ST STP62NS04Z User Manual

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N-CHANNEL CLAMPED 12.5m- 62A TO-220
FULLY PROTECTED MESH OVERLAY™ MOSFET
STP62NS04Z
TYPE
V
DSS
R
DS(on)
I
D
STP62NS04Z CLAMPED <0.015 62 A
TYPICAL R
100% AVALANCHE TESTED
LOW CAPACITANCE AND GATE CHARGE
o
175
C MAXIMUM JUNCTION
(on) = 0.0125
TEMPERATURE
DESCRIPTION
This fully clamped M os fe t is p rod uc ed by u sin g th e l ate st advanced Company’s Mesh Overlay process which is based on a novel strip layout. The inheren t ben ef i t s of th e ne w t ec hn ol o gy co up le d wit h the extra clamping capabilities make this product particularly suitable for the harshest operation conditions such as those encountered in the automotive environment. Any other application requiring extra ruggedness is also recommended.
APPLICATIONS
ABS, SOLENOID DRIVERS
POWER TOOLS
2
TO-220
INTERNAL SCHEMATIC DIAGRAM
Ordering Information
STP62NS04Z P62NS04Z TO-220 TUBE
SALES TYPE MARKING PACKAGE PACKAGING
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
V
DS
V
DG
V
GS
I
D
I
D
I
DG
I
GS
(•)
I
DM
P
tot
dv/dt
E
AS
V
ESD
T
stg
T
j
(•) Pulse width limited by safe operating area. (1) I
.
Drain-source Voltage (VGS = 0)
CLAMPED V Drain-gate Voltage CLAMPED V Gate- source Voltage CLAMPED V Drain Current (conti nuo us ) at TC = 25°C Drain Current (conti nuo us ) at TC = 100°C
62 A
37.5 A Drain Gate Current (co nti nu ou s) ± 50 mA Gate SourceCurrent (continuous) ± 50 mA Drain Current (pulse d) 248 A Total Dissipation at TC = 25°C
110 W
Derating Factor 0.74 W/°C
(1)
Peak Diode Recove ry vo ltag e slo pe 8 V/ns
(2)
Single Pulse Avalanche Energy 500 mJ ESD (HBM - C = 100pF, R=1.5 k)8kV Storage Temperature Operating Junction Temperature
40A, di/dt 100A/µs, VDD V
SD
(2) Starting Tj = 25 oC, ID = 20A, VDD= 20V
-55 to 175 °C
, Tj T
(BR)DSS
JMAX
1/8March 2004
STP62NS04Z
THERMAL DATA
Rthj-case
Rthj-amb
T
l
Thermal Resistance Junction-case Thermal Resistance Junction-ambient Maximum Lead Temperature For Soldering Purpose (for 10 sec., 1.6mm from case)
Max Max
1.36
62.5 300
°C/W °C/W
°C
ELECTRICAL CHARACTERISTICS (T
= 25 °C unless otherwise specified)
case
OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
(BR)DSS
I
DSS
I
GSS
V
GSS
Clamped Voltage Zero Gate Voltage
Drain Current (V
GS
Gate-body Leakage Current (V
DS
= 0)
Gate-Source
= 0)
I
= 1 mA, VGS = 0
D
= 16 V
V
DS
= ± 10 V
V
GS
I
= 100 µA
GS
33 V
10 µA
10 µA
18 V
Breakdown Voltage
(*)
ON
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
GS(th)
R
DS(on)
Gate Threshold Voltage Static Drain-source On
V
= VGS ID = 250 µA
DS
V
= 10 V ID = 30 A
GS
24V
12.5 15 m
Resistance
DYNAMIC
Symbol Parameter Test Conditions Min. Typ. Max. Unit
(*)
g
fs
C
iss
C
oss
C
rss
Forward Transconductance Input Capacitance
Output Capacitance Reverse Transfer Capacitance
V
= 15 V ID=30A
DS
V
= 25V, f = 1 MHz, VGS = 0
DS
20 S
1330
420 135
pF pF pF
2/8
STP62NS04Z
ELECTRICAL CHARACTERISTICS (continued)
SWITCHING ON
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
t
d(on)
Q Q Q
t
r
g gs gd
Turn-on Delay Time Rise Time
Total Gate Charge Gate-Source Charg e Gate-Drain Charge
SWITCHING OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
t
d(off)
t
t
r(Voff)
t
t
f
f
c
Turn-off Delay Time Fall Time
Off-voltage Rise Time Fall Time Cross-over Time
SOURCE DRAIN DIODE
Symbol Parameter Test Conditions Min. Typ. Max. Unit
I
SD
I
SDM
V
SD
t
rr
Q
rr
I
RRM
(*)
Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %.
()
Pulse width limited by safe operating area.
Source-drain Curre nt Source-drain Curre nt (pu lse d)
(•)
(*)
Forward On Voltage Reverse Recovery Time
Reverse Recovery Charge Reverse Recovery Current
= 20 V ID = 20 A
DD
=4.7 Ω VGS = 10 V
R
G
(Resistive Load, Figu re 3)
V
= 20 V ID= 40 A VGS= 10V
DD
V
= 20 V ID = 20 A
DD
=4.7 Ω VGS = 10 V
R
G
(Resistive Load, Figu re 3) V
= 30 V ID = 40 A
clamp
=4.7Ω, V
R
G
GS
= 10 V
(Inductive Load, Figu re 5)
I
= 62 A VGS = 0
SD
I
= 40 A di/dt = 100A/µs
SD
= 20 V Tj = 150°C
V
DD
(see test circuit, Figure 5)
13
104
34 10
11.5
41 42
30 54 90
45 65
2.9
47 nC
62
248
1.5 V
ns ns
nC nC
ns ns
ns ns ns
A A
ns nC
A
Safe Operating Area
Thermal Impedance
3/8
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