ST STGF20NB60S User Manual

ST STGF20NB60S User Manual

STGF20NB60S

STGF20NB60S

N-CHANNEL 13A - 600V TO-220FP

PowerMESH™ IGBT

Table 1: General Features

TYPE

VCES

VCE(sat) (Max)

IC

 

 

@25°C

@100°C

 

 

 

 

STGF20NB60S

600 V

< 1.7 V

13 A

 

 

 

 

LOW ON-VOLTAGE DROP (Vcesat)

HIGHT CURRENT CAPABILITY

OFF LOSSES INCLUDE TAIL CURRENT

HIGH INPUT IMPEDANCE (VOLTAGE DRIVEN)

DESCRIPTION

Using the latest high voltage technology based on a patented strip layout, STMicroelectronics has designed an advanced family of IGBTs, the PowerMESHIGBTs, with outstanding performances.

The suffix “S” identifies a family optimized to achieve minimum on-voltage drop for low frequency to applications (<1kHz).

APPLICATIONS

LIGHT DIMMER

STATIC RELAYS

MOTOR CONTROL

Figure 1: Package

3

2

1

TO-220FP

Figure 2: Internal Schematic Diagram

Table 2: Order Code

PART NUMBER

MARKING

PACKAGE

PACKAGING

 

 

 

 

STGF20NB60S

GF20NB60S

TO-220FP

TUBE

 

 

 

 

Rev. 2

February 2005

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STGF20NB60S

Table 3: Absolute Maximum ratings

Symbol

Parameter

Value

Unit

 

 

 

 

VCES

Collector-Emitter Voltage (VGS = 0)

600

V

VECR

Emitter-Collector Voltage

20

V

VGE

Gate-Emitter Voltage

±20

V

IC

Collector Current (continuous) at TC = 25°C (#)

24

A

IC

Collector Current (continuous) at TC = 100°C (#)

13

A

ICM ( )

Collector Current (pulsed)

70

A

PTOT

Total Dissipation at TC = 25°C

40

W

 

Derating Factor

0.32

W/°C

 

 

 

 

VISO

Insulation withstand voltage AC (t=1sec, Tc=25°C)

2500

V

 

 

 

 

Tstg

Storage Temperature

–55 to 150

°C

 

 

Tj

Operating Junction Temperature range

 

 

( ) Pulse width limited by safe operating area

Table 4: Thermal Data

 

 

Min.

Typ.

Max.

 

 

 

 

 

 

 

Rthj-case

Thermal Resistance Junction-case

 

 

3.15

°C/W

 

 

 

 

 

 

Rthj-amb

Thermal Resistance Junction-ambient

 

 

62.5

°C/W

 

 

 

 

 

 

TL

Maximum Lead Temperature for Soldering Purpose (1.6 mm

 

300

 

°C

 

from case, for 10 sec.)

 

 

 

 

 

 

 

 

 

 

ELECTRICAL CHARACTERISTICS (TCASE =25°C UNLESS OTHERWISE SPECIFIED)

Table 5: On/Off

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Unit

 

 

 

 

 

 

 

VBR(CES)

Collector-Emitter Breakdown

IC = 250 µA, VGE = 0

600

 

 

V

 

Voltage

 

 

 

 

 

 

 

 

 

 

 

 

VBR(ECS)

Emitter-Collector Breakdown

IC = 1mA, VGE = 0

20

 

 

V

 

Voltage

 

 

 

 

 

 

 

 

 

 

 

 

ICES

Collector cut-off Current

VCE = Max Rating, TC = 25 °C

 

 

10

µA

 

(VGE = 0)

VCE = Max Rating, TC = 125 °C

 

 

100

µA

IGES

Gate-Emitter Leakage

VGE = ± 20V , V CE = 0

 

 

±100

nA

 

Current (VCE = 0)

 

 

 

 

 

VGE(th)

Gate Threshold Voltage

VCE = VGE, IC = 250 µA

2.5

 

5

V

VCE(sat)

Collector-Emitter Saturation

VGE = 15V, IC = 20 A, Tj= 25°C

 

1.25

1.7

V

 

Voltage

VGE = 15V, IC = 20A, Tj=150°C

 

1.2

 

V

(#) Calculated according to the iterative formula:

IC( TC)

=

TJ MAX – TC

×-----V-----C----E----S-----AT--------(---M-----A-----X----)---(T-------C---,---I--C----)

 

RTHJ – C

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STGF20NB60S

ELECTRICAL CHARACTERISTICS (CONTINUED)

Table 6: Dynamic

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Unit

 

 

 

 

 

 

 

gfs (1)

Forward Transconductance

VCE = 10 V , IC = 8 A

 

20

 

S

Cies

Input Capacitance

VCE = 25 V, f= 1 MHz, VGE = 0

 

1820

 

pF

Coes

Output Capacitance

 

 

167

 

pF

Cres

Reverse Transfer

 

 

27

 

pF

 

Capacitance

 

 

 

 

 

 

 

 

 

 

 

 

Qg

Total Gate Charge

VCC = 480 V, IC = 20 A,

 

83

115

nC

Qge

Gate-Emitter Charge

VGE = 15 V

 

10

 

nC

Qgc

Gate-Collector Charge

(see Figure 19)

 

27

 

nC

 

 

 

 

 

 

 

ICL

Turn-off SOA minimum

Vclamp = 480 V , Tj = 125°C

80

 

 

A

 

current

RG = 100 Ω

 

 

 

 

(1) Pulsed: Pulse duration= 300 µs, duty cycle 1.5%

Table 7: Switching On

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Unit

 

 

 

 

 

 

 

td(on)

Turn-on Delay Time

VCC = 480 V, IC = 20 A

 

92

 

ns

tr

Current Rise Time

RG= 100 Ω , VGE= 15V

 

70

 

ns

(di/dt)on

Turn-on Current Slope

(see Figure 17)

 

340

 

A/µs

td(on)

Turn-on Delay Time

VCC = 480 V, IC = 20 A

 

80

 

ns

tr

Current Rise Time

RG= 100 Ω , VGE= 15V,

 

73

 

ns

(di/dt)on

Turn-on Delay Time

Tj= 125°C (see Figure 17)

 

320

 

A/µs

Table 8: Switching Off

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Unit

 

 

 

 

 

 

 

tc

Cross-over Time

Vcc = 480 V, IC = 20 A,

 

1.6

 

µs

tr(Voff)

Off Voltage Rise Time

RG = 100 Ω , VGE = 15 V

 

0.78

 

µs

TJ = 25 °C

 

 

td(off)

Turn-off Delay Time

 

1.1

 

µs

(see Figure 17)

 

 

tf

Current Fall Time

 

 

0.79

 

µs

tc

Cross-over Time

Vcc = 480 V, IC = 20 A,

 

2.4

 

µs

tr(Voff)

Off Voltage Rise Time

RG = 100 Ω , VGE = 15 V

 

1.1

 

µs

Tj = 125 °C

 

 

td(off)

Turn-off Delay Time

 

2.4

 

µs

(see Figure 17)

 

 

tf

Current Fall Time

 

 

1.2

 

µs

 

 

 

 

 

 

 

Table 9: Switching Energy

Symbol

Parameterr

Test Conditions

Min.

Typ.

Max

Unit

 

 

 

 

 

 

 

Eon (2)

Turn-on Switching Losses

VCC = 480 V, IC = 20 A

 

0.84

 

mJ

Eoff (3)

Turn-off Switching Loss

RG= 100 Ω , VGE= 15V,

 

7.4

 

mJ

Ets

Total Switching Loss

(see Figure 18)

 

8.24

 

mJ

Eon (2)

Turn-on Switching Losses

VCC = 480 V, IC = 20 A

 

0.86

 

mJ

Eoff (3)

Turn-off Switching Loss

RG= 100 Ω , VGE=15V,Tj=125°C

 

11.5

 

mJ

Ets

Total Switching Loss

(see Figure 18)

 

12.4

 

mJ

(2)Eon is the turn-on losses when a typical diode is used in the test circuit in figure 2. If the IGBT is offered in a package with a co-pack diode, the co-pack diode is used as external diode.

(3)Turn-off losses include also the tail of the collector current.

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