The STA1052 is a single chip device which performs all functions related to read back of
optical disk: servo control operations, reading optical disc decoding the High frequency
signals, EFM decoding, error correction, software decoding of MP3 and WMA encoded
audio, sample rate conversion, managing file system, serial transfer of audio/program
through I
It also performs software decoding of MP3, AAC and WMA encoded audio from USB or
SD card™ memory supports.
Commands can be exchanged with the Host MCU either via one I
STA1052 chip comes along a broad software suite that comprehends different types of
compressed audio files, File System Management, Play Lists.
The key Media and File Types supported are briefly reported below:
●Ability to play any USB/SD card compatible solid state memory media
●MPEG1-Layer 2 compressed audio files
●Playback of MP3 compressed audio files (all bit rates and VBR)
●Playback of lower bit rate MPEG2 layer 3 files and MPEG-2.5 extension
●Playback of WMA version 9 compressed audio files
●Playback of iTunes AAC compressed audio files
●Sample rate converter for recorded sampling rates other than 44.1kHz
●Support FAT16/FAT32 file systems
●Support ISO9660 and Joliet file systems
2
S/SPDIF, direct playback of audio through in-built audio DAC.
2
C port or two SPI ports.
The software can manage the following File Information: folder and file names.
ID3 tag information - as per versions 1.0-1.1, 2.0 - 2.4- is reported. Further parameters
made available by ST software are: File type (i.e. .mp3, .wav, .wma, .cda, .aac), Bit rate,
entire file path for current track and track elapsed time.
STA1052 software provides the essential Navigation Commands: Previous/Next , Fast
forward/Rewind, Jump to any file, Scan, Pause. All these commands can be programmed
and configured via Command Protocol Interface.
Two different types of Playlists are supported: Playlists with .pls extension, Playlists with
.m3u extension.
Robust software architecture provides an efficient error handling and related messaging.
ST developed a software architecture that allows the patching of a few parts of software
resident in ROM. Software patches are loaded into a very inexpensive serial Flash which
provides the capability to patch up to 40 KByte of ROM software.
Software build (patching) upgrade from media USB and SD card and from host MCU onto
serial Flash is supported.
STA1052 is intended for use in automotive entertainment system.
3/14
System block diagramSTA1052
2 System block diagram
Figure 1 provides the complete system block diagram, where the ARM sub-system is
represented as a hierarchical block.
Figure 1.STA1052 block diagram
SPDIF-SONYLSI-I2S
fade/
mute/
deemph
master clock
Application interfaceOutput interface
Obs/Debug
ARM Subsystem
External
Focus Actuator
Track Actuator
Ext
Interrupt
Mem
Sled Motor
Spindle Motor
SDRAM Interface
ADPCM
De-
Decoder
ADPCM
Encoder
Org
Frame
+
RSPC
Scram
CLV
buffer
Reed-Solomon
Cross Interleaving
AHB
ITF
DSP
1.7Kx32 PRAM
256x16 XRAM
256x16 YRAM
TrackCount
A+C B+D E F
JumpSpeed
stepper
PDM/
SLED Loop filter
Track Loop filter
Focus Loop filter
TE
FE
defect
Spindle Motor Feedback (CAV)
Sub code
Digital PLL
Sync protection &
decoder
EFM demodulator
+
digital
equalizer
AUX ADC
Laser
control
LD
MD
4/14
ADC1
ADC2
ABCDE
OFFSET GAIN ADC
I/V
+
RATE
DECIM.
F
E
B+D
A+C
DAC
filter
ANALOG
AUDIO L/R out
PLL
Quartz/
Ceramic
F
STA1052Pin description
3 Pin description
3.1 Pin connection
Figure 2.LQFP144 pin configuration (top view)
DRD10
DRD11
GPB11
GPB10
GPB9
DRD12
DRD13
DRD14
DRD15
VDD3_Core1
VSS
DRCLK
DRCLKE
DRRAS
DRCAS
DRWR
DRA0
DRA1
DRA2
DRA3
DRA4
VDD3
VSS
VDD
DRA5
DRA6
DRA7
DRA8
DRA9
DRA10
DRA11
DRBA0
DRBA1
JTRST
JTCK
NC
DRD9
DRD8
GPB12
GPB13
GPB14
GPB15
DRD7
DRD6
DRD5
VDD
VDD3
DRD4
DRD3
DRD2
DRD1
DRD0
PLL_VSS18P
PLL_VDDA33P
PLL_XTI
PLL_XTO
PLL_VDDA18P
PLL_VDD18P
FE_VSSA33S
FE_A
FE_C
FE_B
FE_D
FE_E
FE_F
FE_VDDA33S
FE_VDDPAD1
FE_ADCIN1
FE_ADCIN2
FE_VREF_ADC
FE_VREF
VSS
1
2
3
4
5
6
7
8
9
10
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37 38 39 40
138139140141
137142143144
41 42 43 44 45
135134 133132
136
461147 48 49 50 51
130
131 129 128127 126125
54 55 56 57 58 59
52 53
122
124
123 121 120119 118117
60 61
115
116
62 63 64 65 66 67
114
112
113
68 69 70
111110 109
71
108
OUTR
ADAC_REF1
107
VCM
106
ADAC_REF2
105
OUTL
104
103
ADAC_VDDA
102
ADAC_VSSA
101
VSS
100
VDD3
99
JTMS
98
JTDO
97
JTDI
96
GPB7
95
GPB6
94
VDD
93
GPB8
92
GPB5
91
GPB4
90
GPB3
89
GPB2
88
GPB1
87
VDD3_Core2
86
VSS
85
GPB0
84
GPA8
83
GPA7
82
GPA6
81
GPA5
80
GPA4
79
GPA13
78
GPA3
77
GPA2
76
GPA1
75
NC
74
NC
73
NC
72
FE_CEXT
FE_REXT
FE_VDDA33R
FE_MD_LAS
FE_VSSA33R
FE_CAP_LAS
FE_LD_LAS
1. NC defines not connected pins.
FE_LD1_LAS
FE_VDDA33T
FE_VDDPAD2
FE_TESTP
FE_TESTN
FE_VSSA33T
FE_VSSA18AD
FE_VDDA18AD
VSS
TESTEN
RESETN
FFSR
SPDL
REFFSR
SLED1
SLED2
VDD
VSS
VDD3
TFSR
CAV
LRCK
GPA9
GPA10
GPA11
GPA12
SDO
BCLK
GPA0
AC00563
5/14
Pin descriptionSTA1052
3.2 Pin function description
This pin list contains the definition and description of all pins.
Tab l e 2 gives pin list for LQFP144.
Table 2.Pin List
N°NameDescriptionPin typeLQFP144
1GPC9(DRD9)GPIO PC9 (SDRAM data 9)bidir, 3.3V , 4 mA1
2GPC8(DRD8)GPIO PC8 (SDRAM data 8)bidir, 3.3 V, 4 mA2
3GPB12GPIO PB12(BSPI1_SS)
4GPB13GPIO PB13 (BSPI1_MISO)
bidir, 3.3 V, 2 mA,
PU (default off)
bidir, 3.3 V, 2 mA,
PU (default off)
3
4
5GPB14GPIO PB14 (BSPI1_MOSI)
6GPB15GPIO PB15 (BSPI1_SCK)
7GPC7(DRD7)GPIO PC7 (SDRAM data 7)bidir, 3.3 V, 4 mA7
8GPC6(DRD6)GPIO PC6 (SDRAM data 6)bidir, 3.3 V, 4 mA8
9GPC5(DRD5)GPIO PC5 (SDRAM data 5)bidir, 3.3 V, 4 mA9
10VDDCore VDD1.8 VVDD10
11VSSDigital pad ring VSS groundVSS11
12VDD3Digital pad ring VDD3 3.3 VVDD312
13GPC4(DRD4)GPIO PC4 (SDRAM data 4)bidir, 3.3 V, 4 mA13
14GPC3(DRD3)GPIO PC3 (SDRAM data 3)bidir, 3.3 V, 4 mA14
GPC2(DRD2/
15
SFLASH_MISO)
GPC1(DRD1/
16
SFLASH_MOSI)
GPC0(DRD0/
17
SFLASH_SCK)
18PLL_VSS18PPLL digital & analog groundVSS18
19PLL_VDDA33PPLL 3.3 analog power supplyVDD19
GPIO PC2 (SDRAM data 2 or serial
flash master in/slave out)
GPIO PC1 (SDRAM Data 1 or serial
flash master out/slave in)
GPIO PC0 (SDRAM data 0 or serial
Flash clock)
bidir, 3.3 V, 2 mA,
PU (default off)
bidir, 3.3 V, 2 mA,
PU (default off)
bidir, 3.3 V, 4 mA15
bidir, 3.3 V, 4 mA16
bidir, 3.3 V, 4 mA17
5
6
20PLL_XTICrystal inputanalog in20
21PLL_XTOCrystal outputanalog out21
22PLL_VDDA18PPLL 1.8V analog power supplyVDD22
23PLL_VDD18PPLL 1.8V digital power supplyVDD23
24FE_VSSA33SGround for servo channelsVSS24
25FE_AOPU A inputanalog in25
26FE_COPU C inputanalog in26
6/14
STA1052Pin description
Table 2.Pin List (continued)
N°NameDescriptionPin typeLQFP144
27FE_BOPU B inputanalog in27
28FE_DOPU D inputanalog in28
29FE_EOPU E inputanalog in29
30FE_FOPU F inputanalog in30
3.3 V analog for servo channels/ 3.3 V
31FE_VDDA33S
32FE_VDDPAD13.3V for AFE pad ringVDD32
33FE_ADCIN1General purpose ADC input 1analog in33
34FE_ADCIN2General purpose ADC input 2analog in34
for AFE pad ring (decoupling cap to
Vssa)
VDD31
35FE_VREF_ADC
36FE_VREF
37FE_VDDA33RAnalog 3.3 V for bandgapVDD37
38FE_CEXTExternal cap for bandgap (1 nF)analog38
39FE_REXTExternal res for bandgap (25 kOhm)analog39
40FE_VSSA33RAnalog ground bandgapVss40
41FE_MD_LASLaser driver input from monitor diodeanalog in41
42FE_CAP_LASLaser driver compensation cap (30 nF)analog42
1. The specifications in USB mode are as per USB specifications for low and full speed interface.
bidir, 3.3 V, 2 mA,
PU (default off)
142
11/14
Package informationSTA1052
4 Package information
In order to meet environmental requirements, ST (also) offers these devices in ECOPACK®
packages. ECOPACK
®
packages are lead-free. The category of second Level Interconnect
is marked on the package and on the inner box label, in compliance with JEDEC Standard
JESD97. The maximum ratings related to soldering conditions are also marked on the inner
box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Figure 3.LQFP144 (20x20x1.4mm) mechanical data and package dimensions
DIM.
A1.6000.0630
A10.0500.150 0.00200.0059
A21.350 1.400 1.450 0.0531 0.0551 0.0571
b0.170 0.220 0.270 0.0067 0.0087 0.0106
c0.0900.200 0.00350.0079
D21.800 22.000 22.200 0.8583 0.8661 0.8740
D1 19.800 20.000 20.200 0.7795 0.7874 0.7953
D317.5000.6890
E21.800 22.000 22.200 0.8583 0.8661 0.8740
E1 19.800 20.000 20.200 0.7795 0.7874 0.7953
E317.5000.6890
e0.5000.0197
L0.450 0.600 0.750 0.0177 0.0236 0.0295
L11.0000.0394
k0˚(min.), 3.5˚ (typ.), 7˚( max.)
ccc0.0800.0031
mminch
MIN. TYP. MAX. MIN. TYP. MAX.
OUTLINE AND
MECHANICAL DATA
LQFP144 (20x20x1.40mm)
Low profile plastic Quad Flat Package
Note 1: Exact shape of each corner is optional.
12/14
0099183 C
STA1052Revision history
5 Revision history
Table 3.Document revision history
DateRevisionChanges
12-Mar-20081Initial release.
13/14
STA1052
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