Automotive low drop power Schottky rectifier
Features
■ Very small conduction losses
■ Negligible switching losses
■ Low forward voltage drop
■ Surface mount miniature packages
■ Avalanche capability specified
■ AEC-Q101 qualified
■ ECOPACK
Description
Single chip Schottky rectifiers suited to switched
mode power supplies and high frequency DC to
DC converters.
Packaged in SMA and SMB this device is
especially intended for surface mounting and
used in low voltage, high frequency inverters, free
wheeling and polarity protection in automotive
applications.
®
2 compliant components
STPS1L40-Y
A
K
SMA
(JEDEC DO-214AC)
STPS1L40AY
Table 1. Device summary
Symbol Value
I
F(AV)
V
RRM
(max) 150 °C
T
j
(max) 0.42 V
V
F
(JEDEC DO-214AA)
A
K
SMB
STPS1L40UY
1 A
40 V
October 2011 Doc ID 18247 Rev 1 1/9
www.st.com
9
Characteristics STPS1L40-Y
1 Characteristics
Table 2. Absolute ratings (limiting values)
Symbol Parameter Value Unit
V
I
F(RMS)
I
F(AV)
I
I
I
P
T
Repetitive peak reverse voltage 40 V
RRM
Forward rms current 8 A
Average forward current TL = 130 °C δ = 0.5 1 A
Surge non repetitive forward current tp = 10 ms sinusoidal 60 A
FSM
Repetitive peak reverse current tp = 2 µs F = 1 kHz square 1 A
RRM
Non repetitive peak reverse current tp = 100 µs square 1 A
RSM
Repetitive peak avalanche power tp = 1 µs Tj = 25 °C 900 W
ARM
Storage temperature range - 65 to + 150 °C
stg
Operating junction temperature range
T
j
(1)
-40 to + 150 °C
dV/dt Critical rate of rise of reverse voltage 10000 V/µs
<
Rth(j-a)
1
dPtot
1. condition to avoid thermal runaway for a diode on its own heatsink
dTj
Table 3. Thermal resistance
Symbol Parameter Value Unit
SMA 30
R
Table 4. Static electrical characteristics
th(j-l)
Junction to lead
SMB 25
°C/W
Symbol Parameter Tests conditions Min. Typ. Max. Unit
T
= 25 °C
(1)
I
R
V
1. Pulse test: tp = 380 µs, δ < 2%
Reverse leakage current
(1)
Forward voltage drop
F
j
T
= 125 °C - 6 10 mA
j
= 25 °C
T
j
T
= 125 °C - 0.37 0.42
j
T
= 25 °C
j
= 125 °C - 0.5 0.61
T
j
V
I
F
I
F
To evaluate the conduction losses use the following equation:
P = 0.23 x I
2/9 Doc ID 18247 Rev 1
F(AV)
+ 0.19 I
F2(RMS)
= V
R
= 1 A
= 2 A
- - 35 µA
RRM
--0.5
V
- - 0.63
STPS1L40-Y Characteristics
Figure 1. Average forward power dissipation
versus average forward current
P
(W)
F(AV)
0.8
0.7
δ = 0.05
0.6
0.5
0.4
0.3
0.2
0.1
0.0
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
δ = 0.1
δ = 0.2
I
F(AV)
(A)
δ = 0.5
δ = 1
δ = tp/T
T
t
p
Figure 3. Average forward current versus
ambient temperature (SMB, δ = 0.5)
I
(A)
F(AV)
1.2
1.0
0.8
0.6
R
R
th(j-a)
th(j-a)
= R
th(j-l)
= 100 °C/W
SMB
Figure 2. Average forward current versus
ambient temperature (SMA, δ = 0.5)
I
(A)
F(AV)
1.2
R
= R
th(j-a)
1.0
0.8
0.6
0.4
0.2
0.0
T
δ = tp/T
0 25 50 75 100 125
t
p
R
th(j-a)
th(j-l)
= 120 °C/W
T
amb
SMA
(°C)
Figure 4. Normalized avalanche power
derating versus pulse duration
P(tp)
ARM
P (1 µs)
ARM
1
0.1
150
0.4
0.2
0.0
T
δ = tp/T
0 25 50 75 100 125 150
t
p
T
amb
(°C)
Figure 5. Normalized avalanche power
derating versus junction
temperature
P(Tj)
ARM
P (25 °C)
ARM
1.2
1
0.8
0.6
0.4
0.2
0
25 50 75 100 125 150
T (°C)
j
0.01
t (µs)
0.001
0.10.01 1
p
10 100 1000
Figure 6. Non repetitive surge peak forward
current versus overload duration
(maximum values, SMA)
IM(A)
7
6
5
4
3
2
I
M
1
0
1.E-04 1.E-03 1.E-02 1.E-01 1.E+00
δ = 0.5
t
t(s)
SMA
Ta= 25 °C
Ta= 75 °C
Ta= 125 °C
Doc ID 18247 Rev 1 3/9
Characteristics STPS1L40-Y
Figure 7. Non repetitive surge peak forward
current versus overload duration
(maximum values, SMB)
IM(A)
7
6
5
4
3
2
I
M
1
0
1.E-04 1.E-03 1.E-02 1.E-01 1.E+00
δ
= 0.5
t
SMB
Ta= 25 °C
Ta= 75 °C
Ta= 125 °C
Figure 9. Relative variation of thermal
impedance junction to ambient
versus pulse duration (SMB)
Z
th(j-a)/Rth(j-a)
1.0
SMB
0.9
Epoxy printed circuit board,
0.8
copper thickness = 35 µm,
recommended pad layout
0.7
0.6
0.5
0.4
0.3
0.2
Single pulse
0.1
0.0
1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
tp(s)
Figure 8. Relative variation of thermal
impedance junction to ambient
versus pulse duration (SMA)
Z
th(j-a)/Rth(j-a)
1.0
SMA
0.9
Epoxy printed circuit board,
0.8
copper thickness = 35 µm,
recommended pad layout
0.7
0.6
0.5
0.4
0.3
0.2
Single pulse
0.1
0.0
1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
tp(s)
Figure 10. Reverse leakage current versus
reverse voltage applied
(typical values)
IR(mA)
1.E+02
1.E+01
1.E+00
1.E-01
1.E-02
1.E-03
0 5 10 15 20 25 30 35 40
Tj= 150 °C
Tj= 125 °C
Tj= 100 °C
Tj= 75 °C
Tj= 50 °C
Tj= 25 °C
VR(V)
Figure 11. Junction capacitance versus
Figure 12. Forward voltage drop versus
reverse voltage applied
(typical values)
C(pF)
1000
100
10
1 10 100
VR(V)
V
osc
F = 1 MHz
= 30 mV
Tj= 25 °C
RMS
4/9 Doc ID 18247 Rev 1
10.00
1.00
0.10
0.01
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2
forward current
(typical values, high level)
IFM(A)
Tj= 125 °C
Tj= 25 °C
VFM(V)
STPS1L40-Y Characteristics
0
Figure 13. Forward voltage drop versus
forward current
(typical values, low level)
IFM(A)
3.0
2.5
2.0
1.5
1.0
0.5
0.0
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7
Tj= 125 °C
Tj= 25 °C
VFM(V)
Figure 14. Thermal resistance junction to
ambient versus copper surface
under each lead (SMA)
R
(°C/W)
th(j-a)
140
120
100
80
60
40
20
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.
Epoxy printed circuit board, FR4
copper thickness = 35 µm
SMA
Scu(cm²)
Figure 15. Thermal resistance junction to ambient versus copper surface under each lead (SMB)
R
(°C/W)
th(j-a)
120
100
Epoxy printed circuit board, FR4
copper thickness = 35 µm
80
60
40
SMB
20
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Scu(cm²)
Doc ID 18247 Rev 1 5/9
Package information STPS1L40-Y
2 Package information
● Epoxy meets UL94, V0
● Cathode band (SMA, SMB)
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com
ECOPACK
Table 5. SMA dimensions
®
packages, depending on their level of environmental compliance. ECOPACK®
®
is an ST trademark.
.
Dimensions
Ref.
E1
Millimeters Inches
Min. Max. Min. Max.
D
A1 1.90 2.45 0.075 0.094
A2 0.05 0.20 0.002 0.008
b 1.25 1.65 0.049 0.065
E
A1
C
L
A2
b
c 0.15 0.40 0.006 0.016
D 2.25 2.90 0.089 0.114
E 4.80 5.35 0.189 0.211
E1 3.95 4.60 0.156 0.181
L 0.75 1.50 0.030 0.059
Figure 16. Footprint, dimensions in mm (inches)
1.4
(0.055) (0.055)
2.63
(0.103)
1.4
5.43
(0.214)
6/9 Doc ID 18247 Rev 1
1.64
(0.064)
STPS1L40-Y Package information
Table 6. SMB dimensions
Dimensions
E1
D
Ref.
A1 1.90 2.45 0.075 0.096
A2 0.05 0.20 0.002 0.008
b 1.95 2.20 0.077 0.087
E
A1
C
L
A2
b
c 0.15 0.40 0.006 0.016
D 3.30 3.95 0.130 0.156
E 5.10 5.60 0.201 0.220
E1 4.05 4.60 0.159 0.181
L 0.75 1.50 0.030 0.059
Figure 17. Footprint, dimensions in mm (inches)
1.62
2.60
(0.064) (0.102)
5.84
(0.300)
1.62
(0.064)
Millimeters Inches
Min. Max. Min. Max.
2.18
(0.086)
Doc ID 18247 Rev 1 7/9
Ordering information STPS1L40-Y
3 Ordering information
Table 7. Ordering information
Order code Marking Package Weight Base qty Delivery mode
STPS1L40AY GB4Y SMA 0.068 g 5000 Tape and reel
STPS1L40UY GC4Y SMB 0.107 g 2500 Tape and reel
4 Revision history
Table 8. Document revision history
Date Revision Changes
21-Oct-2011 1 First issue.
8/9 Doc ID 18247 Rev 1
STPS1L40-Y
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Doc ID 18247 Rev 1 9/9
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