SLLIMM™ (small low-loss intelligent molded module)
IPM, 3-phase inverter - 18 A, 600 V short-circuit rugged IGBT
Features
■ IPM 18 A, 600 V 3-phase IGBT inverter bridge
including control ICs for gate driving and freewheeling diodes
■ Short-circuit rugged IGBTs
■ V
■ 3.3 V, 5 V, 15 V CMOS/TTL inputs
comparators with hysteresis and pull down /
pull up resistors
■ Undervoltage lockout
■ Internal bootstrap diode
■ Interlocking function
■ Smart shutdown function
■ Comparator for fault protection against over
temperature and overcurrent
■ DBC leading to low thermal resistance
■ Isolation rating of 2500 V
negative temperature coefficient
CE(sat)
rms
/min
STGIPS20K60
SDIP-25L
Applications
■ 3-phase inverters for motor drives
■ Home appliances, such as washing machines,
refrigerators, air conditioners and sewing
machine
Description
This intelligent power module provides a compact,
high performance AC motor drive in a simple,
rugged design. Combining ST proprietary control
ICs with the most advanced short-circuit-rugged
IGBT system technology, this device is ideal for 3phase inverters in applications such as home
appliances and air conditioners. SLLIMM™ is a
trademark of STMicroelectronics.
Table 1. Device summary
Order code Marking Package Packaging
STGIPS20K60 GIPS20K60 SDIP-25L Tube
November 2011 Doc ID 16098 Rev 5 1/20
www.st.com
20
Contents STGIPS20K60
Contents
1 Internal block diagram and pin configuration . . . . . . . . . . . . . . . . . . . . 3
2 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.2 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3.1 Control part . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3.2 Waveforms definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
4 Smart shutdown function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
5 Applications information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
5.1 Recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
6 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
7 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
2/20 Doc ID 16098 Rev 5
STGIPS20K60 Internal block diagram and pin configuration
1 Internal block diagram and pin configuration
Figure 1. Internal block diagram
Pin 1
OUT U
VBOOT U
LIN-U
HIN-U
VCC
OUT V
VBOOT V
GND
LIN-V
HIN-V
LIN
S D/O D
HIN
VCC
DT
GND
LIN
S D/O D
HIN
VCC
DT
GND
Vb oot
HVG
OUT
LVG
CP+
Vb oot
HVG
OUT
LVG
CP+
Pin 25
NU
NV
OUT W
VBOOT W
LIN
Vboot
LIN-W
HIN-W
S D/OD
CIN
Pin 16
SD/OD
HIN
VCC
DT
GND
HVG
OUT
LVG
CP+
W
NW
Pin 17
AM05002v1
Doc ID 16098 Rev 5 3/20
Internal block diagram and pin configuration STGIPS20K60
Table 2. Pin description
Pin n° Symbol Description
1O U T
2V
3L I N
4H I N
5V
6O U T
7V
U
bootU
U
U
CC
V
boot V
High-side reference output for U phase
Bootstrap voltage for U phase
Low-side logic input for U phase
High-side logic input for U phase
Low voltage power supply
High-side reference output for V phase
Bootstrap voltage for V phase
8 GND Ground
9L I NVLow-side logic input for V phase
10 HIN
11 OUT
12 V
boot W
13 LIN
14 HIN
15 SD
/ OD Shutdown logic input (active low) / open-drain (comparator output)
V
W
W
W
High-side logic input for V phase
High-side reference output for W phase
Bootstrap voltage for W phase
Low-side logic input for W phase
High-side logic input for W phase
16 CIN Comparator input
17 N
W
Negative DC input for W phase
18 W W phase output
19 P Positive DC input
20 N
V
Negative DC input for V phase
21 V V phase output
22 P Positive DC input
23 N
U
Negative DC input for U phase
24 U U phase output
25 P Positive DC input
Figure 2. Pin layout (bottom view)
4/20 Doc ID 16098 Rev 5
STGIPS20K60 Electrical ratings
2 Electrical ratings
2.1 Absolute maximum ratings
Table 3. Inverter part
Symbol Parameter Value Unit
V
V
PN(surge)
V
CES
± I
C
± I
CP
P
TOT
t
scw
1. Applied between HIN
2. Calculated according to the iterative formula:
3. Pulse width limited by max junction temperature
Supply voltage applied between P - NU, NV, N
PN
W
Supply voltage (surge) applied between P - NU,
, N
N
V
W
Each IGBT collector emitter voltage (V
Each IGBT continuous collector current
(2)
(3)
= 25°C
at T
C
Each IGBT pulsed collector current 40 A
(1)
= 0)
IN
450 V
500 V
600 V
18 A
Each IGBT total dissipation at TC = 25°C 52 W
Short circuit withstand time, VCE = 0.5 V
TJ = 125 °C, VCC = V
, LINi and GND for i = U, V, W
i
ICTC()
= 15 V, V
boot
------------------------------------------------------------------------------------------------------- =
R
thj c–
V
(BR)CES
(1)
= 0 ÷ 5 V
IN
T
CE sat ()max ()Tjmax ()ICTC
–
jmax ()TC
() , () ×
5µ s
Table 4. Control part
Symbol Parameter Value Unit
Output voltage applied between
OUT
OUT
U,
OUTW - GND
V,
V
boot
- 21 to V
+ 0.3 V
boot
Low voltage power supply -0.3 to +21 V
Comparator input voltage -0.3 to VCC +0.3 V
Bootstrap voltage applied between
V
- OUTi for i = U, V, W
boot i
Logic input voltage applied between HIN, LIN and
IN
GND
-0.3 to 620 V
-0.3 to 15 V
Open drain voltage -0.3 to 15 V
/dt Allowed output slew rate 50 V/ns
V
dV
V
OUT
V
CC
V
CIN
V
boot
V
SD/OD
OUT
Doc ID 16098 Rev 5 5/20
Electrical ratings STGIPS20K60
Table 5. Total system
Symbol Parameter Value Unit
V
ISO
(1)
T
j
T
C
Isolation withstand voltage applied between each
pin and heatsink plate (AC voltage, t = 60 sec.)
Operating junction temperature -40 to 150 °C
Module case operation temperature -40 to 125 °C
1. The maximum junction temperature rating of the power chips integrated within the SDIP module is 150°C
(@T
≤ 100°C). To ensure safe operation of the SDIP module, the average junction temperature should be
C
limited to T
≤ 125°C (@TC ≤ 100°C)
j(avg)
2.2 Thermal data
Table 6. Thermal data
Symbol Parameter Value Unit
R
thJC
Thermal resistance junction-case single IGBT 2.4 °C/W
Thermal resistance junction-case single diode 5 °C/W
2500 V
6/20 Doc ID 16098 Rev 5