The STPS20M60S is a single Schottky diode,
suited for high frequency switch mode power
supply.
Packaged in TO-220AB, I
device is intended to be used in notebook, game
station and desktop adapters, providing in these
aplications a good efficiency at both low and high
load.
Table 1.Device summary
SymbolValue
I
F(AV)
V
RRM
(typ)0.365 V
V
F
(max)150 °C
T
j
2
PAK and D2PAK, this
20 A
60 V
A
K
A
K
K
A
K
A
2
PAK
I
STPS20M60SR
K
STPS20M60SG-TR
A
2
PAK
D
A
K
TO-220AB
STPS20M60ST
Figure 1.Electrical characteristics
2 x I
O
I
"Forward"
X
V
I
A
A
(a)
I
F
I
V
RRM
V
V
a. V
ARM
operating area defined in Figure 12. V
pulse measurements (t
are static characteristics
AR
and I
R
"Reverse"
must respect the reverse safe
ARM
O
< 1 µs). VR, IR, V
p
I
R
V
To
I
AR
V
F(Io)
X
V
V
F(2xIo)
F
and IAR are
AR
and VF,
RRM
V
October 2011Doc ID 019045 Rev 11/9
www.st.com
9
CharacteristicsSTPS20M60S
1 Characteristics
Table 2.Absolute ratings (limiting values with terminals 1 and 3 short circuited at
T
= 25 °C, unless otherwise specified)
amb
SymbolParameterValueUnit
V
I
F(RMS)
I
F(AV)
I
P
ARM
V
ARM
V
ASM
T
1. For temperature or pulse time duration deratings, please refer to Figure 4 and 5. More details regarding the
2. See Figure 12
3. condition to avoid thermal runaway for a diode on its own heatsink
Table 3.Thermal resistance
Repetitive peak reverse voltage60V
RRM
Forward rms current90A
Average forward current, δ = 0.5Tc = 135 °C Per package20A
Surge non repetitive forward current tp = 10 ms sine-wave600A
avalanche energy measurements and diode validation in the avalanche are provided in the application
notes AN1768 and AN2025.
<
Rth(j-a)
1
dPtot
dTj
t
< 1 µs, Tj < 150 °C, IAR < 99 A80V
p
< 1 µs, Tj < 150 °C, IAR < 99 A80V
t
p
(3)
150°C
SymbolParameterValueUnit
th(j-c)
Junction to case1.0°C/W
R
Table 4.Static electrical characteristics (terminals 1 and 3 short circuited)
SymbolParameterTest conditionsMin.Typ.Max.Unit
T
Reverse leakage
(1)
I
R
current
(2)
V
1. Pulse test: tp = 5 ms, δ < 2 %
2. Pulse test: tp = 380 µs, δ < 2 %
Forward voltage drop
F
= 25 °C
j
= 125 °C-2075mA
T
j
Tj = 25 °C
= 125 °C-0.3650.405
T
j
= 25 °C
T
j
= 125 °C-0.4500.505
T
j
V
= V
R
I
= 10 A
F
I
= 20 A
F
RRM
-30125µA
-0.4650.500
-0.5200.565
V
To evaluate the conduction losses use the following equation:
P = 0.380 x I
2/9Doc ID 019045 Rev 1
+ 0.0063 x I
F(AV)
F2(RMS)
STPS20M60SCharacteristics
Figure 2.Average forward power dissipation
versus average forward current
P(W)
F(AV)
18
16
14
12
10
8
6
4
2
0
0 4 8 1216202428
δ = 0.05
δ = 0.1
δ = 0.2
T
δ = t / T
p
δ = 0.5
t
p
δ = 1
I(A)
F(AV)
Figure 4.Normalized avalanche power
derating versus pulse duration
P(tp)
ARM
P(1µs)
ARM
1
0.1
Figure 3.Average forward current versus
ambient temperature (δ = 0.5)
I(A)
F(AV)
24
R
= R
th(j-a)
T (°C)
amb
th(j-c)
20
16
12
8
4
0
0255075100125150
Figure 5.Normalized avalanche power
derating versus junction
temperature
P(T)
ARM j
P(25 °C)
ARM
1.2
1
0.8
0.01
t (µs)
0.001
0.10.011
10100
p
1000
Figure 6.Non repetitive surge peak forward
current versus overload duration
(maximum values)
I (A)
M
350
300
250
200
150
100
I
M
50
0
1.E-031.E-021.E-011.E+00
t
δ = 0.5
T = 25 °C
c
T = 75 °C
c
T = 125 °C
c
t(s)
0.6
0.4
0.2
0
255075100125
Figure 7.Relative variation of thermal
impedance junction to case versus
pulse duration
Z/R
th(j-c) th(j-c)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
Single pulse
0.2
0.1
0.0
1.E-041.E-031.E-021.E-011.E+00
T (°C)
t (s)
p
j
150
Doc ID 019045 Rev 13/9
CharacteristicsSTPS20M60S
Figure 8.Reverse leakage current versus
reverse voltage applied
(typical values)
I (mA)
R
1.E+02
1.E+01
1.E+00
1.E-01
1.E-02
1.E-03
0 102030405060
T = 150 °C
j
T = 125 °C
j
T = 100 °C
j
T = 75 °C
j
T = 50 °C
j
T = 25 °C
j
V (V)
Figure 10. Forward voltage drop versus
forward current
I (A)
FM
1000.0
T = 125 °C
j
T = 125 °C
j
(Maximum values)
T = 25 °C
j
(Maximum values)
V (V)
FM
100.0
(Typical values)
10.0
1.0
0.1
0.00.20.40.60.81.01.2
Figure 9.Junction capacitance versus
reverse voltage applied
(typical values)
C(pF)
10000
1000
R
100
110100
Figure 11. Thermal resistance junction to
ambient versus copper surface
under tab
R(°C/W)
th(j-a)
80
70
60
50
40
30
20
10
0
0510152025303540
epoxy printed board copper thickness = 35 µm
2
DPAK
F = 1 MHz
V = 30 mV
oscRMS
T = 25 °C
j
S (cm )
Cu
V (V)
R
2
Figure 12. Reverse safe operating area (tp < 1 µs and Tj < 150 °C)
I(A)
arm
105.0
100.0
95.0
90.0
85.0
80.0
75.0
70.0
65.0
60.0
80859095 100 105 110 115 120
4/9Doc ID 019045 Rev 1
I (V ) 150 °C, 1µs
arm arm
V(V)
arm
STPS20M60SPackage information
2 Package information
●Epoxy meets UL94, V0
●Cooling method: by conduction (C)
●Recommended torque value: 0.4 to 0.6 N·m
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com
ECOPACK
Table 5.TO-220AB dimensions
®
packages, depending on their level of environmental compliance. ECOPACK®
®
is an ST trademark.
.
Dimensions
Ref.
MillimetersInches
Min.Max.Min.Max.
A4.404.600.1730.181
C1.231.320.0480.051
H2
Dia
A
C
D2.402.720.0940.107
E0.490.700.0190.027
L2
F2
F1
F
G1
L5
L9
L6
D
L4
M
E
F0.610.880.0240.034
L7
F11.141.700.0440.066
F21.141.700.0440.066
G4.955.150.1940.202
G12.402.700.0940.106
H21010.400.3930.409
L216.4 Typ.0.645 Typ.
L413140.5110.551
L52.652.950.1040.116
G
L615.2515.750.6000.620
L76.206.600.2440.259
L93.503.930.1370.154
M2.6 Typ.0.102 Typ.
Dia.3.753.850.1470.151
Doc ID 019045 Rev 15/9
Package informationSTPS20M60S
Table 6.D
L2
L
L3
2
PAK dimensions
E
A1
B2
B
G
* FLAT ZONE NO LESSTHAN 2mm
Dimensions
Ref.
MillimetersInches
Min.Max.Min.Max.
A4.404.600.1730.181
A
A12.492.690.0980.106
C2
A20.030.230.0010.009
B0.700.930.0270.037
D
B21.141.700.0450.067
C0.450.600.0170.024
C21.231.360.0480.054
C
R
D8.959.350.3520.368
E10.0010.400.3930.409
A2
G4.885.280.1920.208
L15.0015.850.5900.624
M
*
V2
L21.271.400.0500.055
L31.401.750.0550.069
M2.403.200.0940.126
R0.40 typ.0.016 typ.
V20°8°0°8°
Figure 13. D2PAK footprint (dimensions in mm)
16.90
10.30
8.90
5.08
1.30
3.70
6/9Doc ID 019045 Rev 1
STPS20M60SPackage information
Table 7.I2PAK dimensions
Dimensions
L2
Ref.
MillimetersInches
Min.Max.Min.Max.
A
E
c2
A4.404.600.1730.181
A12.402.720.0940.107
b0.610.880.0240.035
D
b11.141.700.0440.067
c0.490.700.0190.028
L1
L
b1
A1
c21.231.320.0480.052
D8.959.350.3520.368
e2.402.700.0940.106
e14.955.150.1950.203
b
e
e1
c
E1010.400.3940.409
L13140.5120.551
L13.503.930.1380.155
L21.271.400.0500.055
Doc ID 019045 Rev 17/9
Ordering informationSTPS20M60S
3 Ordering information
Table 8.Ordering information
Order codeMarkingPackageWeightBase qty Delivery mode
STPS20M60STSTPS20M60STTO-220AB2.2 g50Tube
STPS20M60SRSTPS20M60SRI2PAK1.49 g50Tube
2
STPS20M60SG-TRSTPS20M60SGD
PAK1.48 g1000Tape and reel
4 Revision history
Table 9.Revision history
DateRevisionChanges
11-Oct-20111Initial release
8/9Doc ID 019045 Rev 1
STPS20M60S
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY TWO AUTHORIZED ST REPRESENTATIVES, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.