ST STGIPS14K60 User Manual

SLLIMM™ (small low-loss intelligent molded module)

IPM, 3-phase inverter - 14 A, 600 V short-circuit rugged IGBT

Features

■ IPM 14 A, 600 V 3-phase IGBT inverter bridge

including control ICs for gate driving and free­wheeling diodes

■ Short-circuit rugged IGBTs

■ V

■ 3.3 V, 5 V, 15 V CMOS/TTL inputs

comparators with hysteresis and pull down /
pull up resistors

■ Undervoltage lockout

■ Internal bootstrap diode

■ Interlocking function

■ Shutdown function

■ Comparator for fault protection against

overtemperature and overcurrent

■ DBC substrate leading to low thermal

resistance

■ Isolation rating of 2500 Vrms/min

Applications

■ 3-phase inverters for motor drives

■ Home appliances, such as washing machines,

refrigerators, air conditioners and sewing
machines

negative temperature coefficient

CE(sat)

STGIPS14K60

SDIP-25L

Description

This intelligent power module provides a
compact, high performance AC motor drive in a
simple, rugged design. Combining ST proprietary
control ICs with the most advanced short-circuit­rugged IGBT system technology, this device is
ideal for 3-phase inverters in applications such as
home appliances and air conditioners. SLLIMM™
is a trademark of STMicroelectronics.

Table 1. Device summary

Order code Marking Package Packaging

STGIPS14K60 GIPS14K60 SDIP-25L Tube

November 2011 Doc ID 15927 Rev 6 1/20

www.st.com

20

Contents STGIPS14K60

Contents

1 Internal block diagram and pin configuration . . . . . . . . . . . . . . . . . . . . 3

2 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

2.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

2.2 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

3.1 Control part . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

3.2 Waveforms definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

4 Smart shutdown function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

5 Applications information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

5.1 Recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

6 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

7 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

2/20 Doc ID 15927 Rev 6

STGIPS14K60 Internal block diagram and pin configuration

P

P

P

U

V

1 Internal block diagram and pin configuration

Figure 1. Internal block diagram

Pin 1

OUT U

VBOOT U

LIN-U

HIN-U

VCC

OUT V

VBOOT V

GND

LIN-V

HIN-V

LIN

SD/O D

HIN

VCC

DT

GND

LIN

SD/O D

HIN

VCC

DT

GND

Vboot

HVG

OUT

LVG

CP+

Vboot

HVG

OUT

LVG

CP+

Pin 25

NU

NV

OUT W

VBOOT W

LIN

Vboot

LIN-W

HIN-W

SD/OD

CIN

Pin 16

SD/OD

HIN

VCC

DT

GND

HVG

OUT

LVG

CP+

W

NW

Pin 17

AM05002v1

Doc ID 15927 Rev 6 3/20

Internal block diagram and pin configuration STGIPS14K60

Table 2. Pin description

Pin n° Symbol Description

1OUT

2V

3LIN

4HIN

5V

6OUT

7V

U

boot U

U

U

CC

V

boot V

High side reference output for U phase

Bootstrap voltage for U phase

Low side logic input for U phase

High side logic input for U phase

Low voltage power supply

High side reference output for V phase

Bootstrap voltage for V phase

8 GND Ground

9LIN

10 HIN

11 OUT

12 V

13 LIN

14 HIN

15 SD

V

V

W

boot W

W

W

/ OD Shut down logic input (active low) / open drain (comparator output)

Low side logic input for V phase

High side logic input for V phase

High side reference output for W phase

Bootstrap voltage for W phase

Low side logic input for W phase

High side logic input for W phase

16 CIN Comparator input

17 N

W

Negative DC input for W phase

18 W W phase output

19 P Positive DC input

20 N

V

Negative DC input for V phase

21 V V phase output

22 P Positive DC input

23 N

U

Negative DC input for U phase

24 U U phase output

25 P Positive DC input

Figure 2. Pin layout (bottom view)

4/20 Doc ID 15927 Rev 6

STGIPS14K60 Electrical ratings

2 Electrical ratings

2.1 Absolute maximum ratings

Table 3. Inverter part

Symbol Parameter Value Unit

V

V

PN(surge)

V

CES

± I

C

± I

CP

P

TOT

t

scw

1. Applied between HIN

Supply voltage applied between P - NU, NV, N

PN

W

Supply voltage (surge) applied between P - NU,
NV, N

W

Each IGBT collector emitter voltage (V

Each IGBT continuous collector current

(2)

(1)

= 0)

IN

at TC = 25°C

(3)

Each IGBT pulsed collector current 30 A

450 V

500 V

600 V

14 A

Each IGBT total dissipation at TC = 25°C 42 W

Short circuit withstand time, VCE = 0.5 V
TJ = 125 °C, VCC = V

, LINi and GND for i = U, V, W

i

= 15 V, V

boot

IN

(1)

(BR)CES

= 0 ÷ 5 V

5µs

2. Calculated according to the iterative formula:

ICTC()

-------------------------------------------------------------------------------------------------------=

R

thj c–

T

V

CE sat()max()Tjmax()ICTC

–

jmax()TC

(),()×

3. Pulse width limited by max junction temperature

Table 4. Control part

Symbol Parameter Value Unit

V

V

V

OUT

V

V

CC

CIN

boot

IN

Output voltage applied between
OUT

OUT

U,

OUTW - GND

V,

Low voltage power supply -0.3 to +21 V

Comparator input voltage -0.3 to VCC +0.3 V

Bootstrap voltage applied between

- OUTi for i = U, V, W

V

boot i

Logic input voltage applied between HIN, LIN and
GND

V

- 21 to V

boot

boot

-0.3 to 620 V

-0.3 to 15 V

+ 0.3 V

V

SD/OD

dV

OUT

Open drain voltage -0.3 to 15 V

/dt Allowed output slew rate 50 V/ns

Doc ID 15927 Rev 6 5/20

Electrical ratings STGIPS14K60

Table 5. Total system

Symbol Parameter Value Unit

V

ISO

(1)

T

j

T

C

1. The maximum junction temperature rating of the power chips integrated within the SDIP module is 150°C
(@TC ≤ 100°C). To ensure safe operation of the SDIP module, the average junction temperature should be
limited to T

Isolation withstand voltage applied between each
pin and heatsink plate (AC voltage, t = 60 sec.)

Operating junction temperature -40 to 150 °C

Module case operation temperature -40 to 125 °C

≤ 125°C (@TC ≤ 100°C).

j(avg)

2.2 Thermal data

Table 6. Thermal data

Symbol Parameter Value Unit

R

thJC

Thermal resistance junction-case single IGBT 3 °C/W

Thermal resistance junction-case single diode 5.5 °C/W

2500 V

6/20 Doc ID 15927 Rev 6