®
MAIN PRODUCT CHARACTERISTICS
STPS0540Z / STPS0560Z
SCHOTTKY RECTIFIER
I
F(AV)
V
RRM
V
(max) 0.40 / 0.50V
F
0.5 A
40 / 60V
FEATURES AND BENEFITS
Very small conduction losses
■
Negligible switching losses
■
Extremely fast switching
■
DESCRIPTION
Single Schottky rectifier suited for switch mode
power supplies and high frequency DC to DC
converters.
SOD-123
PackagesinSOD-123,thesedevicesareintended
for use in low voltage, high frequency inverters,
free wheeling and polarity protection applications.
Due to the small size of the package these devices
fit GSM and PCMCIA requirements.
ABSOLUTE RATINGS (limiting values)
Value
Symbol Parameter
0540Z 0560Z
V
RRM
I
F(RMS)
I
F(AV)
I
FSM
Repetitive peak reverse voltage 40 60 V
RMS forward current 2 A
Average forward current
δ=0.5
Surge non repetitive forward current tp=10ms
STPS0540Z
STPS0560Z
Ta= 60°C
Ta= 40°C
0.5 A
5.5 A
sinusoidal
dV/dt Critical rate of rise of reverse voltage 10000 V/µs
T
Storage temperature range - 65 to + 150 °C
stg
Tj Maximum operating junction temperature * 150 °C
TL Maximum temperature for soldering during 10s 260 °C
UnitSTPS
dPtot
*:
<
dTj Rth j a
January 2002 - Ed : 2B
thermal runaway condition for a diode on its own heatsink
−1()
1/5
STPS0540Z / STPS0560Z
THERMAL RESISTANCE
Symbol Parameter Value Unit
R
th (j-a)
(*) Mounted on epoxy board.
Junction to ambient (*) 340 °C/W
STATIC ELECTRICAL CHARACTERISTICS
Symbol Parameter Tests conditions
typ. max. typ. max.
I
* Reverse leakage
R
Tj=25°C VR=V
RRM
current
T =100°C 1.5 5 1 4 mA
V
** Forward
F
Tj=25°CI
= 0.5 A 0.50 0.53 V
F
voltage drop
Tj=100°C 0.35 0.40 0.44 0.50
Tj=25°CI
= 1 A 0.55 0.66
F
Tj=100°C 0.45 0.51 0.58 0.65
Pulse test : * tp=5ms,δ<2%
** tp = 380 µs, δ <2%
To evaluate the maximum conduction losses use the following equation :
STPS0540Z: P = 0.29 x I
STPS0560Z: P = 0.35 x I
F(AV)
F(AV)
+0.22xI
+0.3xI
F2(RMS)
F2(RMS)
Value
UnitSTPS0540Z STPS0560Z
40 50 µA
2/5
STPS0540Z / STPS0560Z
Fig. 1-1: Average forward power dissipation ver-
sus average forward current.(STPS0540Z)
PF(av)(W)
0.30
0.25
0.20
δ = 0.05
δ = 0.1
δ = 0.2
δ = 0.5
δ = 1
0.15
0.10
T
0.05
0.00
IF(av) (A)
0.0 0.1 0.2 0.3 0.4 0.5 0.6
δ
=tp/T
tp
Fig. 2: Average forward current versus ambient
temperature (δ = 0.5).
IF(av)(A)
0.6
0.5
0.4
STPS0560Z
0.3
0.2
0.1
0.0
0 25 50 75 100 125
δ
=tp/T
T
tp
Tamb(°C)
STPS0540Z
Fig. 1-2: Average forward power dissipation versus average forward current.(STPS0560Z)
PF(av)(W)
0.35
0.30
0.25
δ = 0.05
δ = 0.1
δ = 0.2
δ = 0.5
δ = 1
0.20
0.15
0.10
0.05
0.00
0.0 0.1 0.2 0.3 0.4 0.5 0.6
IF(av) (A)
δ
=tp/T
T
tp
Fig. 3: Non repetitive surge peak forward current
versus overload duration (maximum values).
IM(A)
4.0
3.5
3.0
STPS0540Z
2.5
2.0
STPS0560Z
1.5
1.0
IM
0.5
0.0
1E-3 1E-2 1E-1 1E+0
δ=0.5
t
t(s)
Ta = 25°C
Fig. 4: Relative variation of thermal impedance
junction to ambient versus pulse duration (Epoxy
printed circuit board FR4 with recommended pad
layout).
Zth(j-a)/Rth(j-a)
1E+0
δ = 0.5
δ = 0.2
δ = 0.1
1E-1
1E-2
Single pulse
tp(s)
1E-3
1E-3 1E-2 1E-1 1E+0 1E+1 1E+2
δ
=tp/T
T
tp
Fig. 5-1: Reverse leakage current versus reverse
voltage applied (typical values).(STPS0540Z)
IR(mA)
5E+1
1E+1
1E+0
1E-1
1E-2
1E-3
1E-4
0 5 10 15 20 25 30 35 40
Tj=125°C
Tj=100°C
Tj=70°C
Tj=25°C
VR(V)
3/5
STPS0540Z / STPS0560Z
Fig. 5-2: Reverse leakage current versus reverse
voltage applied (typical values).(STPS0560Z)
IR(mA)
5E+1
1E+1
1E+0
1E-1
Tj=125°C
Tj=100°C
Tj=70°C
1E-2
1E-3
Tj=25°C
VR(V)
1E-4
0 5 10 15 20 25 30 35 40 45 50 55 60
Fig. 7: Junction capacitance versus reverse voltage applied (typical values).
C(pF)
200
100
STPS0540Z
F=1MHz
Tj=25°C
Fig. 6: Reverse leakage current versus junction
temperature (typical values).
IR[Tj] / IR[Tj=25°C]
1E+3
VR=VRRM
1E+2
1E+1
1E+0
Tj(°C)
1E-1
0 25 50 75 100 125
Fig. 8-1: Forward voltage drop versus forward current (maximum values).(STPS0540Z)
IFM(A)
5E+0
1E+0
Tj=100°C
Typical values
50
STPS0560Z
20
VR(V)
10
12 510204060
Fig. 8-2: Forward voltage drop versus forward current (maximum values).(STPS0560Z)
IFM(A)
5E+0
1E+0
Tj=100°C
1E-1
1E-2
1E-3
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2
Tj=100°C
Typical values
Tj=25°C
VFM(V)
1E-1
Tj=100°C
Tj=25°C
1E-2
VFM(V)
1E-3
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1
Fig. 9: Variation of thermal resistance junction to
ambient versus copper surface under each lead
(Printed circuit board FR4, e(Cu) = 35µm).
Rth(j-a) (°C/W)
350
300
250
200
150
S(Cu) (mm²)
100
0 20406080100
P=0.25W
4/5
PACKAGE MECHANICAL DATA
SOD-123
STPS0540Z / STPS0560Z
H
E
D
c
G
FOOTPRINT (in millimeters)
4.45
A2
b
A1
REF.
Millimeters Inches
DIMENSIONS
Min. Max. Min. Max.
A 1.45 0.057
A1 0 0.1 0 0.004
A
A2 0.85 1.35 0.033 0.053
b 0.55 Typ. 0.022 Typ.
c 0.15 Typ. 0.039 Typ.
D 2.55 2.85 0.1 0.112
E 1.4 1.7 0.055 0.067
G 0.25 0.01
H 3.55 3.95 0.14 0.156
0.65
0.97
2.51
0.97
MARKING
Type Marking Package Weight Base qty Delivery mode
STPS0540Z Z54 SOD-123 0.01 g 3000 Tape & reel
STPS0560Z Z56 SOD-123 0.01 g 3000 Tape & reel
■
Epoxy meets UL94, V0.
■
Band indicates cathode.
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ofuse of such information nor for any infringementof patents or other rights of thirdparties which may result from its use. Nolicense is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
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5/5
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