ST STPS30100ST User Manual

STPS30100ST

Power Schottky rectifier

Main product characteristics
I
F(AV)
V
RRM
(max) 150° C
T
j
(typ) 0.385 V
V
F
30 A
100 V
A
K
A
K
Features and Benefits
Avalanche rated
F
Good trade off between leakage current and forward voltage drop
High frequency operation
Avalanche capability specified
A
TO-220AB
STPS30100ST
A
K
Description
Single Schottky rectifier, suited for high frequency switch mode power supply.
Packaged in TO-220AB, this device is intended to be used in notebook and game station adaptors, providing in these applications a good efficiency at both low and high load.

Table 1. Absolute Ratings (limiting values)

Symbol Parameter Value Unit
V
RRM
I
F(RMS)
I
F(AV)
I
FSM
P
ARM
T
stg
T
dPtot
---------------
1. condition to avoid thermal runaway for a diode on its own heatsink
dTj
Repetitive peak reverse voltage 100 V
RMS forward current 60 A
Average forward current δ = 0.5 Tc = 125° C 30 A
Surge non repetitive forward current tp = 10 ms sinusoidal 300 A
Repetitive peak avalanche power tp = 1 µs Tj = 25° C 26400 W
Storage temperature range -65 to + 175 °C
Maximum operating junction temperature
j
1
------------------ --------
<
Rth j a–()
(1)
150 °C
October 2006 Rev 1 1/7
www.st.com
7
Characteristics STPS30100ST

1 Characteristics

Table 2. Thermal resistance

Symbol Parameter Value Unit
R

Table 3. Static electrical characteristics (per diode)

Junction to case 1 °C/W
th(j-c)
Symbol Parameter Test Conditions Min. Typ. Max. Unit
T
(1)
I
V
1. Pulse test: tp = 5 ms, δ < 2%
2. Pulse test: tp = 380 µs, δ < 2%
Reverse leakage current
R
(2)
Forward voltage drop
F
= 25° C
j
Tj = 125° C 20 50 mA
T
= 25° C
j
T
= 125° C 10 20 mA
j
= 25° C
T
j
T
= 125° C 0.385
j
T
= 25° C
j
T
= 125° C 0.475
j
T
= 25° C
j
T
= 125° C 0.525 0.565
j
Tj = 25° C
T
= 125° C 0.605 0.655
j
V
= V
R
= 70 V
V
R
= 5 A
I
F
= 10 A
I
F
= 15 A
I
F
= 30 A
I
F
RRM
0.475
0.555
0.620 0.660
0.740 0.800
175 µA
60 µA
V
To evaluate the conduction losses use the following equation: P = 0.475 x I
2/7
+ 0.006 x I
F(AV)
F2(RMS)
STPS30100ST Characteristics
(av)(W)
Figure 1. Conduction losses versus average
current
P
F
26
24
22
20
18
16
14
12
10
8
6
4
2
0
0 4 8 12162024283236
δ=0.05
δ=0.1 δ=0.2
I (av)(A)
F
δ=0.5 δ=1
=t /T
δ
p
T
t
p
Figure 3. Normalized avalanche power
derating versus pulse duration
P(t)
ARM p
P (1µs)
ARM
1
0.1
0.01
t (µs)
0.001
0.10.01 1
p
10 100 1000
Figure 5. Non repetitive surge peak forward
current versus overload duration (maximum values)
I
(A)
M
350
300
250
200
150
100
IM
50
0
1.E-03 1.E-02 1.E-01 1.E+00
δ=0.5
t
t(s)
Tc=25°C
Tc=75°C
Tc=125°C
Figure 2. Average forward current versus
ambient temperature (δ = 0.5)
(av)(A)
I
F
35
R
30
25
20
15
10
5
0
T
t
=tp/T
δ
0 25 50 75 100 125 150
p
th(j-a)=Rth(j-c)
Rth(j-a)=15°C/W
T (°C)
amb
Figure 4. Normalized avalanche power
derating versus junction temperature
P(t)
ARM p
P (25°C)
ARM
1.2
1
0.8
0.6
0.4
0.2
T (°C)
0
j
0 25 50 75 100 125 150
Figure 6. Relative variation of thermal
impedance junction to case versus pulse duration
Z
th(j-c)/Rth(j-c)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
Single pulse
0.1
0.0
1.E-03 1.E-02 1.E-01 1.E+00
tp(s)
3/7
Characteristics STPS30100ST
(mA)
Figure 7. Reverse leakage current versus
reverse voltage applied (typical values)
I
R
1.E+03
1.E+02
1.E+01
1.E+00
1.E-01
1.E-02
Tj=150°C
Tj=125°C
Tj=100°C
Tj=75°C
Tj=50°C
Tj=25°C
1.E-03
1.E-04
VR(V)
0 102030405060708090100
Figure 9. Forward voltage drop versus
forward current (high level)
(A)
I
FM
200
180
Tj=125°C
160
140
120
100
80
60
40
20
0
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
Tj=125°C
(Maximum values)
(Maximum values)
Tj=125°C
Tj=125°C
(Typical values)
(Typical values)
Tj=25°C
(Maximum values)
VFM(V)
Figure 8. Junction capacitance versus
reverse voltage applied (typical values)
C(pF)
10000
F=1MH z
Vosc=30m V
Tj=2 5°C
1000
VR(V)
100
1 10 100
Figure 10. Forward voltage drop versus
forward current (low level)
(A)
I
FM
30
25
20
15
10
5
0
0.0 0.2 0.4 0.6 0.8 1.0
Tj=125°C
Tj=125°C
(Maximum values)
(Maximum values)
Tj=125°C
Tj=125°C
(Typical values)
(Typical values)
Tj=25°C
(Maximum values)
V(V)
FM
4/7
STPS30100ST Package Information

2 Package Information

Epoxy meets UL94,V0

Table 4. TO-220AB dimensions

Dimensions
Ref.
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 15.20 15.90 0.598 0.625
a1 3.75 0.147
B
Ø I
C
b2
a2 13.00 14.00 0.511 0.551
B 10.00 10.40 0.393 0.409
L
A
I4
l3
a1
l2
e
a2
b1
F
b1 0.61 0.88 0.024 0.034
b2 1.23 1.32 0.048 0.051
C 4.40 4.60 0.173 0.181
c2
c1 0.49 0.70 0.019 0.027
c2 2.40 2.72 0.094 0.107
e 2.40 2.70 0.094 0.106
M
F 6.20 6.60 0.244 0.259
c1
ØI 3.75 3.85 0.147 0.151
I4 15.80 16.40 16.80 0.622 0.646 0.661
L 2.65 2.95 0.104 0.116
l2 1.14 1.70 0.044 0.066
l3 1.14 1.70 0.044 0.066
M2.60 0.102
In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
5/7
Ordering Information STPS30100ST

3 Ordering Information

Ordering type Marking Package Weight Base qty Delivery mode
STPS30100ST STPS30100ST TO-220AB 2.23 g 50 Tube

4 Revision History

Date Revision Changes
24-Oct-2006 1 First issue
6/7
STPS30100ST
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2006 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -
Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
7/7
Loading...