The STM690A/692A/703/704/802/805/817/818/819 supervisors are self-contained devices
which provide microprocessor supervisory functions with the ability to non-volatize and
write-protect external LPSRAM. A precision voltage reference and comparator monitors the
V
input for an out-of-tolerance condition. When an invalid V
CC
output (RST
) is forced low (or high in the case of RST). These devices also offer a watchdog
timer (except for STM703/704/819) as well as a power-fail comparator (except for STM818)
to provide the system with an early warning of impending power failure.
These devices are available in a standard 8-pin SOIC package or a space-saving 8-pin
TSSOP package.
A logic low on MR asserts the reset output. Reset remains asserted as long as MR is low
and for t
driven from a TTL or CMOS logic line, or shorted to ground with a switch. Leave open if
unused.
1.1.2 WDI
If WDI remains high or low for 1.6 sec, the internal watchdog timer runs out and reset is
triggered. The internal watchdog timer clears while reset is asserted or when WDI sees a
rising or falling edge.
The watchdog function can be disabled by allowing the WDI pin to float.
1.1.3 RST
Pulses low for t
or when MR
threshold, the watchdog triggers a reset, or MR
1.1.4 RST
Pulses high for t
threshold or when MR
reset threshold, the watchdog triggers a reset, or MR
after MR returns high. This active-low input has an internal pull-up. It can be
rec
when triggered, and stays low whenever V
rec
is a logic low. It remains low for t
after either V
rec
is below the reset threshold
CC
rises above the reset
CC
goes from low to high.
when triggered, and stays high whenever VCC is above the reset
The STM690A/692A/703/704/802/805/817/818/819 Supervisor asserts a reset signal to the
MCU whenever V
when the Push-button Reset Input (MR
(logic high for STM805) for 0V < V
battery, RST
is guaranteed valid down to VCC =1 V.
goes below the reset threshold (V
CC
) is taken low. RST is guaranteed to be a logic low
CC
< V
if VBAT is greater than 1 V. Without a backup
RST
, a watchdog time-out occurs, or
RST)
During power-up, once V
the reset time-out period, t
If V
drops below the reset threshold, RST goes low. Each time RST is asserted, it stays
CC
low for at least the reset time-out period (t
the internal timer clears. The reset timer starts when V
exceeds the reset threshold an internal timer keeps RST low for
CC
. After this interval RST returns high.
rec
). Any time VCC goes below the reset threshold
rec
returns above the reset threshold.
CC
2.2 Push-button reset input (STM703/704/819)
A logic low on MR asserts reset. Reset remains asserted while MR is low, and for t
Figure 41) after it returns high. The MR
input has an internal 40 kΩ pull-up resistor, allowing
it to be left open if not used. This input can be driven with TTL/CMOS-logic levels or with
open-drain/collector outputs. Connect a normally open momentary switch from MR
to create a manual reset function; external debounce circuitry is not required. If MR
from long cables or the device is used in a noisy environment, connect a 0.1 µF capacitor
from MR
to GND to provide additional noise immunity. MR may float, or be tied to VCC when
not used.
2.3 Watchdog input (NOT available on STM703/704/819)
The watchdog timer can be used to detect an out-of-control MCU. If the MCU does not
toggle the Watchdog Input (WDI) within t
watchdog timer is cleared by either:
1.a reset pulse, or
2. by toggling WDI (high-to-low or low-to-high), which can detect pulses as short as 50ns.
If WDI is tied high or low, a reset pulse is triggered every 1.8 sec (t
The timer remains cleared and does not count for as long as reset is asserted. As soon as
reset is released, the timer starts counting (see Figure 42).
(1.6 sec typ), the reset is asserted. The internal
WD
+ t
WD
rec
).
(see
rec
to GND
is driven
Note:1The watchdog function may be disabled by floating WDI or tri-stating the driver connected to
WDI. When tri-stated or disconnected, the maximum allowable leakage current is 10 µA and
the maximum allowable load capacitance is 200 pF.
2Input pulses less than 20 ns will be ignored.
Doc ID 10522 Rev 1013/43
OperationSTM690A/692A/703/704/802/805/817/818/819
2.4 Backup battery switchover
In the event of a power failure, it may be necessary to preserve the contents of external
SRAM through V
automatically switch the SRAM to the backup supply when V
Note:When the battery is first connected without V
immediately provide backup battery voltage on V
switchover operate as described below. This mode allows a battery to be attached during
manufacturing but not used until after the system has been activated for the first time. As a
result, no battery power is consumed by the device during storage and shipment. For the
STM81x devices, the battery freshness seal can be initiated again by following the
procedure outlined in Section 2.12. If the backup battery is not used, connect both V
V
to V
OUT
Whenever V
CC
.
CC
100 Ω switch. V
be powered by V
battery life.
. With a backup battery installed with voltage V
OUT
power applied, the device does not
CC
falls below the switchover voltage, VSO, V
is the lesser of V
SO
for as long as possible before switching over thereby maximizing the
CC
BAT
and V
RST
. Only after VCC exceeds V
OUT
OUT
. Choosing the lesser allows the device to
falls.
CC
is connected to V
, the devices
BAT
will the
RST
through a
BAT
BAT
and
Assuming V
before V
OUT
external SRAMs. When V
point. V
OUT
> 2.0 V, switchover at VSO ensures that battery backup mode is entered
BAT
gets too close to the 2.0 V minimum required to reliably retain data in most
recovers, hysteresis is used to avoid oscillation around the VSO
CC
is connected to VCC through a 3 Ω PMOS power switch.
Note:The backup battery may be removed while V
decoupled (0.1 µF typ), without danger of triggering a reset.
Table 4.I/O status in battery backup
V
OUT
V
CC
PFIDisabled
PFO
E
E
CON
WDIWatchdog timer is disabled
MR
RST
RSTLogic high
V
BAT
Connected to V
Disconnected from V
Logic low
High impedance
Logic high
Disabled
Logic low
Connected to V
through internal switch
BAT
OUT
OUT
is valid, assuming V
CC
is adequately
BAT
14/43Doc ID 10522 Rev 10
STM690A/692A/703/704/802/805/817/818/819Operation
2.5 Chip-enable gating (STM818 only)
Internal gating of the chip-enable (E) signal prevents erroneous data from corrupting the
external CMOS RAM in the event of an undervoltage condition. The STM818 uses a series
transmission gate from E
asserted), the E
transmission gate is enabled and passes all E transitions. When reset is
to E
(see Figure 11). During normal operation (reset not
CON
asserted, this path becomes disabled, preventing erroneous data from corrupting the CMOS
RAM. The short propagation delay from E
most µPs. If E
is low when reset asserts, E
goes high) to permit the current WRITE cycle to complete. Connect E
to E
CON
enables the STM818 to be used with
CON
remains low for typically 15 µs (or until E
to VSS if unused.
2.6 Chip-enable input (STM818 only)
The chip-enable transmission gate is disabled and E is high impedance (disabled mode)
while reset is asserted. During a power-down sequence when V
threshold, the chip-enable transmission gate disables and E
impedance if the voltage at E
is high. If E is low when reset asserts, the chip-enable
transmission gate will disable 15 µs after reset asserts (see Figure 12). This permits the
current WRITE cycle to complete during power-down.
passes the reset
CC
immediately becomes high
Any time a reset is generated, the chip-enable transmission gate remains disabled and E
remains high impedance (regardless of E
activity) for the reset time-out period. When the
chip-enable transmission gate is enabled, the impedance of E
series with the load at E
gate depends on V
on E
. The chip-enable propagation delay is production tested from the 50% point on E to
CON
the 50% point on E
CC
CON
. The propagation delay through the chip-enable transmission
CON
, the source impedance of the drive connected to E, and the loading
using a 50 Ω driver and a 50 pF load capacitance (see Figure 39).
For minimum propagation delay, minimize the capacitive load at E
impedance driver.
2.7 Chip-enable output (STM818 only)
When the chip-enable transmission gate is enabled, the impedance of E
a 40 Ω resistor in series with the source driving E
gate is off and an active pull-up connects E
off when the transmission gate is enabled.
Figure 11. Chip-enable gating
V
CC
V
RST
COMPARE
. In the disabled mode, the transmission
to V
CON
Generator
appears as a 40 Ω resistor in
and use a low-output
CON
is equivalent to
CON
(see Figure 11). This pull-up turns
OUT
t
rec
RST
V
OUT
E
OUTPUT
CON
CONTROL
E
Doc ID 10522 Rev 1015/43
E
CON
AI08802
OperationSTM690A/692A/703/704/802/805/817/818/819
Figure 12. Chip-enable waveform
V
E
RST
E
CC
CON
V
RST
V
BAT
t
rec
XXXX
t
rec15µs
2.8 Power-fail input/output (NOT available on STM818)
The Power-fail Input (PFI) is compared to an internal reference voltage (independent from
the V
Output (PFO
signal a failing power supply. Typically PFI is connected through an external voltage divider
(see Figure 12) to either the unregulated DC input (if it is available) or the regulated output
of the V
below V
STM690A/692A/703/704/802/805/817/818/819 Supervisor or before the microprocessor
drops below the minimum operating voltage. This provides several milliseconds of advanced
warning that power is about to fail.
comparator). If PFI is less than the power-fail threshold (V
RST
), the Power-Fail
PFI
) will go low. This function is intended for use as an undervoltage detector to
regulator. The voltage divider can be set up such that the voltage at PFI falls
CC
several milliseconds before the regulated VCC input to the
PFI
AI08803b
During battery backup, the power-fail comparator turns off and PFO
(see Figure 13 below and Figure 14). This occurs after V
When power returns, PFO
WRITE protect time (t
PFO
follows PFI. If the comparator is unused, PFI should be connected to VSS and PFO left
unconnected. PFO
may be connected to MR on the STM703/704/818 so that a low voltage
is forced high (STM817/819 only), irrespective of V
). At the end of this time, the power-fail comparator is enabled and
rec
on PFI will generate a reset output.
2.9 Applications information
These supervisor circuits are not short-circuit protected. Shorting V
excluding power-up transients such as charging a decoupling capacitor - destroys the
device. Decouple both V
the device as possible.
CC
and V
BAT
goes (or remains) low
drops below 2.4 V (or VSO).
CC
to ground -
OUT
for the
PFI
pins to ground by placing 0.1 µF capacitors as close to
SuperCaps™ are capacitors with extremely high capacitance values (e.g., 0.47 F) for their
size. Figure 15 shows how to use a SuperCap as a backup power source. The SuperCap
may be connected through a diode to the 5 V supply. Since V
is above the reset threshold, there are no special precautions for using these supervisors
with a SuperCap.
Doc ID 10522 Rev 1017/43
can exceed VCC while VCC
BAT
OperationSTM690A/692A/703/704/802/805/817/818/819
2.11 Negative-going VCC transients
The STM690A/692A/703/704/802/805/817/818/819 Supervisors are relatively immune to
negative-going V
reset comparator overdrive (for which the STM690A/692A/703/704/802/805/817/818/819
will NOT generate a reset pulse). The graph was generated using a negative pulse applied
to V
, starting at V
CC
indicated (comparator overdrive). The graph indicates the maximum pulse width a negative
V
transient can have without causing a reset pulse. As the magnitude of the transient
CC
increases (further below the threshold), the maximum allowable pulse width decreases. Any
combination of duration and overdrive which lies under the curve will NOT generate a reset
signal. Typically, a V
or less will not cause a reset pulse. A 0.1 µF bypass capacitor mounted as close as possible
to the V
pin provides additional transient immunity.
CC
transients (glitches). Figure 37 shows typical transient duration versus
CC
+ 0.3 V and ending below the reset threshold by the magnitude
RST
transient that goes 100 mV below the reset threshold and lasts 40 µs
CC
18/43Doc ID 10522 Rev 10
STM690A/692A/703/704/802/805/817/818/819Operation
2.12 Battery freshness seal (STM817/818/819)
The battery freshness seal disconnects the backup battery from internal circuitry and V
until it is needed. This allows an OEM to ensure that the backup battery connected to V
OUT
BAT
will be fresh when the final product is put to use. To enable the freshness seal:
1.Connect a battery to V
BAT
2. Ground PFO
3. Bring VCC above the reset threshold and hold it there until reset is deasserted following
the reset timeout period and
4. Bring V
Use the same procedure for the STM818, but ground E
down again (Figure 16)
CC
instead of PFO. Once the
CON
battery freshness seal is enabled (disconnecting the backup battery from internal circuitry
and anything connected to V
), it remains enabled until VCC is brought above V
Stressing the device above the rating listed in the absolute maximum ratings table may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the operating sections of
this specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.
Table 5.Absolute maximum ratings
SymbolParameterValueUnit
T
STG
(1)
T
SLD
V
IO
V
CC/VBAT
I
O
P
D
1. Reflow at peak temperature of 260 °C. The time above 255 °C must not exceed 30 seconds.
Storage temperature (VCC off)–55 to 150°C
Lead solder temperature for 10 seconds260°C
Input or output voltage–0.3 to VCC +0.3V
Supply voltage–0.3 to 6.0V
Output current20mA
Power dissipation320mW
Doc ID 10522 Rev 1031/43
DC and AC parametersSTM690A/692A/703/704/802/805/817/818/819
5 DC and AC parameters
This section summarizes the operating measurement conditions, and the DC and AC
characteristics of the device. The parameters in the DC and AC characteristics Tables that
follow, are derived from tests performed under the measurement conditions summarized in
Table 6: Operating and AC measurement conditions. Designers should check that the
operating conditions in their circuit match the operating conditions when relying on the
quoted parameters.
Table 6.Operating and AC measurement conditions
Parameter
VCC/V
supply voltage1.0 to 5.5V
BAT
Ambient operating temperature (T
)–40 to 85°C
A
STM690A/692A/703/704/802/805/
817/818/819
Unit
Input rise and fall times≤ 5ns
Input pulse voltages0.2 to 0.8V
Input and output timing ref. voltages0.3 to 0.7V
Figure 39. E
to E
propagation delay test circuit
CON
V
CC
V
CC
V
BAT
3.6V
STMXXX
25 Equivalent
Source Impedance
E
50
50
Cable
50
GND
E
CON
50pF C
CC
CC
(1)
L
V
V
1. CL includes load capacitance and scope probe capacitance.
32/43Doc ID 10522 Rev 10
AI08854
STM690A/692A/703/704/802/805/817/818/819DC and AC parameters
Figure 40. AC testing input/output waveforms
0.8V
0.2V
CC
CC
0.7V
0.3V
CC
CC
AI02568
Figure 41. MR
MR
RST
timing waveform
t
MLRL
(1)
t
MLMH
1. RST for STM805.
Figure 42. Watchdog timing
V
CC
t
RST
WDI
rec
t
rec
t
WD
AI07837a
AI07891
Doc ID 10522 Rev 1033/43
DC and AC parametersSTM690A/692A/703/704/802/805/817/818/819
Table 7.DC and AC characteristics
V
V
I
CC
I
BAT
V
V
Sym
CC
BAT
(4)
OUT1
OUT2
Alter-
native
,
(2)
DescriptionTest condition
Operating voltageTA = –40 to +85 °C1.2
V
supply currentExcluding I
CC
V
supply current in
CC
battery backup mode
V
supply current in
BAT
battery backup mode
V
voltage (active)
OUT
V
voltage (battery
OUT
Excluding I
VCC = 2.0 V, MR = VCC)
I
OUT2
OUT
OUT
Excluding I
(V
= 3.6 V)
BAT
I
= 5 mA
OUT1
I
= 75 mA
OUT1
I
= 250 µA,
OUT1
> 2.5 V
V
CC
= 250 µA, V
(1)
MinTypMaxUnit
(3)
5.5V
(VCC < 5.5 V)2560µA
(V
= 2.3 V,
BAT
OUT
(5)
(5)
BAT
= 2.3 V
VCC –
0.03
–
V
CC
0.3
VCC –
0.0015
–
V
BAT
0.1
2535µA
0.41.0µA
– 0.015V
V
CC
V
– 0.15V
CC
VCC –
0.0006
V
– 0.034V
BAT
V
backup)
I
to V
V
CC
OUT
on-resistance
OUT2
= 1 mA, V
= 2.3 VV
BAT
– 0.14V
BAT
34Ω
V
to V
BAT
on-resistance
Input leakage current
(MR
Input leakage current
I
LI
(PFI)
Input leakage current
(WDI)
V
IH
V
IH
V
IL
V
IL
Input high voltage (MR)4.5 V < VCC < 5.5 V2.0V
Input high voltage (WDI)V
Input low voltage (MR)4.5 V < VCC < 5.5 V0.8V
Input low voltage (WDI)V
Output low voltage (PFO,
RST
V
OL
Output low voltage
(E
V
OL
Output low voltage (RST)
)
, RST)
CON
(6)
OUT
4.5 V < V
0 V < V
WDI = V
< 5.5 V75125300µA
CC
< V
IN
CC
, time average120160µA
CC
–252+25nA
100Ω
WDI = GND, time average–20–15µA
(max) < VCC < 5.5 V0.7V
RST
(max) < VCC < 5.5 V0.3V
RST
= V
V
CC
I
SINK
= V
V
)
CC
I
= 1.6 mA, E = 0 V
OUT
I
= 50 µA, VCC = 1.0 V,
SINK
V
= V
BAT
CC
I
= 100 µA, VCC = 1.2 V,
SINK
V
(max),
RST
= 3.2 mA
(max),
RST
, TA = 0°C to 85°C
= V
BAT
CC
CC
0.3V
0.2V
0.3V
0.3V
CC
CC
V
V
V
34/43Doc ID 10522 Rev 10
STM690A/692A/703/704/802/805/817/818/819DC and AC parameters
Table 7.DC and AC characteristics (continued)
Sym
Alter-
native
DescriptionTest condition
Output high voltage
, RST)
V
V
V
OHB
OH
OH
(RST
Output high voltage
)
(E
CON
Output high voltage
)
(PFO
Output high voltage
VOH battery backup
, RST)
(RST
battery backup
V
OH
(E
)
CON
I
OUT
I
SOURCE
V
= V
BAT
I
SOURCE
V
V
VCC = V
V
I
VCC = V
I
SOURCE
CC
I
CC
Power-fail comparator (NOT available on STM818)
PFI falling
(V
V
PFI
PFI input threshold
CC
= 5 V)
(1)
= V
= 1 mA
(max)
RST
(max),
RST
I
SOURCE
CC
= 1.6 mA, E= V
SOURCE
= 75 µA,
(max)
RST
= 4 µA, VCC = 1.1 V,
, TA = 0°C to 85°C
CC
= 4 µA, VCC = 1.2 V,
V
= V
BAT
CC
= 100 µA,
= 0, V
SOURCE
= 0, V
= 2.8 V
BAT
= 75 µA,
= 2.8 V
BAT
All other
versions
CC
MinTypMaxUnit
2.4V
0.8V
CC
0.8V
CC
0.8V
0.9V
0.8V
BAT
0.8V
BAT
1.201.251.30V
V
V
V
V
t
PFD
I
SC
PFI to PFO propagation
delay
PFO output short to GND
current
Battery switchover
Battery backup
switchover voltage
VSO
(VCC < V
V
Hysteresis40mV
Reset thresholds
V
RST
Reset threshold
Reset threshold
hysteresis
V
V
10 V/ms)
&
BAT
< V
CC
to RST delay (from
CC
RST
)
RST
(9)
, VCC falling at
(7)(8)
STM8021.2251.2501.275V
2µs
Power-down
= 5 V, V
V
CC
Power-up
= 0 V0.10.752.0mA
PFO
V
V
V
V
RST
RST
RST
RST
> V
< V
> V
< V
BAT
BAT
BAT
BAT
V
V
V
V
BAT
RST
BAT
RST
STM690A/703, STM8XXL4.504.654.75V
STM692A/704, STM8XXM4.254.404.50V
25mV
STM817/818/819100µs
V
V
V
V
Doc ID 10522 Rev 1035/43
DC and AC parametersSTM690A/692A/703/704/802/805/817/818/819
Table 7.DC and AC characteristics (continued)
Sym
t
REC
Alter-
native
DescriptionTest condition
RST pulse width140200280ms
(1)
MinTypMaxUnit
Push-button reset input (STM703/704/819)
STM703/704150ns
t
MLMHtMR
MR pulse width
STM8191µs
STM703/704250ns
t
MLMRtMRD
MR to RST output delay
STM819120ns
glitch immunitySTM819100ns
MR
MR
pull-up resistorMR = 0 V, VCC = 5 V456385kΩ
Watchdog timer (NOT available on STM703/704/819)
t
Watchdog timeout periodV
WD
WDI pulse widthV
(max) < VCC < 5.5 V1.121.602.24s
RST
(max) < VCC < 5.5 V50ns
RST
Chip-enable gating (STM818 only)
E to E
to E
E
delay
Reset to E
E
CON
1. Valid for ambient operating temperature: TA = –40 to 85 °C; VCC = 4.75 V to 5.5 V for “L” versions; VCC = 4.5 V to 5.5 V for
“M” versions; and V
supply current, logic input leakage, watchdog functionality, push-button reset functionality, PFI functionality, state of
2. V
CC
RST and RST tested at V
Either V
3. V
CC
4. Tested at V
5. Guaranteed by design.
6. WDI input is designed to be driven by a three-state output device. To float WDI, the “high impedance mode” of the output
device must have a maximum leakage current of 10 µA and a maximum output capacitance of 200 pF. The output device
must also be able to source and sink at least 200 µA when active.
7. When V
8. When V
9. For V
or V
CC
(min) = 1.0 V for TA = 0 °C to +85 °C.
BAT
RST
falling.
CC
can go to 0 V if the other is greater than 2.0 V.
BAT
= 3.6 V, VCC = 3.5 V and 0 V.
BAT
> VCC > V
> VCC > V
resistanceVCC = V
CON
propagation
CON
high delay(Power-down)15µs
CON
short circuit current
= 2.8 V (except where noted).
BAT
= 3.6 V, and VCC = 5.5 V. The state of RST or RST and PFO is tested at VCC = VCC (min).
BAT
, V
RST
BAT
remains connected to VCC until VCC drops below V
OUT
, V
remains connected to VCC until VCC drops below the battery voltage (V
OUT
RST
4.5 V < V
V
= 5 V, disable mode,
CC
= logic high, E
E
CC
(max)40150Ω
< 5.5 V27ns
CON
= 0 V
0.10.752.0mA
.
RST
) – 75 mV.
BAT
36/43Doc ID 10522 Rev 10
STM690A/692A/703/704/802/805/817/818/819Package mechanical data
6 Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK®
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
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