These Schottky rectifiers are designed for high
frequency miniature switched mode power
supplies such as adaptators and on board DC/DC
converters. They are available in SMB, and lowprofile SMB.
STPS3H100
Power Schottky rectifier
A
K
SMB
STPS3H100U
Table 1.Device summary
SymbolValue
I
F(AV)
V
RRM
T
(max)175 °C
j
(max)0.68 V
V
F
A
K
SMB flat
STPS3H100UF
3 A
100 V
January 2010Doc ID 16776 Rev 11/9
www.st.com
9
CharacteristicsSTPS3H100
1 Characteristics
Table 2.Absolute ratings (limiting values)
SymbolParameterValueUnit
V
I
F(AV)
I
P
T
1. condition to avoid thermal runaway for a diode on its own heatsink
Table 3.Thermal resistance
Repetitive peak reverse voltage100V
RRM
Average forward current
Surge non repetitive forward currenttp =10 ms sinusoidal75A
To evaluate the conduction losses use the following equation:
P = 0.6 x I
2/9Doc ID 16776 Rev 1
F(AV)
+ 0.027 I
F2(RMS)
STPS3H100Characteristics
Figure 1.Average forward power dissipation
versus average forward current
P(W)
F(AV)
2.6
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0.00.51.01.52.02.53.03.5
δ=0.05
I(A)
F(AV)
δ=0.1
δ=0.2
δ
=tp/T
δ=0.5
δ=1
T
tp
Figure 3.Normalized avalanche power
derating versus pulse duration
P(tp)
ARM
P(1 µs)
ARM
1
0.1
0.01
t (µs)
0.001
0.10.011
p
101001000
Figure 2.Average forward current versus
ambient temperature (δ = 0.5)
I(A)
F(AV)
3.5
R
3.0
2.5
2.0
1.5
1.0
0.5
0.0
T
tp
=tp/T
δ
0255075100125150175
th(j-a)=Rth(j-l)
T(°C)
amb
SMB flatSMB flat
SMBSMB
Figure 4.Normalized avalanche power
derating versus junction
temperature
P(Tj)
ARM
P(25 °C)
ARM
1.2
1
0.8
0.6
0.4
0.2
0
255075100125150
T (°C)
j
Figure 5.Non repetitive surge peak forward
current versus overload duration
(maximum values) (SMB)
I (A)
M
12
11
10
9
8
7
6
5
4
3
I
M
2
1
0
1.E-031.E-021.E-011.E+00
t
=0.5
δ
t(s)
SMB
Ta=25 °C
Ta=75 °C
Ta=125 °C
Doc ID 16776 Rev 13/9
Figure 6.Non repetitive surge peak forward
current versus overload duration
(maximum values) (SMB flat)
I (A)
M
40
35
30
25
20
15
10
I
M
5
0
1.E-031.E-021.E-011.E+00
t
=0.5
δ
t(s)
SMB flat
TL=25 °C
TL=75 °C
TL=125 °C
CharacteristicsSTPS3H100
Figure 7.Relative variation of thermal
impedance junction to ambient
versus pulse duration (SMB)
Z/R
th(j-a) th(j-a)
1.0
SMB
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
Single pulse
0.1
0.0
1.E-021.E-011.E+001.E+011.E+021.E+03
t (s)
p
Figure 9.Reverse leakage current versus
reverse voltage applied
(typical values)
I (µA)
R
1.E+04
1.E+03
1.E+02
1.E+01
1.E+00
1.E-01
1.E-02
020406080100
Tj=150 °C
Tj=125 °C
Tj=100 °C
Tj=75 °C
Tj=50 °C
Tj=25 °C
V (V)
R
Figure 8.Relative variation of thermal
impedance junction to lead
versus pulse duration (SMB flat)
Z/R
th(j-l) th(j-l)
1.0
SMB flat
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
Single pulse
0.1
0.0
1.E-041.E-031.E-021.E-011.E+00
t (s)
p
Figure 10. Junction capacitance versus
reverse voltage applied
(typical values)
C(pF)
100
V (V)
10
110100
R
V
F=1 MHz
OSC
Tj=25 °C
=30 mV
RMS
4/9Doc ID 16776 Rev 1
STPS3H100Characteristics
Figure 11. Forward voltage drop versus
forward current
Figure 12. Thermal resistance junction to
ambient versus copper surface
under each lead (SMB)
I (A)
FM
6.0
5.5
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
0.0 0.10.2 0.30.4 0.50.6 0.70.8 0.91.0 1.1
Tj=125°C
Tj=125 °C
(Maximum values)
(Maximum values)
Tj=125°C
Tj=125 °C
(Typical values)
(Typical values)
Tj=25 °C
(Maximum values)
V (V)
FM
R(°C/W)
th(j-a)
110
100
90
80
70
60
50
40
30
20
10
0
0.00.51.01.52.02.53.03.54.04.55.0
S (cm²)
CU
Figure 13. Thermal resistance junction to ambient versus copper surface under each lead
(SMBflat)
R(°C/W)
th(j-a)
110
100
90
80
70
60
50
40
30
20
10
0
0.00.51.01.52.02.53.03.54.04.55.0
S (cm²)
CU
SMB flat
SMB
Doc ID 16776 Rev 15/9
Package InformationSTPS3H100
2 Package Information
●Epoxy meets UL94, V0
●Lead-free packages
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
Table 5.SMB dimensions
®
packages, depending on their level of environmental compliance. ECOPACK®
®
is an ST trademark.
Dimensions
E1
Ref.
MillimetersInches
Min.Max.Min.Max.
D
A11.902.450.0750.096
A20.050.200.0020.008
b1.952.200.0770.087
E
A1
C
L
A2
b
c0.150.400.0060.016
E5.105.600.2010.220
E14.054.600.1590.181
D3.303.950.1300.156
L0.751.500.0300.059
Figure 14. SMB footprint (dimensions in mm)
1.62
2.60
5.84
6/9Doc ID 16776 Rev 1
1.62
2.18
STPS3H100Package Information
Table 6.SMBflat dimensions
Dimensions
Ref.
A
D
L
E
E1
c
A0.901.10 0.0350.043
(1)
b
(1)
c
L2
D3.303.95 0.1300.156
E5.105.60 0.2000.220
L
b
E14.054.60 0.1890.181
L1
L0.751.500.0290.059
L10.400.016
L20.600.024
1. Applies to plated leads
Figure 15. SMBflat footprint (dimensions in mm)
5.84
MillimetersInches
Min. Typ. Max.Min.Typ.Max.
1.952.20 0.0770.087
0.150.40 0.0060.016
2.07
1.201.203.44
Doc ID 16776 Rev 17/9
Ordering informationSTPS3H100
3 Ordering information
Table 7.Ordering information
Order codeMarkingPackageWeightBase qtyDelivery mode
STPS3H100UG31SMB0.107 g2500Tape and reel
STPS3H100UFFG31SMBflat0.050 g5000Tape and reel
4 Revision history
Table 8.Document revision history
DateRevisionChanges
15-Jan-20101First issue.
8/9Doc ID 16776 Rev 1
STPS3H100
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.