In addition, the STLC1510 provides the following features:
■
Serial and Parallel network interface at backend to CO equipment
■
Serial interface to the AFE chip STLC1511
■
Access to off chip memory
■
Power-up boot program stored in ROM
■ 132 balls 12x12x1.7 mm LBGA package
■
Power Consumption: 0.75 Watt
■
Power Supp.: 2.5 V (core) and 3.3 V (I/O ring)
■
STLC1510
PRODUCT PREVIEW
LBGA132
ORDERING NUMBER: STLC1510
1.0 GENERAL DESCRIPTION
The STLC1510 is a high-speed modem chip that provides the digital portion of a G.992.2 DSL access at a
Central Office (CO) site. It provides downstream and
upstream data transport between an ATM byte
stream and an analog front-end chip using Discrete
Multi-Tone (DMT) Modulation.
The STLC1510 is compliant with ITU-T G.992.2
(G.Lite), G.996.1 (G.Test), G.994.1 (G.Handshake),
G.997.1 (G.Ploam).
Figure 1. Block Diagram
TxClk
TxClav
TxEnb
TxSOC
UTxData[7:0]
TxAddr[4:0]
TxParity
TxBP
RxClk
RxClav
RxEnb
RxSOC
URxData[7:0]
RxAddr[4:0]
RxParity
VDD3_3
VDD2_5
VSS
HPI_Data[7:0]
HPI_Addr [2 :0]
HPI_RWN
HPI_ASN
83
HPI
NIF
FEC
MAP
7
7
14
TAP
TDI
TCK
TDO
EPM
LAMBA Bus
TMS
TRSTN
VDD_PLL
Guard_PLL
EN_D950_EMU
ARM2H P_INT
HPI_CSN
mem
VSS_PL L
ARM_MODE
HPI_CLK
BPU
mem
mem
D950ARM
22
Pmode[1:0]
CMode[1:0]
pgmctrl
Dual
MAC
TGB
8
VCODC
RESETN
GPIO[7:0 ]
D950_CMODE
LinDr_AGC2
LinDr_AGC1
LinDr_Peak
DFE
TxSOUT[1:0]
mem
mem
INF_OUT
REF_OUT
A_SCLK
CK35M
RxSIN[1:0]
REF_CLK
SPI_CLK
SPI_ENB
SPI_DTX
SPI_DRX
November 2000
This is preliminary information ona new product now in development. Details are subject to change without notice.
1/40
STLC1510
2.0 LIST OF MAIN BLOCKS
The STLC1510 G.lite DMT Transceiver is formed by
the following blocks (refer to Figure 1.):
Embedded Processor Module (EPM)
The EPM includes two embedded processor cores:
the ARM7TDMI, a RISC microprocessor, and the
D950, a 16-bit DSP processor. The RISC microprocessor handles the chip control, G.Lite start-up and
showtime control and DSP initialization. It also implements the Framing and Interleaving/Deinterleaving
function required by G.992.2 standard.
Block Processing Unit (BPU)
Computationally intensive digital signal processing
functions are performed in this engine. This engine
utilizes customized DSP architecture that includes
two multiplier/accumulator (MAC).
DigitalFront-End (DFE)
This block provides the interface to an external analog front-end (AFE) device. This block provides decimation, interpolation for the signal sample for the
ADC and DAC on the AFE and signal level monitoring for the analog AGC.
NetworkInterface (NIF)
The NIF is aselectable interface that carries the ATM
signals to and from the STLC1510. This interface
supports one parallel interface (Utopia Level 2) or a
serial data interface. The NIF includes a FIFO to buffer the data between the clock domains of the backend interface and the internal clock.
ForwardError-Correction (FEC)
The Forward Error Correction is done using ReedSolomon Coding. The R-S FEC encoding is performed byte-wise in the transceiver on the transmitted bytes. The two basic parameters that determine
the performance of the code are the code word size,
which consists ofone or more DMT symbols (S), and
the number of redundant check bytes R.
Timing Generation Block(TGB)
The timing generation block generates global clock
and synchronization signals for the STLC1510. It
uses the input clock signals to derive the main internal and output clock signals, as well as all synchronization pulses required to coordinate timing between
the sub-blocks.
Test Access Port (TAP)
This block provides the test access to the STLC1510
using JTAG and BIST techniques.
HPI Interface
A host processor interface is provided to allow the
STLC1510 to be optionally controlled by an external
microcontroller.
3.0 TRANSIENT ENERGY CAPABILITIES
3.1 ESD
ESD (Electronic Discharged) tests have been performed for the Human Body Model (HBM).
The pins of the device are to be able to withstand
minimum 2000V for the HBM.
3.2 Latch-up
The maximum sink or source current from any pin is
limited to 200mA to prevent latch-up.
4.0 ABSOLUTE MAXIMUM RATINGS
The absolute maximum ratings, as specified below,
are those ratings beyond which the device’s lifetime
may be impaired. The meeting of electrical specifications is not implied when the device is subjected to
the absolute limits.
The following table identifies the device’s minimum
and maximum ratings and along with the operatingconditions they define the limits for testing the device
Mapper/De-mapperBlock (MAP)
The Mapper/De-mapper Block (MAP) performs the
bit packing and un-packing and constellation encoder/decoder for a G.992.2 DSL modem. This block
also supports generation of Reverb and medley.
2/40
Table 1. ABSOLUTE MAXIMUM RATINGS
SYMBOLPARAMETERMINIMUMMAXIMUMUNITS
VDD3_33.3V Supply voltage w.r.t.VSS (0V)-0.54V
VDD2_52.5V Supply voltage w.r.t.VSS (0V)-0.53.3V
STLC1510
T
amb
V
IN,VOUT
V
IN5,VOUT5
I
IN,IOUT
P
D
Ambient temperature-4085°C
Voltage at any 3.3V standard input or output-0.5VDD3_3 + 0.5V
Voltage at any 5V compatible input or output
1
-0.86.3V
Current at any input or outputs-2020mA
Power dissipation00.75W
VesdElectrostatic Protection2000V
I latchupI/O Latch-up CurrentV < 0V, V > Vdd200mA
<1>-0.8V undershoots and 6.3V overshoots do not last longer than 4nS.
reset by ARM7, GPIO pin #1,2,3 and
4 are normal mode
EN_D950_EMU=1; D950 core is not
held inreset by ARM7, GPIO pins
#1,2,3 and 4 are dedicated to the
D950 emulator
TAP pins directly to ARM_TAP
ARM_MODE=1; ARM_TAP in daisy
chain configuration after MTAP(i.e.
same as ALPHA configuration)
VDD3_3_8P3.3 volt supply pad3.3V I/O power supplyD3
VDD3_3_7P3.3 volt supply pad3.3V I/O power supplyC5
VDD3_3_6P3.3 volt supply pad3.3V I/O power supplyC3
VDD3_3_5P3.3 volt supply pad3.3V I/O power supplyC4
VDD3_3_4P3.3 volt supply pad3.3V I/O power supplyL12
VDD3_3_3P3.3 volt supply pad3.3V I/O power supplyM12
VDD3_3_2P3.3 volt supply pad3.3V I/O power supplyK12
General Purpose I/O Ports/
D950_IDLE
General Purpose I/O Ports/
D950_SNAP
General Purpose I/O Ports/
D950_INCYCLE
General Purpose I/O Ports/
D950_NERQ
General Purpose I/O Ports/LCLKN10
N12
P12
N11
P11
VDD3_3_1P3.3 volt supply pad3.3V I/O power supplyM11
VDD2_5_8P2.5 volt supply pad2.5V ASIC core power supplyM3
VDD2_5_7P2.5 volt supply pad2.5V ASIC core power supplyL3
VDD2_5_6P2.5 volt supply pad2.5V ASIC core power supplyK3
VDD2_5_5P2.5 volt supply pad2.5V ASIC core power supplyC10
VDD2_5_4P2.5 volt supply pad2.5V ASIC core power supplyC11
VDD2_5_3P2.5 volt supply pad2.5V ASIC core power supplyC12
VDD2_5_2P2.5 volt supply pad2.5V ASIC core power supplyD12
VDD2_5_1P2.5 volt supply pad2.5V ASIC core power supplyM4
VSS_20Pcommon ground supply padGround return for VDD3_3 and
VDD2_5
VSS_19Pcommon ground supply padGround return for VDD3_3 and
VDD2_5
VSS_18Pcommon ground supply padGround return for VDD3_3 and
VDD2_5
VSS_17Pcommon ground supply padGround return for VDD3_3 and
VDD2_5
C9
J3
J12
H12
9/40
STLC1510
Table 2. Pad Description
SignalI/OPad TypeDescriptionBGA
VSS_16Pcommon ground supply padGround return for VDD3_3 and
VDD2_5
VSS_15Pcommon ground supply padGround return for VDD3_3 and
VDD2_5
VSS_14Pcommon ground supply padGround return for VDD3_3 and
VDD2_5
VSS_13Pcommon ground supply padGround return for VDD3_3 and
VDD2_5
VSS_12Pcommon ground supply padGround return for VDD3_3 and
VDD2_5
VSS_11Pcommon ground supply padGround return for VDD3_3 and
VDD2_5
VSS_10Pcommon ground supply padGround return for VDD3_3 and
VDD2_5
VSS_9Pcommon ground supply padGround return for VDD3_3 and
VDD2_5
VSS_8Pcommon ground supply padGround return for VDD3_3 and
VDD2_5
VSS_7Pcommon ground supply padGround return for VDD3_3 and
VDD2_5
VSS_6Pcommon ground supply padGround return for VDD3_3 and
VDD2_5
M6
M5
H3
M7
G3
F3
E3
M9
C6
C7
C8
VSS_5Pcommon ground supply padGround return for VDD3_3 and
M10
VDD2_5
VSS_4Pcommon ground supply padGround return for VDD3_3 and
E12
VDD2_5
VSS_3Pcommon ground supply padGround return for VDD3_3 and
F12
VDD2_5
VSS_2Pcommon ground supply padGround return for VDD3_3 and
M8
VDD2_5
VSS_1Pcommon ground supply padGround return for VDD3_3 and
G12
VDD2_5
VDD_PLLP2.5 volt supply pad2.5V supply forPLLG14
VSS_PLLPground padGround return for PLLF13
Guard_PLLPground padGround Voltage reference for PLLG13
<1>212 MHz in PLL bypass mode
<2>This pad is configured as a pseudo open drain connection and can only pull the output low, or go high impedance
<3>Add pullup to this pin on board. This pad is configured as a pseudo open drain connection and can only pull the output low, or go high
impedance
10/40
STLC1510
5.0 MAIN BLOCK DESCRIPTION
The following sections describe the sequence of
functions performed by the chip
5.1 Network Interface and Controller (NIF)
The Network Interface and Controller block (NIF) is
responsible for transferring data between the
STLC1510 and the ATM network. The NIF has two
interfaces to the backplane: an 8-bit Utopia Level 2
Physical Interface (U2PHY) and a clock and data serial interface (CDIF). It communicates with the rest of
the STLC1510 via the LambaBus. Figure 3. shows a
functional/data path block diagram of the NIF (this diagram does not include all glue logic between the
major functional blocks). 37 external pins are required for the U2PHY and CDIF interfaces (19 for the
Tx direction, 18 for Rx). Pins are shared between the
two interfaces, as they will not both be active at the
same time.
5.1.1 Features
■
Utopia Level 2 8-bit parallel interface.
■ Up to 9 ATM cells (477 bytes) of rate adaptation
buffering for the Utopia Level 2 TX interface.
The amount of buffering is programmable via a
memory-mapped register.
■
Up to 2 ATM cells (106 bytes) of rate adaptation
buffering for the Utopia Level 2 RX interface.
The amount of buffering is programmable via a
memory-mapped register.
■
ATM Transconvergance (TC) layer cell
processor with 16-bit data path: performs
scrambling/descrambling, HEC calculation, cell
delineation with error detection (no error
correction) and cell rate decoupling by idle cell
insertion/detection.
■ Clock and Data serial interface.
■ Implemented as a hardware module on the
Lamba bus with an 8-bit data interface and 16bit control interface.
■ 4 ATM cells (212 bytes) of rate adaptation
buffering in each direction (TX and RX) for
interfacing to the Lamba bus.
■
Pads partial or runt cells (ATM cells of length
less than 53 bytes) to 53 bytes in the TX
direction to prevent loss of synchronization at
theCPE.
5.1.2 External Interface (Pins)
The STLC1510 connects to the ATM network via 37
external pins. These are illustrated in Figure 3. Note
that the pins TxClk and RxClk are bidirectional and,
along with UTxData[0] and URxData[0], are shared
between the CDIF and U2PHY
5.1.3 Clock and data serial Interface (CDIF)
The STLC1510 can communicate serially to an ATM
network through the CDIF. Two serial data lines,one
for the Tx path (CO to CPE), the other for the Rx path
(CPE to CO), and two respective clocks realize the
exchange of information and control signals between
the STLC1510 and the network.
The CDIF of the STLC1510 has the following attributes:
■
Synchronizes to the ATM network.
■
Provides Tx and Rx clocks to the ATM network.
Transfers data between the ATM network and the
STLC1510’s Lamba Bus
■
Accepts idle ATM cells inserted by the ATM
network in the Tx direction. These idle cells are
used by the ATM network to adapt to the clock
provided to it by the STLC1510.
■
Generates clock gapping in the Tx direction.
This serves two purposes: it is a flow control
mechanism to theATM network chip, andit can
be used for the byte alignment. In the bytealignment role, a clockgap longer thana pre-set
threshold indicates that the most significant bit
of a byte should be transmitted on the next
rising clock edge. This is useful for aligning data
bytes to the overhead bits inserted by the
STLC1510. In the flow control role, incoming
data is not sampled when the clock is off. The
threshold used to distinguish between byte
alignment and flow control clock gapping is
software programmable and has a range offrom
0 to 65535 clock cycles (a 16 bit register stores
the value).
■
Generates clock gapping in the Rx direction.
This serves asa flow-control mechanism; when
there is no data available for transmission to the
backplane, the clock is shutoff, ensuring that no
invalid data bits are sampled by the backplane.
11/40
STLC1510
Figure 3. NIF Off-Chip Signals
TxC lk
UTxData[0]
UTxData[7:1]
TxAddr[4:0]
TxParity
TxEnb
TxSOC
TxClav
TxBP
CDIF
TX
URxData[0]
8
5
U2PHY
TX
URxData[7:1]
RxClk
RxEnb
RxSOC
RxAddr[4:0]
RxClav
RxParity
8
5
CDIF
RX
U2PHY
RX
The following tasks are performed by the ATM network (in accordance with ITU-T Recommendation
I.432.1), and therefore do not have to be implemented in the STLC1510 when using the CDIF:
■
HCS generation (Tx).
■
Payload scrambling (Tx).
■
Optionally, enables clear channel mode, in
which HCS generation and payload scrambling
are disabled (Tx).
■
HCS cell delineation (Rx).
■ Payload descrambling (Rx).
■
Idle cell filtering (Rx).
■
Header error detection to recover valid ATM
cells (header correction is not implemented)
(Rx).
■
Optionally, enables clear channel mode, in
which every 53 x 8 = 424 bits are collected by
the receiver and sent to the backplane (Rx).
5.1.4 UTOPIA Level 2 Interface and Controller
The Universal Test and Operations Physical Interface forATM (UTOPIA) provides a standard that links
ATM layer orvarious management entities with a variety of physical (PHY) layers.
The UTOPIA IF has the following features:
■
provides clock decoupling mechanism.
■ throttles data flow from the ATM layer.
■
indicates to the ATM layer when the modem is
ready to receive data.
■ signals tothe ATM layer the presence of valid
data for transmission.
■
Recognizes the address when the modem is
selected for communication.
■ Supports octet-level and/or cell-level
handshaking.
■
UTOPIA Level 2 supports a multi-PHY
operation for up to n PHY devices where,
■
n=< 8 at ATM layers intended for 155 Mbps;
12/40
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