查询STM1645-30供应商
SATELLITE COMMUNICATION APPLICATIONS
■ CLASSC SATELLITECOMMUNICATIONS
AMPLIFIER
■ 1625-1665 MHz
■ 12/28VOLTS
■ INPUT/OUTPUT 50 OHMS
■ Pout= 30 W MIN.
■ GAIN = 34.8 dB MIN.
DESCRIPTION
The STM1645-30 hybrid RF Power Module is
designed for high power satellite communication
applicationsin the1.6 GHz frequencyrange.
High f
devices, optimized for use in STM1645-30, are
employed to provide high gain and efficiency
while ensuring excellent reliability.
, gold metallized silicon microwave power
T
RF POWER MODULE
ORDER CODE :
STM1645-30
PIN CONNECTIONS
STM1645-30
BRANDING:
STM1645-30
1. RF Input 2. Ground 3. V
28V 6. Ground 7. R F Outp u t
5. V
C3
ABSOLUTE MAXIMUM RATINGS(T
Symbol Parameter Value Unit
V DC Supp ly Volta ge 30 Vdc
P
T
T
October 1999
RF Inpu t Power (P
IN
Sto rage Tem peratu re R ange - 40 to + 100
STG
Oper a t ing Case Te mperat ur e -35 to + 70
C
OUT
≤ 30 W)
case
=25oC)
20 mW
12V 4. VC228V
C1
o
C
o
C
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STM1645-30
ELECTRICAL SPECIFICATION
(T
case
=25oC, V
=12V;V
C1*
C2,VC3
=28V)
Symbol Parameter Test Conditions Min. Typ. M ax Unit
BW Fr eque nc y Range 1625 1665 MHz
P
OUT
G
Power Output
Power Gain P
P
η Efficiency P
Z
Input Imp eda nc e
IN
HHarmonics P
vs T
∆P
∆
P
OUT
OUT
CASE
vs Fr eq uen c y
Load Mi sm a t c h VSW R = 10:1 V = 28 Vdc
P
Control Range P
OUT
Sta bility P
Note :
*V
= 12 V regulated ±1%
C1
** P
adjustedby varying V
OUT
C3
10 W
P
≤
IN
= 30 W 34.8 35.5 dB
OUT
=30W 35 %
OUT
=30W ZG,ZL=50
P
OUT
= 30 W reference -45 -40 dB
OUT
Ω
TC=-35oCto+70oC@PIN=10mW 2 dB
f = 1 625 - 166 5 MHz 1 dB
P
=30W
OUT
=30W 8 10 dB
OUT
= 5 to 30 W**
OUT
Load V SW R = 3:1 any phas e
30 35 40 W
1.5: 1 2:1 VSWR
No Degra dation in O utput
Power
All Spurious Outputs More
Than 60 dB B elow Ca rr ier
REF. 1015506I
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TYPICALPERFORMANCE
STM1645-30
PowerOutput vs Frequency and Power Input
V
CONTROL
vs Collector Efficiency
PowerGain vs Frequency and Power Input
V
CONTROL
vs Power Outputand IC3(Typical)
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STM1645-30
APPLICATIONS RECOMMENDATIONS
OPERATIONLIMITS
The STM1645-30power module should never be
operated under any condition which exceeds the
Absolute Maximum Ratings presented on this
data sheet. Nor should the module be operated
continuously at any of the specified maximum
ratings. If the module is to be subjected to one or
more of the maximum rating conditions, care
must be taken to monitor other parameters which
may be affected.
MODULEMOUNTING
To insure adequate thermal transfer from the
module to the heatsink, it is recommended that a
satisfactory thermal compound such as Dow
Corning 340, Wakefield 120-2 or equivalent be
applied between the module flange and the
heatsink.
The heatsink mounting surface under the module
shouldbe flat to within ±
0.05 mm (± 0.002Inch).
The module should be mounted to the heatsink
using 3.5 mm (or 6-32) or equivalent screws
torquedto 5-6 Kg-cm(4-6 in-lb).
The module leads should be attached to
equipment PC board using 180
to leads with a properly grounded soldering iron
tip, not to exceed195
o
C, applied a minimum of 2
o
C solder applied
mm (0.080 inch) from the body of the module for
a duration not to exceed 15 seconds per lead. It
is imperative that no other portion of the module,
other than the leads,be subjectedto temperature
in excess of 100
o
C (maximum storage
temperature), for any period of time, as the
plastic moulded cover, internal components and
sealing adhesives may be advertiselyaffected by
suchconditions.
Due to the construction techniques and materials
used within the module, reflow soldering of the
flangeheatsink or leads, is not recommended.
4/6
H160 MECHANICAL DATA
STM1645-30
1016819C
5/6
STM1645-30
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is
granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this publication are
subject tochange without notice. This publication supersedes and replaces all informationpreviously supplied. STMicroelectronics products
are not authorized for use as critical components in life support devices orsystems without express written approval of STMicroelectronics.
The ST logo is a trademarkof STMicroelectronics
1999 STMicroelectronics – Printed in Italy – All Rights Reserved
STMicroelectronics GROUP OF COMPANIES
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