Single Schottky rectifier suited for switch mode
power supplies and high frequency DC to DC
converters.
Packaged in SOD-123, this device is intended for
use in low voltage, high frequency inverters, free
wheeling and polarity protection applications. Due
to the small size of the package this device fits
GSM and PCMCIA requirements.
Table 1.Absolute ratings (limiting values)
SymbolParameterValueUnit
V
RRM
I
F(RMS)
I
F(AV)
I
FSM
dV/dtCritical rate of rise of reverse voltage10000V/µs
T
stg
T
T
dPtot
---------------
1. condition to avoid thermal runaway for a diode on its own heatsink
dTj
Repetitive peak reverse voltage30V
RMS forward current2A
Average forward current δ = 0.5Ta = 55° C 0.5A
Surge non repetitive forward currenttp = 10 ms sinusoidal5.5A
Storage temperature range-65 to + 150°C
Maximum operating junction temperature
j
Maximum temperature for soldering during 10 s260°C
L
1
--------------------------
<
Rth j a–()
Order code
Order codeMarking
STPS0503ZZ53
(1)
150°C
October 2006 Rev 21/7
www.st.com
7
CharacteristicsSTPS0530Z
1 Characteristics
Table 2.Thermal resistance
SymbolParameterValueUnit
Val ue
(1)
°C/W
R
th(j-a)
1. Copper area on PCB S = 2.5 mm
Table 3.Static electrical characteristics
Junction to ambient340
2
SymbolParameterTest conditions
= 25° C
T
(1)
I
R
V
1. Pulse test: tp = 5 ms, δ < 2%
2. Pulse test: tp = 380 µs, δ < 2%
Reverse leakage current
(2)
Forward voltage drop
F
j
= 125° C35mA
T
j
= 25° C
T
j
T
= 125° C921mA
j
= 25° C
T
j
T
= 125° C0.200.22
j
T
= 25° C
j
= 125° C0.310.33
T
j
V
= 15 V
R
= V
V
R
RRM
= 0.1 A
I
F
IF = 0.5 A
To evaluate the maximum conduction losses use the following equation:
P = 0.23 x I
F(AV)
+ 0.18 I
F2(RMS)
UnitSTPS0530Z
Typ.Max.
12µA
130µA
0.375
V
0.43
2/7
STPS0530ZCharacteristics
Figure 1.Conduction losses versus average
current
P(W)
F(AV)
0.22
0.20
0.18
0.16
0.14
0.12
0.10
0.08
0.06
0.04
0.02
0.00
0.00.10.20.30.40.50.6
δ = 0.05
δ = 0.1
δ = 0.2
I(A)
F(AV)
δ = 0.5
δ
=tp/T
δ = 1
T
tp
Figure 3.Non repetitive surge peak forward
current versus overload duration
(maximum values)
I (A)M
4.0
3.5
3.0
2.5
2.0
1.5
T
=50°CT
=50°C
amb
1.0
IM
0.5
0.0
1.E-031.E-021.E-011.E+00
δ=0.5
t
t(s)
amb
T
=25°C
amb
T
=75°C
amb
Figure 5.Reverse leakage current versus
reverse voltage applied (typical
values)
I (mA)
R
1.E+01
Tj=125°C
Figure 2.Average forward current versus
ambient temperature (δ = 0.5)
I(A)F(AV)
0.55
0.50
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0.00
0255075100125
R
=340°C/W
th(j-a)
S=2.5mm²
Tamb(°C)
Figure 4.Relative variation of thermal
impedance junction to ambient
versus pulse duration
Zth(j-a)/Rth(j-a)
1.0E+00
δ = 0.5
δ = 0.2
δ = 0.1
1.0E-01
1.0E-02
δ
=tp/T
T
tp
Single pulse
tp(s)
1.0E-03
1.E-031.E-021.E-011.E+001.E+011.E+02
Figure 6.Reverse leakage current versus
junction temperature (typical
values)
I (mA)R
1.E+01
VR=30V
1.E+00
1.E-01
1.E-02
1.E-03
024681012141618202224262830
Tj=100°C
Tj=75°C
Tj=50°C
Tj=25°C
V (V)
R
1.E+00
1.E-01
1.E-02
Tj(°C)
1.E-03
0255075100125
3/7
CharacteristicsSTPS0530Z
Figure 7.Junction capacitance versus
reverse voltage applied (typical
values)
C(pF)
1000
100
V (V)
R
10
110100
V
F=1MHz
OSC
Tj=25°C
=30mV
Figure 9.Thermal resistance junction to
ambient versus copper surface
under each lead (epoxy printed
circuit board FR4, Cu = 35 µm,
typical values)
th(j-a)
R(°C/W)
350
300
250
200
150
100
50
0
0 102030405060708090100
S(mm²)
Figure 8.Forward voltage drop versus
forward current
I (A)FM
2.0
RMS
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0.000.100.200.300.400.500.600.700.80
Tj=125°C
Tj=125°C
(Maximum values)
(Maximum values)
Tj=125°C
Tj=125°C
(Typical values)
(Typical values)
V (V)FM
Tj=25°C
(Maximum values)
4/7
STPS0530ZPackage information
2 Package information
●Epoxy meets UL94, V0.
●Band indicates cathode.
Table 4.SOD-123 dimensions
Dimensions
H
b
E
D
c
G
A2
A
Figure 10. Footprint (in millimeters)
4.45
Ref
A1
MillimetersInches
Min.Max.Min.Max.
A1.450.057
A100.100.004
A20.851.350.0330.053
b0.55 Typ.0.022 Typ.
c0.15 Typ.0.039 Typ.
D2.552.850.10.112
E1.41.70.0550.067
G0.250.01
H3.553.950.140.156
0.65
0.97
2.51
0.97
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Reformated to current standards. Updated maximum junction
17-Oct-20062
temperatures to 150° C and updated package illustration to show
cathode bar on page 1
6/7
STPS0530Z
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