The STPS30M60DJF is a power Schottky
rectifier, suited for high frequency switch mode
power supply and DC to DC converters.
Packaged in PowerFLAT™, this device is
intended to be used in notebook, game station
and desktop adapters, providing in these
applications a good efficiency at both low and
high load. Its low profile was especially designed
to be used in applications with space-saving
constraints.
A
A
K
A
PowerFLAT 5x6
STPS30M60DJF
Table 1.Device summary
SymbolValue
I
F(AV)
V
RRM
(typ)0.46 V
V
F
(max)150 °C
T
j
K
K
A
30 A
60 V
TM: PowerFLAT is a trademark of STMicroelectronics
April 2012Doc ID 023120 Rev 11/8
This is information on a product in full production.
www.st.com
8
CharacteristicsSTPS30M60DJF
1 Characteristics
Table 2.Absolute ratings (limiting values, anode terminals 1 and 3 short circuited)
SymbolParameterValueUnit
V
I
F(RMS)
I
F(AV)
I
P
ARM
V
T
1. More details regarding the avalanche energy measurements and diode validation in the avalanche are
2. condition to avoid thermal runaway for a diode on its own heatsink
Table 3.Thermal resistance
Repetitive peak reverse voltage60V
RRM
Forward rms current45A
Average forward current δ = 0.5Tc = 100 °C 30A
Surge non repetitive forward currenttp = 10 ms sinusoidal250A
FSM
(1)
Repetitive peak avalanche power3500W
Maximum repetitive peak avalanche
ARM
voltage
Storage temperature range-65 to +175°C
stg
Maximum operating junction temperature
T
j
provided in the STMicroelectronics’ application notes AN1768 and AN2025.
dPtot
dTj
<
Rth(j-a)
1
tp < 1 µs, Tj < 150 °C
IAR < 13 A
(2)
80V
150°C
SymbolParameterValueUnit
R
Table 4.Static electrical characteristics (anode terminals short circuited)
Junction to case2.0°C/W
th(j-c)
SymbolParameterTest conditionsMin.Typ.Max.Unit
= 25 °C
T
Reverse leakage
(1)
I
R
current
(2)
V
1. Pulse test: tp = 5 ms, δ < 2%
2. Pulse test: tp = 380 µs, δ < 2%
Forward voltage drop
F
j
= 125 °C-2050mA
T
j
= 25 °C
T
j
T
= 125 °C-0.460.52
j
= 25 °C
T
j
T
= 125 °C-0.570.67
j
VR = V
= 15 A
I
F
= 30 A
I
F
To evaluate the conduction losses use the following equation:
P = 0.55 x I
2/8Doc ID 023120 Rev 1
+ 0.004 x I
F(AV)
F2(RMS)
--90µA
RRM
--0.59
V
--0.72
STPS30M60DJFCharacteristics
Figure 1.Average forward power dissipation
versus average forward current
P(W)
F(AV)
30
25
20
15
10
5
0
δ = 0.05
0510152025303540
δ = 0.2
δ = 0.1
δ = 0.5
δ = t / T
p
I(A)
F(AV)
δ = 1
T
t
p
Figure 3.Normalized avalanche power
derating versus pulse duration
P(tp)
ARM
P(1 µs)
ARM
1
0.1
0.01
t (µs)
0.001
0.10.011
p
101001000
Figure 2.Average forward current versus
ambient temperature (δ = 0.5)
I(A)
F(AV)
35
30
25
20
15
10
5
0
T
δ = t / T
0255075100125150
t
p
p
R= R
th(j-a)th(j-c)
T (°C)
amb
Figure 4.Normalized avalanche power
derating versus junction
temperature
P(Tj)
ARM
P(25 °C)
ARM
1.2
1
0.8
0.6
0.4
0.2
0
255075100125150
T (°C)
j
Figure 5.Non repetitive surge peak forward
current versus overload duration
(maximum values)
I (A)
M
280
240
200
160
T = 25 °C
120
80
I
M
40
0
1.E-031.E-021.E-011.E+00
δ = 0.5
t
c
T = 75 °C
c
T = 125 °C
c
t(s)
Doc ID 023120 Rev 13/8
Figure 6.Relative variation of thermal
impedance junction to case versus
pulse duration
Z/R
th(j-c) th(j-c)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
Single pulse
0.1
0.0
1.E-051.E-041.E-031.E-021.E-011.E+00
t (s)
p
CharacteristicsSTPS30M60DJF
Figure 7.Reverse leakage current versus
reverse voltage applied
(typical values)
I (mA)
R
1.E+03
1.E+02
T = 150 °C
1.E+01
1.E+00
1.E-01
1.E-02
1.E-03
0510 15 20 25 30 35 40 45 50 55 60
j
T = 125 °C
j
T = 100 °C
j
T = 75 °C
j
T = 50 °C
j
T = 25 °C
j
V (V)
Figure 9.Forward voltage drop versus
forward current
I (A)
FM
100.0
T = 125 °C
j
(Maximum values)
T = 125 °C
10.0
j
(Typical values)
Figure 8.Junction capacitance versus
reverse voltage applied
(typical values)
C(pF)
10000
1000
R
100
110100
Figure 10. Thermal resistance junction to
ambient versus copper surface
under tab
R(°C/W)
th(j-a)
250
200
150
epoxy printed board FR4,
copper thickness = 35 µm
F = 1 MHz
V = 30 mV
oscRMS
T = 25 °C
j
V (V)
R
1.0
T = 25 °C
j
(Maximum values)
V (V)
0.1
0.00.10.20.30.40.50.60.70.80.91.0
FM
100
50
0
012345678910
Figure 11. Reverse safe operating area (tp < 1 µs and Tj < 150 °C)
I(A)
arm
20
15
10
V
5
6065707580859095100105110
arm
S (cm²)
cu
4/8Doc ID 023120 Rev 1
STPS30M60DJFPackage information
2 Package information
●Epoxy meets UL94,V0
●Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com
ECOPACK
Table 5.PowerFLAT 5x6 dimensions
®
packages, depending on their level of environmental compliance. ECOPACK®
®
is an ST trademark.
.
Dimensions
E2
D2
Ref.
A0.801.000.0310.039
K
A10.020.050.0010.002
MillimetersInches
Min.Typ.Max.Min.Typ.Max.
A20.250.010
b
e
A
A1
D
L
A2
b0.300.500.0120.020
D5.200.205
D24.114.310.1620.170
e1.270.050
E
E6.150.242
E23.503.700.1380.146
L0.500.800.0200.031
K1.2751.5750.0500.062
Figure 12. Footprint (dimensions in mm)
5.35
4.41
1.27
Doc ID 023120 Rev 15/8
0.98
0.62
3.86
0.95
4.33
6.29
Package informationSTPS30M60DJF
Figure 13. Tape and reel specifications
Dot identifying Pin A1 location
2.0
4.0
Ø 1.55
0.30
12.0
5.30
1.20
All dimensions are typical values in mm
0.20
6.30
8.0
User direction of unreeling
1.75
Ø 1.5
5.5
R 0.50
6/8Doc ID 023120 Rev 1
STPS30M60DJFOrdering information
3 Ordering information
Table 6.Ordering information
Order codeMarkingPackageWeight Base qty Delivery mode
STPS30M60DJF-TRPS30 M60PowerFLAT 5x695 mg3000Tape and reel
4 Revision history
Table 7.Document revision history
DateRevisionChanges
18-Apr-20121First issue.
Doc ID 023120 Rev 17/8
STPS30M60DJF
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