Features
STPS1L60
Power Schottky rectifier
■ Negligible switching losses
■ Low forward voltage drop
■ Surface mount miniature packages
■ Avalanche capability specified
Description
Axial and surface mount power Schottky rectifiers
suited to switched mode power supplies and high
frequency DC to DC converters.
Packaged in SMA, STmite flat and DO-41, this
device is especially intended for use in low
voltage, high frequency inverters and small
battery chargers.
K
DO-41
STPS1L60
A
K
SMA
(JEDEC DO-214AC)
STPS1L60A
Table 1. Device summary
Symbol Value
I
F(AV)
V
RRM
(max) 150 °C
T
j
(max) 0.56 V
V
F
A
A
K
STmite flat
(DO222-AA)
STPS1L60MF
1 A
60 V
October 2009 Doc ID 7504 Rev 8 1/10
www.st.com
10
Characteristics STPS1L60
1 Characteristics
Table 2. Absolute ratings (limiting values)
Symbol Parameter Value Unit
V
Repetitive peak reverse voltage 60 V
RRM
STmite flat 2 A
I
F(RMS)
I
F(AV)
I
P
T
Forward rms current
SMA, DO-41 10 A
SMA T
Average forward current
STmite flat T
Surge non repetitive forward current tp =10 ms sinusoidal 40 A
FSM
Repetitive peak avalanche power tp = 1 µs Tj = 25 °C 1200 W
ARM
Storage temperature range - 65 to + 150 °C
stg
T
Maximum operating junction temperature
j
= 130 °C δ = 0.5
L
= 120 °C δ = 0.5
L
= 135 °C δ = 0.5
C
(1)
1ADO-41 T
150 °C
dV/dt Critical rate of rise of reverse voltage 10000 V/µs
<
Rth(j-a)
1
dPtot
1. condition to avoid thermal runaway for a diode on its own heatsink
dTj
Table 3. Thermal resistance
Symbol Parameter Value Unit
SMA 120
R
Junction to ambient
th(j-a)
Lead length = 10 mm DO-41 100
°C/W
SMA 30
R
R
Table 4. Static electrical characteristics
Junction to lead
th(j-l)
Junction to case STmite flat 20 °C/W
th(j-c)
Lead length = 10 mm DO-41 45
°C/W
Symbol Parameter Tests conditions Min. Typ. Max. Unit
= 25 °C
T
(1)
I
Reverse leakage current
R
j
= 100 °C 1.5 5 mA
T
j
V
Tj = 25 °C
(1)
V
1. Pulse test: tp = 380 µs, δ < 2%
Forward voltage drop
F
Tj = 100 °C 0.56
= 125 °C 0.5 0.54
T
j
T
= 25 °C
j
Tj = 100 °C 0.68
= 125 °C 0.6 0.66
T
j
I
I
To evaluate the conduction losses use the following equation:
P = 0.44 x I
2/10 Doc ID 7504 Rev 8
F(AV)
+ 0.12 I
F2(RMS)
= V
R
= 1 A
F
= 2 A
F
50 µA
RRM
0.57
V
0.75
STPS1L60 Characteristics
Figure 1. Average forward power dissipation
versus average forward current
P
(W)
F(AV)
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
0.0 0.2 0.4 0.6 0.8 1.0 1.2
δ = 0.05
δ = 0.1
I
F(AV)
(A)
δ = 0.2
δ = 0.5
δ = tp/T
δ = 1
T
t
p
Figure 3. Average forward current versus
ambient temperature (δ = 0.5)
(DO-41)
I
(A)
F(AV)
1.2
1.0
0.8
R
th(j-a)
= R
th(j-l)
DO-41
Figure 2. Average forward current versus
ambient temperature (δ = 0.5)
(SMA)
I
(A)
F(AV)
1.2
R
= R
th(j-a)
th(j-a)
(°C)
th(j-l)
= 120 °C/W
1.0
0.8
0.6
T
R
amb
0.4
δ = tp/T
T
t
p
0.2
0.0
0 25 50 75 100 125 150
SMA
Figure 4. Average forward current versus
ambient temperature (δ = 0.5)
(STmite flat)
I
(A)
F(AV)
1.2
1.0
0.8
R
th(j-a)
= R
th(j-c)
STmite flat
0.6
0.4
0.2
0.0
0 25 50 75 100 125 150
δ = tp/T
T
t
p
T
R
amb
th(j-a)
(°C)
= 100 °C/W
Figure 5. Normalized avalanche power
derating versus pulse duration
P(tp)
ARM
P (1 µs)
ARM
1
0.1
0.01
t (µs)
0.001
0.10.01 1
p
10 100 1000
0.6
0.4
0.2
δ = tp/T
0.0
0 25 50 75 100 125 150
R
= 250 °C/W
T
th(j-a)
t
p
T
amb
(°C)
Figure 6. Normalized avalanche power
derating versus junction
temperature
P(Tj)
ARM
P (25 °C)
ARM
1.2
1
0.8
0.6
0.4
0.2
0
25 50 75 100 125 150
T (°C)
j
Doc ID 7504 Rev 8 3/10
Characteristics STPS1L60
Figure 7. Non repetitive surge peak forward
current versus overload duration
(maximum values) (SMA)
IM(A)
7
6
5
4
3
2
I
M
1
0
1.E-04 1.E-03 1.E-02 1.E-01 1.E+00
δ = 0.5
t
t(s)
SMA
Ta= 25 °C
Ta= 75 °C
Ta= 125 °C
Figure 9. Non repetitive surge peak forward
current versus overload duration
(maximum values) (STmite flat)
IM(A)
18
16
14
12
10
8
6
4
I
M
δ = 0.5
t
t(s)
2
0
1.E-04 1.E-03 1.E-02 1.E-01 1.E+00
STmite flat
Tc= 25 °C
Tc= 75 °C
Tc= 125 °C
Figure 8. Non repetitive surge peak forward
current versus overload duration
(maximum values) (DO-41)
IM(A)
8
7
6
5
4
3
2
I
M
1
0
1.E-04 1.E-03 1.E-02 1.E-01 1.E+00
t
δ
= 0.5
t(s)
DO-41
Ta= 25 °C
Ta= 75 °C
Ta= 125 °C
Figure 10. Relative variation of thermal
impedance junction to ambient
versus pulse duration (SMA)
Z
th(j-a)/Rth(j-a)
1.0
Epoxy printed circuit board,
0.9
copper thickness = 35 µm,
0.8
recommended pad layout
0.7
0.6
0.5
0.4
0.3
0.2
Single pulse
0.1
0.0
1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
SMA
tp(s)
Figure 11. Relative variation of thermal
Figure 12. Relative variation of thermal
impedance junction to ambient
versus pulse duration (DO-41)
Z
th(j-a)/Rth(j-a)
1.0
Epoxy printed circuit board,
0.9
copper thickness = 35 µm,
0.8
recommended pad layout
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Single pulse
DO-41
tp(s)
4/10 Doc ID 7504 Rev 8
Z
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
impedance junction to ambient
versus pulse duration (STmite flat)
th(j-a)/Rth(j-a)
Epoxy printed circuit board,
copper thickness = 35 µm,
recommended pad layout
Single pulse
STmite flat
tp(s)
STPS1L60 Characteristics
Figure 13. Reverse leakage current versus
reverse voltage applied
(typical values)
IR(mA)
1.E+02
Tj= 150 °C
1.E+01
1.E+00
1.E-01
1.E-02
1.E-03
0 5 10 15 20 25 30 35 40 45 50 55 60
Tj= 125 °C
Tj= 100 °C
Tj= 75 °C
Tj= 50 °C
Tj= 25 °C
VR(V)
Figure 15. Forward voltage drop versus
forward current
(typical values, high level)
IFM(A)
10.00
Tj= 125 °C
1.00
Tj= 25 °C
Figure 14. Junction capacitance versus
reverse voltage applied
(typical values)
C(pF)
1000
100
10
1 10 100
VR(V)
V
osc
F = 1 MHz
= 30 mV
Tj= 25 °C
Figure 16. Forward voltage drop versus
forward current
(typical values, low level)
IFM(A)
3.0
2.5
2.0
1.5
Tj= 125 °C
Tj= 25 °C
RMS
0.10
0.01
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8
VFM(V)
1.0
0.5
0.0
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9
VFM(V)
Doc ID 7504 Rev 8 5/10
Characteristics STPS1L60
Figure 17. Thermal resistance junction to
ambient versus copper surface
Figure 18. Thermal resistance versus lead
length (DO-41)
under each lead (SMA)
R
(°C/W)
th(j-a)
140
120
100
80
60
40
20
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Epoxy printed circuit board FR4
copper thickness= 35 µm
Scu(cm²)
SMA
Rth(°C/W)
120
R
R
th(j-a)
th(j-l)
100
80
60
40
20
0
5101520
L
leads
DO-41
(mm)
25
Figure 19. Thermal resistance junction to ambient versus copper surface under tab (STmite flat)
R
(°C/W)
th(j-a)
250
225
200
175
150
125
100
75
50
25
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Epoxy printed circuit board FR4
copper thickness= 35 µm
STmite flat
Scu(cm²)
6/10 Doc ID 7504 Rev 8
STPS1L60 Package information
2 Package information
● Epoxy meets UL94, V0
● Band indicates cathode
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com
ECOPACK
Table 5. SMA dimensions
®
packages, depending on their level of environmental compliance. ECOPACK®
®
is an ST trademark.
.
Dimensions
Ref.
E1
Millimeters Inches
Min. Max. Min. Max.
D
A1 1.90 2.45 0.075 0.094
A2 0.05 0.20 0.002 0.008
b 1.25 1.65 0.049 0.065
E
A1
C
L
A2
b
c 0.15 0.40 0.006 0.016
D 2.25 2.90 0.089 0.114
E 4.80 5.35 0.189 0.211
E1 3.95 4.60 0.156 0.181
L 0.75 1.50 0.030 0.059
Figure 20. Footprint, dimensions in mm (inches)
1.4
(0.055) (0.055)
2.63
(0.103)
1.4
1.64
(0.064)
5.43
(0.214)
Doc ID 7504 Rev 8 7/10
Package information STPS1L60
Table 6. STmite flat dimensions
Dimensions
E1
D
E
c
L
b
L3
Figure 21. Footprint dimensions
0.85 0.63 2.00
(0.033) (0.079)
0.65
Ref.
L1
L2
A 0.80 0.85 0.95 0.031 0.033 0.037
b 0.40 0.55 0.65 0.016 0.022 0.026
b2 0.70 0.85 1.00 0.027 0.033 0.039
b2
c 0.10 0.15 0.25 0.004 0.006 0.009
D 1.75 1.90 2.05 0.069 0.075 0.081
E 3.60 3.80 3.90 0.142 0.150 0.154
A
E1 2.80 2.95 3.10 0.110 0.116 0.122
L 0.50 0.55 0.80 0.020 0.022 0.031
L1 2.10 2.40 2.60 0.083 0.094 0.102
L2 0.45 0.60 0.75 0.018 0.024 0.030
L3 0.20 0.35 0.50 0.008 0.014 0.020
0.65
(.025) (.026)
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
0.95
(0.037) (0.077)(0.026)
1.95
4.13
(0.163)
millimeters
(inches)
Table 7. DO-41 (plastic) dimensions
ØD
ØB
CC
A
8/10 Doc ID 7504 Rev 8
Dimensions
Ref.
Millimeters Inches
Min. Max. Min. Max.
A 4.07 5.20 0.160 0.205
B 2.04 2.71 0.080 0.107
C25.4 1
D 0.71 0.86 0.028 0.034
STPS1L60 Ordering information
3 Ordering information
Table 8. Ordering information
Order code Marking Package Weight Base qty Delivery mode
STPS1L60A GB6 SMA 0.068 g 5000 Tape and reel
STPS1L60 STPS1L60 DO-41 0.34 g 2000 Ammopack
STPS1L60RL STPS1L60 DO-41 0.34 g 5000 Tape and reel
STPS1L60MF F1L6 STmite flat 0.016 g 12000 Tape and reel
4 Revision history
Table 9. Document revision history
Date Revision Changes
Jul-2003 5A Last update.
Aug-2004 6
25-Jun-2009 7 Added package STmite flat. Updated ECOPACK statement.
30-Sep-2009 8 Updated table 7 ref. “ C “.
SMA package dimensions update. Reference A1 max changed from
2.70 mm (0.106 inc.) to 2.03 mm (0.080 inc).
Doc ID 7504 Rev 8 9/10
STPS1L60
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