ST STPS3H100 User Manual

Features

■ Negligible switching losses

■ High junction temperature capability

■ Low leakage current

■ Good trade-off between leakage current and

forward voltage drop

■ Avalanche capability specified

Description

These Schottky rectifiers are designed for high
frequency miniature switched mode power
supplies such as adaptators and on board DC/DC
converters. They are available in SMB, and low­profile SMB.

STPS3H100

Power Schottky rectifier

A

K

SMB

STPS3H100U

Table 1. Device summary

Symbol Value

I

F(AV)

V

RRM

T

(max) 175 °C

j

(max) 0.68 V

V

F

A

K

SMB flat

STPS3H100UF

3 A

100 V

January 2010 Doc ID 16776 Rev 1 1/9

www.st.com

9

Characteristics STPS3H100

1 Characteristics

Table 2. Absolute ratings (limiting values)

Symbol Parameter Value Unit

V

I

F(AV)

I

P

T

1. condition to avoid thermal runaway for a diode on its own heatsink

Table 3. Thermal resistance

Repetitive peak reverse voltage 100 V

RRM

Average forward current

Surge non repetitive forward current tp =10 ms sinusoidal 75 A

FSM

Repetitive peak avalanche power tp = 1 µs Tj = 25 °C 2400 W

ARM

Storage temperature range -65 to + 175 °C

stg

Operating junction temperature

T

j

dPtot

dTj

<

Rth(j-a)

1

SMB T

SMB flat T

(1)

= 115 °C δ = 0.5

L

= 140 °C δ = 0.5

L

3A

175 °C

Symbol Parameter Value Unit

SMB 25

R

Table 4. Static electrical characteristics

th(j-l)

Junction to lead

SMB flat 15

°C/W

Symbol Parameter Test conditions Min. Typ. Max. Unit

T

(1)

I

V

1. Pulse test: tp = 5 ms, δ < 2%

2. Pulse test: tp = 380 µs, δ < 2%

Reverse leakage current

R

(2)

Forward voltage drop

F

= 25 °C

j

T

= 125 °C - 0.4 1 mA

j

= 25 °C

T

j

T

= 125 °C - 0.63 0.68

j

T

= 25 °C

j

= 125 °C - 0.71 0.76

T

j

V

R

= 3 A

I

F

= 6 A

I

F

= V

RRM

--1µA

- - 0.84

- - 0.92

V

To evaluate the conduction losses use the following equation:
P = 0.6 x I

2/9 Doc ID 16776 Rev 1

F(AV)

+ 0.027 I

F2(RMS)

STPS3H100 Characteristics

Figure 1. Average forward power dissipation

versus average forward current

P (W)

F(AV)

2.6

2.4

2.2

2.0

1.8

1.6

1.4

1.2

1.0

0.8

0.6

0.4

0.2

0.0

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5

δ=0.05

I (A)

F(AV)

δ=0.1

δ=0.2

δ

=tp/T

δ=0.5

δ=1

T

tp

Figure 3. Normalized avalanche power

derating versus pulse duration

P(tp)

ARM

P (1 µs)

ARM

1

0.1

0.01

t (µs)

0.001

0.10.01 1

p

10 100 1000

Figure 2. Average forward current versus

ambient temperature (δ = 0.5)

I (A)

F(AV)

3.5

R

3.0

2.5

2.0

1.5

1.0

0.5

0.0

T

tp

=tp/T

δ

0 25 50 75 100 125 150 175

th(j-a)=Rth(j-l)

T (°C)

amb

SMB flatSMB flat

SMBSMB

Figure 4. Normalized avalanche power

derating versus junction
temperature

P(Tj)

ARM

P (25 °C)

ARM

1.2

1

0.8

0.6

0.4

0.2

0

25 50 75 100 125 150

T (°C)

j

Figure 5. Non repetitive surge peak forward

current versus overload duration
(maximum values) (SMB)

I (A)

M

12

11

10

9

8

7

6

5

4

3

I

M

2

1

0

1.E-03 1.E-02 1.E-01 1.E+00

t

=0.5

δ

t(s)

SMB

Ta=25 °C

Ta=75 °C

Ta=125 °C

Doc ID 16776 Rev 1 3/9

Figure 6. Non repetitive surge peak forward

current versus overload duration
(maximum values) (SMB flat)

I (A)

M

40

35

30

25

20

15

10

I

M

5

0

1.E-03 1.E-02 1.E-01 1.E+00

t

=0.5

δ

t(s)

SMB flat

TL=25 °C

TL=75 °C

TL=125 °C

Characteristics STPS3H100

Figure 7. Relative variation of thermal

impedance junction to ambient
versus pulse duration (SMB)

Z/R

th(j-a) th(j-a)

1.0

SMB

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

Single pulse

0.1

0.0

1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03

t (s)

p

Figure 9. Reverse leakage current versus

reverse voltage applied
(typical values)

I (µA)

R

1.E+04

1.E+03

1.E+02

1.E+01

1.E+00

1.E-01

1.E-02

0 20 40 60 80 100

Tj=150 °C

Tj=125 °C

Tj=100 °C

Tj=75 °C

Tj=50 °C

Tj=25 °C

V (V)

R

Figure 8. Relative variation of thermal

impedance junction to lead
versus pulse duration (SMB flat)

Z/R

th(j-l) th(j-l)

1.0

SMB flat

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

Single pulse

0.1

0.0

1.E-04 1.E-03 1.E-02 1.E-01 1.E+00

t (s)

p

Figure 10. Junction capacitance versus

reverse voltage applied
(typical values)

C(pF)

100

V (V)

10

1 10 100

R

V

F=1 MHz

OSC

Tj=25 °C

=30 mV

RMS

4/9 Doc ID 16776 Rev 1

STPS3H100 Characteristics

Figure 11. Forward voltage drop versus

forward current

Figure 12. Thermal resistance junction to

ambient versus copper surface
under each lead (SMB)

I (A)

FM

6.0

5.5

5.0

4.5

4.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1

Tj=125 °C

Tj=125 °C

(Maximum values)

(Maximum values)

Tj=125 °C

Tj=125 °C

(Typical values)

(Typical values)

Tj=25 °C

(Maximum values)

V (V)

FM

R (°C/W)

th(j-a)

110

100

90

80

70

60

50

40

30

20

10

0

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

S (cm²)

CU

Figure 13. Thermal resistance junction to ambient versus copper surface under each lead

(SMBflat)

R (°C/W)

th(j-a)

110

100

90

80

70

60

50

40

30

20

10

0

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

S (cm²)

CU

SMB flat

SMB

Doc ID 16776 Rev 1 5/9

Package Information STPS3H100

2 Package Information

● Epoxy meets UL94, V0

● Lead-free packages

In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK

Table 5. SMB dimensions

®

packages, depending on their level of environmental compliance. ECOPACK®

®

is an ST trademark.

Dimensions

E1

Ref.

Millimeters Inches

Min. Max. Min. Max.

D

A1 1.90 2.45 0.075 0.096

A2 0.05 0.20 0.002 0.008

b 1.95 2.20 0.077 0.087

E

A1

C

L

A2

b

c 0.15 0.40 0.006 0.016

E 5.10 5.60 0.201 0.220

E1 4.05 4.60 0.159 0.181

D 3.30 3.95 0.130 0.156

L 0.75 1.50 0.030 0.059

Figure 14. SMB footprint (dimensions in mm)

1.62

2.60

5.84

6/9 Doc ID 16776 Rev 1

1.62

2.18

STPS3H100 Package Information

Table 6. SMBflat dimensions

Dimensions

Ref.

A

D

L

E

E1

c

A 0.90 1.10 0.035 0.043

(1)

b

(1)

c

L2

D 3.30 3.95 0.130 0.156

E 5.10 5.60 0.200 0.220

L

b

E1 4.05 4.60 0.189 0.181

L1

L 0.75 1.50 0.029 0.059

L1 0.40 0.016

L2 0.60 0.024

1. Applies to plated leads

Figure 15. SMBflat footprint (dimensions in mm)

5.84

Millimeters Inches

Min. Typ. Max. Min. Typ. Max.

1.95 2.20 0.077 0.087

0.15 0.40 0.006 0.016

2.07

1.20 1.203.44

Doc ID 16776 Rev 1 7/9

Ordering information STPS3H100

3 Ordering information

Table 7. Ordering information

Order code Marking Package Weight Base qty Delivery mode

STPS3H100U G31 SMB 0.107 g 2500 Tape and reel

STPS3H100UF FG31 SMBflat 0.050 g 5000 Tape and reel

4 Revision history

Table 8. Document revision history

Date Revision Changes

15-Jan-2010 1 First issue.

8/9 Doc ID 16776 Rev 1

STPS3H100

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Doc ID 16776 Rev 1 9/9