ST STPS30H100C User Manual

STPS30H100C
High voltage power Schottky rectifier
Datasheet production data
Features
Negligible switching losses
Good trade off between leakage current and
forward voltage drop
Low thermal resistance
Avalanche capability specified
Description
Dual center tap Schottky rectifier suited for switch mode power supplies and high frequency DC to DC converters.
Packaged in TO-200AB, TO-220AB narrow leads, TO-247,and I in high frequency inverters.
2
PAK this device is intended for use
A1
A2
A2
K
A1
TO-220AB
STPS30H100CT
A2
K
A1
TO-220AB narrow leads
STPS30H100CTN
K
K
A1
TO-247
STPS30H100CW
I2PAK
STPS30H100CR
A2
A2
K
A1
j

Table 1. Device summary

Symbol Value
I
F(AV)
V
RRM
(max) 175 °C
T
j
V
(max) 0.67 V
F
2 x 15 A
100 V
June 2012 Doc ID 6347 Rev 8 1/10
This is information on a product in full production.
www.st.com
10
Characteristics STPS30H100C
d
-

1 Characteristics

Table 2. Absolute ratings (limiting values, per diode)

Symbol Parameter Value Unit
V
RRM
I
F(RMS)
I
F(AV)
I
FSM
I
RRM
I
RSM
P
ARM
T
T
Repetitive peak reverse voltage 100 V
Forward rms current 30 A
Average forward current
Tc = 155 °C δ = 0.5
Per diode Per device
Surge non repetitive forward current tp = 10 ms sinusoidal 250 A
Repetitive peak reverse current tp = 2 µs square, F= 1 kHz 1 A
Non repetitive peak reverse current tp = 100 µs square 3 A
Repetitive peak avalanche power tp = 1 µs Tj = 25 °C 10800 W
Storage temperature range -65 to + 175 °C
stg
Operating junction temperature range
j
(1)
-40 to +175 °C
15 30
dV/dt Critical rate of rise of reverse voltage 10000 V/µs
Ptot
--------------
1. condition to avoid thermal runaway for a diode on its own heatsink
dTj

Table 3. Thermal resistance

1
------------------------- -
<
Rth j a–()
Symbol Parameter Value Unit
R
R
Junction to case
th(j-c)
Coupling 0.1
th(c)
Per diode To t al
1.6
0.9
°C/W
When the diodes 1 and 2 are used simultaneously:
A
ΔT
(diode 1) = P(diode1) x R
j

Table 4. Static electrical characteristics (per diode)

(Per diode) + P(diode 2) x R
th(j-c)
Symbol Parameter Test conditions Min. Typ. Max. Unit
T
= 25 °C
(1)
I
V
Reverse leakage current
R
(2)
Forward voltage drop
F
j
T
= 125 °C 2 6 mA
j
= 25 °C
T
j
T
= 125 °C 0.64 0.67
j
= 25 °C
T
j
Tj = 125 °C 0.74 0.8
1. Pulse test: tp = 5 ms, δ < 2%
2. Pulse test: tp = 380 µs, δ < 2%
To evaluate the conduction losses use the following equation: P = 0.54 x I
2/10 Doc ID 6347 Rev 8
F(AV)
+ 0.0086 I
F2(RMS)
= V
V
R
= 15 A
I
F
= 30 A
I
F
th(c)
A
RRM
0.80
V
0.93
STPS30H100C Characteristics
Figure 1. Average forward power dissipation
versus average forward current (per diode)
P (W)
F(AV)
14
12
10
8
6
4
2
0
02468101214161820
δ = 0.05
δ = 0.1
δ = 0.2
I (A)
F(AV)
δ = 0.5
δ
δ = 1
=tp/T
T
tp
Figure 3. Normalized avalanche power
derating versus pulse duration
P(tp)
ARM
P (1 µs)
ARM
1
0.1
0.01
t (µs)
0.001
0.10.01 1
p
10 100 1000
Figure 2. Average forward current versus
ambient temperature (δ = 0.5, per diode)
I (A)
F(AV)
18
16
14
12
10
8
6
4
2
0
R =15°C/W
th(j-a)
T
=tp/T
δ
0 25 50 75 100 125 150 175
tp
R=R
th(j-a) th(j-c)
T (°C)
amb
Figure 4. Normalized avalanche power
derating versus junction temperature
P(Tj)
ARM
P (25 °C)
ARM
1.2
1
0.8
0.6
0.4
0.2
0
25 50 75 100 125 150
T (°C)
j
Figure 5. Non repetitive surge peak forward
current versus overload duration (maximum values, per diode)
I (A)
M
240 220 200 180 160 140 120 100
80 60
IM
40 20
0
1E-3 1E-2 1E-1 1E+0
δ=0.5
t
t(s)
T =25°C
a
T =75°C
a
T =150°C
a
Doc ID 6347 Rev 8 3/10
Figure 6. Relative variation of thermal
impedance junction to case versus pulse duration
Z/R
th(j-c) th(j-c)
1.0
0.8
δ = 0.5
0.6
0.4
δ = 0.2
δ
T
=tp/T
δ = 0.1
0.2
Single pulse
0.0 1E-4 1E-3 1E-2 1E-1 1E+0
t (s)
p
tp
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