ST STGIPN3H60 User Manual

SLLIMM™-nano (small low-loss intelligent molded module)

IPM, 3 A - 600 V 3-phase IGBT inverter bridge

Features

■ IPM 3 A, 600 V, 3-phase IGBT inverter bridge

including control ICs for gate driving and
freewheeling diodes

■ Optimized for low electromagnetic interference

■ V

■ 3.3 V, 5 V, 15 V CMOS/TTL inputs

comparators with hysteresis and pull down/pull
up resistors

■ Undervoltage lockout

■ Internal bootstrap diode

■ Interlocking function

■ Smart shutdown function

■ Comparator for fault protection against

overtemperature and overcurrent

■ Op amp for advanced current sensing

■ Optimized pinout for easy board layout

Applications

■ 3-phase inverters for motor drives

■ Dish washers, refrigerator compressors,

heating systems, air-conditioning fans,
draining and recirculation pumps

negative temperature coefficient

CE(sat)

STGIPN3H60

Datasheet − production data

NDIP-26L

Description

This intelligent power module implements a
compact, high performance AC motor drive in a
simple, rugged design. It is composed of six
IGBTs with freewheeling diodes and three half­bridge HVICs for gate driving, providing low
electromagnetic interference (EMI) characteristics
with optimized switching speed. The package is
optimized for thermal performance and
compactness in built-in motor applications, or
other low power applications where assembly
space is limited. This IPM includes an operational
amplifier, completely uncommitted, and a
comparator that can be used to design a fast and
efficient protection circuit. SLLIMM™ is a
trademark of STMicroelectronics.

Table 1. Device summary

Order code Marking Package Packaging

STGIPN3H60 GIPN3H60 NDIP-26L Tube

May 2012 Doc ID 018957 Rev 3 1/21

This is information on a product in full production.

www.st.com

21

Contents STGIPN3H60

Contents

1 Internal schematic diagram and pin configuration . . . . . . . . . . . . . . . . 3

2 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

2.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

2.2 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

3.1 Control part . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

3.2 Waveform definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

4 Smart shutdown function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

5 Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

5.1 Recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

6 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

7 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

2/21 Doc ID 018957 Rev 3

STGIPN3H60 Internal schematic diagram and pin configuration

1 Internal schematic diagram and pin configuration

Figure 1. Internal schematic diagram

GND

SD-OD

Vcc W

HIN W

LIN W

OP+

OPOUT

OP-

Vcc V

HIN V

LIN V

CIN

Vcc U

HIN U

SD-OD

LIN U

PIN 1

GND

VCC

HIN

SD-OD

LIN

GND

OPOUT

OP-

VCC

HIN

SD-OD

LIN

GND

VCC

HIN

SD-OD

LIN

HVG

OUT

LVG

VBOOT

OP+

HVG

OUT

LVG

VBOOT

CIN

HVG

OUT

LVG

VBOOT

PIN 26

N W

W, OU T W

Vboot W

N V

V, O UT V

Vboot V

N U

U,OUT U

P

Vboot U

PIN 16 PIN 17

AM09916v1

Doc ID 018957 Rev 3 3/21

Internal schematic diagram and pin configuration STGIPN3H60

Table 2. Pin description

Pin Symbol Description

1 GND Ground

2SD / OD Shut down logic input (active low) / open drain (comparator output)

3V

W Low voltage power supply W phase

CC

4 HIN W High side logic input for W phase

5LIN

W Low side logic input for W phase

6 OP+ Op amp non inverting input

7OP

OUT

Op amp output

8 OP- Op amp inverting input

9V

V Low voltage power supply V phase

CC

10 HIN V High side logic input for V phase

11 LIN

V Low side logic input for V phase

12 CIN Comparator input

13 V

U Low voltage power supply for U phase

CC

14 HIN U High side logic input for U phase

15 SD

16 LIN

17 V

/ OD Shut down logic input (active low) / open drain (comparator output)

U Low side logic input for U phase

U Bootstrap voltage for U phase

BOOT

18 P Positive DC input

19 U, OUT

20 N

21 V

U

BOOT

22 V, OUT

23 N

24 V

V

BOOT

25 W, OUT

26 N

W

U phase output

U

Negative DC input for U phase

V Bootstrap voltage for V phase

V phase output

V

Negative DC input for V phase

W Bootstrap voltage for W phase

W phase output

W

Negative DC input for W phase

4/21 Doc ID 018957 Rev 3

STGIPN3H60 Internal schematic diagram and pin configuration

Figure 2. Pin layout (top view)

(*) Dummy pin internally connected to P (positive DC input).

Doc ID 018957 Rev 3 5/21

Electrical ratings STGIPN3H60

2 Electrical ratings

2.1 Absolute maximum ratings

Table 3. Inverter part

Symbol Parameter Value Unit

V

CES

± I

C

± I

CP

P

TOT

1. Applied between HIN

2. Calculated according to the iterative formula:

3. Pulse width limited by max junction temperature

Each IGBT collector emitter voltage (V

Each IGBT continuous collector current

(2)

(3)

= 25°C

at T

C

Each IGBT pulsed collector current 18 A

Each IGBT total dissipation at TC = 25°C 8 W

, LINi and GND for i = U, V, W

i

ICTC()

------------ ------------- ------------- ------------ ------------- ------------- ------------- ------------ --=

R

thj c–

V

(1)

= 0)

IN

–

T

jmax()TC

CE sat()max()Tjmax()ICTC

(),()×

600 V

3A

Table 4. Control part

Symbol Parameter Min. Max. Unit

V

OUT

V

CC

V

CIN

V

op+

V

op-

V

boot

V

IN

V

SD/OD

ΔV

OUT/dT

Table 5. Total system

Output voltage applied between OUTU, OUTV,

- GND

OUT

W

V

boot

- 21 V

+ 0.3 V

boot

Low voltage power supply - 0.3 21 V

Comparator input voltage - 0.3 VCC +0.3 V

OPAMP non-inverting input - 0.3 VCC +0.3 V

OPAMP inverting input - 0.3 VCC +0.3 V

Bootstrap voltage - 0.3 620 V

Logic input voltage applied between HIN, LIN
and GND

- 0.3 15 V

Open drain voltage - 0.3 15 V

Allowed output slew rate 50 V/ns

Symbol Parameter Value Unit

V

ISO

T

T

C

Isolation withstand voltage applied between each
pin and heatsink plate (AC voltage, t = 60 sec.)

Power chips operating junction temperature -40 to 150 °C

j

1000 V

Module case operation temperature -40 to 125 °C

6/21 Doc ID 018957 Rev 3

STGIPN3H60 Electrical ratings

2.2 Thermal data

Table 6. Thermal data

Symbol Parameter Value Unit

R

thJA

Thermal resistance junction-ambient 50 °C/W

Doc ID 018957 Rev 3 7/21