Features
STPS3L60
Power Schottky rectifier
■ Negligible switching losses
■ Low forward voltage drop
■ Avalanche capability specified
Description
Axial and surface mount power Schottky rectifier
suited for switch mode power supplies and high
frequency dc to dc converters. Packaged in
DO-201AD, DO-15, SMB and SMBflat, this device
is intended for use in low voltage, high frequency
inverters and small battery chargers and for
applications where there are space constraints,
for example telecom battery charger.
A
K
DO-201AD
STPS3L60
A
K
SMB
STPS3L60U
Table 1. Device summary
I
3 A
F(AV)
V
RRM
150 °C
T
j (max)
V
F (max)
A
K
DO-15
STPS3L60Q
A
K
SMBflat
STPS3L60UF
60 V
0.61 V
June 2009 Doc ID 7505 Rev 6 1/11
www.st.com
11
Characteristics STPS3L60
1 Characteristics
Table 2. Absolute ratings
(1)
Symbol Parameter Value Unit
V
I
F(RMS)
Repetitive peak reverse voltage 60 V
RRM
RMS forward current 10 A
TL = 105 °C δ = 0.5
(DO-201AD, SMB)
T
= 72 °C δ = 0.5
Average forward current
I
F(AV)
L
(DO-15)
= 127 °C δ = 0.5
T
L
3A
(SMBflat)
I
Surge non repetitive forward current t
FSM
P
T
Repetitive peak avalanche power
ARM
Storage temperature range -65 to + 150 °C
stg
Maximum operating junction temperature
T
j
= 10 ms Sinusoidal 100 A
p
= 1 µs Tj = 25 °C
t
p
(2)
2000 W
150 °C
dV/dt Critical rate of rise reverse voltage 10000 V/µs
1. limiting values, per diode
dPtot
---------------
2. condition to avoid thermal runaway for a diode on its own heatsink
dTj
Table 3. Thermal resistance
1
--------------------------
<
Rth j a–()
Symbol Parameter Value Unit
SMBflat 10
SMB 20
Junction to leads
R
th (j-l)
DO-201AD 20
°C/W
Lead length = 10 mm
DO-15 35
2/11 Doc ID 7505 Rev 6
STPS3L60 Characteristics
Table 4. Static electrical characteristics
Symbol Parameter Tests Conditions Min. Typ. Max. Unit
T
= 25 °C
j
(1)
IR
V
Reverse leakage current
(1)
Forward voltage drop
F
= 100 °C
T
j
T
= 125 °C
j
T
= 25 °C
j
= 100 °C
T
j
= 125 °C
T
j
T
= 25 °C
j
T
= 100 °C
j
T
= 125 °C
j
1. Pulse test :tp = 380 µs, δ < 2%
To evaluate the conduction losses use the following equation :
P = 0.44 x I
F(AV)
+ 0.05 x I
F2(RMS)
Figure 1. Average forward power dissipation
versus average forward current
P (W)
F(AV)
2.50
2.25
2.00
1.75
1.50
1.25
1.00
0.75
0.50
0.25
0.00
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
δ = 0.05
δ = 0.1
I (A)
F(AV)
δ = 0.2
δ = 0.5
δ
=tp/T
δ = 1
T
tp
--150
= V
V
R
RRM
-415
-1430
--0.62
IF = 3 A
-0.530.61
-0.510.59
--0.79
IF = 6 A
-0.620.71
-0.60.69
Figure 2. Average forward current versus
ambient temperature (
δ = 0.5)
(DO-201AD, SMB)
I (A)
F(AV)
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
0 25 50 75 100 125 150
R=R
R =80°C/W
th(j-a)
th(j-a) th(j-I)
T (°C)
amb
µA
mA
V
Doc ID 7505 Rev 6 3/11
Characteristics STPS3L60
Figure 3. Average forward current versus
ambient temperature (
δ = 0.5)
(DO-15)
I (A)
F(AV)
3.5
Rth(j-a)=Rth(j-l)
3.0
2.5
2.0
1.5
1.0
0.5
0.0
Rth(j-a)=100°C/W
T (°C)
amb
0 25 50 75 100 125 150
Figure 5. Normalized avalanche power
derating versus pulse duration
P(tp)
ARM
P (1 µs)
ARM
1
0.1
0.01
t (µs)
0.001
0.10.01 1
p
10 100 1000
Figure 4. Average forward current versus
ambient temperature (δ = 0.5)
(SMBflat)
I (A)
F(AV)
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
0 25 50 75 100 125 150
Rth(j-a)=100°C/W
T (°C)
amb
Rth(j-a)=Rth(j-l)
Figure 6. Normalized avalanche power
derating versus junction
temperature
P(Tj)
ARM
P (25 °C)
ARM
1.2
1
0.8
0.6
0.4
0.2
0
25 50 75 100 125 150
T (°C)
j
Figure 7. Non repetitive surge peak forward
current versus overload duration
(maximum values) (DO-201AD)
I (A)
M
12
10
8
6
4
IM
2
0
1.E-03 1.E-02 1.E-01 1.E+00
t
=0.5
δ
t(s)
4/11 Doc ID 7505 Rev 6
Ta=25°C
Ta=50°C
Ta=100°C
Figure 8. Non repetitive surge peak forward
current versus overload duration
(maximum values) (DO-15)
I (A)
M
11
10
9
8
7
6
5
4
3
IM
2
1
0
1.E-03 1.E-02 1.E-01 1.E+00
t
=0.5
δ
t(s)
Ta=25°C
Ta=50°C
Ta=100°C
STPS3L60 Characteristics
Figure 9. Non repetitive surge peak forward
current versus overload duration
(maximum values) (SMB)
I (A)
M
11
10
9
8
7
6
5
4
3
IM
2
1
0
1.E-03 1.E-02 1.E-01 1.E+00
t
=0.5
δ
t(s)
Ta=25°C
Ta=50°C
Ta=100°C
Figure 11. Relative variation of thermal
impedance junction to ambient
versus pulse duration (DO-201AD)
Z/R
th(j-a) th(j-a)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
Single pulse
0.0
1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
t (s)
p
Figure 10. Non repetitive surge peak forward
current versus overload duration
(maximum values) (SMBflat)
I (A)
M
40
35
30
25
20
15
10
IM
5
0
1.E-03 1.E-02 1.E-01 1.E+00
t
=0.5
δ
t(s)
TL=25°C
TL=50°C
TL=100°C
Figure 12. Relative variation of thermal
impedance junction to ambient
versus pulse duration (DO-15)
Z/R
th(j-a) th(j-a)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
Single pulse
0.1
0.0
1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
t (s)
p
Figure 13. Relative variation of thermal
impedance junction to ambient
versus pulse duration (SMB)
Z/R
th(j-a) th(j-a)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
Single pulse
0.2
0.1
0.0
1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
t (s)
p
Figure 14. Relative variation of thermal
impedance junction to lead
versus pulse duration (SMBflat)
Z/R
th(j-l) th(j-l)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
Single pulse
0.1
0.0
1.E-03 1.E-02 1.E-01 1.E+00
Doc ID 7505 Rev 6 5/11
t (s)
p
Characteristics STPS3L60
0.00.51.01.52.02.53.03.54.04.55.0
Figure 15. Reverse leakage current versus
reverse voltage applied
(typical values)
I (mA)
R
1.E+02
1.E+01
1.E+00
1.E-01
1.E-02
1.E-03
0 5 10 15 20 25 30 35 40 45 50 55 60
Tj=125°C
Tj=100°C
Tj=25°C
V (V)
R
Figure 17. Forward voltage drop versus
forward current (high level)
I (A)
FM
30
25
20
15
10
5
0
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4
Tj=100°C
Tj=100°C
(Typical values)
(Typical values)
Tj=100°C
Tj=100°C
(Maximum values)
(Maximum values)
(Maximum values)
V (V)
FM
Tj=25°C
Figure 16. Junction capacitance versus
reverse voltage applied
(typical values)
C(pF)
1000
100
V (V)
10
1 10 100
R
F=1MHz
Vosc=30mV
Tj=25°C
Figure 18. Forward voltage drop versus
forward current (low level)
I (A)
FM
5
Tj=100°C
Tj=100°C
(Typical values)
4
3
2
1
0
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
(Typical values)
Tj=100°C
Tj=100°C
(Maximum values)
(Maximum values)
Tj=25°C
(Maximum values)
V (V)
FM
Figure 19. Thermal resistance junction to
ambient versus copper surface
under each lead (SMB)
R (°C/W)
th(j-a)
120
100
80
60
40
20
Expoxy printed circuit FR4,
copper thickness = 35 µm
S(Cu)(cm²)
0
6/11 Doc ID 7505 Rev 6
SMB
Figure 20. Thermal resistance junction to
ambient versus copper surface
under each lead (SMBflat)
R (°C/W)
th(j-a)
120
100
80
60
40
20
Expoxy printed circuit FR4,
copper thickness = 35 µm
S(Cu)(cm²)
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
SMB-Flat
STPS3L60 Package information
2 Package information
● Epoxy meets UL94,V0
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com
ECOPACK
Figure 21. DO-15 plastic dimensions
®
packages, depending on their level of environmental compliance. ECOPACK®
®
is an ST trademark.
.
Dimensions
CC
A
Ref.
Millimeters Inches
Min. Max. Min. Max.
A 6.05 6.75 0.238 0.266
D
B
B 2.95 3.53 0.116 0.139
C 26 31 1.024 1.220
D 0.71 0.88 0.028 0.035
Figure 22. DO-201AD plastic dimensions
Dimensions
BB
Note 1 Note 1
ØD
A
EE
Note 2
ØC
Ref.
Millimeters Inches
Min. Max. Min. Max.
A 9.50 0.374
B 25.40 1.000
∅C 5.30 0.209
∅D 1.30 0.051
E 1.25 0.049
Notes:
1. The lead diameter ∅D is not controlled over zone E
2. The minimum axial length within which the device may be placed with its leads bent at
right angles is 0.59”(15 mm)
Doc ID 7505 Rev 6 7/11
Package information STPS3L60
Table 5. SMB dimensions
Dimensions
Ref.
E1
Min. Max. Min. Max.
A1 1.90 2.45 0.075 0.096
D
A2 0.05 0.20 0.002 0.008
b 1.95 2.20 0.077 0.087
E
c 0.15 0.40 0.006 0.016
D 3.30 3.95 0.130 0.156
A1
C
L
A2
b
E 5.10 5.60 0.201 0.220
E1 4.05 4.60 0.159 0.181
L 0.75 1.50 0.030 0.059
Figure 23. SMB footprint, dimensions in mm (inches)
1.62
2.60
(0.064) (0.102)
5.84
(0.300)
1.62
(0.064)
Millimeters Inches
2.18
(0.086)
8/11 Doc ID 7505 Rev 6
STPS3L60 Package information
Table 6. SMBflat dimensions
Dimensions
A
c
D
L 2x
L1 2x
E
E1
L
L2 2x
b
Figure 24. SMBflat footprint dimensions
5.84
(0.230)
Ref.
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 0.90 1.10 0.035 0.043
b 1.95 2.20 0.077 0.087
c 0.15 0.40 0.006 0.016
D 3.30 3.95 0.130 0.156
E 5.10 5.60 0.200 0.220
E1 4.05 4.60 0.189 0.181
L 0.75 1.50 0.029 0.059
L1 0.40 0.016
L2 0.60 0.024
(a)
2.07
(0.082)
1.20
(0.047)
3.44
(0.136)
1.20
(0.047)
millimeters
(inches)
a. SMB footprint may also be used.
Doc ID 7505 Rev 6 9/11
Ordering information STPS3L60
3 Ordering information
Table 7. Ordering information
Order codes Marking Package Weight Base qty Delivery mode
STPS3L60 STPS3L60 DO-201AD 1.12 g 600 Ammopack
STPS3L60RL STPS3L60 DO-201AD 1.12 g 1900 Tape and reel
STPS3L60Q STPS3L60 DO-15 0.4 g 1000 Ammopack
STPS3L60QRL STPS3L60 DO-15 0.4 g 6000 Tape and reel
STPS3L60U G36 SMB 0.107 g 2500 Tape and reel
STPS3L60UF FG36 SMBflat 0.136 g 5000 Tape and reel
4 Revision history
Table 8. Document revision history
Date Revision Changes
July-2003 5A Previous issue
12-Jun-2009 6
Reformatted to current standards. Added SMBflat package.
Added ECOPACK statement. Added cathode band graphics.
10/11 Doc ID 7505 Rev 6
STPS3L60
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Doc ID 7505 Rev 6 11/11
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