The Smart Reset™ devices provide a useful feature that ensures that inadvertent short
reset push-button closures do not cause system resets as the extended Smart Reset™
delay setup periods are implemented. Once the valid Smart Reset™ input levels and setup
delay are met, the device generates an output reset pulse for a fixed timeout period (t
The typical application hookup shows that either a single Smart Reset™ input, or both reset
inputs can be connected to the applications interrupt and control both the interrupt pin and
the hard reset functions. If the push-button is closed for a short time, the processor is only
interrupted. If the system still does not respond properly, holding the push-button(s) for the
extended setup time (t
) causes a hard reset of the processor. The Smart Reset™
SRC
feature helps significantly increase system stability and eliminates the need for a dedicated
reset button.
The STM65xx family of Smart Reset™ devices consists of low-current microprocessor reset
circuits targeted at applications such as MP3 players, portable navigation or mobile phones,
generally any application that requires delayed reset push-button(s) response for improved
system stability. The devices in the STM65xx Smart Reset™ family include various
combinations of useful features for the targeted applications.
REC
).
The STM6522 has two combined Smart Reset™ inputs (SR0
setup time (t
) programmed by an external capacitor on the SRC pin.
SRC
Figure 1.Logic diagram
V
CC
SR0
RST1
RST2
SR1
SRC
STM6522
V
SS
and SR1) with delayed reset
AM04867v2
Doc ID 17045 Rev 35/25
DescriptionSTM6522
Table 1.Signal names
Symbol
RST1
RST2
SR0
Input/
output
Description
Output Open-drain reset output, active-low, no internal pull-up resistor.
Output Open-drain reset output, active-low, no internal pull-up resistor.
Input
Primary push-button Smart Reset™ input, active-low, fixed voltage input logic
levels, no internal pull-up.
Secondary push-button Smart Reset™ input - combines with the primary push-
SR1
Input
button reset to provide setup delay time, active-low, fixed voltage input logic
levels, no internal pull-up.
SRCInput
V
V
Supply
CC
Supply Supply ground.
SS
Smart Reset™ input delay setup control: connect to an external capacitor to
adjust the delay setup time (t
SRC
).
Supply voltage input. Power supply for the device. A 0.1 µF decoupling ceramic
capacitor is recommended to be connected between V
NCNo connect (not bonded); should be connected to V
This pin is used to provide the power to the device. A 0.1 µF decoupling ceramic capacitor is
recommended to be connected between V
2.2 Ground (VSS)
This is the supply ground for the device.
2.3 Primary Smart Reset™ input (SR0)
The primary push-button Smart Reset™ input, active-low pin is connected to the pushbutton switch. The input logic voltage levels are set to a fixed voltage level and have no
internal pull-up resistor.
2.4 Secondary Smart Reset™ input (SR1)
and VSS pins.
CC
The secondary push-button Smart Reset™ input, active-low pin is connected to the second
push-button switch. The input logic voltage levels are set to a fixed voltage level and have no
internal pull-up resistor. Keeping both Smart Reset™ inputs SR0
than t
activates the reset output pulse.
SRC
and SR1 active for longer
Figure 7.STM6522 timing
t
SRC
SR0
SR1
RST1,
RST2
Reset is asserted “low” right after the Smart Reset™ setup delay (t
returns to high after the t
REC
period.
t
REC
) has been met and
SRC
AM04873v2
Doc ID 17045 Rev 39/25
Pin descriptionsSTM6522
2.5 Adjustable delay of Smart Reset™ (SRC pin)
This pin controls the setup time before the push-button action is validated by the reset
output. It is connected to an external capacitor (C
desired value of setup time (t
Selected calculated t
Table 2.t
Calculated C
value [µF]
0.222.53.00.22
0.333.754.50.33
0.667.590.56
11012.5151
1. At 25 ° C. Example calculations based on an ideal capacitor. During application design and component
selection it should be considered that the current flowing into the external t
(C
) is on the order of 100 nA, therefore a low-leakage capacitor (ceramic or film capacitor) should be
SRC
used and placed as close as possible to the SRC pin. Also an adequate low-leakage PCB environment
should be ensured to prevent t
is 0.1 µF.
2. In case of quickly repeated activations of t
activations to fully discharge C
programmed by an ideal external capacitor
SRC
SRC
and C
SRC
Min.Typ.Max.
).
SRC
examples are given in Ta bl e 2 . Refer also toTable 5.
SRC
Setup delay t
accuracy from being affected. A recommended minimum value of C
SRC
counter, an interval of 10 ms min. is needed between the
SRC
, so that the next t
SRC
SRC
), which is tied to ground to provide the
SRC
(1)(2)
[s]
SRC
is as specified.
programming capacitor
SRC
Closest common
C
SRC
value [µF]
SRC
2.6 Reset output (RST1)
This output is active-low, open-drain with no internal pull-up resistor.
2.7 Reset output (RST2)
This output is active-low, open-drain with no internal pull-up resistor.
10/25Doc ID 17045 Rev 3
STM6522Typical operating characteristics
3 Typical operating characteristics
Figure 8.Supply current (ICC) vs. temperature
3
2.5
2
[µA]
CC
I
–60–40–20020406080100120140
1.5
1
0.5
0
Figure 9.Smart Reset™ delay (t
9
8.5
8
[s]
SRC
t
–60–40–20
7.5
7
6.5
6
020406080100120140
Temperature [˚C]
5.5 V3.3 V2 V
) vs. temperature, C
SRC
SRC
AM07328
= 0.6 µF
Temperature [˚C]
5.5 V3. 3 V2 V
AM07329
Doc ID 17045 Rev 311/25
Typical operating characteristicsSTM6522
Figure 10. Reset timeout period (t
280
260
240
[ms]
REC
t
–60–40–20
220
200
180
160
140
020406080100120140
) vs. temperature
REC
Temperature [˚C]
5.5 V3. 3 V2 V
AM07330
Figure 11. Smart Reset™ input voltage threshold vs. temperature
0.8
0.7
[V]
0.6
ITH(SR )
V
–60–40–20
0.5
0.4
0.3
020406080100120140
Temperature [˚C]
5.5 V3. 3 V2 V
AM07331
12/25Doc ID 17045 Rev 3
STM6522Maximum ratings
4 Maximum ratings
Stressing the device above the ratings listed in Table 3: Absolute maximum ratings may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in Table 4: Operating and
measurement conditions of this specification is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability. Refer also to the
STMicroelectronics™ SURE program and other relevant quality documents.
Table 3.Absolute maximum ratings
SymbolParameterValueUnit
T
STG
T
SLD
θ
JA
V
V
CC
1. Reflow at peak temperature of 260 °C. The time above 255 °C must not exceed 30 seconds.
Storage temperature (VCC off)–55 to +150°C
(1)
Lead solder temperature for 10 seconds260°C
Thermal resistance (junction to ambient)TDFN8149.0°C/W
Input or output voltage–0.3 to 5.5V
IO
Supply voltage–0.3 to 7V
Doc ID 17045 Rev 313/25
DC and AC parametersSTM6522
5 DC and AC parameters
This section summarizes the operating measurement conditions, and the DC and AC
characteristics of the device. The parameters in Table 5: DC and AC characteristics that
follows, are derived from tests performed under the measurement conditions summarized in
Table 4: Operating and measurement conditions. Designers should check that the operating
conditions in their circuit match the operating conditions when relying on the quoted
parameters.
Table 4.Operating and measurement conditions
ParameterValueUnit
supply voltage1.65 to 5.5V
V
CC
Ambient operating temperature (T
Input rise and fall times≤
)–40 to +85°C
A
5ns
Input pulse voltages0.2 to 0.8 V
Input and output timing ref. voltages0.3 to 0.7 V
Figure 12.AC testing input/output waveforms
0.8 V
0.2 V
CC
CC
0.7 V
0.3 V
CC
CC
CC
CC
V
V
AM00478
14/25Doc ID 17045 Rev 3
STM6522DC and AC parameters
Table 5.DC and AC characteristics
SymbolParameterTest conditions
V
I
V
t
REC
Supply voltage range1.655.5V
CC
Supply current (inputs in
their inactive state, neither
CC
t
nor t
REC
Reset output voltage low
OL
(active-low reset asserted)
SRC
in progress)
V
= 5.0 V23µA
CC
V
= 3.0 V1.5µA
CC
V
≥ 4.5 V, sinking 3.2 mA0.3V
CC
V
≥ 3.3 V, sinking 2.5 mA0.3V
CC
V
≥ 1.65 V, sinking 1 mA0.3V
CC
Reset timeout delay, factory
programmed
Smart Reset™ inputs
V
V
I
LI(SR)
SR0, SR1 input voltage lowV
IL
SR0, SR1 input voltage high0.855.5V
IH
Input leakage current,
SRx
input
Smart Reset™ delay
Delayed Smart Reset™
t
SRC
(3)
setup time. Refer to Table 2.
T
= 25 °C
A
(1)
Min.Typ.
(2)
Max.Unit
140210280ms
– 0.30.3V
SS
–1+1µA
10 x C
(µF)
SRC
12.5 x C
(µF)
SRC
15 x C
SRC
(µF)
s
1. Valid for ambient operating temperature: TA = –40 to +85 °C; VCC = 1.65 to 5.5 V (except where noted).
2. Typical value is at 25 °C and V
3. Input glitch immunity is equal to t
= 3.3 V unless otherwise noted.
CC
(when both SR inputs are low, otherwise infinite).
SRC
Doc ID 17045 Rev 315/25
Package mechanical dataSTM6522
6 Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK®
®
is an ST trademark.
16/25Doc ID 17045 Rev 3
STM6522Package mechanical data
Figure 13. TDFN – 8-lead 2 x 2 x 0.75 mm, 0.5 mm pitch package outline
PIN 1 INDEX AREA
0.10 C
0.10
C
A
0.08 C
PIN 1 INDEX AREA
Pin#1 I D
D
2x
0.10 C
2x
TOP VIEW
SIDE VIEW
e
1
A
B
E
C
A1
SEATING
PLANE
b
4
0.10C A B
L
8
BOTTOM VIEW
5
8070540_A
Table 6.TDFN – 8-lead 2 x 2 x 0.75 mm, 0.5 mm pitch package mechanical data
Dimension (mm)Dimension (inches)
Symbol
Min.Nom.Max.Min.Nom.Max.
A0.700.750.800.0280.0300.031
A10.000.020.050.0000.0010.002
b0.150.200.250.0060.0080.010
D
BSC
E
BSC
e0.500.020
L0.450.550.650.0180.0220.026
1.92.002.10.0750.0790.083
1.92.002.10.0750.0790.083
Doc ID 17045 Rev 317/25
Package footprintSTM6522
7 Package footprint
Figure 14. Landing pattern - TDFN – 8-lead 2 x 2 mm without thermal pad
D
P
E1E
L
b
Table 7.Parameters for landing pattern - TDFN – 8-lead 2 x 2 mm package
2All dimensions are in mm, unless otherwise noted.
User direction of feed
AM00442
Doc ID 17045 Rev 321/25
Part numberingSTM6522
9 Part numbering
Table 10.Ordering information scheme
Example:STM6522AA AADG6F
Device type
STM6522
V
monitoring, power-on reset
CC
A = no V
Smart Reset™ setup delay (t
pull-up on all Smart Reset™ inputs (SRx
monitoring, no power-on reset
CC
SRC
); presence of internal input
)
A = user-programmed (external capacitor); no input pull-up
Output type
A = both RST1
Reset timeout period (t
and RST2 open-drain, no pull-up, active-low
)
REC
A = 140 ms min.
Package
DG = TDFN8 2 x 2 x 0.75 mm, 0.5 mm pitch
Temperature range
6 = –40 °C to +85 °C
Shipping method
F = ECOPACK
®
package, tape and reel
For device options currently available refer to Ta bl e 11 . For other options, or for more information on any
aspect of this device, please contact the ST sales office nearest you.
22/25Doc ID 17045 Rev 3
STM6522Package marking
10 Package marking
Table 11.Package marking
Smart
Part number
t
SRC
delay
control
Reset™
inputs
(1)
monitoring
Power-on
reset, V
CC
RST1
output
(1)
RST2
output
(1)
t
REC
option
Topmark
STM6522AAAADG6FC
1. AL = active-low, AH = active-high, PU = with internal pull-up resistor, OD = open-drain.
SRC
AL—AL, ODAL, ODACAL, AAL
Figure 19. Package marking, top view
A
BC
E
D
Topmark
A = dot (pin 1 reference)
B = assembly plant (P)
C = assembly year (Y, 0-9): 9 = 2009 etc.
D = assembly work week (WW, 01 to 52): 20 = WW20 etc.
E = marking area (topmark)
Figure 2, Figure 3, Figure 4, Figure 5, Figure 6, Section 2.4,
Figure 7, note 1 below Ta bl e 2 , Section 2.6, added Section 2.7,
Section 3, Ta bl e 5 , Ta b l e 6 , Tabl e 7 , Ta b l e 1 0 , Section 8, Table 11.
Updated Ta bl e 3 , Ta b l e 5 , Ta ble 1 1 and Disclaimer, minor text
corrections throughout document.
24/25Doc ID 17045 Rev 3
STM6522
y
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