Datasheet STPS0530Z Datasheet (ST)

Main product characteristics
I
F(AV)
V
RRM
V
(max) 0.33 V
F
0.5 A
30 V

STPS0530Z

Schottky rectifiers

Features and benefits
Very small conduction losses
Extremely fast switching
K
SOD-123
STPS0503Z
A
Description
Single Schottky rectifier suited for switch mode power supplies and high frequency DC to DC converters.
Packaged in SOD-123, this device is intended for use in low voltage, high frequency inverters, free wheeling and polarity protection applications. Due to the small size of the package this device fits GSM and PCMCIA requirements.

Table 1. Absolute ratings (limiting values)

Symbol Parameter Value Unit
V
RRM
I
F(RMS)
I
F(AV)
I
FSM
dV/dt Critical rate of rise of reverse voltage 10000 V/µs
T
stg
T
T
dPtot
---------------
1. condition to avoid thermal runaway for a diode on its own heatsink
dTj
Repetitive peak reverse voltage 30 V
RMS forward current 2 A
Average forward current δ = 0.5 Ta = 55° C 0.5 A
Surge non repetitive forward current tp = 10 ms sinusoidal 5.5 A
Storage temperature range -65 to + 150 °C
Maximum operating junction temperature
j
Maximum temperature for soldering during 10 s 260 °C
L
1
--------------------------
<
Rth j a–()
Order code
Order code Marking
STPS0503Z Z53
(1)
150 °C
October 2006 Rev 2 1/7
www.st.com
7
Characteristics STPS0530Z

1 Characteristics

Table 2. Thermal resistance

Symbol Parameter Value Unit
Val ue
(1)
°C/W
R
th(j-a)
1. Copper area on PCB S = 2.5 mm

Table 3. Static electrical characteristics

Junction to ambient 340
2
Symbol Parameter Test conditions
= 25° C
T
(1)
I
R
V
1. Pulse test: tp = 5 ms, δ < 2%
2. Pulse test: tp = 380 µs, δ < 2%
Reverse leakage current
(2)
Forward voltage drop
F
j
= 125° C 3 5 mA
T
j
= 25° C
T
j
T
= 125° C 9 21 mA
j
= 25° C
T
j
T
= 125° C 0.20 0.22
j
T
= 25° C
j
= 125° C 0.31 0.33
T
j
V
= 15 V
R
= V
V
R
RRM
= 0.1 A
I
F
IF = 0.5 A
To evaluate the maximum conduction losses use the following equation: P = 0.23 x I
F(AV)
+ 0.18 I
F2(RMS)
UnitSTPS0530Z
Typ. Max.
12 µA
130 µA
0.375
V
0.43
2/7
STPS0530Z Characteristics
Figure 1. Conduction losses versus average
current
P (W)
F(AV)
0.22
0.20
0.18
0.16
0.14
0.12
0.10
0.08
0.06
0.04
0.02
0.00
0.0 0.1 0.2 0.3 0.4 0.5 0.6
δ = 0.05
δ = 0.1
δ = 0.2
I (A)
F(AV)
δ = 0.5
δ
=tp/T
δ = 1
T
tp
Figure 3. Non repetitive surge peak forward
current versus overload duration (maximum values)
I (A)M
4.0
3.5
3.0
2.5
2.0
1.5
T
=50°CT
=50°C
amb
1.0
IM
0.5
0.0
1.E-03 1.E-02 1.E-01 1.E+00
δ=0.5
t
t(s)
amb
T
=25°C
amb
T
=75°C
amb
Figure 5. Reverse leakage current versus
reverse voltage applied (typical values)
I (mA)
R
1.E+01
Tj=125°C
Figure 2. Average forward current versus
ambient temperature (δ = 0.5)
I (A)F(AV)
0.55
0.50
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0.00
0 25 50 75 100 125
R
=340°C/W
th(j-a)
S=2.5mm²
Tamb(°C)
Figure 4. Relative variation of thermal
impedance junction to ambient versus pulse duration
Zth(j-a)/Rth(j-a)
1.0E+00
δ = 0.5
δ = 0.2
δ = 0.1
1.0E-01
1.0E-02
δ
=tp/T
T
tp
Single pulse
tp(s)
1.0E-03
1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02
Figure 6. Reverse leakage current versus
junction temperature (typical values)
I (mA)R
1.E+01
VR=30V
1.E+00
1.E-01
1.E-02
1.E-03
024681012141618202224262830
Tj=100°C
Tj=75°C
Tj=50°C
Tj=25°C
V (V)
R
1.E+00
1.E-01
1.E-02
Tj(°C)
1.E-03
0 25 50 75 100 125
3/7
Characteristics STPS0530Z
Figure 7. Junction capacitance versus
reverse voltage applied (typical values)
C(pF)
1000
100
V (V)
R
10
1 10 100
V
F=1MHz
OSC
Tj=25°C
=30mV
Figure 9. Thermal resistance junction to
ambient versus copper surface under each lead (epoxy printed circuit board FR4, Cu = 35 µm, typical values)
th(j-a)
R (°C/W)
350
300
250
200
150
100
50
0
0 102030405060708090100
S(mm²)
Figure 8. Forward voltage drop versus
forward current
I (A)FM
2.0
RMS
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0.00 0.10 0.20 0.30 0.40 0.50 0.60 0.70 0.80
Tj=125°C
Tj=125°C
(Maximum values)
(Maximum values)
Tj=125°C
Tj=125°C
(Typical values)
(Typical values)
V (V)FM
Tj=25°C
(Maximum values)
4/7
STPS0530Z Package information

2 Package information

Epoxy meets UL94, V0.
Band indicates cathode.

Table 4. SOD-123 dimensions

Dimensions
H
b
E
D
c
G
A2
A

Figure 10. Footprint (in millimeters)

4.45
Ref
A1
Millimeters Inches
Min. Max. Min. Max.
A1.450.057
A1 0 0.1 0 0.004
A2 0.85 1.35 0.033 0.053
b 0.55 Typ. 0.022 Typ.
c 0.15 Typ. 0.039 Typ.
D 2.55 2.85 0.1 0.112
E 1.4 1.7 0.055 0.067
G 0.25 0.01
H 3.55 3.95 0.14 0.156
0.65
0.97
2.51
0.97
In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
5/7
Ordering information STPS0530Z

3 Ordering information

Ordering type Marking Package Weight Base qty Delivery mode
STPS0530Z Z53 SOD-123 0.01 g 3000 Tape & reel

4 Revision history

Date Revision Changes
Mar-2003 1A Initial release.
Reformated to current standards. Updated maximum junction
17-Oct-2006 2
temperatures to 150° C and updated package illustration to show cathode bar on page 1
6/7
STPS0530Z
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