ST STPS3H100 User Manual

Features
Negligible switching losses
High junction temperature capability
Low leakage current
forward voltage drop
Avalanche capability specified
Description
These Schottky rectifiers are designed for high frequency miniature switched mode power supplies such as adaptators and on board DC/DC converters. They are available in SMB, and low­profile SMB.
STPS3H100
Power Schottky rectifier
A
K
SMB
STPS3H100U

Table 1. Device summary

Symbol Value
I
F(AV)
V
RRM
T
(max) 175 °C
j
(max) 0.68 V
V
F
A
K
SMB flat
STPS3H100UF
3 A
100 V
January 2010 Doc ID 16776 Rev 1 1/9
www.st.com
9
Characteristics STPS3H100

1 Characteristics

Table 2. Absolute ratings (limiting values)

Symbol Parameter Value Unit
V
I
F(AV)
I
P
T
1. condition to avoid thermal runaway for a diode on its own heatsink

Table 3. Thermal resistance

Repetitive peak reverse voltage 100 V
RRM
Average forward current
Surge non repetitive forward current tp =10 ms sinusoidal 75 A
FSM
Repetitive peak avalanche power tp = 1 µs Tj = 25 °C 2400 W
ARM
Storage temperature range -65 to + 175 °C
stg
Operating junction temperature
T
j
dPtot
dTj
<
Rth(j-a)
1
SMB T
SMB flat T
(1)
= 115 °C δ = 0.5
L
= 140 °C δ = 0.5
L
3A
175 °C
Symbol Parameter Value Unit
SMB 25
R

Table 4. Static electrical characteristics

th(j-l)
Junction to lead
SMB flat 15
°C/W
Symbol Parameter Test conditions Min. Typ. Max. Unit
T
(1)
I
V
1. Pulse test: tp = 5 ms, δ < 2%
2. Pulse test: tp = 380 µs, δ < 2%
Reverse leakage current
R
(2)
Forward voltage drop
F
= 25 °C
j
T
= 125 °C - 0.4 1 mA
j
= 25 °C
T
j
T
= 125 °C - 0.63 0.68
j
T
= 25 °C
j
= 125 °C - 0.71 0.76
T
j
V
R
= 3 A
I
F
= 6 A
I
F
= V
RRM
--1µA
- - 0.84
- - 0.92
V
To evaluate the conduction losses use the following equation: P = 0.6 x I
2/9 Doc ID 16776 Rev 1
F(AV)
+ 0.027 I
F2(RMS)
STPS3H100 Characteristics
Figure 1. Average forward power dissipation
versus average forward current
P (W)
F(AV)
2.6
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5
δ=0.05
I (A)
F(AV)
δ=0.1
δ=0.2
δ
=tp/T
δ=0.5
δ=1
T
tp
Figure 3. Normalized avalanche power
derating versus pulse duration
P(tp)
ARM
P (1 µs)
ARM
1
0.1
0.01
t (µs)
0.001
0.10.01 1
p
10 100 1000
Figure 2. Average forward current versus
ambient temperature (δ = 0.5)
I (A)
F(AV)
3.5
R
3.0
2.5
2.0
1.5
1.0
0.5
0.0
T
tp
=tp/T
δ
0 25 50 75 100 125 150 175
th(j-a)=Rth(j-l)
T (°C)
amb
SMB flatSMB flat
SMBSMB
Figure 4. Normalized avalanche power
derating versus junction temperature
P(Tj)
ARM
P (25 °C)
ARM
1.2
1
0.8
0.6
0.4
0.2
0
25 50 75 100 125 150
T (°C)
j
Figure 5. Non repetitive surge peak forward
current versus overload duration (maximum values) (SMB)
I (A)
M
12
11
10
9
8
7
6
5
4
3
I
M
2
1
0
1.E-03 1.E-02 1.E-01 1.E+00
t
=0.5
δ
t(s)
SMB
Ta=25 °C
Ta=75 °C
Ta=125 °C
Doc ID 16776 Rev 1 3/9
Figure 6. Non repetitive surge peak forward
current versus overload duration (maximum values) (SMB flat)
I (A)
M
40
35
30
25
20
15
10
I
M
5
0
1.E-03 1.E-02 1.E-01 1.E+00
t
=0.5
δ
t(s)
SMB flat
TL=25 °C
TL=75 °C
TL=125 °C
Characteristics STPS3H100
Figure 7. Relative variation of thermal
impedance junction to ambient versus pulse duration (SMB)
Z/R
th(j-a) th(j-a)
1.0
SMB
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
Single pulse
0.1
0.0
1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
t (s)
p
Figure 9. Reverse leakage current versus
reverse voltage applied (typical values)
I (µA)
R
1.E+04
1.E+03
1.E+02
1.E+01
1.E+00
1.E-01
1.E-02
0 20 40 60 80 100
Tj=150 °C
Tj=125 °C
Tj=100 °C
Tj=75 °C
Tj=50 °C
Tj=25 °C
V (V)
R
Figure 8. Relative variation of thermal
impedance junction to lead versus pulse duration (SMB flat)
Z/R
th(j-l) th(j-l)
1.0
SMB flat
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
Single pulse
0.1
0.0
1.E-04 1.E-03 1.E-02 1.E-01 1.E+00
t (s)
p
Figure 10. Junction capacitance versus
reverse voltage applied (typical values)
C(pF)
100
V (V)
10
1 10 100
R
V
F=1 MHz
OSC
Tj=25 °C
=30 mV
RMS
4/9 Doc ID 16776 Rev 1
STPS3H100 Characteristics
Figure 11. Forward voltage drop versus
forward current
Figure 12. Thermal resistance junction to
ambient versus copper surface under each lead (SMB)
I (A)
FM
6.0
5.5
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1
Tj=125 °C
Tj=125 °C
(Maximum values)
(Maximum values)
Tj=125 °C
Tj=125 °C
(Typical values)
(Typical values)
Tj=25 °C
(Maximum values)
V (V)
FM
R (°C/W)
th(j-a)
110
100
90
80
70
60
50
40
30
20
10
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
S (cm²)
CU
Figure 13. Thermal resistance junction to ambient versus copper surface under each lead
(SMBflat)
R (°C/W)
th(j-a)
110
100
90
80
70
60
50
40
30
20
10
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
S (cm²)
CU
SMB flat
SMB
Doc ID 16776 Rev 1 5/9
Package Information STPS3H100

2 Package Information

Epoxy meets UL94, V0
Lead-free packages
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK

Table 5. SMB dimensions

®
packages, depending on their level of environmental compliance. ECOPACK®
®
is an ST trademark.
Dimensions
E1
Ref.
Millimeters Inches
Min. Max. Min. Max.
D
A1 1.90 2.45 0.075 0.096
A2 0.05 0.20 0.002 0.008
b 1.95 2.20 0.077 0.087
E
A1
C
L
A2
b
c 0.15 0.40 0.006 0.016
E 5.10 5.60 0.201 0.220
E1 4.05 4.60 0.159 0.181
D 3.30 3.95 0.130 0.156
L 0.75 1.50 0.030 0.059

Figure 14. SMB footprint (dimensions in mm)

1.62
2.60
5.84
6/9 Doc ID 16776 Rev 1
1.62
2.18
STPS3H100 Package Information

Table 6. SMBflat dimensions

Dimensions
Ref.
A
D
L
E
E1
c
A 0.90 1.10 0.035 0.043
(1)
b
(1)
c
L2
D 3.30 3.95 0.130 0.156
E 5.10 5.60 0.200 0.220
L
b
E1 4.05 4.60 0.189 0.181
L1
L 0.75 1.50 0.029 0.059
L1 0.40 0.016
L2 0.60 0.024
1. Applies to plated leads

Figure 15. SMBflat footprint (dimensions in mm)

5.84
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
1.95 2.20 0.077 0.087
0.15 0.40 0.006 0.016
2.07
1.20 1.203.44
Doc ID 16776 Rev 1 7/9
Ordering information STPS3H100

3 Ordering information

Table 7. Ordering information

Order code Marking Package Weight Base qty Delivery mode
STPS3H100U G31 SMB 0.107 g 2500 Tape and reel
STPS3H100UF FG31 SMBflat 0.050 g 5000 Tape and reel

4 Revision history

Table 8. Document revision history

Date Revision Changes
15-Jan-2010 1 First issue.
8/9 Doc ID 16776 Rev 1
STPS3H100
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Doc ID 16776 Rev 1 9/9
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