– 2 channels of binary PWM (stereo mode)
– 2 channels of ternary PWM (stereo mode)
PowerSSO-36 with exposed pad down
2 channels of 24-bit DDX
100-dB SNR and dynamic range
Selectable 32- to 192-kHz input sample rates
2
I
C control with selectable device address
Digital gain -80 dB to +48 dB in 0.5-dB steps
Software volume update
Individual channel and master gain/attenuation
Individual channel and master software and
®
hardware mute
Independent channel volume bypass
Automatic zero-detect mute
Automatic invalid input detect mute
2-channel I
Selectable clock input ratio
Input channel mapping
Automatic volume control for limiting maximum
2
S input data Interface
power
96-kHz internal processing sample rate, 24-bit
precision
Advanced AM interference frequency
switching and noise suppression modes
Thermal-overload and short-circuit protection
embedded
Video application: 576 * f
input mode support
S
Table 1.Device summary
Order codePackagePackaging
STA333WPowerSSO-36 EPDTube
STA333W13TRPowerSSO-36 EPDTape and reel
Applications
LCD
DVD
Cradle
Digital speaker
Wireless-speaker cradle
Description
The STA333W is an integrated circuit comprising
digital audio processing, digital amplifier control
and DDX
power, single-chip DDX
amplification with high quality and high efficiency.
The STA333W power section consists of four
independent half-bridges stages. These can be
configured via digital control to operate in different
modes. 2 channels can be provided by two full
bridges, providing up to 20 W + 20 W of power.
Also provided in the STA333W are new advanced
AM radio interference reduction modes. The serial
audio data input interface accepts all possible
formats, including the popular I
channels of DDX
The STA333W is part of the Sound Terminal™
family that provides full digital audio streaming to
the speaker offering cost effectiveness, low power
dissipation and sound enrichment.
Figure 15.FFT 0 dBfs (V
Figure 16.FFT -60 dBfs (V
Figure 17.THD vs. frequency (V
Figure 18.FFT 0 dBfs (V
Figure 19.FFT -60 dBfs (V
Figure 20.THD vs. frequency (V
Figure 21.Double-layer PCB with two copper ground areas and 16 vias . . . . . . . . . . . . . . . . . . . . . . 44
0: power stage is switched off then the PLL is also
switched off (this operation take 13 million clock cycles)
1: normal operation
24PWRVDD_PLLPositive supply for PLL
25IFILTER_PLLConnection to PLL filter
26PWRGND_PLLNegative supply for PLL
27IXTIPLL input clock, 256 * f
28IBICKII2S serial clock
2
29ILRCKII
30ISDII
S left/right clock
2
S serial data channel
Reset:
31IRESET
0: reset state, power stage is switched off, all registers are
set to default value
1: normal operation
32OINT_LINEFault interrupt
33I/OSDAI
34ISCLI
2
C serial data, used as SDA_OUT
2
C serial clock
35PWRGND_DIGDigital ground
36PWRVDD_DIGDigital supply
--EP
Exposed pad for ground-plane heatsink, to be connected
to GND
, or 384 * f
S
S
Doc ID 13365 Rev 29/49
Pin descriptionSTA333W
2.3 Thermal data
Table 3.Thermal data
SymbolParameterMinTypMaxUnit
R
Th(j-case)
T
sd
T
w
T
hsd
Thermal resistance junction to case (thermal pad)-1.5 2.0°C/W
Thermal-shutdown junction temperature140150160°C
Thermal-warning temperature-130-°C
Thermal-shutdown hysteresis182022°C
10/49Doc ID 13365 Rev 2
STA333WElectrical specification
3 Electrical specification
3.1 Absolute maximum ratings
Table 4.Absolute maximum ratings
SymbolParameterMinTypMaxUnit
V
CC
V
DD
I
L
T
op
T
stg
Analog supply voltage (pins VCCx)--23V
Digital supply voltage (pins VDD_DIG)--4.0V
Logic input interface-0.3-4.0V
Operating junction temperature0-150°C
Storage temperature-40-150°C
Warning:Stresses beyond those listed in Table 4: Absolute maximum
ratings may cause permanent damage to the device. These
are stress ratings only, and functional operation of the device
at these or any other conditions beyond those indicated in
Table 5: Recommended operating conditions are not implied.
Exposure to absolute-maximum-rated conditions for
extended periods may affect device reliability. In the real
application, a power supply with nominal value rated within
the limits of the recommended operating conditions, may
experience some rising beyond the maximum operating
conditions for a short time when no or very low current is
being sinked (amplifier in mute state). In this case the
reliability of the device is guaranteed, provided that the
absolute maximum ratings are not exceeded.
3.2 Recommended operating conditions
Table 5.Recommended operating conditions
SymbolParameterMinTypMaxUnit
V
V
I
T
CC
DD
L
amb
Analog supply voltage (VCCx)4.5-20.0V
Digital supply voltage (VDD_DIG)2.73.33.6V
Logic input interface2.73.33.6V
Ambient temperature0-70°C
Doc ID 13365 Rev 211/49
Electrical specificationSTA333W
3.3 Electrical specifications - digital section
Table 6.Electrical characteristics for digital section
Symbol Parameter ConditionsMinTypMaxUnit
I
il
I
ih
V
il
V
ih
V
ol
V
oh
I
pu
R
pu
Input current, no pull-up or
pull-down resistor
Low-level input voltage---
High-level input voltage-
Low-level output voltageIol = 2 mA--
High-level output voltageIoh = 2 mA
Pull-up current-2566125µA
Equivalent pull-up
resistance
= 0 V--±10 µA
V
i
Vi = VDD = 3.6 V--±10µA
--50-kΩ
3.4 Electrical specifications - power section
The specifications in Ta bl e 7 below are given for the conditions VCC = 18 V, VDD = 3.3 V,
f
= 384 kHz, T
SW
Table 7.Electrical specifications for power section
SymbolParameterConditionsMinTypMaxUnit
= 25 °C and RL = 8 Ω, unless otherwise specified.
amb
0.8 *
--V
V
DD
0.8 *
--V
V
DD
0.2 *
V
DD
0.4 *
V
DD
V
V
PoOutput power BTL
THD = 1%-16-
THD = 10%-20-
R
l
dss
gP
gN
I
LDT
I
HDT
t
r
t
f
dsON
Power P-channel/N-channel
MOSFET (total bridge)
Power P-channel/N-channel
leakage
Power P-channel R
dsON
matching
Power N-channel R
dsON
matching
Low-current dead time
(static)
High-current dead time
(dynamic)
Rise time
Fall time
ld = 1 A-180250mΩ
V
= 18 V--10µA
CC
ld = 1 A95--%
ld = 1 A95--%
Resistive load,
refer to Figure 5
Refer to Figure 6- 1020ns
Resistive load,
refer to Figure 5
Resistive load,
refer to Figure 5
12/49Doc ID 13365 Rev 2
W
-510ns
-810ns
-810ns
STA333WElectrical specification
Table 7.Electrical specifications for power section (continued)
SymbolParameterConditionsMinTypMaxUnit
V
CC
I
VCC
Supply voltage -4.5-20V
Supply current from VCC in
power down
PWRDN = 03060200µA
PCM input signal = -60 dBfs
in
Supply current from V
operation
CC
Switching frequency =
384 kHz
- 3050mA
No LC filters
I
VDD_DIG
Supply current for DDX
processing (reference only)
Internal clock = 49.152 MHz103050mA
Supply current in standby-81125mA
I
LIM
I
SCP
V
UVP
t
min
THD+N
Overcurrent limitNon-linear output
Short-circuit protectionHigh-impedance output
Undervoltage protection
threshold
Output minimum pulse
width
Total harmonic distortion
and noise
--3.5 4.3V
No load203060ns
DXX stereo mode, Po = 1 W,
f = 1 kHz
(1)
2.23.54.3A
(2)
2.73.85.0A
-0.050.2%
DRDynamic range--100-dB
Signal to noise ratio in
ternary mode
A-weighted-100-
SNR
Signal to noise ratio in
binary mode
A-weighted-90-
DXX stereo mode, < 5 kHz,
PSRRPower supply rejection ratio
V
RIPPLE
= 1 V RMS
-80-dB
audio input = dither only
DXX stereo mode, < 5 kHz,
X
TA L K
Crosstalk
One channel driven at 1 W
-80-dB
the other channel measured
η
1. The I
The current limit is active when OCRB = 0 (see Table 23: Overcurrent warning detect adjustment bypass
on page 28. When OCRB = 1 then I
2. The I
configuration. The short-circuit current is applicable when OCRB = 1 (see Table 23: Overcurrent warning
detect adjustment bypass on page 28.
Peak efficiency
in DXX mode
data is for 1 channel of BTL configuration, thus, 2 * I
LIM
current limit data is for 1 channel of BTL configuration, thus, 2 * I
SCP
Po = 2 x 20 W into 8 Ω-90-%
drives the 2-channel BTL configuration.
LIM
applies.
SC
drives the 2-channel BTL
SCP
dB
Doc ID 13365 Rev 213/49
Electrical specificationSTA333W
3.5 Power-on/off sequences
The power-on/off sequences shown in Figure 3 and Figure 4 below ensure a pop-free turn
on and turn off.
Figure 3.Power-on sequence
No specific VCC and VDD_DIG turn-on sequence is required
VCC
VCC
VCC
Don’t care
Don’t care
VDD_Dig
VDD_Dig
VDD_DIG
XTI
XTI
XTI
Reset
Reset
RESET
PWRDN
PWRDN
PWRDN
Bit EAPD
Soft EAPD
Soft EAPD
Register 0x05
Reg. 0x05
Reg. 0x05Bit 7 = 1
Bit 7 = 1
Don’t care
Don’t care
Don’t care
Don’t care
TR
TR
TC
TC
TR = mimimum time between XTI master clock stable and reset removal: 1 ms
TC = minimum time between reset removal and I
Clock stable means: fmax - fmin < 1 MHz
Figure 4.Power-off sequence
No specific VCC and VDD_DIG turn-off sequence is required
VCC
VCC
VCC
VDD_DIG
VDD_Dig
VDD_Dig
XTI
XTI
XTI
Mute
Soft Mute
Soft Mute
Register 0x07
Reg. 0x07
Reg. 0x07Data 0xFE
Data 0xFE
Bit EAPD
Soft EAPD
Soft EAPD
Register 0x05
Reg. 0x05
Reg. 0x05Bit7 = 0
Bit7 = 0
Don’t care
Don’t care
2
C program sequence start: 1 ms
FE
FE
Don’t care
Don’t care
Don’t care
Don’t care
Don’t care
Don’t care
Don’t care
Don’t care
14/49Doc ID 13365 Rev 2
STA333WElectrical specification
3.6 Testing
Figure 5.Test circuit
OUTxY
Vcc
(3/4)Vcc
Low current dead time = MAX(DTr,DTf)
(1/2)Vcc
(1/4)Vcc
+Vcc
t
Duty cycle = 50%
INxY
M58
M57
gnd
OUTxY
R 8Ω
DTfDTr
+
V67 =
-
vdc = Vcc/2
D03AU1458
Figure 6.Current dead-time test circuit
High Current Dead time for Bridge application = ABS(DTout(A)-DTin(A))+ABS(DTOUT(B)-DTin(B))
+V
CC
Duty cycle=ADuty cycle=B
M58
DTin(A)
INA
M57
Q1
OUTA
Iout=4A
Lout = 1.5 A
Q3
DTout(A)
C69
470nF
Rload=8Ω
C71 470nF
M64
OUTB
Q2
M63
Q4
DTout(B)DTin(B)
L68 22µL67 22µ
Iout=4A
Lout = 1.5 A
C70
470nF
INB
Duty cycle A and B: Fixed to have DC output current of 4A in the direction shown in figure
Doc ID 13365 Rev 215/49
D03AU1517
Functional descriptionSTA333W
4 Functional description
4.1 Functional pins
4.1.1 Power-down function
Pin PWRDN (23) is used to power down the STA333W.
PWRDN = 0 (0 V): power-down state.
PWRND = 1 (V
During the power-down sequence the output begins to mute. After the mute condition is
reached the power stage is switched off and the output becomes high impedance. Then the
master clock to all internal hardware blocks is gated off. The PLL is also switched off. The
complete power-down sequence takes 13 million cycles.
): normal operation.
DD
4.1.2 Reset function
Pin RESET (31) is used to reset the STA333W.
RESET = 0 (0 V): reset state.
RESET = 1 (V
When pin RESET is forced to 0 the power stage is switched off (with high-impedance
output) and the master clock to all internal hardware blocks is gated off.
Note:Reset has a higher priority than power down.
): normal operation.
DD
16/49Doc ID 13365 Rev 2
STA333WFunctional description
4.2 Serial audio interface description
4.2.1 Serial audio interface protocols
The STA333W serial audio input was designed to interface with standard digital audio
components and to accept serial data formats. The STA333W always acts as a slave when
receiving audio input from standard digital audio components. Serial data for two channels
is provided using 3 input pins: left/right clock LRCKI (pin 29), serial clock BICKI (pin 28), and
serial data SDI (pin 30).
The available formats are showed in Tab l e 7 and Ta bl e 8 , and set through register CONFB
on page 24.
Figure 7.I
LRCLKI
BICKI
SDI
2
S
21
3
1
2
3
Figure 8.Left justified
LRCLKI
n
n
n
n
n
-1
-1
21
3
n
-1
BICKI
SDI
1
n
1
2
3
n
-1
2
3
n
n
-1
Doc ID 13365 Rev 217/49
I2C bus specificationSTA333W
5 I2C bus specification
The STA333W supports the I2C protocol via the input ports SCL and SDA. This protocol
defines any device that sends data on to the bus as a transmitter and any device that reads
the data as a receiver. The device that controls the data transfer is known as the master and
the other as the slave. The master always starts the transfer and provides the serial clock for
synchronization. The STA333W is always a slave device in all of its communications. It
supports up to 400 kb/s (fast-mode bit rate).
5.1 Communication protocol
5.1.1 Data transition or change
Data changes on the SDA line must only occur when the SCL clock is low. SDA transition
while the clock is high is used to identify a START or STOP condition.
5.1.2 Start condition
START is identified by a high to low transition of the data bus SDA signal while the clock
signal SCL is stable in the high state. A START condition must precede any command for
data transfer.
5.1.3 Stop condition
STOP is identified by low to high transition of the data bus SDA signal while the clock signal
SCL is stable in the high state. A STOP condition terminates communication between
STA333W and the bus master.
5.1.4 Data input
During the data input the STA333W samples the SDA signal on the rising edge of clock
SCL. For correct device operation the SDA signal must be stable during the rising edge of
the clock and the data can change only when the SCL line is low.
5.2 Device addressing
To start communication between the master and the STA333W, the master must initiate a
start condition. Following this, the master sends onto the SDA line 8 bits (MSB first)
corresponding to the device-select address and read or write mode.
The 7 most significant bits are the device address identifiers, corresponding to the I
definition. In the STA333W the I
port configuration, 0x38 when SA = 0, and 0x3A when SA = 1.
The 8th bit (LSB) identifies read or write operation RW, this bit is set to 1 for read mode and
0 for write mode. After a START condition the STA333W identifies the device address on the
SDA bus and if a match is found, acknowledges the identification during the 9th bit time. The
byte following the device identification byte is the internal space address.
2
C interface has two device addresses depending on the SA
2
C bus
18/49Doc ID 13365 Rev 2
STA333WI2C bus specification
5.3 Write operation
Following the START condition the master sends a device select code with the RW bit set
to 0. The STA333W acknowledges this and then waits for the byte of internal address. After
receiving the internal byte address the STA333W again responds with an
acknowledgement.
5.3.1 Byte write
In the byte write mode the master sends one data byte, this is acknowledged by the
STA333W. The master then terminates the transfer by generating a STOP condition.
5.3.2 Multi-byte write
The multi-byte write modes can start from any internal address. The master generating a
STOP condition terminates the transfer.
Figure 9.Write-mode sequence
BYTE
WRITE
MULTIBYTE
WRITE
DEV-ADDR
START
DEV-ADDR
START
ACK
SUB-ADD R
RW
ACK
SUB-ADD R
RW
5.4 Read operation
5.4.1 Current address byte read
Following the START condition the master sends a device select code with the RW bit set
to 1. The STA333W acknowledges this and then responds by sending one byte of data. The
master then terminates the transfer by generating a STOP condition.
5.4.2 Current address multi-byte read
The multi-byte read modes can start from any internal address. Sequential data bytes are
read from sequential addresses within the STA333W. The master acknowledges each data
byte read and then generates a STOP condition terminating the transfer.
5.4.3 Random address byte read
ACK
ACK
DATA IN
DATA IN
ACK
ACK
STOP
ACK
DATA IN
STOP
Following the START condition the master sends a device select code with the RW bit set
to 0. The STA333W acknowledges this and then the master writes the internal address byte.
After receiving, the internal byte address the STA333W again responds with an
acknowledgement. The master then initiates another START condition and sends the device
select code with the RW bit set to 1. The STA333W acknowledges this and then responds
by sending one byte of data. The master then terminates the transfer by generating a STOP
condition.
Doc ID 13365 Rev 219/49
I2C bus specificationSTA333W
5.4.4 Random address multi-byte read
The multi-byte read modes could start from any internal address. Sequential data bytes are
read from sequential addresses within the STA333W. The master acknowledges each data
byte read and then generates a STOP condition to terminate the transfer.
The STA333W supports sample rates of 32 kHz, 44.1 kHz, 48 KHz, 88.2 kHz, 96 kHz,
176.4 kHz, and 192 kHz. Therefore the internal clock is:
z32.768 MHz for 32 kHz
z45.1584 MHz for 44.1 kHz, 88.2 kHz, and 176.4 kHz
z49.152 MHz for 48 kHz, 96 kHz, and 192 kHz
Master clock select: Selects the ratio between the
2
input I
S sample frequency and the input clock.
The external clock frequency provided to the XTI pin must be a multiple of the input sample
frequency (f
).
S
The relationship between the input clock and the input sample rate is determined by both
the MCSx and the IR (input rate) register bits. The MCSx bits determine the PLL factor
generating the internal clock and the IR bit determines the oversampling ratio used
internally.
Table 10.MCS bits
Input sample rate
fS (kHz)
32, 44.1, 4800576 * f
IR
101100011010001000
128 * f
S
88.2, 9601NA64 * f
176.4, 1921XNA32 * f
S
S
S
MCS[2:0]
256 * fS384 * fS512 * fS768 * f
128 * fS192 * fS256 * fS384 * f
64 * f
96 * fS128 * fS192 * f
S
S
S
S
22/49Doc ID 13365 Rev 2
STA333WRegister description
Interpolation ratio select
Table 11.Interpolation ratio select
BitR/WRSTNameDescription
4:3R/W00IR [1:0]
Interpolation ratio select: Selects internal
interpolation ratio based on input I
2
S sample
frequency.
The STA333W has variable interpolation (oversampling) settings such that internal
processing and DDX output rates remain consistent. The first processing block interpolates
by either 2 times or 1 time (pass-through) or provides a 2-times downsample. The
oversampling ratio of this interpolation is determined by the IR bits.
Table 12.IR bit settings as a function of input sample rate
Input sample rate fS (kHz)IR1st stage interpolation ratio
If the thermal warning adjustment is enabled (TWAB = 0), then the thermal warning
recovery determines if the -3 dB output limit is removed when thermal warning is negative.
If TWRB = 0 and TWAB = 0, then when a thermal warning disappears the -3 dB output limit
is removed and the gain is added back to the system. If TWRB = 1 and TWAB = 0, then
when a thermal warning disappears the -3 dB output limit remains until TWRB is changed to
zero or the device is reset.
The on-chip STA333W power output block provides feedback to the digital controller using
inputs to the power control block. The TWARN input is used to indicate a thermal warning
condition. When TWARN is asserted (set to 0) for a period of time greater than 400 ms, the
power control block will force a -3dB output limit (determined by TWOCL in coefficient RAM)
to the modulation limit in an attempt to eliminate the thermal warning condition. Once the
thermal warning output limit adjustment is applied, it remains in this state until reset, unless
FDRB = 0.
Fault detect recovery bypass
Table 15.Fault detect recovery
BitR/WRSTNameDescription
7R/W0FDRB
The on-chip STA333W power output block provides feedback to the digital controller using
inputs to the power control block. The FAULT input is used to indicate a fault condition (either
overcurrent or thermal). When FAULT is asserted (set to 0), the power control block attempts
a recovery from the fault by asserting the 3-state output (setting it to 0 which directs the
power output block to begin recovery), holding it at 0 for period of time in the range of 0.1 ms
to 1 second as defined by the fault detect recovery constant register (FDRC registers 0x2B,
0x2C), then toggling it back to 1. This sequence is repeated as log as the fault indication
exists. This feature is enabled by default but can be bypassed by setting the FDRB control
bit to 1.
Determines the interface format of the input serial
digital audio interface.
3R/W0SAI3
Serial data interface
The STA333W audio serial input interfaces with standard digital audio components and
accepts a number of serial data formats. STA333W always acts a slave when receiving
audio input from standard digital audio components. Serial data for two channels is provided
using three inputs: left/right clock LRCKI, serial clock BICKI, and serial data SDI.
Bits SAI and bit SAIFB are used to specify the serial data format. The default serial data
format is I
2
S, MSB first. Available formats are shown in the tables and figure that follow.
Serial data first bit
Table 17.Serial data first bit
SAIFBFormat
0MSB-first
1LSB-first
Table 18.Support serial audio input formats for MSB first (SAIFB = 0)
BICKISAI [3:0]SAIFBInterface format
32 * f
48* f
S
S
00000I2S 15-bit data
00010Left/right justified 16-bit data
00000I2S 16- to 23-bit data
00010Left justified 16- to 24-bit data
00100Right justified 24-bit data
01100Right justified 20-bit data
10100Right justified 18-bit data
11100Right justified 16-bit data
Doc ID 13365 Rev 225/49
Register descriptionSTA333W
Table 18.Support serial audio input formats for MSB first (SAIFB = 0) (continued)
00000I2S 16- to 24-bit data
00010Left justified 16- to 24-bit data
64* f
S
Table 19.Supported serial audio input formats for LSB-First (SAIFB = 1)
BICKISAI[3:0]SAIFBInterface format
00100Right justified 24-bit data
01100Right justified 20-bit data
10100Right justified 18-bit data
11100Right justified 16-bit data
32* f
48* f
48* f
11001I2S 15-bit data
S
11101Left/right justified 16-bit data
01001I2S 23-bit data
01001I
10001I
11001LSB first I
S
00011Left justified 24-bit data
2
S 20-bit data
2
S 18-bit data
2
S 16-bit data
01011Left justified 20-bit data
10011Left justified 18-bit data
11011Left justified 16-bit data
00101Right justified 24-bit data
01101Right justified 20-bit data
S
10101Right justified 18-bit data
11101Right justified 16-bit data
00001I2S 24-bit data
01001I
10001I
11001LSB First I
2
S 20-bit data
2
S 18-bit data
2
S 16-bit data
00011Left justified 24-bit data
01011Left justified 20-bit data
64* f
S
10011Left justified 18-bit data
11011Left justified 16-bit data
00101Right justified 24-bit data
01101Right justified 20-bit data
10101Right justified 18-bit data
11101Right justified 16-bit data
26/49Doc ID 13365 Rev 2
STA333WRegister description
Channel input mapping
Table 20.Channel input mapping
BitR/WRSTNameDescription
2
6R/W0C1IM
7R/W0C2IM
0: processing channel 1 receives left I
1: processing channel 1 receives right I2S input
0: processing channel 2 receives left I
1: processing channel 2 receives right I2S input
S input
2
S input
Each channel received via I2S can be mapped to any internal processing channel via the
channel input mapping registers. This allows for flexibility in processing. The default settings
of these registers map each I
2
S input channel to its corresponding processing channel.
6.1.3 Configuration register C (addr 0x02)
D7D6D5D4D3D2D1D0
OCRBReservedCSZ3CSZ2CSZ1CSZ0OM1OM0
10010111
DDX power output mode
Table 21.DDX power output mode
BitR/WRSTNameDescription
0R/W1OM0The DDX power output mode selects the configuration
The status bit OCWARN is used to warn of an overcurrent condition. When OCWARN is
asserted (set to 0), the power control block forces an adjustment to the modulation limit
(default -3dB) in an attempt to eliminate the overcurrent warning condition. Once the
overcurrent warning volume adjustment is applied, it remains applied until the device is
reset. The overcurrent limit can be changed via register OLIM (Output limit register (addr
0x34) on page 38).
6.1.4 Configuration register D (addr 0x03)
D7D6D5D4D3D2D1D0
ReservedZDEReserved
01000000
Zero-detect mute enable
Table 24.Zero detect mute enable
BitR/WRSTNameDescription
6R/W1ZDE1: enable the automatic zero-detect mute
Setting the ZDE bit enables the zero-detect automatic mute. The zero-detect circuit looks at
the data for each processing channel at the output of the crossover (bass management)
filter. If any channel receives 2048 consecutive zero value samples (regardless of f
) then
S
that individual channel is muted if this function is enabled.
6.1.5 Configuration register E (addr 0x04)
D7D6D5D4D3D2D1D0
SVEZCEDCCVPWMSAMENSBWMPCMPCV
11000010
Max power correction variable
Table 25.Max power correction variable
BitR/WRSTNameDescription
0R/W0MPCV
0: use standard MPC coefficient
1: use MPCC bits for MPC coefficient
28/49Doc ID 13365 Rev 2
STA333WRegister description
Max power correction
Table 26.Max power correction
BitR/WRSTNameDescription
1R/W1MPC
1: enable power bridge correction for THD reduction
near maximum power output.
Setting the MPC bit turns on special processing that corrects the STA333W power device at
high power. This mode lowers the THD+N of a full DDX system at maximum power output
and slightly below. If enabled, MPC is operational in all output modes except tapered
(OM[1:0] = 01) and binary. When OCFG = 00, MPC does not affect channels 3 and 4, the
line-out channels.
Noise-shaper bandwidth selection
Table 27.Noise-shaper bandwidth selection
BitR/WRSTNameDescription
rd
1: 3
2R/W0NSBW
order NS
0: 4th order NS
AM mode enable
Table 28.AM mode enable
BitR/WRSTNameDescription
3R/W0AME
0: normal DDX operation
1: AM reduction mode DDX operation
The STA333W features a DDX processing mode that minimizes the amount of noise
generated in frequency range of AM radio. This mode is intended for use when DDX is
operating in a device with an AM tuner active. The SNR of the DDX processing is reduced to
approximately 83 dB in this mode, which is still greater than the SNR of AM radio.
PWM speed mode
Table 29.PWM speed mode
BitR/WRSTNameDescription
4R/W0PWMS
0: normal speed (384 kHz) all channels
1: odd speed (341.3 kHz) all channels
Distortion compensation variable enable
Table 30.Distortion compensation variable enable
BitR/WRSTNameDescription
5R/W0DCCV
Doc ID 13365 Rev 229/49
0: uses preset DC coefficient.
1: uses DCC coefficient.
Register descriptionSTA333W
Zero-crossing volume enable
Table 31.Zero-crossing volume enable
BitR/WRSTNameDescription
1: volume adjustments will only occur at digital
6R/W1ZCE
zero-crossings
0: volume adjustments will occur immediately
The ZCE bit enables zero-crossing volume adjustments. When volume is adjusted on digital
zero-crossings no clicks will be audible.
Soft volume update enable
Table 32.Zero-crossing volume enable
BitR/WRSTNameDescription
1: volume adjustments ramp according to SVR
7R/W1SVE
settings
0: volume adjustments will occur immediately
6.1.6 Configuration register F (addr 0x05)
D7D6D5D4D3D2D1D0
EAPDPWDNECLELDTEBCLEIDEReserved
0101110 0
Invalid Input detect mute enable
Table 33.Invalid input detect mute enable
BitR/WRSTNameDescription
2R/W1IDE1: enables the automatic invalid input detect mute
Setting the IDE bit enables this function, which looks at the input I2S data and will
automatically mute if the signals are perceived as invalid.
Binary output mode clock loss detection
Table 34.Binary output mode clock loss detection
BitR/WRSTNameDescription
3R/W1BCLEBinary output mode clock loss detection enable
Detects loss of input MCLK in binary mode and outputs 50% of the duty cycle.
30/49Doc ID 13365 Rev 2
STA333WRegister description
LRCK double trigger protection
Table 35.LRCK double trigger protection
BitR/WRSTNameDescription
4R/W1LDTELRCLK double trigger protection enable
Actively prevents double trigger of LRCLK.
Auto EAPD on clock loss
Table 36.Auto EAPD on clock loss
BitR/WRSTNameDescription
5R/W0ECLEAuto EAPD on clock loss
When active will issue a power device power-down signal (EAPD) on clock loss detection.
IC power down
Table 37.Power down
BitR/WRSTNameDescription
6R/W1PWDN
0: power down, low-power condition
1: normal operation
The PWDN register is used to put the IC in a low-power state. When PWDN is 0, the output
begins a soft-mute. After the mute condition is reached, EAPD is asserted to power down
the power stage, then the master clock to all internal hardware except the I
2
C block is gated.
This puts the IC in a very low power consumption state.
External amplifier power down
Table 38.External amplifier power down
BitR/WRSTNameDescription
7R/W1EAPD
The EAPD register directly disables/enables the internal power circuitry.
When EAPD = 0, the internal power section is placed in a low-power state (disabled).
0: external power stage power down active
1: normal operation
0: normal operation
1: all channels are in mute condition
Channel mute
Table 40.Channel mute
BitR/WRSTNameDescription
Channel 1 mute:
1R/W0C1M
2R/W0C2M
0: not muted, it is possible to set the channel volume
1: hardware muted
Channel 2 mute:
0: not muted, it is possible to set the channel volume
1: hardware muted
32/49Doc ID 13365 Rev 2
STA333WRegister description
6.2.2 Master volume register (addr 0x07)
D7D6D5D4D3D2D1D0
MV7MV6MV5MV4MV3MV2MV1MV0
11111111
6.2.3 Channel volume (addr 0x08, 0x09)
D7D6D5D4D3D2D1D0
C1V7C1V6C1V5C1V4C1V3C1V2C1V1C1V0
01100000
D7D6D5D4D3D2D1D0
C2V7C2V6C2V5C2V4C2V3C2V2C2V1C2V0
01100000
Volume setting
The volume structure of the STA333W consists of individual volume registers for each
channel and a master volume register that provides an offset to each channels volume
setting. The individual channel volumes are adjustable in 0.5-dB steps from +48 dB to
-80 dB. As an example if C3V = 0x00 or +48 dB and MV = 0x18 or -12 dB, then the total gain
for channel 3 = +36 dB.
The master mute when set to 1 will mute all channels at once, whereas the individual
channel mutes (CxM) mute only that channel. Both the master mute and the channel mutes
provide a “soft mute” with the volume ramping down to mute in 4096 samples from the
maximum volume setting at the internal processing rate (about 96 kHz). A hard mute can be
obtained by commanding a value of all 1’s (255) to any channel volume register or the
master volume register. When volume offsets are provided via the master volume register
any channel that whose total volume is less than -80 dB is muted.
All changes in volume take place at zero-crossings when ZCE = 1 (configuration register F)
on a per channel basis as this creates the smoothest possible volume transitions. When
ZCE = 0, volume updates will occur immediately.
Table 41.Master volume offset as a function of MV
MV[7:0]Volume offset from channel value
00000000 (0x00)0 dB
00000001 (0x01)-0.5 dB
00000010 (0x02)-1 dB
……
01001100 (0x4C)-38 dB
……
11111110 (0xFE)-127.5 dB
11111111 (0xFF)Hard master mute
Doc ID 13365 Rev 233/49
Register descriptionSTA333W
Table 42.Channel volume as a function of CxV
CxV[7:0]Volume
00000000 (0x00)+48 dB
00000001 (0x01)+47.5 dB
00000010 (0x02)+47 dB
……
01011111 (0x5F)+0.5 dB
01100000 (0x60)0 dB
01100001 (0x61)-0.5 dB
……
11010111 (0xD7)-59.5 dB
11011000 (0xD8)-60 dB
11011001 (0xD9)-61 dB
11011010 (0xDA)-62 dB
……
11101100 (0xEC)-80 dB
11101101 (0xED)Hard channel mute
……
11111111 (0xFF)Hard channel mute
6.3 Automodes™ register (0x0C)
D7D6D5D4D3D2D1D0
ReservedAMAM2AMAM1AMAM0AMAME
00000000
AM interference frequency switching
Table 43.AM interference frequency switching
BitR/WRSTNameDescription
0R/W0AMAME
AMAM bits
Table 44.Automodes™ AM switching frequency selection
AMAM[2:0]48 kHz / 96 kHz input f
0000.535 MHz - 0.720 MHz0.535 MHz - 0.670 MHz
0: switching frequency determined by PWMS setting
1: switching frequency determined by AMAM setting
S
44.1 kHz / 88.2 kHz input f
S
0010.721 MHz - 0.900 MHz0.671 MHz - 0.800 MHz
34/49Doc ID 13365 Rev 2
STA333WRegister description
Table 44.Automodes™ AM switching frequency selection
Each channel contains an individual channel volume bypass. If a particular channel has
volume bypassed via the CxVBP = 1 register then only the channel volume setting for that
particular channel affects the volume setting, the master volume setting will not affect that
channel.
6.5 Variable max power correction registers (addr 0x27, 0x28)
MPCC bits determine the 16 MSBs of the MPC compensation coefficient. This coefficient is
used in place of the default coefficient when MPCV = 1.
FDRC bits specify the 16-bit fault detect recovery time delay. When status register bit FAULT
is asserted, the tristate output is immediately asserted low and held low for the time period
specified by this constant. A value of 0x0001 in this register is approximately 0.083 ms. The
default value of 0x000C gives approximately 0.1 ms.
Note:0x0000 is a reserved value for this register pair. This value must not be used.
6.8 Device status register (addr 0x2D)
D7D6D5D4D3D2D1D0
PLLULFAULTUVFAULTReservedOCFAULTOCWARNTFAULTTWARN
This read-only register provides the fault, warning and PLL status from the power control
block.
Table 45.Status bits description
BitR/WRSTNameDescription
Thermal warning:
0RO- TWARN
1RO- TFAULT
0: junction temperature is close to the fault condition
1: normal operation
Thermal fault:
0: junction temperature limit detection
1: normal operation
36/49Doc ID 13365 Rev 2
STA333WRegister description
Table 45.Status bits description (continued)
BitR/WRSTNameDescription
Overcurrent warning:
2RO- OCWARN
3RO- OCFAULT
4---Reserved
5RO-UVFAULT
6RO- FAULT
7RO-PLLUL
0: warning
1: normal operation
Overcurrent fault:
0: fault detected
1: normal operation
Undervoltage warning:
0: VCCx below lower voltage threshold
The STA333W provides one additional multiplication after the last interpolation stage and
the distortion compensation on each channel, which can be used to limit the maximum
modulation index and therefore the peak current through the power device. The register
values represent an 8-bit signed fractional number. This number is extended to a 24-bit
number, by adding zeros to the right, and then directly multiplied by the data on that
channel. An independent postscale is provided for each channel but all channels can use
channel 1 postscale factor by setting the postscale link bit. By default, all postscale factors
are set to 0x7F (pass-through).
Doc ID 13365 Rev 237/49
Register descriptionSTA333W
6.11 Output limit register (addr 0x34)
6.11.1 Thermal and overcurrent warning output limit register
D7D6D5D4D3D2D1D0
OLIM7OLIM6OLIM5OLIM4OLIM3OLIM2OLIM1OLIM0
01011010
The STA333W provides a simple mechanism for reacting to a thermal or overcurrent
warning in the power device. When the TWARN or OCWARN status bit is asserted, the
output is limited to the OLIM setting. The limit can be adjusted by modifying the thermal
warning/overcurrent output limit value. As for the normal postscale, the register value
represents an 8-bit signed fractional number. This number is extended to a 24-bit number,
by adding zeros to the right, and then directly multiplied by the data on both channels. The
scaling value range is from 0x80 = -1 to 0x7F = 0.992. To avoid phase changes in the output
signal only the positive range is used (0x00 to 0x7F). The default setting of 0x5A provides a
-3-dB limit.
If the cause of the limiting is a thermal warning, the output limiting is removed when the
thermal warning situation disappears. If the cause of the limiting is an overcurrent warning,
output limiting remains in effect until the device is reset.
Table 46.Output limit values for thermal and overcurrent warnings
OLIM[7:0]Attenuation (dB)
0x7F0.06
0x7E0.13
........
0x5A3.0
........
0x406.0
........
0x2810
........
0x0142
0x00Inf
38/49Doc ID 13365 Rev 2
STA333WApplications information
7 Applications information
7.1 Applications scheme for power supplies
Figure 11 below shows a typical applications scheme for STA333W.
Special care has to be taken with regard to the power supplies when laying out the PCB. In
particular the 3.3-Ω resistors on the digital supplies (VDD_DIG) have to be placed as close
as possible to the device. This prevents unwanted oscillation on the digital parts of the
device due to the inductive effects of the PCB tracks. The same rule also applies to all the
decoulpling capacitors; they should be placed as close as possible to the device in order to
limit the effect of spikes on the supplies.
Figure 11. Applications diagram
3R3
3R3
+
+
+
1000uF 35V
1000uF 35V
1000uF 35V
1uF 35V
1uF 35V
1uF 35V
100nF
100nF
100nF
100nF
100nF
100nF
1uF 35V
1uF 35V
1uF 35V
VCC
VCC
VCC
100nF
100nF
100nF
100nF
100nF
100nF
OUT2B
OUT2B
OUT2B
OUT2B
OUT2B
OUT2B
OUT2A
OUT2A
OUT2A
OUT2A
OUT2A
OUT2A
OUT1B
OUT1B
OUT1B
OUT1A
OUT1A
OUT1A
100nF
100nF
100nF
1
1
1
GND_SUB
GND_SUB
GND_SUB
2
2
2
SA
SA
SA
3
3
3
TEST_MODE
TEST_MODE
TEST_MODE
4
4
4
VSS
VSS
VSS
5
5
5
VCC_REG
VCC_REG
VCC_REG
6
6
6
OUT2B
OUT2B
OUT2B
7
7
7
GND2
GND2
GND2
8
8
8
VCC2
VCC2
VCC2
9
9
9
OUT2A
OUT2A
OUT2A
10
10
10
OUT1B
OUT1B
OUT1B
11
11
11
VCC1
VCC1
VCC1
12
12
12
GND1
GND1
GND1
13
13
13
OUT1A
OUT1A
OUT1A
14
14
14
GND_REG
GND_REG
GND_REG
15
15
15
VDD
VDD
VDD
16
16
16
CONFIG
CONFIG
CONFIG
17
17
17
NC
NC
NC
18
18
18
NC
NC
NC
VDD_DIG
VDD_DIG
VDD_DIG
GND_DIG
GND_DIG
GND_DIG
SCL
SCL
SCL
SDA
SDA
SDA
INT_LINE
INT_LINE
INT_LINE
RESET
RESET
RESET
SDI
SDI
SDI
LRCKI
LRCKI
LRCKI
BICKI
BICKI
BICKI
XTI
XTI
XTI
PLL_GND
PLL_GND
PLL_GND
FILTER_PLL
FILTER_PLL
FILTER_PLL
VDD_PLL
VDD_PLL
VDD_PLL
PWRDN
PWRDN
PWRDN
GND_DIG
GND_DIG
GND_DIG
VDD_DIG
VDD_DIG
VDD_DIG
NC
NC
NC
NC
NC
NC
3R3
3R3
3R3
3R3
SCL
SCL
SCL
SCL
SCL
SCL
SDA
SDA
SDA
SDA
SDA
SDA
INTL
INTL
INTL
DATA
DATA
DATA
DATA
DATA
DATA
LRCKI
LRCKI
LRCKI
LRCKI
LRCKI
LRCKI
BICKI
BICKI
BICKI
BICKI
BICKI
BICKI
XTI
XTI
XTI
XTI
XTI
XTI
PLL_FILT
PLL_FILT
PLL_FILT
PLL_FILT
PLL_FILT
PLL_FILT
100nF
100nF
100nF
GND_DIG
GND_DIG
GND_DIG
PWDN
PWDN
PWDN
PWDN
PWDN
PWDN
100nF
100nF
100nF
100nF
100nF
100nF
100nF
100nF
100nF
BEADBEAD
BEADBEAD
BEADBEAD
3V3
3V3
3V3
10K
10K
10K
1nF
1nF
1nF
1nF
1nF
1nF
GND_DIG
GND_DIG
GND_DIG
36
36
36
35
35
35
34
34
34
33
33
33
32
32
32
31
31
31
30
30
30
29
29
29
28
28
28
27
27
27
26
26
26
25
25
25
24
24
24
23
23
23
22
22
22
21
21
21
20
20
20
19
19
19
PLL_GND
PLL_GND
PLL_GND
GND_DIG
GND_DIG
GND_DIG
BEAD
BEAD
BEAD
3V3
3V3
3V3
RESET
RESET
RESET
RESET
RESET
RESET
3V3
3V3
3V3
3V3
3V3
3V3
3V3
3V3
3V3
RESET
RESET
RESET
RESET
RESET
RESET
GND_DIG
GND_DIG
GND_DIG
7.2 PLL filter
It is recommended to use the circuit in Figure 12 below for the PLL loop filter to achieve the
best performance from the device in general applications. Note that the ground of this filter
has to be connected to the ground of the PLL without any resistive path.
For the component values, it should be remembered that the greater the filter bandwidth, the
shorter the lock time but the higher the PLL output jitter.
Doc ID 13365 Rev 239/49
Applications informationSTA333W
Figure 12. PLL filter circuit
FILTER_PLL
FILTER_PLL
FILTER_PLL
FILTER_PLL
2K2
2K2
2K2
2K2
680pF
680pF
680pF
680pF
100pF
100pF
100pF
100pF
PLL_GNDGND_DIG
PLL_GNDGND_DIG
BEAD
BEADBEAD
4.7nF
4.7nF
4.7nF
4.7nF
7.3 Typical output configuration
Figure 13 below shows a typical output configuration used for BTL stereo mode.
Figure 13. Output configuration for stereo BTL mode
22uH
22uH
OUT1A
OUT1A
OUT1A
22uH
100nF
100nF
100nF
OUT1B
OUT1B
OUT1B
OUT2A
OUT2A
OUT2A
OUT2B
OUT2B
OUT2B
22
22
22
330pF
330pF
330pF
22
22
22
330pF
330pF
330pF
22uH
22uH
22uH
22uH
22uH
22uH
22uH
22uH
22uH
6.2
6.2
6.2
6.2
6.2
6.2
6.2
6.2
6.2
6.2
6.2
6.2
100nF
100nF
100nF
100nF
100nF
100nF
100nF
100nF
100nF
100nF
100nF
100nF
100nF
100nF
100nF
100nF
100nF
100nF
100nF
100nF
100nF
470nF
470nF
470nF
470nF
470nF
470nF
LEFT
LEFT
LEFT
RIGHT
RIGHT
RIGHT
40/49Doc ID 13365 Rev 2
STA333WCharacterization data
8 Characterization data
The following characterizations were made with RL = 8 Ω and f = 1 kHz unless otherwise
stated.
Figure 14. Output power vs. supply voltage (THD = 1%)
30
30
25
25
20
20
15
15
10
10
Output power, W
5
5
0
0
5791113151719
5791113151719
Figure 15. FFT 0 dBfs (V
+10
+10
+0
+0
-10
-10
-20
-20
-30
-30
-40
-40
-50
-50
-60
-60
d
d
B
B
-70
-70
r
r
-80
-80
A
A
-90
-90
-100
-100
-110
-110
-120
-120
-130
-130
-140
-140
-150
-150
2020k5010 02005001k2 k5k10k
2020k5010 02005001k2 k5k10k
= 12 V)
CC
4 Ω
Supply voltage, V
Hz
Hz
RKP
6 Ω
RKP
8 Ω
RKP
16 Ω
RKP
Doc ID 13365 Rev 241/49
Characterization dataSTA333W
Figure 16. FFT -60 dBfs (VCC = 12 V)
+10
+10
+0
+0
-10
-10
-20
-20
-30
-30
-40
-40
-50
-50
-60
-60
d
d
B
B
-70
-70
r
r
-80
-80
A
A
-90
-90
-100
-100
-110
-110
-120
-120
-130
-130
-140
-140
-150
-150
2020k501002005001k2k5k10k
2020k501002005001k2k5k10k
Hz
Hz
Figure 17. THD vs. frequency (V
1
0.5
0.2
0.1
%
0.05
0.02
0.01
2020k501002005001k2k5k10k
= 12 V, Po = 1 W)
CC
6 Ω
6ohm
Hz
8 Ω
8ohm
4ohm
4 Ω
42/49Doc ID 13365 Rev 2
STA333WCharacterization data
Figure 18. FFT 0 dBfs (VCC = 18 V)
+10
+10
+0
+0
-10
-10
-20
-20
-30
-30
-40
-40
-50
-50
-60
-60
d
d
B
B
-70
-70
r
r
-80
-80
A
A
-90
-90
-100
-100
-110
-110
-120
-120
-130
-130
-140
-140
-150
-150
2020k501002005001k2k5k10k
2020k501002005001k2k5k10k
Hz
Hz
Figure 19. FFT -60 dBfs (V
+10
+10
+0
+0
-10
-10
-20
-20
-30
-30
-40
-40
-50
-50
-60
-60
d
d
B
B
-70
-70
r
r
-80
-80
A
A
-90
-90
-100
-100
-110
-110
-120
-120
-130
-130
-140
-140
-150
-150
2020k501002005001k2k5k10k
2020k501002005001k2k5k10k
= 18 V)
CC
Figure 20. THD vs. frequency (V
1
1
0.5
0.5
0.2
0.2
Hz
Hz
= 18 V, Po = 1 W)
CC
6 Ω
4ohm6ohm
4ohm6ohm
4 Ω
0.1
0.1
%
%
0.05
0.05
8ohm
8ohm
0.02
0.02
0.01
0.01
2020k501002005001k2k5k10k
2020k501002005001k2k5k10k
Hz
Hz
8 Ω
Doc ID 13365 Rev 243/49
Package thermal characteristicsSTA333W
9 Package thermal characteristics
A thermal resistance of 25 °C/W can be achieved by mounting the device on a PCB which
has two copper ground areas of 3 x 3 cm and 16 vias (see Figure 21).
Given that the amount of power dissipated within the device depends primarily on the supply
voltage, load impedance and output modulation level the maximum estimated dissipated
power for the STA333W is 3 W.
With the above suggested board as heatsink, a maximum junction temperature rise, ∆Tj, of
75 °C is possible. In consumer environments where 50 °C is the maximum ambient
temperature this provides some safety margin before the intervention of the thermal
protection (T
Figure 21. Double-layer PCB with two copper ground areas and 16 vias
= 150 °C).
j
Figure 22 shows the power derating curve for the PowerSSO-36 package on PCBs with
copper areas of 2 x 2 cm
Figure 22. Power derating curve for PCB used as heatsink
8
8
Pd (W)
Pd (W)
8
7
7
7
6
6
6
5
5
5
4
4
4
3
3
3
2
2
2
1
1
1
0
0
0
020406080100120140160
020406080100120140160
020406080100120140160
2
and 3 x 3 cm2.
CopperArea 3x3cm
Copper Area 3x3 cm
Copper Area 3x3 cm
and via holes
and via holes
and via holes
Copper Area 2x2cm
Copper Area 2x2 cm
Copper Area 2x2 cm
and viaholes
and via holes
and via holes
Tamb ( °C)
Tamb ( °C)
STA333W
STA333W
STA333W
STA333WPSSO36
PSSO36
PSSO36
PowerSSO-36
44/49Doc ID 13365 Rev 2
STA333WPackage mechanical data
10 Package mechanical data
The STA333W comes in a 36-pin PowerSSO package with exposed pad down (EPD).
Figure 23 below shows the package outline and Tab l e 47 gives the dimensions.
Figure 23. PowerSSO-36 EPD outline drawing
h x 45°
Doc ID 13365 Rev 245/49
Package mechanical dataSTA333W
Table 47.PowerSSO-36 EPD dimensions
Dimensions in mmDimensions in inches
Symbol
MinTypMaxMinTypMax
A2.15-2.470.085-0.097
A22.15-2.400.085-0.094
a10.00-0.100.000-0.004
b0.18-0.360.007-0.014
c0.23-0.320.009-0.013
D10.10-10.500.398-0.413
E7.40-7.600.291-0.299
e-0.5--0.020-
e3-8.5--0.335-
F-2.3--0.091-
G--0.10 --0.004
H10.10-10.500.398-0.413
h--0.40 --0.016
k0-8 degrees0-8 degrees
L0.60-1.000.024-0.039
M-4.30--0.169-
N--10 degrees--10 degrees
O-1.20--0.047-
Q-0.80--0.031-
S-2.90--0.114-
T-3.65--0.144-
U-1.00--0.039-
X4.10-4.700.161-0.185
Y4.90-7.100.193-0.280
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK®
®
is an ST trademark.
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STA333WTrademarks and other acknowledgements
11 Trademarks and other acknowledgements
DDX is a registered trademark of Apogee Technology Inc.
Automodes is a trademark of Apogee Technology Inc.
ECOPACK is a registered trademark of STMicroelectronics.
Sound Terminal is a trademark of STMicroelectronics.
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Revision historySTA333W
12 Revision history
Table 48.Document revision history
DateRevisionChanges
25-May-20071Initial release.
Updated features for operating voltage range, digital gain increments
and maximum power control on page 1
Updated description on page 1
Updated electrical specifications Ta b l e 4 , Tab le 3 and Tabl e 5 on
page 11
Added Section 3.3: Electrical specifications - digital section on
page 12
21-Jan-20102
Added chapter Functional description on page 16
Updated usage of pin name SDA in first paragraph of Chapter 5: I
bus specification on page 18
Added Section 5.4: Read operation on page 19
Removed PSL (register add 0x03) in Table 8: Register summary on
page 21
Updated text concerning overcurrent warning for register CONFC on
page 27
Removed bit PSL in Configuration register D (addr 0x03) on page 28
Corrected reset value for register bit MPCV in Table 25 on page 28
Updated bit names and added register description table in Device
status register (addr 0x2D) on page 36
Updated text and added OLIM attenuation table in Output limit
register (addr 0x34) on page 38
Deleted mention of appsnote in Section 7.3 on page 40
Updated package Y (Min) dimension in Table 47 on page 46
Removed references to STA50x/51x throughout the document
2
C
48/49Doc ID 13365 Rev 2
STA333W
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