiates the transmission of a packet.

Data for transmission is taken from the transmit buffers, but always beginning with the lower
buffer segment (Buffer[0]). The buffer ready flag indicates that a buffer segment has
been emptied and is ready to be filled up again. When the number of MACFrame (payload)
data bytes is not an integer number of the buffer segment size, the buffer ready flag is also
triggered when the last byte of the frame has been taken from a buffer segment. In this case,
it is not required to fill this buffer part up completely, but it is mandatory to issue the buffer
command.

A typical transmit buffer control timing is illustrated in Figure 59.

Figure 59. Transmit timing

A transmit underrun exception occurs (TxUnderrun) when the transmitter tries to send out
data from a buffer segment that was not beforehand filled up properly. The transmit
operation runs out of data and cannot be completed. The flag informs the software, which
usually treats the exception in its protocol stack.

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Buffer control timing TN100

External Microcontroller Software

MACFrame

MACFrame (Payload) Data

Data are taken from receive buffers

Packet Begin

Packet End

RxBuffer[0]

RxBuffer[1]

RxBuffer[0]

RxBuffer[1]

RxBuffer[0]

[0]

[0]

t

t

Read TxBuffer[0]

[1]

[1]

Read TxBuffer[1]

[0]

[0]

Read TxBuffer[0]

[1]

[0]

Read TxBuffer[1]

Read TxBuffer[0]

Packet transmission is started

[1] [0]

17.2 Receive buffer control timing

Before a packet can be received, software starts the reception of a packet. If the receiver
detects a packet, the MACFrame (payload) data is stored in the receive buffer segment, but
always beginning with the lower buffer segment (Buffer[0]). When the receiver has filled
up a buffer segment, the corresponding buffer ready flag is triggered. The corresponding
receive buffer can be emptied by software, which was indicated by the flag.

When the last byte has been read from a receive buffer segment, the software issues the
receive buffer ready command to indicate to the receiver that the buffer part has been read
out completely. If the number of MACFrame (payload) data bytes is not an integer number of
the buffer part size, the buffer ready flag is also triggered when the last byte of the frame has
been stored in a buffer part. In this case, it is not required to read out this buffer segment
completely, but it is mandatory to issue the buffer command.

A typical receive buffer control timing is illustrated in Figure 60.

Figure 60. Receive timing

A receive overflow exception occurs (RxOverflow) when the receiver tries to store a byte in
a buffer part that was not indicated as empty. The receive operation causes a data overflow
and cannot be completed properly. The flag informs the software, which usually treats the
exception in its protocol stack.

82/235

TN100 Buffer access synchronization

BufferRdy[0]

Buffer[0]

BufferCmd[0]

BufferRdy[1]

Buffer[1]

BufferCmd[1]

Upper buffer segment

Lower buffer segment

= command

= interrupt

18 Buffer access synchronization

This section describes the flags and commands used for buffer access synchronization.

18.1 Flags and commands

To avoid underrun or overflow exceptions of TX or RX data, the delivery or consumption of
data by an external microcontroller must be synchronized to the transmit or receive data
rate. Consequently, each TX and RX buffer is divided into two parts or blocks of equal length
– an upper part and a lower part. Additionally, each buffer has a flag and a command to
control the data traffic to and from the buffers. An example buffer is illustrated in Figure 61.

Figure 61. Example buffer showing upper and lower parts with flags and commands

Note: The size of the buffer depends on the selected buffer configuration mode.

A flag-command pair is provided for each buffer segment (lower and upper) and for each
direction (transmit and receive).

18.2 Receive and transmit flags

Flags indicate to the software that buffers are ready for a data transfer and are not accessed
by the transceiver baseband. Usually flags are enabled as interrupts so that the software
can react to a triggered flag as quickly as possible. The following tables lists the receive and
transmit flags.

Table 37. Receive flags

Flag Description

RxBufferRdy[0]

RxBufferRdy[1]

RxOverflow

Indicates to the software that RxBuffer[0] (lower segment) has been
filled up with data by a receive operation.

Indicates to the software that RxBuffer[1] (upper segment) has been
filled up with data by a receive operation.

Indicates to the software that a buffer part has been accessed by the
receiver, but was not ready to store data (a receive buffer command was
not issued in time).

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Buffer access synchronization TN100

Table 38. Transmit flags

Flag Description

TxBufferRdy[0]

TxBufferRdy[1]

Indicates to the software that TxBuffer[0] (lower segment) has been
emptied by a transmit operation and is ready to store new data.

Indicates to the software that TxBuffer[1] (upper segment) has been
emptied by a transmit operation and is ready to store new data.

Flag which indicates to the software that a buffer part has been

TxUnderrun

accessed by the transmitter but was not ready for transmission (means
that a transmit buffer command was not issued in time).

18.3 Receive and transmit commands

Commands are issued after a data transaction and indicate to the transceiver baseband that
data is ready for transmission or buffers are ready to store received data. The following
tables lists the receive and transmit commands.

Table 39. Receive commands

Command Description

Indicates to the transceiver that RxBuffer[0] (lower segment) has

RxBufferCmd[0]

RxBufferCmd[1]

Table 40. Transmit commands

been read out and the buffer is now ready to store new data of a receive
operation.

Indicates to the transceiver that RxBuffer[1] (upper segment) has
been read out and the buffer is now ready to store new data of a receive
operation.

Command Description

TxBufferCmd[0]

TxBufferCmd[1]

Indicates to the transceiver that TxBuffer[0] (lower segment) has
been filled up and data is now ready for transmission.

Indicates to the transceiver that TxBuffer[1] (upper segment) has
been filled up and data is now ready for transmission.

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TN100 Buffer access synchronization

Software

External Microcontroller

TRX

Transmitter/Receiver

Buffer Management Unit

Overflow / Underrun

BufferRdy[0]

Buffer[0]

(Lower segment)

BufferCmd[0]

BufferRdy[1]

Buffer[1]

(upper segment)

BufferCmd[1]

The following diagram shows the flags and commands for buffer access synchronization.

Figure 62. Flags and commands for buffer access synchronization

Note: Flags and commands are always related to their buffer segments, independent of buffer

size. Also, transmit buffer overflows are severe software errors and are not implemented.

85/235

Bit processing TN100

CRC Generation Encryption Scrambling FEC Encoding

CRC Checking Decryption Descrambling FEC Decoding

RF Inter-

MACFrame to transmit

Received MACFrame

Optional

Mandatory

CRC1

Frame

Control

LengthAddress2Address1

Type

Code

CRC2Data

19 Bit processing

This section describes the methods used in the TN100 transceiver for bit error detection,
forward error correction, bit scrambling, retransmission, and encryption.

19.1 Bit stream processes

Before application data is sent out over the air interface, several bit manipulations are
performed in the transmitter to increase reliability and security. These include:

1. Cyclic Redundancy Check (CRC), which is added to the MACFrame for error detection.

2. Encryption, which is optionally applied to the Data and CRC2 fields of the MACFrame.

3. Bit scrambling with a PRN-sequence.

4. Forward Error Correction (FEC) coding, which is optionally applied.

In the receiver, the reverse process is carried out. The following illustrates the processes:

Figure 63. Bit processing in transmitter and receiver

Note: CRC and bit scrambling processes are mandatory, while FEC and encryption can be

enabled by the application.

19.2 Cyclic redundancy check (CRC)

The purpose of the CRC scheme is to detect bit errors occurring during transmission. The
CRC field is a 16 or 32 bit field containing a Cyclic Redundancy Check. Two CRC fields are
defined in the MACFrame: CRC1 and CRC2.

Figure 64. CRC fields in MACFrame

19.2.1 CRC1 field

The CRC1 value is calculated over the following MACFrame header fields: TypeCode,
Address1, Address2, Length, and FrameControl. It is not calculated over the ScrInit and
Crypt fields. The CRC1 is appended to MACFrame header fields and transmitted with the
LSB first.

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TN100 Bit processing

19.2.2 CRC2 field

The CRC2 value, which is optional, is calculated over the Data field of Data and Brdcast
packets. Different polynomials of 16 or 32 bit lengths are defined and can be selected for the
CRC2. The CRC2 is appended to the Data field of the MACFrame and transmitted with the
LSB first.

19.2.3 CRC types 1, 2, and 3

Three CRC types are defined – CRC type 1, CRC type 2, and CRC type 3. The CRC1 field
uses only CRC type 1 whereas the CRC2 field can use any of the three CRC types or use
none. A user application can select an appropriate CRC type to satisfy error detection
requirements or specific customer demands.

● CRC type 1 (ISO/IEC 3309, CCITT X.25,X.75, ETS 300 125)

Length 16 bit
Polynomial 2
Initial value of LFSR 0xFFFF
CRC Ones complement of the LFSR
Check value of LFSR 0xF0B8

● CRC type 2 (IEC 60870-5-1)

Length 16 bit
Polynomial 2
Initial value of LFSR 0x0000
CRC Ones complement of the LFSR
Check value of LFSR 0xA366

● CRC type 3 (CCITT-32, Ethernet)

Length 32 bit
Polynomial 2
Initial value of LFSR 0xFFFFFFFF
CRC Content of the LFSR
Check value of LFSR 0xCBF43926

16+212+25

16+213+212+211+210+28+26+25+22

32+226+223+222+216+212+211+210+28+27+25+24+22

+1

+1

+2+1

19.3 Bit scrambling

Before transmission, all fields of the MACFrame, except the ScrambIerInit field, are
scrambled with a PRN-sequence to randomize the data into highly redundant patterns and
to minimize the probability of large zero patterns. At the receiver, the received data is
descrambled using the same PRN-sequence that was generated in the transmitter.

The PRN-sequence is generated with the polynomial g(D)= D7+D4+D0 (221 in octal
representation) and is subsequently EXORed with the MACFrame. Before each
transmission, the shift register must be initialized with a 7 bit value by the transmitting
station. The value should be changed for every new packet, even for retransmissions.

Note: No scrambling is performed when an initialization value of zero is programmed.

The initial value of the shift register is loaded in the ScrambIerInit field of the packet (LSB
first) and sent over the air interface. During reception of a MACFrame, the shift register of
the receiver descrambler is initialized with the bits from the ScramblerInit field.
Consequently, the remaining fields are subsequently EXORed with the same PRN­sequence.

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Bit processing TN100

19.4 Forward error correction (FEC)

Using Forward Error Correction (FEC) scheme on the MACFrame reduces the number of
retransmissions. However, in a reasonable error-free environment, FEC gives unnecessary
overhead that reduces the throughput. Therefore, the user application must decide whether
or not it should be applied. If FEC is applied, all MACFrame fields are elements of the FEC
algorithm.

The FEC scheme is a (7,4) shortened Hamming code and consists of 4 data bits and 3
parity bits. The parity bits are generated with the polynomial g(D)=D3+D+1. The LFSR
generating the parity bits is illustrated below.

The code is able to correct single bit errors and detect double bit errors within a codeword.
Consequently, a 14 bit code word can contain 2 bit errors even if the bit errors are
consecutive. This is achieved through the interleaving scheme.

The receiver informs the LLC about the number of bit errors that have occurred during the
reception and correction of a Data packet. This bit error number combined with the Length
field is an indication of the BER at the physical interface.

19.5 Encryption

The encryption process is applied to the Data and CRC2 fields of a MACFrame. This
process is based on a stream cipher with a symmetric key scheme. The stream cipher
sequence bits are XORed with the data bits before transmission or after reception. The
cipher stream is re-initialized for every packet (re-)transmission. Since the process is
reversible, the same cipher stream is used for encryption and decryption. Consequently, the
same input values are required for the generator in both the transmitter and the receiver.
The 32 bit clock value and the 48 bit address are publicly known while the 128 bit secret key
is generated during the encryption negotiation process and never disclosed.

To keep the probability very low of a successful correlation attack, the same cipher stream is
never used twice. The 32 bit clock value is changed (at least incremented by one) for every
new packet transmission.

88/235

TN100 Chirp modulation

t

Symbol

t

Symbol

t

Downchirp PulseUpchirp Pulse

t

20 Chirp modulation

This section describes describes the TN100 transceiver’s modulation technique, Chirp
Spread Spectrum (CSS), which was developed by Nanotron.

20.1 Chirp spread spectrum (CSS)

A chirp pulse is a frequency modulated pulse with a frequency that changes monotonic from
a lower value to a higher value (called an Upchirp) or from a higher value to a lower value
(called a Downchirp). These two chirp pulses are illustrated in Figure 65.

Figure 65. Upchirp and Downchirp pulses

The difference between these two frequencies is approximately the bandwidth B of the chirp
pulse. For this specification, Upchirps and Downchirps have the following characteristics:

● Chirp duration: t

● Symbol period: t

● Frequency bandwidth: B

= 0.5 µs, 1 µs, 2 µs, 4 µs

Symbol

= 0.5, 1, 2, 4 µs @ 80 MHz or 2, 4 µs @ 22 MHz

SPeriod

= 80 MHz, 22 MHz

Chirp

Note: Chirp duration is the time when a signal is present and the gap is not regarded. For

example, chirp duration is 0.5 µs and symbol period is 1 µs. Then symbol duration consists
of a 0.5 µs chirp signal and a 0.5 µs gap.

Using these chirp pulses, several different modulation systems can be selected to represent
binary symbols. These include:

● Upchirps and Downchirps

● On/Off Keying (Upchirp/Off and Downchirp/Off)

20.2 Secondary modulation systems

Using Upchirp and Downchirp and On/Off Keying, several secondary modulations systems
are possible.

20.2.1 Upchirp/downchirp modulation system

An Upchirp and a Downchirp could be used to represent binary symbols. For example, the
Upchirp could represent a bit value of “1” while the Downchirp could represent a bit value of
“0”.

89/235

Chirp modulation TN100

10100001

t

SPeriod

t

Upchirp Downchirp Downchirp Downchirp DownchirpUpchirp Upchirp

10100001

t

SPeriod

t

Upchirp Off Upchirp Off Off Off Upchirp

11011110

t

SPeriod

t

Downchirp OffDownchirp Downchirp Downchirp Downchirp Off

An example of an Upchirp/Downchirp pulse sequence is illustrated in Figure 66.

Figure 66. Upchirp/Downchirp pulse sequence

20.2.2 Upchirp/off modulation system

Using On/Off Keying, an Upchirp/Off modulation system can be produced, where an
Upchirp pulse could represent a bit value of “1” while the absence of an Upchirp pulse (an
“off” chirp pulse) could represents a bit value of “0”. An example of an Upchirp/Off pulse
sequence is illustrated in Figure 67.

Figure 67. Upchirp/off chirp pulse sequence

20.2.3 Downchirp/off modulation system

Using On/Off Keying, a Downchirp/Off modulation system can be produced, where a
Downchirp pulse could represent a bit value of “1”, while the absence of a Downchirp pulse
(an “off” chirp pulse) could represents a bit value of “0”. An example of a Downchirp/Off
pulse sequence is illustrated in Figure 68.

Figure 68. Downchirp/off pulse sequence

90/235

TN100 Chirp modulation

20.2.4 Physical channels and the on-off keying modulation systems

The two binary On/Off keying modulation systems (Upchirp/Off and Downchirp/Off) require
only Upchirp or Downchirp pulses. Consequently, these two different on-off keying systems
can access the same medium with low interference (0 < cross correlation < 0.5) to each
other.

Both systems can operate in the same frequency channel, in the same physical range, and
at the same time but remain independent of each other. They can, therefore, be regarded as
separated physical channels.

91/235

Local oscillator TN100

LoT etValuearg round

LoDiv10

16

----------------------- 12–〈〉8192⋅

⎝⎠

⎛⎞

=

21 Local oscillator

This section describes how to calibrate Local Oscillator frequency.

21.1 Purpose of the local oscillator

Switched capacitors are used to calibrate the Local Oscillator (LO) frequency. The total
capacitance of 22 capacitors plus the capacitance of the oscillating circuit determine the
frequency. Each of the twelve capacitors can be separately switched on and off.

The capacitor values are stored for both receive and transmit modes inside the Local
Oscillator controller. A single control signal permits the quick tuning of the Local Oscillator to
the corresponding target frequency.

During normal operation, the LO controller powers the Local Oscillator and sets the receive
or transmit frequency automatically, depending on the operation of the MAC controller.

To compensate for die temperature and supply voltage drifts, as well as for fabrication
process variations, the Local Oscillator controller supports an automatic Local Oscillator
frequency adjustment with a minimum of required software interaction. The Local Oscillator
frequency is compared with the internal crystal quartz frequency while the implemented
successive approximation algorithm determines the capacitor switch values (on or off),
depending on the comparison result and a value for the target frequency. The capacitor
switch values (on or off) can be read out and written to again if the automatic readjustment is
not required after a power down cycle.

21.2 Calibrating the local oscillator frequency

The software interaction of the Local Oscillator frequency calibration is as follows:

1. Start up the baseband clock and reset the digital baseband controller, if required.

Note: Steps 2 and 3 can be performed simultaneously.

2. Enable the LO circuitry, the LO divider, and the LO adjustment clock as follows:

a) Set EnableLO = True.

b) Set EnableLOdiv10 = True.

3. Switch the Local Oscillator into transmit mode by setting UseLoRxCaps = False.

4. Wait 24 µs.

5. Set the 16 bit value for the TX target frequency fTarget as follows:

The adjustment procedure starts automatically when writing to the upper bits of the
value.

Frequency example: fTarget = 2.44175 GHz:

Table 41. Value for fTarget

fTarget RfLoAdjIncValue

2.44175 GHz 0x685A

92/235

TN100 Local oscillator

LOdiv10 16MHz()⁄{}12–()8192⋅

6. Wait 13 ms (baseband timer could be used).

Note: When fast tuning mode is used, then wait time is reduced to 6 ms. See Section 26.2.24: RF

local oscillator controls on page 148 for details on using fast tuning mode.

7. Optionally, the resulting value LoTxCapsValue can be put into a variable to be used
after power down mode. During powering up, this value can then be reused:

8. Disable the LO adjustment clock, LO divider, and the LO circuitry as follows:

a) Set EnableLOdiv10 = False.

b) Set EnableLO = False.

9. Repeat the procedure for tuning the receiver. Use LoRxCaps = True for tuning RX.

21.2.1 Fields for updating the local oscillator

The following fields are used for updating the Local Oscillator.

Table 42. RTC and TimeB packets

Field Offset R/W Description

EnableLO 0x42

EnableLOdiv10 0x42

UseLoRxCaps 0x1C

LoTargetValue

LoTxCapsValue

0x1D –

0x1E

0x19 –

0x1B

WO

brst

BbClk

WO

brst

BbClk

WO

brst

BbClk

WO

brst

BbClk

RW
brst

BbClk

Enables the Local Oscillator. Required only for tuning the
Local Oscillator and for programming the Chirp Sequencer
(CSQ) RAM.

When enabled, the LO frequency divided by 10 is delivered
to the digital part. Required only for tuning the Local
Oscillator and for programming the Chirp Sequencer (CSQ)
RAM.

Switch between TX and RX Caps for LO caps tuning. This
field must be set before starting the LO caps tuning.

16 bit target value for the Local Oscillator frequency
adjustment. This value is used to determines the target LO
center frequency.

The LOTargetValue is determined as follows:

Before setting this value, the following must be enabled:
Local Oscillator – EnableLO
Clock divider – EnableLOdiv10
Also, the appropriate mode (RX, TX) must be selected using

the UseLoRxCaps:
UseLoRxCaps = 1 (RX mode)
UseLoRxCaps = 0 (Tx mode)
A write operation to the upper byte starts the tuning

algorithm automatically.

Reads or writes the 22 capacitors of the Local Oscillator for
transmit frequency. The correct capacitor values can be
read after the Local Oscillator has been tuned.

Default Value = 0x200040

93/235

RF transmitter TN100

1

f

ref

---------

n1 c

ref

43⋅=

22 RF transmitter

This section describes the adjustment of the Baseband filter frequency, the power amplifier
bias current, and the output power of the transmitter.

22.1 Adjusting the baseband filter frequency

Why Adjust this Frequency?

The frequency of the Baseband filter (chirp DAC filter) must be adjusted because of process
deviations of the resistor values and capacitor values.

Realization

● A fixed relationship exists between the RC-Oscillator (RCOSC) frequency and the

Baseband filter frequency because both circuits use the same resistor and capacitor
types.

● The user can set the 4 bit value ChirpFilterCaps to adjust the RC-

oscillator/Baseband filter frequency.

● ChirpFilterCaps is used for adjusting the RCOSC frequency in comparison with

the system clock.

● The algorithm has to be implemented in software.

To Adjust the RC-Oscillator Baseband Filter Frequency

(b)

1. Set the start value to ChirpFilterCaps = 0b0110.

2. Enable the RC-Oscillator (RCOSC) by setting TxFctEn = True.

3. Ignore at least 4 cycles of RCOSC output frequency by waiting 20 µs (baseband timer
can be used).

4. Count the cycles of the baseband system clock for next c

cycles of RCOSC as

ref

follows:

a) Start the counter by setting StartFctMeasure = True.

b) Wait at least .

c) Read out the counter value from the FctPeriod field.

d) Run this sequence c

5. Decision (for c

RCOSC cycles):

ref

times, accumulating the counter value after each run.

ref

a) If the number of system cycles are greater than the following:

(For c

= 4, n1 = 172)

ref

then decrease value for RfTxChirpFilterCaps.

b. Cycle reference frequency definitions:

Variable Definition Value

c

ref

f

ref

Cycle reference: number of RCOSC reference cycles. ≥ 4
Frequency reference: reference frequency of RCOSC. 400 kHz

94/235

TN100 RF transmitter

n2 c

ref

39⋅=

b) If the number of system cycles are less than the following:

(For c

= 4, n2 = 156)

ref

then increase value for RfTxChirpFilterCaps (ChirpFilterCaps).

c) If the counter value from step 4d above is between n1 and n2, then stop the

calibration.

or if n

≤ 172 after the previous counter value was > 172, or if n ≥ 156 after the

previous counter value was < 156, then:

Set FctClockEn = False.

22.2 Setting the power amplifier bias current

To set the PA Bias Current

● Set the following:

Table 43. Setting PA bias current

Switch Setting

RfTxPaBiasAdj (TxPaBias) 000

22.3 Adjusting the transmitter output power

22.3.1 Output power control

The typical characteristics of the output power control (as set by RfTxOutputPower)
measured at the SMA connector of a typical RF Module is shown in Figure 69. The typical
output power values are listed in Table 44 on page 96.

95/235

RF transmitter TN100

Figure 69. Output power control measured at SMA connector of RF Test Module

Table 44. Typical output power for RfTxOutputPower register values

Register

Val ue

Pout /

dBm

Register

Val ue

Pout /

dBm

Register

Value

Pout /

dBm

Register

Val ue

0 -36.20 16 -23.28 32 -12.07 48 -3.33

1 -35.30 17 -22.48 33 -11.41 49 -2.87

2 -34.47 18 -21.75 34 -10.80 50 -2.45

3 -33.65 19 -21.03 35 -10.20 51 -2.05

4 -32.83 20 -20.31 36 -9.61 52 -1.66

5 -32.02 21 -19.60 37 -9.03 53 -1.28

6 -31.21 22 -18.89 38 -8.46 54 -0.92

7 -30.41 23 -18.19 39 -7.91 55 -0.57

8 -29.54 24 -17.44 40 -7.31 56 -0.23

9 -28.70 25 -16.70 41 -6.74 57 0.12

10 -27.92 26 -16.02 42 -6.22 58 0.42

11 -27.14 27 -15.36 43 -5.71 59 0.72

12 -26.37 28 -14.70 44 -5.21 60 1.00

13 -25.60 29 -14.04 45 -4.73 61 1.28

14 -24.85 30 -13.40 46 -4.26 62 1.54

15 -24.09 31 -12.76 47 -3.80 63 1.79

Pout /

dBm

96/235

TN100 RF transmitter

22.3.2 Fields for adjusting the RF Transmitter

The following fields are used for adjusting the RF Transmitter.

Table 45. RTC and TimeB packets

Field Offset R/W Description

ChirpFilterCaps 0x27

EnableTx 0x27

FctClockEn 0x27

StartFctMeasure 0x27

LoTxCapsValue

0x19 to

0x1B

TxPaBias 0x43

TxOutputPower0 0x44

WO
brst

BbClk

WO
brst

BbClk

WO
brst

BbClk

WO
brst

BbClk

RW
brst

BbClk

WO
brst

BbClk

WO
brst

BbClk

Switches the capacitors of the chirp filter to adjust the
FCT clock to 400 kHz.

Enables the transmitter for tuning. It manually starts the
transmitter.

Switches on the FCT generator. This is required for the
chirp filter calibration.

Starts the tuning algorithm. It initiates an FCT count
cycle. FctClockEn must be set to 1 before starting the
measurement cycle.

Reads or writes the 22 capacitors of the Local Oscillator
for transmit frequency. The correct capacitor values can
be read after the Local Oscillator has been tuned.
Default Value - 0x200040

Adjusts the PA bias current to compensate process
deviations.

Sets the transmitter output power for data (Data)
packets, time beacon (TimeB) packets, and broadcast
(BrdCast) packets.

Default Value = 0x3F

97/235

Media access control methods TN100

23 Media access control methods

This section describes various media access methods, including Direct Access (DA),
Random Access (CSMA/CA) and TDMA.

23.1 Symbol definitions

The following symbol is used in this section:

● MacArqCntMax

Note: These symbols are defined in Appendix A: Attributes and constants on page 221.

23.2 Direct access (DA) mode

A very simple way to access the media is with the Direct Access (DA) mode. Using this
method, a station that wants to access the media does not sense the carrier nor wait a
specific period of time before accessing the media. However, collisions may occur with
transmissions from other stations or with noise sources using the same frequency
bandwidth and located in the same range. Direct access is, therefore, intended for protocols
where the probability of collisions is very low. Applications of Direct Access include master­slave protocols and TDMA:

● Master-Slave Protocols - A single master station allocates bandwidth for a slave station

and it assumes that there are no competitors for the media other than this master. The
master then polls a slave to request a Data packet. Only that polled station can transmit
a Data packet. The master station then waits for the Data packet a time-out interval and
then polls this slave again or else polls other slave stations. The poll command is
transmitted to the slave via an LCMP command in a Data packet.

● TDMA - Time Slotted Media Access achieves bandwidth reservation through the use of

dedicated time slots.

Note: For more details, see Section 23.4: Time slotted access (TDMA) on page 106.

23.3 Random access (CSMA/CA) mode

23.3.1 General description

Carrier Sense Multiple Access/Collision Avoidance (CSMA/CA) is an access method that
promotes fairness as all stations have equal probability of gaining access to the media.
Fairness is maintained because each station must recontend for the media after every
transmission.

CSMA works as follows:

1. A station that has data to transmit first senses the channel (CSMA) for a certain
duration to determine if the media is busy before transmitting a message.

2. If the channel is busy, the station attempts a retransmission at a later time.

3. If the channel is idle, the station waits a random period of time (a “backoff” time) and
then attempts again to acquire the media. This random backoff scheme avoids
collisions (CA) as much as possible.

98/235

TN100 Media access control methods

Medium = busy

Initiate transmission

of a data packet

N

Y

N

Y

CSMA/CA

Y

N

Y

Y

N

N

Set random

range to min

Set backup counter

with random value

Decrement backoff

counter if !zero

Medium = busy

Counter = zero

Double random

range

Retransmissions

= max

Increment

retransmission

counter

Transmit packet

Wait o n

acknowledge

Acknowledge

= true

Flush

packet

4. The acquisition of the media is followed by the transmission of the Data packet.

5. This transmission is then acknowledged by the destination station with an Ack packet to
allow the transmitting station to determine if the transmission was successful. If an Ack
packet was not received, the transmission was deemed not successful.

6. This procedure is repeated until the transmission has been successful, a
retransmission counter is exceeded, or a time-out is reached.

Note: For more details, see Section 23.3.4: Retransmissions on page 101.

The scheme for CSMA/CA is shown in Figure 70.

Figure 70. CSMA/CA protocol (at transmitting station)

99/235

Media access control methods TN100

TypeCode

Field

Data

Ack

t

Length

Field

}

}

CIFSSIFS

NAV (Data)

Defer access

TypeCode

Field

Brdcast, TimeB

t

Length

Field

}

}

CIFS

NAV (Brdcast, TimeB)

Defer access

23.3.2 Carrier sensing

The state of the media is determined by using physical and virtual carrier-sense functions:

● Physical carrier sensing detects activity in the media via a bit detector unit and a RSSI

(Receive Signal Strength Indicator). For instance, if the bit detector senses chirp
signals, then there is communication activity in the media. The physical carrier sensing
unit selects the output of either the bit detector or the RSSI or both. A station will
continue sensing the media until the media has been idle for at least a CIFS (Carrier
sense InterFrame Space) period.

● Virtual carrier sensing predicts if the media is allocated by detecting the TypeCode and

Length fields in packets transmitted by any station. These fields are used to indicate the
amount of time required to complete a transmission and are used by stations to adjust
their NAVs (Network Allocation Vector). A NAV is an indicator of the amount of time that
must elapse until the current transmission is complete and when the media can be
sampled again to determine if the media is idle.

A station updates its NAV with the indication from the Length field. If the error detection
over the MACFrame fails (that is CRC1 fails), then the NAV is set to “0” and physical
carrier sensing is applied until the NAV can be updated again.

If either the physical or virtual carrier sensing mechanisms indicate that the channel is busy,
then the channel is marked busy. Carrier sensing for Data, Brdcast, and TimeB packets is
illustrated in Figure 71.

Figure 71. CSMA/CA carrier sense timing diagram of Data, Brdcast and TimeB

packets

The NAV can also be used as a mechanism for power saving. A station can be powered
down for a NAV period of time. However, if a station is powered down, it is unable to receive

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packets and, consequently, cannot update its NAV.