STGF10NB60SD
STGF10NB60SD
N-CHANNEL 10A - 600V TO-220FP
PowerMESH™ IGBT
TYPE |
VCES |
VCE(sat) (Max) |
IC |
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@25°C |
@100°C |
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STGF10NB60SD |
600 |
< 1.8 V |
10 A |
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■HIGHT INPUT IMPEDANCE (VOLTAGE DRIVEN)
■LOW ON-VOLTAGE DROP
■HIGH CURRENT CAPABILITY
■OFF LOSSES INCLUDE TAIL CURRENT
■CO-PACKAGED WITH TURBOSWITCH™ ANTIPARALLEL DIODE
DESCRIPTION
Using the latest high voltage technology based on a patented strip layout, STMicroelectronics has designed an advanced family of IGBTs, the PowerMESH™ IGBTs, with outstanding performances. The suffix “S” identifies a family optimized achieve minimum on-voltage drop for low frequency applications (<1kHz).
APPLICATIONS
■LIGHT DIMMER
■STATIC RELAYS
■MOTOR CONTROL
3
2
1
TO-220FP
INTERNAL SCHEMATIC DIAGRAM
ABSOLUTE MAXIMUM RATINGS
Symbol |
Parameter |
Value |
Unit |
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VCES |
Collector-Emitter Voltage (VGS = 0) |
600 |
V |
VECR |
Reverse Battery Protection |
20 |
V |
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VGE |
Gate-Emitter Voltage |
± 20 |
V |
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IC |
Collector Current (continuous) at TC = 25°C |
20 |
A |
IC |
Collector Current (continuous) at TC = 100°C |
10 |
A |
ICM (●) |
Collector Current (pulsed) |
80 |
A |
PTOT |
Total Dissipation at TC = 25°C |
25 |
W |
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Derating Factor |
0.2 |
W/°C |
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VISO |
Insulation Withstand Voltage A.C.(t = 1 sec; Tc = 25°C) |
2500 |
V |
Tstg |
Storage Temperature |
–65 to 150 |
°C |
Tj |
Max. Operating Junction Temperature |
150 |
°C |
(●) Pulse width limited by safe operating area
June 2003 |
1/8 |
STGF10NB60SD
THERMAL DATA
Rthj-case |
Thermal Resistance Junction-case Max |
5 |
°C/W |
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Rthj-amb |
Thermal Resistance Junction-ambient Max |
62.5 |
°C/W |
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ELECTRICAL CHARACTERISTICS (TCASE = 25 °C UNLESS OTHERWISE SPECIFIED)
OFF
Symbol |
Parameter |
Test Conditions |
Min. |
Typ. |
Max. |
Unit |
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VBR(CES) |
Collector-Emitter Break-down |
IC = 250 µA, VGE = 0, |
600 |
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V |
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Voltage |
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VBR(CES) |
Emitter Collector Break-down |
IC = 1 mA, VGE = 0, |
20 |
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V |
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Voltage |
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ICES |
Collector cut-off Current |
VCE = Max Rating ,Tj =25 °C |
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10 |
µA |
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(VGE = 0) |
VCE = Max Rating ,Tj =125 °C |
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100 |
µA |
IGES |
Gate-Emitter Leakage |
VGE = ± 20V , VCE = 0 |
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± 100 |
nA |
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Current (VCE = 0) |
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ON (1)
Symbol |
Parameter |
Test Conditions |
Min. |
Typ. |
Max. |
Unit |
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VGE(th) |
Gate Threshold Voltage |
VCE = VGE, IC = 250µA |
2.5 |
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5 |
V |
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VCE(SAT) |
Collector-Emitter Saturation |
VGE =15V, IC = 5 A, Tj= 25°C |
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1.15 |
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V |
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Voltage |
VGE =15V, IC = 10 |
A, Tj= 25°C |
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1.35 |
1.8 |
V |
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VGE =15V, IC = 10 |
A, Tj= 125°C |
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1.25 |
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V |
DYNAMIC
Symbol |
Parameter |
Test Conditions |
Min. |
Typ. |
Max. |
Unit |
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gfs |
Forward Transconductance |
VCE = 25 V , IC =10 A |
5 |
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S |
Cies |
Input Capacitance |
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610 |
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pF |
Coes |
Output Capacitance |
VCE = 25V, f = 1 MHz, VGE = 0 |
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65 |
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pF |
Cres |
Reverse Transfer |
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12 |
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pF |
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Capacitance |
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Qg |
Gate Charge |
VCE = 400V, IC = 10 A, |
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33 |
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nC |
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VGE = 15V |
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ICL |
Latching Current |
Vclamp= 480V, RG= 1kΩ, |
20 |
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A |
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Tj= 125°C |
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2/8
STGF10NB60SD
SWITCHING ON
Symbol |
Parameter |
Test Conditions |
Min. |
Typ. |
Max. |
Unit |
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td(on) |
Turn-on Delay Time |
VCC = 480 V, IC = 10 A |
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0.7 |
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µs |
tr |
Rise Time |
RG = 1KΩ , VGE = 15 V |
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0.46 |
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µs |
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(di/dt)on |
Turn-on Current Slope |
VCC= 480 V, IC = 10 A |
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8 |
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A/µs |
Eon |
Turn-on Switching Losses |
Ω |
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0.6 |
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mJ |
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RG=1K , VGE = 15 V |
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SWITCHING OFF
Symbol |
Parameter |
Test Conditions |
Min. |
Typ. |
Max. |
Unit |
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tc |
Cross-over Time |
Vclamp = 480 V, IC = 10 A, |
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2.2 |
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µs |
tr(Voff) |
Off Voltage Rise Time |
RGE = 1K Ω , VGE = 15 V |
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1.2 |
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µs |
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tf |
Fall Time |
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1.2 |
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µs |
Eoff(**) |
Turn-off Switching Loss |
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5.0 |
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mJ |
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tc |
Cross-over Time |
Vclamp = 480 V, IC = 10 A, |
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3.8 |
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µs |
tr(Voff) |
Off Voltage Rise Time |
RGE = 1KΩ , VGE = 15 V |
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1.2 |
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µs |
Tj = 125 °C |
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tf |
Fall Time |
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1.9 |
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µs |
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Eoff(**) |
Turn-off Switching Loss |
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8.0 |
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mJ |
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COLLECTOR-EMITTER DIODE
Symbol |
Parameter |
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Test Conditions |
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Min. |
Typ. |
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Max. |
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Unit |
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If |
Forward Current |
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7 |
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A |
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Ifm |
Forward Current pulsed |
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56 |
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A |
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Vf |
Forward On-Voltage |
If = 3.5 A |
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1.4 |
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1.9 |
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V |
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If = 3.5 A, Tj = 125 °C |
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1.15 |
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V |
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trr |
Reverse Recovery Time |
If = 7 A ,VR = 20 V, |
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50 |
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ns |
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Qrr |
Reverse Recovery Charge |
Tj =125°C, di/dt = 100A/ μs |
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70 |
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nC |
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Irrm |
Reverse Recovery Current |
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2.7 |
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A |
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(●)Pulsed: Pulse |
duration = 300 µs, duty cycle 1.5 %. |
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(1)Pulse width limited by max. junction temperature. |
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(**)Losses Include Also the Tail |
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Switching Off Safe Operating Area |
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Thermal Impedance |
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3/8