Main product characteristics
I
F(AV)
V
RRM
T
(max) 150° C
j
(max) 0.42 V
V
F
2 x 15 A
30 V
Features and benefits
STPS3030/CT/CG/CR
Low drop power Schottky rectifier
A1
K
A2
K
■ Very small conduction losses
■ Negligible switching losses
■ Extremely fast switching
■ Low forward voltage drop for higher efficiency
■ Low thermal resistance
■ Avalanche capability specified
Description
Dual Schottky rectifier suited for switch mode
power supply and high frequency DC to DC
converters.
Packaged in TO-220AB, D
device is intended for use in low voltage high
frequency inverters, free-wheeling and polarity
protection applications.
2
PAK and I2PAK, this
j
A2
A1
2
PAK
D
STPS3030CG
STPS3030CR
I2PAK
TO-220AB
STPS3030CT
A2
K
A1
A1
A2
K
October 2006 Rev 4 1/9
www.st.com
9
Characteristics STPS3030CT/CG/CR
d
-
1 Characteristics
Table 1. Absolute ratings (limiting values, per diode)
Symbol Parameter Value Unit
V
RRM
I
F(RMS)
I
F(AV)
I
FSM
I
RRM
I
RSM
P
ARM
T
T
dV/dt Critical rate of rise of reverse voltage (rated V
Ptot
--------------
1. condition to avoid thermal runaway for a diode on its own heatsink
dTj
Table 2. Thermal resistance
Repetitive peak reverse voltage 30 V
RMS forward current 30 A
T
= 135° C Per diode 15
Average forward current
c
δ = 0.5 Per device 30
Surge non repetitive forward current tp = 10 ms sinusoidal 250 A
Peak repetitive reverse current tp = 2 µs square F= 1 kHz 1 A
Non repetitive peak reverse current tp = 100 µs square 3 A
Repetitive peak avalanche power tp = 1 µs Tj = 25° C 4100 W
Storage temperature range -65 to + 150 °C
stg
Maximum operating junction temperature
j
1
--------------------------
<
Rth j a–()
(1)
, Tj = 25° C) 10000 V/µs
R
150 °C
Symbol Parameter Value Unit
Per diode 1.2
R
R
Table 3. Static electrical characteristics (per diode)
Junction to case TO-220AB - D2PAK - I2PA K
th(j-c)
th(c)
°C/WTo t al 0 . 8
Coupling 0.4
A
Symbol Parameter Test conditions Min. Typ. Max. Unit
T
= 25° C
(1)
I
V
1. Pulse test: tp = 380 µs, δ < 2%
Reverse leakage current
R
(1)
Forward voltage drop
F
j
= 125° C 125 180
T
j
= 25° C IF = 15 A 0.44 0.49
T
j
T
= 125° C IF = 15 A 0.36 0.40
j
T
= 25° C IF = 30 A 0.53 0.58
j
= 125° C IF = 30 A 0.49 0.53
T
j
To evaluate the conduction losses use the following equation:
P = 0.26 x I
2/9
F(AV)
+ 0.0107 I
F2(RMS)
= V
V
R
RRM
mA
V
0.23 1.0
STPS3030CT/CG/CR Characteristics
0
Figure 1. Conduction losses versus average
current
P(W)
10
9
8
7
6
5
4
3
2
1
0
0246810121416182
δ = 0.05
δ = 0.1
δ = 0.2
I (A)F(av)
δ = 0.5
δ
=tp/T
δ = 1
T
tp
Figure 3. Normalized avalanche power
derating versus pulse duration
P(t)
ARM p
P (1µs)
ARM
1
0.1
0.01
t (µs)
0.001
0.10.01 1
p
10 100 1000
Figure 5. Non repetitive surge peak forward
current versus overload duration
(maximum values)
IM(A)
250
225
200
175
150
125
100
75
50
25
0
1.E-03 1.E-02 1.E-01 1.E+00
t(s)
TC=25°C
TC=75°C
TC=125°C
Figure 2. Average forward current versus
ambient temperature (δ = 0.5)
IF(av)(A)
18
16
14
12
10
8
6
4
2
0
0 25 50 75 100 125 150
Rth
(j-a)
=50°C/W
Rth
=Rth
(j-a)
Tamb(°C)
(j-c)
Figure 4. Normalized avalanche power
derating versus junction
temperature
P(t)
ARM p
P (25°C)
ARM
1.2
1
0.8
0.6
0.4
0.2
T (°C)
0
j
0 25 50 75 100 125 150
Figure 6. Relative variation of thermal
impedance junction to case versus
pulse duration
Zth(j-c)/Rth(j-c)
1.0
0.9
0.8
0.7
δ = 0.5
0.6
0.5
0.4
δ = 0.2
δ = 0.1
0.3
0.2
Single pulse
0.1
0.0
1.E-03 1.E-02 1.E-01 1.E+00
tp(s)
δ
=tp/T
T
tp
3/9
Characteristics STPS3030CT/CG/CR
)
Figure 7. Reverse leakage current versus
reverse voltage applied (typical
values)
IR(mA
1.E+03
1.E+02
1.E+01
1.E+00
1.E-01
1.E-02
0 5 10 15 20 25 30
Tj=150°C
Tj=125°C
Tj=100°C
Tj=75°C
Tj=50°C
Tj=25°C
VR(V)
Figure 9. Forward voltage drop versus
forward current
IFM(A)
100
Tj=125°C
Tj=125°C
(Maximum values)
(Maximum values)
Tj=125°C
Tj=125°C
(Typical values)
(Typical values)
10
1
0.0 0.2 0.4 0.6 0.8 1.0 1.2
Tj=25°C
(Maximum values)
V (V)FM
Figure 8. Junction capacitance versus
reverse voltage applied (typical
values)
C(nF)
10.0
1.0
F=1MHz
V
osc
T
=30mV
=25°C
j
VR(V)
0.1
1 10 100
Figure 10. Thermal resistance junction to
ambient versus copper surface
under tab (epoxy printed board
FR4, Cu = 35 µm)
Rth(j-a)(°C/W)
80
70
60
50
40
30
20
10
0
0 5 10 15 20 25 30 35 40
S(cm²)
D²PAK
4/9
STPS3030CT/CG/CR Package information
2 Package information
● Epoxy meets UL94,V0
● Cooling method: C
● Recommended torque value: 0.55 Nm
● Maximum torque value: 0.70 Nm
Table 4. I2PAK dimensions
Dimensions
L2
Ref.
Millimeters Inches
Min. Max. Min. Max.
A
E
c2
A 4.40 4.60 0.173 0.181
A1 2.40 2.72 0.094 0.107
b 0.61 0.88 0.024 0.035
b1 1.14 1.70 0.044 0.067
D
c 0.49 0.70 0.019 0.028
c2 1.23 1.32 0.048 0.052
L1
L
b1
A1
D 8.95 9.35 0.352 0.368
e 2.40 2.70 0.094 0.106
e1 4.95 5.15 0.195 0.203
E 10 10.40 0.394 0.409
b
e
e1
c
L 13 14 0.512 0.551
L1 3.50 3.93 0.138 0.155
L2 1.27 1.40 0.050 0.055
5/9
Package information STPS3030CT/CG/CR
Table 5. D
L2
L
L3
2
PAK dimensions
E
A1
B2
B
G
* FLAT ZONE NO LESS THAN 2mm
Dimensions
Ref
Millimeters Inches
Min. Max. Min. Max.
A
C2
A 4.40 4.60 0.173 0.181
A1 2.49 2.69 0.098 0.106
A2 0.03 0.23 0.001 0.009
D
B 0.70 0.93 0.027 0.037
B2 1.14 1.70 0.045 0.067
C 0.45 0.60 0.017 0.024
C2 1.23 1.36 0.048 0.054
C
R
D 8.95 9.35 0.352 0.368
E 10.00 10.40 0.393 0.409
A2
G 4.88 5.28 0.192 0.208
L 15.00 15.85 0.590 0.624
M
*
V2
L2 1.27 1.40 0.050 0.055
L3 1.40 1.75 0.055 0.069
M 2.40 3.20 0.094 0.126
R 0.40 typ. 0.016 typ.
V2 0° 8° 0° 8°
Figure 11. Footprint (dimensions in millimeters)
16.90
10.30
8.90
3.70
5.08
1.30
6/9
STPS3030CT/CG/CR Package information
Table 6. TO-220AB dimensions
Dimensions
Ref
Millimeters Inches
Min. Max. Min. Max.
A 4.40 4.60 0.173 0.181
C 1.23 1.32 0.048 0.051
H2
Dia
L5
L6
L2
F2
F1
L9
A
C
D
D 2.40 2.72 0.094 0.107
E 0.49 0.70 0.019 0.027
F 0.61 0.88 0.024 0.034
L7
F1 1.14 1.70 0.044 0.066
F2 1.14 1.70 0.044 0.066
G 4.95 5.15 0.194 0.202
G1 2.40 2.70 0.094 0.106
F
G1
L4
M
E
G
H2 10 10.40 0.393 0.409
L2 16.4 typ. 0.645 typ.
L4 13 14 0.511 0.551
L5 2.65 2.95 0.104 0.116
L6 15.25 15.75 0.600 0.620
L7 6.20 6.60 0.244 0.259
L9 3.50 3.93 0.137 0.154
M 2.6 typ. 0.102 typ.
Diam 3.75 3.85 0.147 0.151
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
7/9
Ordering information STPS3030CT/CG/CR
3 Ordering information
Ordering type Marking Package Weight Base qty
Delivery
mode
STPS3030CT STPS3030CT TO-220AB 2.2 g 50 Tube
2
STPS3030CG STPS3030CG D
STPS3030CG-TR STPS3030CG D
STPS3030CR STPS3030CR I
PAK 1.48 g 50 Tube
2
PAK 1.48 g 1000 Tape and reel
2
PAK 1.49 g 50 Tube
4 Revision history
Date Revision Changes
Jul-2006 3A Initial release.
16-Oct-2006 4
Reformatted to current standards. Corrected dimensions for I2PA K i n
Table 4
8/9
STPS3030CT/CG/CR
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