STM6502 has two combined Smart Reset inputs (SR0 and SR1) with delayed Smart Reset
setup time (t
STM6503 is similar to STM6502, has two combined delayed Smart Reset inputs (SR0
and three user-selectable delayed Smart Reset setup time (t
s through a three-state TSR input pin: when connected to ground, t
open, t
SRC
STM6504 has two independent Smart Reset inputs. SR0
setup time (t
input pin: when connected to ground, t
connected to V
is edge-triggered with a special debounce time (t
edge after a valid reset period.
) programmed by an external capacitor on the SRC pin.
SRC
= 6 s; when connected to VCC, t
= 10 s (all the times are minimum).
SRC
provides the delayed Smart Reset
) function with three user-selectable t
SRC
CC
, t
= 10 s (all the times are minimum). SRE provides instant reset. SRE
SRC
= 2 s; when left open, t
SRC
DEBOUNCE
options through a three-state TSR
SRC
, SR1)
) options of 2 s, 6 s and 10
SRC
= 2 s; when left
SRC
= 6 s; when
SRC
= 240 ms min.) at the falling
STM6505 has two combined delayed Smart Reset inputs (SR0
adjustable reset delay setup time via an external capacitor connected to the SRC pin.
The RST
output depends also on the VCC monitoring threshold. STM6505 also provides
independent low battery detect (BLD
voltage V
detect output pin (BLD
BAT
. V
is monitored for low voltage and provides an indication on the battery low
BAT
). V
BAT
be used to set the actual battery voltage threshold. V
(16 mV max.). V
V
pin; VCC must be ≥ 1.575 V for proper operation of the V
CC
is voltage monitoring input only, the device is powered only from the
BAT
1.1 Smart Reset devices
The Smart Reset device family STM65xx provides a useful feature that ensures inadvertent
short reset push-button closures do not cause system resets. This is done by implementing
extended Smart Reset input delay (t
delay are met, the device generates an output reset pulse with user-programmable timeout
period (t
The Smart Reset inputs can be also connected to the applications interrupt to allow the
control of both the interrupt pin and the hard reset functions. If the push-buttons are closed
for a short time, the processor is only interrupted. If the system still does not respond
properly, holding the push-buttons for the extended setup time (t
the processor through the reset outputs. The Smart Reset feature helps significantly
increase system stability.
REC
).
, SR1) and provides an
) output controlled by the secondary external input
threshold is 1.25 V, fixed, and an external resistor divideris to
threshold hysteresis is 8 mV typ.
BAT
comparator.
BAT
). Once the valid Smart Reset input levels and setup
SRC
) causes hard reset of
SRC
The STM65xx family of Smart Reset devices consists of low current microprocessor reset
circuits targeted at applications such as MP3 players, navigation, smartphones or mobile
phones; generally any application that requires delayed reset push-button(s) response for
improved system stability. The STM65xx devices feature single or dual Smart Reset inputs
(SR). The delayed Smart Reset setup time (t
) options of 2 s, 6 s and 10 s (all min.) are
SRC
adjustable by an external capacitor on the SRC pin or selectable by three-state logic. The
delayed setup period ignores switch closures shorter than t
, thus preventing unwanted
SRC
resets.
Doc ID 16101 Rev 65/29
DescriptionSTM6502, STM6503, STM6504, STM6505
The STM65xx devices have active-low (optionally active-high) open-drain reset (RST)
output(s) with or without internal pull-up resistor or push-pull as output options, with factoryprogrammed or capacitor-adjustable or push-buttons defined output reset pulse duration,
with or without power-on reset function.
Some devices also have an undervoltage monitoring feature: the reset output is also
asserted when the monitored supply voltage V
reset output remains asserted for the reset timeout period (t
is edge-triggered with a special debounce time (t
the falling edge after a valid reset period. Active-high, no internal pull-up to V
STM6504 only.
SRCInput
Smart Reset input delay setup control: connect to an external capacitor to adjust
the delay setup time (t
). STM6502 and STM6505 only.
SRC
A three-state Smart Reset input delay setup control. When connected to
TSRInput
ground, t
t
= 10 s (all times are minimum). TSR is a DC-type input, intended to be
SRC
either permanently grounded, permanently connected to V
= 2 s; when left open, t
SRC
= 6 s; when connected to VCC,
SRC
left open. If left open, for improved system glitch immunity it is strongly
recommended to connect a 0.1 µF decoupling ceramic capacitor between the
TSR and V
pins. STM6503 and STM6504 only.
SS
Supply voltage input. Power supply for the device and an input for the monitored
V
V
BAT
V
Supply
CC
Supply Ground
SS
InputBattery voltage monitoring input. STM6505 only.
supply voltage. A 0.1 µF decoupling ceramic capacitor is recommended to be
connected between the V
and VSS pins.
CC
NCNo connect (not bonded); should be connected to V
1. STM6504 only: SR0 and SRE are working independently. SRE is edge-triggered and has a special
debounce time (t
DEBOUNCE
= 240 ms min.) at the falling edge after a valid reset period.
Logic
Figure 4.Block diagram - STM6505
6
"!4
6
##
32
32
32#
6
##
6
"!44(
6
234
#/-
#/-
,OGIC
0!2%
0!2%
",$
T
GENE
2%#
RATOR
234
AM00352a
!-B
8/29Doc ID 16101 Rev 6
STM6502, STM6503, STM6504, STM6505Description
Figure 5.Single-button Smart Reset typical hookup
6
##
6
##
234
432
34-
32
6
32
33
Figure 6.Dual-button Smart Reset typical hookup
6
##
2%3%4
).4
.-)
053(
37)4#(
6
##
-#5
6
33
"544/.
!-B
6
##
34-
6
33
234
432
32
32
053("544/.
37)4#(
053(
37)4#(
2%3%4
).4
.-)
"544/.
6
##
-#5
6
33
!-6
Doc ID 16101 Rev 69/29
DescriptionSTM6502, STM6503, STM6504, STM6505
1.2 Pin descriptions
1.2.1 Power supply (VCC)
This pin is used to provide the power to the device and to monitor the power supply.
A 0.1 µF decoupling ceramic capacitor is recommended to be connected between the V
and V
SS
pins.
1.2.2 Ground (VSS)
This is the supply ground for the device.
1.2.3 Primary Smart Reset input (SR0)
The primary push-button Smart Reset input, active-low pin is connected to the first pushbutton switch.
1.2.4 Secondary Smart Reset input (SR1)
The secondary push-button Smart Reset input, active-low pin is connected to the second
push-button switch. Keeping both Smart Reset inputs SR0
t
activates the reset output pulse.
SRC
and SR1 active for longer than
CC
Figure 7.STM6502, STM6503 timing
t
REC
SR0
SR1
RST
t
SRC
Reset is asserted “low” right after the Smart Reset setup delay (t
returns to high after the t
REC
period.
) has been met and
SRC
AM00327
10/29Doc ID 16101 Rev 6
STM6502, STM6503, STM6504, STM6505Description
1.2.5 Edge-triggered Smart Reset input (SRE pin) – STM6504 only
The SRE pin is active-high, immediate and independent reset input that includes an edge
trigger with debounce delay t
DEBOUNCE
Note:The triggering edge must be a high-to-low or low-to-high transition with a slew-rate faster
than 1 V/µs typ.
Figure 8.STM6504 timing
on the falling edge.
SR0
Independent
SRE
No debounce
RST
t < t
=> t
REC
DEBOUNCE
timer reset
t < t
=> no output response
t
REC
(rising edges within
t
DEBOUNCE
SRC
t
DEBOUNCE
are ignored)
t
REC
t
SRC
t
REC
1.2.6 Adjustable delay of Smart Reset input (SRC pin) – STM6502 and
STM6505 only
This pin controls the setup time before the push-button action is validated by the reset
output. It is connected to an external capacitor (C
desired value of the setup time (t
Calculated t
Table 3.t
Calculated C
value [µF]
and C
SRC
programmed by an ideal external capacitor – STM6502 and STM6505
SRC
SRC
examples are given in Ta bl e 3 . Refer also to Ta b le 6 .
SRC
Min.Typ.Max.
).
SRC
Setup delay t
), which is tied to ground to provide the
SRC
(1)(2)
[s]
SRC
Closest common
C
SRC
value [µF]
AM00328V2
0.222.53.00.22
0.333.754.50.33
0.667.590.56
11012.5151
1. At 25 °C. Example calculations based on an ideal capacitor. During application design and component
selection it should be considered that the current flowing into the external t
(C
) is on the order of 100 nA, therefore a low-leakage capacitor (ceramic or film capacitor) should be
SRC
used and placed as close as possible to the SRC pin. Also an adequate low-leakage PCB environment
should be ensured to prevent t
is 0.01 µF.
2. In case of repeated activations of the t
activations to fully discharge C
accuracy from being affected. A recommended minimum value of C
SRC
timer, an interval of 10 ms min. is needed between the
SRC
, so that the next t
SRC
is as specified.
SRC
programming capacitor
SRC
Doc ID 16101 Rev 611/29
SRC
DescriptionSTM6502, STM6503, STM6504, STM6505
1.2.7 Programmable Smart Reset input delay (TSR pin) – STM6503 and
STM6504 only
The TSR pin allows the user to program the setup time before the push-button action is
validated by the reset output. It is controlled by different voltage levels on the three-state
TSR input pin: when connected to ground, t
connected to V
CC
, t
= 10 s (all times are minimum). TSR is a DC-type input, intended to
SRC
be either permanently grounded, permanently connected to V
= 2 s; when left open, t
SRC
= 6 s; when
SRC
or permanently left open.
CC
If it is left open, for improved system glitch immunity it is strongly recommended to connect
a 0.1 µF decoupling ceramic capacitor between the TSR and V
SS
pins.
1.2.8 Reset output (RST)
RST is the active-low, open-drain reset output in the Smart Reset family.
1.2.9 Battery monitoring input (V
V
is an input for monitoring the battery voltage. V
BAT
) – STM6505 only
BAT
threshold is 1.25 V, fixed, and an
BAT
external resistor divider is to be used to set the actual battery voltage threshold.
1.2.10 Battery low detect output (BLD) – STM6505 only
The battery low detect output is controlled by the V
active-low, open-drain, with no pull-up.
) vs. temperature, “S” threshold option, VCC falling (STM6505)
RST
2.99
2.97
2.95
2.93
2.91
2.89
2.87
2.85
Temperature [°C]
AM04888v1
Figure 13. V
[V]
BATTH
V
-60-40-20020406080100120140
monitoring threshold (V
BAT
1.275
1.27
1.265
1.26
1.255
1.25
1.245
1.24
1.235
1.23
1.225
BATTH)
vs. temperature, falling (STM6505)
Temperature [°C]
5.75 V5.5 V3.3 V2 V1.58 V
AM04889v1
14/29Doc ID 16101 Rev 6
STM6502, STM6503, STM6504, STM6505Maximum ratings
3 Maximum ratings
Stressing the device above the rating listed in Table 4: Absolute maximum ratings may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the operating sections of
this specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability. Refer also to the STMicroelectronics SURE
Program and other relevant quality documents.
Table 4.Absolute maximum ratings
SymbolParameterValueUnit
T
STG
T
SLD
θ
JA
V
V
CC
1. Reflow at peak temperature of 260 °C. The time above 255 °C must not exceed 30 seconds.
2. For inputs or outputs with internal pull-up resistors and push-pull type outputs –0.3 to VCC+0.3 V only.
Storage temperature (VCC off)–55 to +150°C
(1)
Lead solder temperature for 10 seconds260°C
Thermal resistance (junction to ambient)TDFN8149.0°C/W
Input or output voltage–0.3 to 5.5
IO
Supply voltage–0.3 to 7V
(2)
V
Doc ID 16101 Rev 615/29
DC and AC parametersSTM6502, STM6503, STM6504, STM6505
4 DC and AC parameters
This section summarizes the operating measurement conditions, and the DC and AC
characteristics of the device. The parameters in the DC and AC characteristics tables that
follow, are derived from tests performed under the measurement conditions summarized in
Table 5: Operating and measurement conditions. Designers should check that the operating
conditions in their circuit match the operating conditions when relying on the quoted
parameters.
Table 5.Operating and measurement conditions
Paramete rValueUnit
supply voltage1.0 to 5.5V
V
CC
Ambient operating temperature (T
Input rise and fall times≤
)–40 to +85°C
A
5ns
Input pulse voltages0.2 to 0.8 V
Input and output timing ref. voltages0.3 to 0.7 V
Figure 14. AC testing input/output waveforms
0.8 V
0.2 V
CC
CC
0.7 V
0.3 V
CC
CC
CC
CC
V
V
AM00478
16/29Doc ID 16101 Rev 6
STM6502, STM6503, STM6504, STM6505DC and AC parameters
Table 6.DC and AC characteristics
SymbolParameterTest conditions
CC
Supply voltage rangeReset output valid - active-low1.05.5V
= 5.0 V1.2µA
V
CC
V
= 3.0 V
CC
V
= 5.0 V, TSR left open45.8µA
CC
V
= 3.0 V, TSR left open
CC
V
= 5.0 V, TSR left open45.8µA
CC
V
= 3.0 V, TSR left open
CC
V
= 5.0 V2.33.3µA
CC
V
= 3.0 V
CC
Supply current (inputs
in their inactive state,
t
REC
and t
SRC
counter
is inactive)
STM6502
STM6503
STM6504
STM6505
V
I
CC
Output characteristics
V
≥ 4.5 V, sinking 3.2 mA0.3V
CC
V
t
REC
OL
Reset output voltage low
(reset asserted: RST
, BLD)
Reset timeout delay,
factory-programmed
V
≥ 3.3 V, sinking 2.5 mA0.3V
CC
V
≥ 1.0 V, sinking 0.1 mA0.3V
CC
Option A140210280ms
Option B240360480ms
(3)
(3)
(1)
(3)
(3)
Min. Typ.
1.1µA
2.2µA
(2)
Max. Unit
3µA
3µA
V
monitoring reset thresholds
CC
Fixed voltage trip point for
V
V
RST
monitoring (refer to
CC
Table 7)
V
HYST
V
BAT
V
BATTH
V
BATHYSTVBATTH
I
LI(VBAT)
Hysteresis of V
V
CC
monitoring
Fixed V
threshold
V
BAT
to reset delay
monitoring
BAT
hysteresisSTM6505 only816mV
input leakage currentSTM6505 only–10010100nA
RST
–40 to +85 °C
25 °C
RST
–2.5%
V
RST
–2.0%
V
V
RST
RST
V
RST
+2.5%
V
RST
+2.0%
V
L, M0.5%
T, S, R, Z, Y, W, V1%
falling from
V
CC
(V
+ 100 mV) to (V
RST
10 mV/µs
(4)
- 100 mV) at
RST
20µs
STM6505 only1.2251.251.275V
V
V
Doc ID 16101 Rev 617/29
DC and AC parametersSTM6502, STM6503, STM6504, STM6505
Table 6.DC and AC characteristics (continued)
SymbolParameterTest conditions
Smart Reset inputs
(1)
Min. Typ.
(2)
Max. Unit
V
IL
V
IH
I
LI(SR)
I
LI(TSR)
SR0, SR1, SRE input
voltage low
SR0, SR1, SRE input
voltage high
Input leakage current, SR
and SRE inputs
Input leakage current, TSR
input
Option without internal pull-up resistor–1+1µA
STM6503 and STM6504 only–5+7µA
VSS
–0.3
0.7
V
CC
0.3
V
CC
5.5V
Internal pull-up resistor,
PUI
input (optional - refer to
R
65kΩ
Table 12)
t
DEBOUNCE
SRE input falling edge
debounce time
STM6504 only240360480ms
Smart Reset delay
Capacitor-programmable
t
SRC
(5)
STM6502 and STM6505.
T
= 25 °C
A
C
Smart Reset setup time,
Refer to Ta bl e 3 .
TSR pin-programmable
(5)
t
SRC
Smart Reset setup time,
STM6503 and STM6504.
1. Valid for ambient operating temperature: TA = –40 to +85 °C; VCC = 1.0 to 5.5 V (except wher e noted).
2. Typical value is at 25 °C and V
3. For devices with V
4. Guaranteed by design.
5. Input glitch immunity is equal to t
only.
6. If left open, for improved system glitch immunity it is strongly recommended to connect a 0.1 µF decoupling ceramic
capacitor between the TSR and V
RST
< 3.0 V.
= 3.3 V unless otherwise noted.
CC
SRC
SS
TSR = V
TSR = floating
TSR = V
(when both SR inputs are low, otherwise infinite). STM6502, STM6503, STM6505
pins.
SS
(6)
CC
10 x
SRC
(µF)
12.5 x
C
(µF)
SRC
15 x
C
SRC
(µF)
22.53s
67.59s
1012.515s
V
s
18/29Doc ID 16101 Rev 6
STM6502, STM6503, STM6504, STM6505DC and AC parameters
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK®
®
is an ST trademark.
20/29Doc ID 16101 Rev 6
STM6502, STM6503, STM6504, STM6505Package mechanical data
Figure 15. TDFN – 8-lead 2 x 2 x 0.75 mm, 0.5 mm pitch package outline
PIN 1 INDEX AREA
0.10 C
0.10
C
A
0.08 C
PIN 1 INDEX AREA
Pin#1 I D
D
2x
0.10 C
2x
TOP VIEW
SIDE VIEW
e
1
A
B
E
C
A1
SEAT ING
PLANE
b
4
0.10 C A B
L
8
BOTTOM VIEW
5
8070540_A
Table 8.TDFN – 8-lead 2 x 2 x 0.75 mm, 0.5 mm pitch package mechanical data
STM6502, STM6503, STM6504, STM6505Package mechanical data
Figure 19. Tape trailer/leader
End
To p
cover
tape
No componentsNo componentsComponents
TRAILER
160 mm min.
Figure 20. Pin 1 orientation
Sealed with cover tape
User direction of feed
10 0 mm min.
LEADE
400 mm min.
Start
R
AM00444
Note:1Drawings are not to scale.
2All dimensions are in mm, unless otherwise noted.
User direction of feed
AM00442
Doc ID 16101 Rev 625/29
Part numberingSTM6502, STM6503, STM6504, STM6505
6 Part numbering
Table 12.Ordering information scheme
Example:STM6505WC ABDG6F
Device type
STM6502
(1)
STM6503
STM6504
(1)
STM6505
Reset (V
(V
RST
monitoring) threshold voltage
CC
), typ., falling
L = 4.625 V
S = 2.925 V
R = 2.625 V
Z = 2.313 V
W = 1.665 V
V = 1.575 V
Smart Reset setup delay (t
pull-up on all Smart Reset inputs (SRx
); presence of internal input
SRC
, SRE)
A = user-programmable (external capacitor); no input pull-up
C = user-programmable (external capacitor); 65 kΩ input pull-up
E = 2 or 6 or 10 s min., user-programmable (three-state); no input pull-up
F = 2 or 6 or 10 s min., user-programmable (three-state); 65 kΩ input pull-up
Output type
A = open-drain, no pull-up, active-low
Reset timeout period (t
REC
)
A = 140 ms min.
B = 240 ms min.
Package
DG = TDFN8 2 x 2 x 0.75 mm, 0.5 mm pitch
Temperature range
6 = –40 °C to +85 °C
Shipping method
F = ECOPACK
®
package, tape and reel
1. Contact local ST sales office for availability.
For device options currently available refer to Tabl e 13 . For other options, voltage threshold values etc. or
for more information on any aspect of this device, please contact the ST sales office nearest you.
26/29Doc ID 16101 Rev 6
STM6502, STM6503, STM6504, STM6505Package marking
7 Package marking
Table 13.Package marking
Smart
t
Part number
SRC
delay
control
Reset
inputs
(1)
V
RST
STM6503REAADG6FTSRALRAL, ODA—3RG
STM6503SEAADG6FTSRALSAL, ODA—3SG
STM6503VEAADG6FTSRALVAL, ODA—3VG
STM6504SEABDG6F
(2)
TSRALSAL, ODB—4SG
RST
output
(1)
t
REC
option
BLD
output
(1)
Topmark
STM6505SCABDG6FC
STM6505RCABDG6FC
STM6505WCABDG6FC
1. AL = active-low, AH = active-high, PU = with internal pull-up resistor, OD = open-drain.
2. Contact local ST sales office for availability.
SRC
SRC
SRC
AL, PUSAL, ODBAL, OD5SK
AL, PURAL, ODBAL, OD5RK
AL, PUWAL, ODBAL, OD5WK
Figure 21. Package marking, top view
A
BC
E
D
Topmark
A = dot (pin 1 reference)
B = assembly plant (P)
C = assembly year (Y, 0-9): 9 = 2009 etc.
D = assembly work week (WW, 01 to 52): 20 = WW20 etc.
E = marking area (topmark)
Updated Applications, Section 1, Section , Figure 3 to Figure 6
updated and moved to Section , updated Ta b l e 1 , Ta b le 2 , Ta bl e 3 ,
06-Nov-20092
15-Jan-20103
01-Mar-20104
Ta b le 4 , Ta bl e 6 , Ta b l e 1 2 , Section 1.2.3, Section 1.2.7,
Section 1.2.9, Section 5, added package footprint, tape and reel
information, and Section 7.
Updated Features, Section 1, Section 1.2.6, Tab le 1 , Ta b le 2 ,
Figure 5, Figure 6, Ta bl e 3 , Table 6 , Ta b le 1 2 , Table 13, removed
Table 4.
Updated title of datasheet, Features, Applications, Tab le 1, 2, 6, 12,
footnote 5 of Ta b l e 6 ; updated Figure 3, 4; added Section 2: Typical
operating characteristics; minor textual and formatting changes.
21-Jun-20105
09-Feb-20116
Updated Features, Section 1, Figure 8, footnote 1 and 2
updated Tab le 4 , added footnote 2 to Ta b le 4 , Tabl e 6, added
footnote 6 to Tabl e 6, updated Ta bl e 6 to Ta b l e 9 , and added footnote
2 of Tab le 1 3 .
Reformatted Tab le 1 , updated Ta b l e 6 , added STM6503REAADG6F
and STM6503SEAADG6F device to Table 13, corrected typo in
Ta b le 1 3 .
of Ta b le 3 ,
28/29Doc ID 16101 Rev 6
STM6502, STM6503, STM6504, STM6505
y
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