ST ST6253C, ST6263C, ST6263B, ST6260C, ST6260B User Manual

ST6253C ST6263C ST6263B
PDIP20
PSO20
CDIP20W
(See end of Datasheet for Ordering Information)
safe reset, auto-reload timer, EEPROM and SPI
Features
3.0 to 6.0 V Supply Operating Range
8 MHz Maximum Clock Frequency
Run, Wait and Stop Modes
5 Interrupt Vectors
Look-up Table capability in Program Memory
Data Storage in Program Memory:
User selectable size
Data RAM: 128 bytes
Data EEPROM: 64/128 bytes (not in ST6253C
devices)
User Programmable Options
13 I/O pins, fully programmable as:
– Input with pull-up resistor – Input without pull-up resistor – Input with interrupt generation – Open-drain or push-pull output – Analog Input
6 I/O lines can sink up to 30 mA to drive LEDs or
TRIACs directly
8-bit Timer / Counter with 7-bit programmable
prescaler
8-bit Auto-reload Timer with 7-bit programmable
prescaler (AR Timer)
Digital Watchdog
Oscillator Safe Guard (not in ROM devices)
Low Voltage Detector for Safe Reset (not in
ROM devices)
8-bit A/D Converter with 7 analog inputs
8-bit Synchronous Peripheral Interface (SPI)
On-chip Clock oscillator can be driven by Quartz
Crystal Ceramic resonator or RC network
User configurable Power-on Reset
One external Non-Maskable Interrupt
ST626x-EMU2 Emulation and Development
System (connects to an MS-DOS PC via a parallel port).
ST6260C ST6260B
8-bit MCUs with A/D converter,
DEVICE SUMMARY
DEVICE
ST6253C 1836 ­ST6260C / ST6260B 3884 128 ST6263C / ST6263B 1836 64
Program memory
(Bytes)
EEPROM
(Bytes)
March 2009 Rev. 3 1/83
Table of Contents
Document
Page
ST6253C ST6263C ST6263B
ST6260C ST6260B . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1 GENERAL DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.2 PIN DESCRIPTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
1.3 MEMORY MAP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
1.4 PROGRAMMING MODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2 CENTRAL PROCESSING UNIT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
2.1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
2.2 CPU REGISTERS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3 CLOCKS, RESET, INTERRUPTS AND POWER SAVING MODES . . . . . . . . . . . . . . . . . . . . . 17
3.1 CLOCK SYSTEM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3.2 RESETS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
3.3 DIGITAL WATCHDOG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
3.4 INTERRUPTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
3.5 POWER SAVING MODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
4 ON-CHIP PERIPHERALS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
4.1 I/O PORTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
4.2 TIMER . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
4.3 AUTO-RELOAD TIMER . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
4.4 A/D CONVERTER (ADC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
4.5 SERIAL PERIPHERAL INTERFACE (SPI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
4.6 SPI TIMING DIAGRAMS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
5 SOFTWARE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
5.1 ST6 ARCHITECTURE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
5.2 ADDRESSING MODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
5.3 INSTRUCTION SET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
6 ELECTRICAL CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
6.1 ABSOLUTE MAXIMUM RATINGS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
6.2 RECOMMENDED OPERATING CONDITIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
6.3 DC ELECTRICAL CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
6.4 AC ELECTRICAL CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
6.5 A/D CONVERTER CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
6.6 TIMER CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
6.7 SPI CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
6.8 ARTIMER ELECTRICAL CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
7 PACKAGE MECHANICAL DATA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
8 ORDERING INFORMATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
8.1 OTP/EPROM VERSIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
8.2 FASTROM VERSIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
8.3 ROM VERSIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
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Table of Contents
9 REVISION HISTORY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
Document
Page
3/83
ST6253C ST6263C ST6263B ST6260C ST6260B
TEST
NMI
INTERRUPT
PROGRAM
PC
STACK LEVEL 1 STACK LEVEL 2 STACK LEVEL 3 STACK LEVEL 4 STACK LEVEL 5 STACK LEVEL 6
POWER SUPPLY
OSCILLATOR
RESET
DATA ROM
USER
SELECTABLE
DATA RAM
PORT A
PORT B
TIMER
DIGITAL
8 BIT CORE
TEST/V
PP
8-BIT
A/D CONVERTER
PA0..PA3 / Ain
PB0..PB3 / 30 mA Sink
VDDV
SS
OSCin OSCout RESET
WATCHDOG
MEMORY
PB6 / ARTimin / 30 mA Sink
PORT C
PC2 / Sin / Ain PC3 / Sout / Ain
SPI (SERIAL
PERIPHERAL
INTERFACE)
AUTORELOAD
TIMER
PC4 / Sck / Ain
PB7 / ARTimout / 30 mA Sink
128 Bytes
1836 bytes OTP
3884 bytes OTP
3884 bytes EPROM
(ST62T53C,T63C)
(ST62T60C)
(ST62E60C)
DATA EEPROM
64 Bytes
128 Bytes
(ST62T60C/E60C)
(ST62T63C)

1 GENERAL DESCRIPTION

1.1 INTRODUCTION

The ST62T53C, ST62T60C, ST62T63C and ST62E60C devices are low cost members of the ST62xx 8-bit HCMOS family of microcontrollers, which is targeted at low to medium complexity ap plications. All ST62xx devices are based on a building block approach: a common core is sur rounded by a number of on-chip peripherals.
The ST62E60C is the erasable EPROM version of the ST62T60C device, which may be used to em ulate the ST62T53C, ST62T60C and ST62T63C devices, as well as the respective ST6253C, ST6260B and ST6263B ROM devices.
OTP and EPROM devices are functionally identi­cal. The ROM based versions offer the same func­tionality selecting as ROM options the options de-
Figure 1. Block Diagram
-
-
-
fined in the programmable option byte of the OTP/ EPROM versions.
OTP devices offer all the advantages of user pro­grammability at low cost, which make them the ideal choice in a wide range of applications where frequent code changes, multiple code versions or last minute programmability are required.
These compact low-cost devices feature a Timer comprising an 8-bit counter and a 7-bit program
­mable prescaler, an 8-bit Auto-Reload Timer, EEPROM data capability (except ST62T53C), a serial port communication interface, an 8-bit A/D Converter with 7 analog inputs and a Digital Watchdog timer, making them well suited for a wide range of automotive, appliance and industrial applications.
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ST6253C ST6263C ST6263B ST6260C ST6260B
1 2 3 4 5 6 7 8 9
10
11
12
13
14
15
16
17
18
19
20
PB0 PB1
V
PP
/TEST
PB2 PB3
Ain/PA0
V
SS
V
DD
PC2 / Sin / Ain
RESET
PA1/Ain
ARTIMin/PB6
ARTIMout/PB7
PC3 / Sout / Ain PC4 / Sck / Ain NMI
OSCin
OSCout
PA2/Ain
PA3/Ain

1.2 PIN DESCRIPTIONS

VDD and VSS. Power is supplied to the MCU via
these two pins. V V
is the ground connection.
SS
OSCin and OSCout. These pins are internally connected to the on-chip oscillator circuit. A quartz crystal, a ceramic resonator or an external clock signal can be connected between these two pins. The OSCin pin is the input pin, the OSCout pin is the output pin.
RESET. The active-low RESET pin is used to re­start the microcontroller.
TEST/VPP. The TEST must be held at VSS for nor- mal operation. If TEST pin is connected to a +12.5V level during the reset phase, the EPROM/ OTP programming Mode is entered.
NMI. The NMI pin provides the capability for asyn­chronous interruption, by applying an external non maskable interrupt to the MCU. It is provided with an on-chip pullup resistor (if option has been ena bled), and Schmitt trigger characteristics.
PA0-PA3. These 4 lines are organized as one I/O port (A). Each line may be configured under soft ware control as inputs with or without internal pull­up resistors, interrupt generating inputs with pull­up resistors, open-drain or push-pull outputs, ana log inputs for the A/D converter.
PB0-PB3. These 4 lines are organized as one I/O port (B). Each line may be configured under soft ware control as inputs with or without internal pull­up resistors, interrupt generating inputs with pull­up resistors, open-drain or push-pull outputs. PB0-PB3 can also sink 30mA for direct LED driving.
is the power connection and
DD
-
-
-
-
PB6/ARTIMin, PB7/ARTIMout. These pins are ei­ther Port B I/O bits or the Input and Output pins of the AR TIMER. To be used as timer input function PB6 has to be programmed as input with or with out pull-up. A dedicated bit in the AR TIMER Mode Control Register sets PB7 as timer output function. PB6-PB7 can also sink 30mA for direct LED driv­ing.
PC2-PC4. These 3 lines are organized as one I/O port (C). Each line may be configured under soft ware control as input with or without internal pull­up resistor, interrupt generating input with pull-up resistor, analog input for the A/D converter, open­drain or push-pull output. PC2-PC4 can also be used as respectively Data in, Data out and Clock I/O pins for the on-chip SPI to carry the synchronous serial I/O signals.
Figure 2ST62T53C/T60C/T63C/E60C Pin
Configuration
-
-
5/83
ST6253C ST6263C ST6263B ST6260C ST6260B
PROGRAM SPACE
PROGRAM
INTERRUPT &
RESET VECTORS
ACCUMULATOR
DATA RAM
BANK SELECT
WINDOW SELECT
RAM
X REGISTER Y REGISTER V REGISTER
W REGISTER
DATA READ-ONLY
WINDOW
RAM / EEPROM BANKING AREA
000h
03Fh
040h
07Fh
080h 081h 082h 083h 084h
0C0h
0FFh
0-63
DATA SPACE
0000h
0FF0h
0FFFh
MEMORY
MEMORY
DATA READ-ONLY
MEMORY

1.3 MEMORY MAP

1.3.1 Introduction

The MCU operates in three separate memory spaces: Program space, Data space, and Stack space. Operation in these three memory spaces is described in the following paragraphs.
Figure 3Memory Addressing Diagram
Briefly, Program space contains user program code in OTP and user vectors; Data space con tains user data in RAM and in OTP, and Stack space accommodates six levels of stack for sub routine and interrupt service routine nesting.
-
-
6/83
ST6253C ST6263C ST6263B ST6260C ST6260B
0000h
RESERVED
*
USER
PROGRAM MEMORY
(OTP/EPROM)
3872 BYTES
0F9Fh
0FA0h 0FEFh 0FF0h 0FF7h 0FF8h 0FFBh
0FFCh 0FFDh
0FFEh 0FFFh
RESERVED
*
RESERVED
INTERRUPT VECTORS
NMI VECTOR
USER RESET VECTOR
0080h
(*) Reserved areas should be filled with 0FFh
007Fh
0000h
RESERVED
*
USER
PROGRAM MEMORY
(OTP)
1824 BYTES
0F9Fh
0FA0h
0FEFh
0FF0h
0FF7h
0FF8h
0FFBh
0FFCh
0FFDh
0FFEh
0FFFh
RESERVED
*
RESERVED
INTERRUPT VECTORS
NMI VECTOR
USER RESET VECTOR
087Fh
(*) Reserved areas should be filled with 0FFh
0880h
MEMORY MAP (Cont’d)

1.3.2 Program Space

Program Space comprises the instructions to be executed, the data required for immediate ad dressing mode instructions, the reserved factory test area and the user vectors. Program Space is addressed via the 12-bit Program Counter register (PC register).
1.3.2.1 Program Memory Protection
The Program Memory in OTP or EPROM devices can be protected against external readout of mem ory by selecting the READOUT PROTECTION op­tion in the option byte.
Figure 4ST62E60C/T60C Program
Memory Map
In the EPROM parts, READOUT PROTECTION
-
option can be disactivated only by U.V. erasure that also results into the whole EPROM context erasure.
Note: Once the Readout Protection is activated, it is no longer possible, even for STMicroelectronics, to gain access to the OTP contents. Returned parts with a protection set can therefore not be ac cepted.
-
Figure 5ST62T53C/T63C Program
Memory Map
-
7/83
ST6253C ST6263C ST6263B ST6260C ST6260B
MEMORY MAP (Cont’d)

1.3.3 Data Space

Data Space accommodates all the data necessary for processing the user program. This space com prises the RAM resource, the processor core and peripheral registers, as well as read-only data such as constants and look-up tables in OTP/ EPROM.
1.3.3.1 Data ROM
All read-only data is physically stored in program memory, which also accommodates the Program Space. The program memory consequently con tains the program code to be executed, as well as the constants and look-up tables required by the application.
The Data Space locations in which the different constants and look-up tables are addressed by the processor core may be thought of as a 64-byte window through which it is possible to access the read-only data stored in OTP/EPROM.
1.3.3.2 Data RAM/EEPROM
In ST62T53C, T60C, T63C and ST62E60C devic­es, the data space includes 60 bytes of RAM, the accumulator (A), the indirect registers (X), (Y), the short direct registers (V), (W), the I/O port regis ters, the peripheral data and control registers, the interrupt option register and the Data ROM Win dow register (DRW register).
Additional RAM and EEPROM pages can also be addressed using banks of 64 bytes located be tween addresses 00h and 3Fh.

1.3.4 Stack Space

Stack space consists of six 12-bit registers which are used to stack subroutine and interrupt return addresses, as well as the current program counter contents.
Table 1. Additional RAM/EEPROM Banks
Device RAM EEPROM
ST62T53C 1 x 64 bytes -
ST62T60C/E60C 1 x 64 bytes 2 x 64 bytes
ST62T63C 1 x 64 bytes 1 x 64 bytes
Table 2ST62T53C, T60C, T63C and ST62E60C Data Memory Space
-
-
-
-
-
AR TIMER STATUS/CONTROL REGISTER1 0D6h AR TIMER STATUS/CONTROL REGISTER2 0D7h
AR TIMER RELOAD/CAPTURE REGISTER 0D9h
* WRITE ONLY REGISTER
RAM and EEPROM
DATA ROM WINDOW AREA
X REGISTER 080h Y REGISTER 081h V REGISTER 082h
W REGISTER 083h
DATA RAM 60 BYTES
PORT A DATA REGISTER 0C0h PORT B DATA REGISTER 0C1h PORT C DATA REGISTER 0C2h
RESERVED 0C3h PORT A DIRECTION REGISTER 0C4h PORT B DIRECTION REGISTER 0C5h PORT C DIRECTION REGISTER 0C6h
RESERVED 0C7h INTERRUPT OPTION REGISTER 0C8h*
DATA ROM WINDOW REGISTER 0C9h*
RESERVED
PORT A OPTION REGISTER 0CCh PORT B OPTION REGISTER 0CDh PORT C OPTION REGISTER 0CEh
RESERVED 0CFh
A/D DATA REGISTER 0D0h
A/D CONTROL REGISTER 0D1h
TIMER PRESCALER REGISTER 0D2h
TIMER COUNTER REGISTER 0D3h
TIMER STATUS CONTROL REGISTER 0D4h
AR TIMER MODE CONTROL REGISTER 0D5h
WATCHDOG REGISTER 0D8h
AR TIMER COMPARE REGISTER 0DAh
AR TIMER LOAD REGISTER 0DBh
OSCILLATOR CONTROL REGISTER 0DCh*
MISCELLANEOUS 0DDh
RESERVED
SPI DATA REGISTER 0E0h
SPI DIVIDER REGISTER 0E1h
SPI MODE REGISTER 0E2h
RESERVED
DATA RAM/EEPROM REGISTER 0E8h*
RESERVED 0E9h EEPROM CONTROL REGISTER
(except ST62T53C)
RESERVED
ACCUMULATOR 0FFh
000h 03Fh
040h
07Fh
084h 0BFh
0CAh 0CBh
0DEh 0DFh
0E3h 0E7h
0EAh
0EBh 0FEh
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ST6253C ST6263C ST6263B ST6260C ST6260B
DATA ROM
WINDOW REGISTER
CONTENTS
DATA SPACE ADDRESS
40h-7Fh
IN INSTRUCTION
PROGRAM SPACE ADDRESS
765432 0
543210
543210
READ
1
67891011
0
1
VR01573C
12
1
0
DATA SPACE ADDRESS
:
:
59h
000
0
1
00
1
11
Example:
(DWR)
DWR=28h
11
0000000
1
ROM
ADDRESS:A19h
11
13
0
1
MEMORY MAP (Cont’d)

1.3.5 Data Window Register (DWR)

The Data read-only memory window is located from address 0040h to address 007Fh in Data space. It allows direct reading of 64 consecutive bytes locat ed anywhere in program memory, between ad­dress 0000h and 0FFFh (top memory address de­pends on the specific device). All the program memory can therefore be used to store either in structions or read-only data. Indeed, the window can be moved in steps of 64 bytes along the pro gram memory by writing the appropriate code in the Data Window Register (DWR).
The DWR can be addressed like any RAM location in the Data Space, it is however a write-only regis ter and therefore cannot be accessed using single­bit operations. This register is used to position the 64-byte read-only data window (from address 40h to address 7Fh of the Data space) in program memory in 64-byte steps. The effective address of the byte to be read as data in program memory is obtained by concatenating the 6 least significant bits of the register address given in the instruction (as least significant bits) and the content of the DWR register (as most significant bits), as illustrat ed in Figure 6 below. For instance, when address­ing location 0040h of the Data Space, with 0 load­ed in the DWR register, the physical location ad­dressed in program memory is 00h. The DWR reg­ister is not cleared on reset, therefore it must be written to prior to the first access to the Data read­only memory window area.
Figure 6Data read-only memory Window Memory Addressing
Data Window Register (DWR)
Address: 0C9h — Write Only
7 0
-
- - DWR5 DWR4 DWR3 DWR2 DWR1 DWR0
­Bits 6, 7 = Not used.
Bit 5-0 = DWR6-DWR0: Data read-only memory
­Window Register Bits. These are the Data read- only memory Window bits that correspond to the upper bits of the data read-only memory space.
Caution: This register is undefined on reset. Nei-
-
ther read nor single bit instructions may be used to address this register.
Note: Care is required when handling the DWR register as it is write only. For this reason, the DWR contents should not be changed while exe cuting an interrupt service routine, as the service routine cannot save and then restore the register’s previous contents. If it is impossible to avoid writ ing to the DWR during the interrupt service routine,
-
an image of the register must be saved in a RAM location, and each time the program writes to the DWR, it must also write to the image register. The image register must be written first so that, if an in terrupt occurs between the two instructions, the DWR is not affected.
-
-
-
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ST6253C ST6263C ST6263B ST6260C ST6260B
MEMORY MAP (Cont’d)

1.3.6 Data RAM/EEPROM Bank Register (DRBR)

Address: E8h — Write only
7 0
- - -
DRBR
4
- -
DRBR1DRBR
Bit 7-5 = These bits are not used Bit 4 - DRBR4. This bit, when set, selects RAM
Page 2. Bit 3-2 - Reserved. These bits are not used. Bit 1 - DRBR1. This bit, when set, selects
EEPROM Page 1, when available. Bit 0 - DRBR0. This bit, when set, selects
EEPROM Page 0, when available. The selection of the bank is made by programming
the Data RAM Bank Switch register (DRBR regis ter) located at address E8h of the Data Space ac­cording to Table 1. No more than one bank should be set at a time.
The DRBR register can be addressed like a RAM Data Space at the address E8h; nevertheless it is a write only register that cannot be accessed with single-bit operations. This register is used to select the desired 64-byte RAM/EEPROM bank of the Data Space. The bank number has to be loaded in the DRBR register and the instruction has to point
Table 3Data RAM Bank Register Set-up
DRBR ST62T53C ST62T60C/E60C ST62T63C
to the selected location as if it was in bank 0 (from 00h address to 3Fh address).
This register is not cleared during the MCU initiali­zation, therefore it must be written before the first access to the Data Space bank region. Refer to the Data Space description for additional informa
0
tion. The DRBR register is not modified when an interrupt or a subroutine occurs.
Notes : Care is required when handling the DRBR register
as it is write only. For this reason, it is not allowed to change the DRBR contents while executing in terrupt service routine, as the service routine can­not save and then restore its previous content. If it is impossible to avoid the writing of this register in interrupt service routine, an image of this register must be saved in a RAM location, and each time the program writes to DRBR it must write also to the image register. The image register must be
-
written first, so if an interrupt occurs between the two instructions the DRBR is not affected.
In DRBR Register, only 1 bit must be set. Other­wise two or more pages are enabled in parallel, producing errors.
Care must also be taken not to change the E²PROM page (when available) when the parallel writing mode is set for the E²PROM, as defined in EECTL register.
-
-
00 None None None
01 Not Available EEPROM Page 0 EEPROM Page 0
02 Not Available EEPROM Page 1 Not Available
08 Not Available Not Available Not Available
10h RAM Page 2 RAM Page 2 RAM Page 2
other Reserved Reserved Reserved
10/83
ST6253C ST6263C ST6263B ST6260C ST6260B
MEMORY MAP (Cont’d)

1.3.7 EEPROM Description

EEPROM memory is located in 64-byte pages in data space. This memory may be used by the user program for non-volatile data storage.
Data space from 00h to 3Fh is paged as described in Table 4. EEPROM locations are accessed di rectly by addressing these paged sections of data space.
The EEPROM does not require dedicated instruc­tions for read or write access. Once selected via the Data RAM Bank Register, the active EEPROM page is controlled by the EEPROM Control Regis ter (EECTL), which is described below.
Bit E20FF of the EECTL register must be reset prior to any write or read access to the EEPROM. If no bank has been selected, or if E2OFF is set, any ac cess is meaningless.
Programming must be enabled by setting the E2ENA bit of the EECTL register.
The E2BUSY bit of the EECTL register is set when the EEPROM is performing a programming cycle. Any access to the EEPROM when E2BUSY is set is meaningless.
Provided E2OFF and E2BUSY are reset, an EEP­ROM location is read just like any other data loca­tion, also in terms of access time.
Writing to the EEPROM may be carried out in two modes: Byte Mode (BMODE) and Parallel Mode
Table 4. Row Arrangement for Parallel Writing of EEPROM Locations
Byte 0 1 2 3 4 5 6 7 ROW7 38h-3Fh ROW6 30h-37h ROW5 28h-2Fh ROW4 20h-27h ROW3 18h-1Fh ROW2 10h-17h ROW1 08h-0Fh ROW0 00h-07h
(PMODE). In BMODE, one byte is accessed at a time, while in PMODE up to 8 bytes in the same row are programmed simultaneously (with conse quent speed and power consumption advantages, the latter being particularly important in battery powered circuits).
­General Notes:
Data should be written directly to the intended ad­dress in EEPROM space. There is no buffer mem­ory between data RAM and the EEPROM space.
When the EEPROM is busy (E2BUSY = “1”)
-
EECTL cannot be accessed in write mode, it is only possible to read the status of E2BUSY. This implies that as long as the EEPROM is busy, it is not possible to change the status of the EEPROM Control Register. EECTL bits 4 and 5 are reserved
­and must never be set.
Care is required when dealing with the EECTL reg­ister, as some bits are write only. For this reason, the EECTL contents must not be altered while ex ecuting an interrupt service routine.
If it is impossible to avoid writing to this register within an interrupt service routine, an image of the register must be saved in a RAM location, and each time the program writes to EECTL it must also write to the image register. The image register must be written to first so that, if an interrupt oc curs between the two instructions, the EECTL will not be affected.
Dataspace addresses. Banks 0 and 1.
-
-
-
Up to 8 bytes in each row may be programmed simultaneously in Parallel Write mode.
The number of available 64-byte banks (1 or 2) is device dependent.
Note: The EEPROM is disabled as soon as STOP instruction is executed in order to achieve the lowest power-consumption.
11/83
ST6253C ST6263C ST6263B ST6260C ST6260B
MEMORY MAP (Cont’d) Additional Notes on Parallel Mode:
If the user wishes to perform parallel program­ming, the first step should be to set the E2PAR2 bit. From this time on, the EEPROM will be ad dressed in write mode, the ROW address and the data will be latched and it will be possible to change them only at the end of the programming cycle or by resetting E2PAR2 without program ming the EEPROM. After the ROW address is latched, the MCU can only “see” the selected EEPROM row and any attempt to write or read other rows will produce errors.
The EEPROM should not be read while E2PAR2 is set.
As soon as the E2PAR2 bit is set, the 8 volatile ROW latches are cleared. From this moment on, the user can load data in all or in part of the ROW. Setting E2PAR1 will modify the EEPROM regis ters corresponding to the ROW latches accessed after E2PAR2. For example, if the software sets E2PAR2 and accesses the EEPROM by writing to addresses 18h, 1Ah and 1Bh, and then sets E2PAR1, these three registers will be modified si multaneously; the remaining bytes in the row will be unaffected.
Note that E2PAR2 is internally reset at the end of the programming cycle. This implies that the user must set the E2PAR2 bit between two parallel pro gramming cycles. Note that if the user tries to set E2PAR1 while E2PAR2 is not set, there will be no programming cycle and the E2PAR1 bit will be un affected. Consequently, the E2PAR1 bit cannot be set if E2ENA is low. The E2PAR1 bit can be set by the user, only if the E2ENA and E2PAR2 bits are also set.
Notes: The EEPROM page shall not be changed through the DRBR register when the E2PAR2 bit is set.
EEPROM Control Register (EECTL) Address: EAh — Read/Write Reset status: 00h
-
7 0
E2O
D7
-
FF
D5 D4
E2PAR1E2PAR2E2BUSYE2E
Bit 7 = D7: Unused. Bit 6 = E2OFF: Stand-by Enable Bit. WRITE ONLY.
If this bit is set the EEPROM is disabled (any access will be meaningless) and the power consumption of the EEPROM is reduced to its lowest value.
Bit 5-4 = D5-D4: Reserved. MUST be kept reset. Bit 3 = E2PAR1: Parallel Start Bit. WRITE ONLY.
Once in Parallel Mode, as soon as the user software
-
sets the E2PAR1 bit, parallel writing of the 8 adja cent registers will start. This bit is internally reset at the end of the programming procedure. Note that less than 8 bytes can be written if required, the un defined bytes being unaffected by the parallel pro-
-
gramming cycle; this is explained in greater detail in the Additional Notes on Parallel Mode overleaf.
Bit 2 = E2PAR2: Parallel Mode En. Bit. WRITE ONLY. This bit must be set by the user program in order to perform parallel programming. If E2PAR2
-
is set and the parallel start bit (E2PAR1) is reset, up to 8 adjacent bytes can be written simultane ously. These 8 adjacent bytes are considered as a
-
row, whose address lines A7, A6, A5, A4, A3 are fixed while A2, A1 and A0 are the changing bits, as illustrated in
Table 4. E2PAR2 is automatically re-
set at the end of any parallel programming proce­dure. It can be reset by the user software before starting the programming procedure, thus leaving the EEPROM registers unchanged.
Bit 1 = E2BUSY: EEPROM Busy Bit. READ ON- LY. This bit is automatically set by the EEPROM control logic when the EEPROM is in program ming mode. The user program should test it before any EEPROM read or write operation; any attempt to access the EEPROM while the busy bit is set will be aborted and the writing procedure in progress will be completed.
Bit 0 = E2ENA: EEPROM Enable Bit. WRITE ON- LY. This bit enables programming of the EEPROM cells. It must be set before any write to the EEP ROM register. Any attempt to write to the EEP­ROM when E2ENA is low is meaningless and will not trigger a write cycle.
The EEPROM is disabled as soon as a STOP in­struction is executed in order to achieve the lowest power-consumption.
NA
-
-
-
-
-
12/83
ST6253C ST6263C ST6263B ST6260C ST6260B

1.4 PROGRAMMING MODES

1.4.1 Option Bytes

The two Option Bytes allow configuration capabili­ty to the MCUs. Option byte’s content is automati­cally read, and the selected options enabled, when the chip reset is activated.
It can only be accessed during the programming mode. This access is made either automatically (copy from a master device) or by selecting the OPTION BYTE PROGRAMMING mode of the pro grammer.
The option bytes are located in a non-user map. No address has to be specified.
EPROM Code Option Byte (LSB)
7 0
PRO-
EXTC-
PB2-3
TECT
NTL
PULL
PB0-1
PULL
WDACT
DE­LAY
OSCIL OSGEN
EPROM Code Option Byte (MSB)
15 8
- - -
ADC
SYNCHRO
- -
NMI
PULL
D15-D13. Reserved. Must be cleared. ADC SYNCHRO. When set, an A/D conversion is
started upon WAIT instruction execution, in order to reduce supply noise. When this bit is low, an A/ D conversion is started as soon as the STA bit of the A/D Converter Control Register is set.
D11. Reserved, must be set to one. D10. Reserved, must be cleared. NMI PULL. NMI Pull-Up. This bit must be set high
to configure the NMI pin with a pull-up resistor. When it is low, no pull-up is provided.
LVD. LVD RESET enable.When this bit is set, safe RESET is performed by MCU when the supply
-
LVD
voltage is too low. When this bit is cleared, only power-on reset or external RESET are active.
PROTECT. Readout Protection. This bit allows the protection of the software contents against piracy. When the bit PROTECT is set high, readout of the OTP contents is prevented by hardware.. When this bit is low, the user program can be read.
EXTCNTL. External STOP MODE control.. When EXTCNTL is high, STOP mode is available with watchdog active by setting NMI pin to one. When EXTCNTL is low, STOP mode is not available with the watchdog active.
PB2-3 PULL. When set this bit removes pull-up at reset on PB2-PB3 pins. When cleared PB2-PB3 pins have an internal pull-up resistor at reset.
PB0-1 PULL. When set this bit removes pull-up at reset on PB0-PB1 pins. When cleared PB0-PB1 pins have an internal pull-up resistor at reset.
WDACT. This bit controls the watchdog activation. When it is high, hardware activation is selected. The software activation is selected when WDACT is low.
DELAY. This bit enables the selection of the delay internally generated after the internal reset (exter nal pin, LVD, or watchdog activated) is released. When DELAY is low, the delay is 2048 cycles of the oscillator, it is of 32768 cycles when DELAY is high.
OSCIL. Oscillator selection. When this bit is low, the oscillator must be controlled by a quartz crys tal, a ceramic resonator or an external frequency. When it is high, the oscillator must be controlled by an RC network, with only the resistor having to be externally provided.
OSGEN. Oscillator Safe Guard. This bit must be set high to enable the Oscillator Safe Guard. When this bit is low, the OSG is disabled.
The Option byte is written during programming ei­ther by using the PC menu (PC driven Mode) or automatically (stand-alone mode).
-
-
13/83
ST6253C ST6263C ST6263B ST6260C ST6260B
PROGRAMMING MODES (Cont’d)

1.4.2 EPROM Erasing

The EPROM of the windowed package of the MCUs may be erased by exposure to Ultra Violet light. The erasure characteristic of the MCUs is such that erasure begins when the memory is ex posed to light with a wave lengths shorter than ap­proximately 4000Å. It should be noted that sun­lights and some types of fluorescent lamps have wavelengths in the range 3000-4000Å.
It is thus recommended that the window of the MCUs packages be covered by an opaque label to
prevent unintentional erasure problems when test ing the application in such an environment.
The recommended erasure procedure of the MCUs EPROM is the exposure to short wave ul
-
traviolet light which have a wave-length 2537A. The integrated dose (i.e. U.V. intensity x exposure time) for erasure should be a minimum of 15W-
2
. The erasure time with this dosage is ap-
sec/cm proximately 15 to 20 minutes using an ultraviolet lamp with 12000µW/cm
2
power rating. The ST62E60C should be placed within 2.5cm (1Inch) of the lamp tubes during erasure.
-
-
14/83
ST6253C ST6263C ST6263B ST6260C ST6260B
PROGRAM
RESET
OPCODE
FLAG
VALUES
2
CONTROLLER
FLAGS
ALU
A-DATA
B-DATA
ADDRESS/READ LINE
DATA SPACE
INTERRUPTS
DATA
RAM/EEPROM
DATA
ROM/EPROM
RESULTS TO DATA SPACE (WRITE LINE)
ROM/EPROM
DEDICATIONS
ACCUMULATOR
CONTROL SIGNALS
OSCin
OSCout
ADDRESS
DECODER
256
12
Program Counter
and
6 LAYER STACK
0,01 TO 8MHz
VR01811

2 CENTRAL PROCESSING UNIT

2.1 INTRODUCTION

The CPU Core of ST6 devices is independent of the I/O or Memory configuration. As such, it may be thought of as an independent central processor communicating with on-chip I/O, Memory and Pe ripherals via internal address, data, and control buses. In-core communication is arranged as shown in Figure 7; the controller being externally linked to both the Reset and Oscillator circuits, while the core is linked to the dedicated on-chip pe ripherals via the serial data bus and indirectly, for interrupt purposes, through the control registers.

2.2 CPU REGISTERS

The ST6 Family CPU core features six registers and three pairs of flags available to the programmer. These are described in the following paragraphs.
Accumulator (A). The accumulator is an 8-bit general purpose register used in all arithmetic cal culations, logical operations, and data manipula­tions. The accumulator can be addressed in Data space as a RAM location at address FFh. Thus the ST6 can manipulate the accumulator just like any other register in Data space.
Figure 7. ST6 Core Block Diagram
-
-
-
Indirect Registers (X, Y). These two indirect reg­isters are used as pointers to memory locations in Data space. They are used in the register-indirect addressing mode. These registers can be ad dressed in the data space as RAM locations at ad­dresses 80h (X) and 81h (Y). They can also be ac­cessed with the direct, short direct, or bit direct ad­dressing modes. Accordingly, the ST6 instruction set can use the indirect registers as any other reg ister of the data space.
Short Direct Registers (V, W). These two regis­ters are used to save a byte in short direct ad­dressing mode. They can be addressed in Data space as RAM locations at addresses 82h (V) and 83h (W). They can also be accessed using the di rect and bit direct addressing modes. Thus, the ST6 instruction set can use the short direct regis ters as any other register of the data space.
Program Counter (PC). The program counter is a 12-bit register which contains the address of the next ROM location to be processed by the core. This ROM location may be an opcode, an oper and, or the address of an operand. The 12-bit length allows the direct addressing of 4096 bytes in Program space.
-
-
-
-
-
15/83
CPU REGISTERS (Cont’d)
SHORT
DIRECT
ADDRESSING
MODE
VREGISTER
WREGISTER
PROGRAM COUNTER
SIX LEVELS
STACK REGISTER
CZNORMAL FLAGS
INTERRUPT FLAGS
NMI FLAGS
INDEX
REGISTER
VA000423
b7
b7
b7
b7
b7
b0
b0
b0
b0
b0
b0b11
ACCUMULATOR
Y REG. POINTER
X REG. POINTER
CZ
CZ
However, if the program space contains more than 4096 bytes, the additional memory in program space can be addressed by using the Program Bank Switch register.
The PC value is incremented after reading the ad­dress of the current instruction. To execute relative jumps, the PC and the offset are shifted through the ALU, where they are added; the result is then shifted back into the PC. The program counter can be changed in the following ways:
- JP (Jump) instructionPC=Jump address
- CALL instructionPC= Call address
- Relative Branch Instruction.PC= PC +/- offset
- Interrupt PC=Interrupt vector
- Reset PC= Reset vector
- RET & RETI instructionsPC= Pop (stack)
- Normal instructionPC= PC + 1
Flags (C, Z). The ST6 CPU includes three pairs of flags (Carry and Zero), each pair being associated with one of the three normal modes of operation: Normal mode, Interrupt mode and Non Maskable Interrupt mode. Each pair consists of a CARRY flag and a ZERO flag. One pair (CN, ZN) is used during Normal operation, another pair is used dur ing Interrupt mode (CI, ZI), and a third pair is used in the Non Maskable Interrupt mode (CNMI, ZN MI).
The ST6 CPU uses the pair of flags associated with the current mode: as soon as an interrupt (or a Non Maskable Interrupt) is generated, the ST6 CPU uses the Interrupt flags (resp. the NMI flags) instead of the Normal flags. When the RETI in struction is executed, the previously used set of flags is restored. It should be noted that each flag set can only be addressed in its own context (Non Maskable Interrupt, Normal Interrupt or Main rou tine). The flags are not cleared during context switching and thus retain their status.
The Carry flag is set when a carry or a borrow oc­curs during arithmetic operations; otherwise it is cleared. The Carry flag is also set to the value of the bit tested in a bit test instruction; it also partici pates in the rotate left instruction.
The Zero flag is set if the result of the last arithme­tic or logical operation was equal to zero; other­wise it is cleared.
Switching between the three sets of flags is per­formed automatically when an NMI, an interrupt or a RETI instructions occurs. As the NMI mode is
ST6253C ST6263C ST6263B ST6260C ST6260B
automatically selected after the reset of the MCU, the ST6 core uses at first the NMI flags.
Stack. The ST6 CPU includes a true LIFO hard­ware stack which eliminates the need for a stack pointer. The stack consists of six separate 12-bit RAM locations that do not belong to the data space RAM area. When a subroutine call (or inter rupt request) occurs, the contents of each level are shifted into the next higher level, while the content of the PC is shifted into the first level (the original contents of the sixth stack level are lost). When a subroutine or interrupt return occurs (RET or RETI instructions), the first level register is shifted back into the PC and the value of each level is popped back into the previous level. Since the accumula tor, in common with all other data space registers, is not stored in this stack, management of these registers should be performed within the subrou tine. The stack will remain in its “deepest” position if more than 6 nested calls or interrupts are execut ed, and consequently the last return address will be lost. It will also remain in its highest position if the stack is empty and a RET or RETI is executed. In this case the next instruction will be executed.
Figure 8. ST6 CPU Programming Mode
l
-
-
-
-
-
-
-
-
-
16/83
ST6253C ST6263C ST6263B ST6260C ST6260B
INTEGRATED CLOCK
CRYSTAL/RESONATOR option
OSG ENABLED option
OSC
in
OSC
out
C
L1n
C
L2
ST6xxx
CRYSTAL/RESONATOR CLOCK
CRYSTAL/RESONATOR option
OSC
in
OSC
out
ST6xxx
EXTERNAL CLOCK
CRYSTAL/RESONATOR option
NC
OSC
in
OSC
out
ST6xxx
NC
OSC
in
OSC
out
R
NET
ST6xxx
RC NETWORK
RC NETWORK option
NC

3 CLOCKS, RESET, INTERRUPTS AND POWER SAVING MODES

3.1 CLOCK SYSTEM

The MCU features a Main Oscillator which can be driven by an external clock, or used in conjunction with an AT-cut parallel resonant crystal or a suita ble ceramic resonator, or with an external resistor
). In addition, a Low Frequency Auxiliary Os-
(R
NET
cillator (LFAO) can be switched in for security rea­sons, to reduce power consumption, or to offer the benefits of a back-up clock system.
The Oscillator Safeguard (OSG) option filters spikes from the oscillator lines, provides access to the LFAO to provide a backup oscillator in the event of main oscillator failure and also automati cally limits the internal clock frequency (f function of V ation. These functions are illustrated in Figure 10,
Figure 11, Figure 12 and Figure 13.
A programmable divider on F order to adjust the internal clock of the MCU to the
, in order to guarantee correct oper-
DD
is also provided in
INT
INT
) as a
best power consumption and performance trade­off.
Figure 9 illustrates various possible oscillator con-
figurations using an external crystal or ceramic res­onator, an external clock input, an external resistor (R LFAO. C range 12 to 22 pF for an oscillator frequency in the 4-8 MHz range.
The internal MCU clock frequency (f by 12 to drive the Timer, the A/D converter and the Watchdog timer, and by 13 to drive the CPU core, as may be seen in Figure 12.
), or the lowest cost solution using only the
NET
an CL2 should have a capacitance in the
L1
) is divided
INT
With an 8 MHz oscillator frequency, the fastest ma­chine cycle is therefore 1.625µs.
A machine cycle is the smallest unit of time needed to execute any operation (for instance, to increment the Program Counter). An instruction may require two, four, or five machine cycles for execution.

3.1.1 Main Oscillator

The oscillator configuration may be specified by se­lecting the appropriate option. When the CRYSTAL/ RESONATOR option is selected, it must be used with a quartz crystal, a ceramic resonator or an external signal provided on the OSCin pin. When the RC NET WORK option is selected, the system clock is gen­erated by an external resistor.
The main oscillator can be turned off (when the OSG ENABLED option is selected) by setting the OSCOFF bit of the ADC Control Register. The Low Frequency Auxiliary Oscillator is automatical ly started.
Figure 9. Oscillator Configurations
-
-
-
-
17/83
ST6253C ST6263C ST6263B ST6260C ST6260B
CLOCK SYSTEM (Cont’d)
Turning on the main oscillator is achieved by re­setting the OSCOFF bit of the A/D Converter Con­trol Register or by resetting the MCU. Restarting the main oscillator implies a delay comprising the oscillator start up delay period plus the duration of the software instruction at f

3.1.2 Low Frequency Auxiliary Oscillator (LFAO)

The Low Frequency Auxiliary Oscillator has three main purposes. Firstly, it can be used to reduce power consumption in non timing critical routines. Secondly, it offers a fully integrated system clock, without any external components. Lastly, it acts as a safety oscillator in case of main oscillator failure.
This oscillator is available when the OSG ENA­BLED option is selected. In this case, it automati­cally starts one of its periods after the first missing edge from the main oscillator, whatever the reason (main oscillator defective, no clock circuitry provid ed, main oscillator switched off...).
User code, normal interrupts, WAIT and STOP in­structions, are processed as normal, at the re­duced f cy is decreased, since the internal frequency is be-
frequency. The A/D converter accura-
LFAO
low 1MHz. At power on, the Low Frequency Auxiliary Oscilla-
tor starts faster than the Main Oscillator. It there­fore feeds the on-chip counter generating the POR delay until the Main Oscillator runs.
The Low Frequency Auxiliary Oscillator is auto­matically switched off as soon as the main oscilla­tor starts.
ADCR
Address: 0D1h — Read/Write
7 0
ADCR7ADCR6ADCR5ADCR4ADCR3OSC
Bit 7-3, 1-0= ADCR7-ADCR3, ADCR1-ADCR0: ADC Control Register. These bits are reserved for ADC Control.
Bit 2 = OSCOFF. When low, this bit enables main oscillator to run. The main oscillator is switched off when OSCOFF is high.

3.1.3 Oscillator Safe Guard

The Oscillator Safe Guard (OSG) affords drastical­ly increased operational integrity in ST62xx devic­es. The OSG circuit provides three basic func-
clock frequency.
LFAO
OFF
ADCR1ADCR
0
-
tions: it filters spikes from the oscillator lines which would result in over frequency to the ST62 CPU; it gives access to the Low Frequency Auxiliary Os cillator (LFAO), used to ensure minimum process­ing in case of main oscillator failure, to offer re­duced power consumption or to provide a fixed fre­quency low cost oscillator; finally, it automatically limits the internal clock frequency as a function of supply voltage, in order to ensure correct opera tion even if the power supply should drop.
The OSG is enabled or disabled by choosing the relevant OSG option. It may be viewed as a filter whose cross-over frequency is device dependent.
Spikes on the oscillator lines result in an effectively increased internal clock frequency. In the absence of an OSG circuit, this may lead to an over fre quency for a given power supply voltage. The OSG filters out such spikes (as illustrated in Figure
10). In all cases, when the OSG is active, the max
imum internal clock frequency, f
, which is supply voltage dependent. This re-
f
OSG
lationship is illustrated in Figure 13.
, is limited to
INT
When the OSG is enabled, the Low Frequency Auxiliary Oscillator may be accessed. This oscilla tor starts operating after the first missing edge of the main oscillator (see Figure 11).
Over-frequency, at a given power supply level, is seen by the OSG as spikes; it therefore filters out some cycles in order that the internal clock fre quency of the device is kept within the range the particular device can stand (depending on V and below f cy with OSG enabled.
: the maximum authorised frequen-
OSG
DD
),
Note. The OSG should be used wherever possible as it provides maximum safety. Care must be tak en, however, as it can increase power consump­tion and reduce the maximum operating frequency
.
to f
OSG
Warning: Care has to be taken when using the OSG, as the internal frequency is defined between a minimum and a maximum value and is not accu rate.
For precise timing measurements, it is not recom­mended to use the OSG and it should not be ena­bled in applications that use the SPI or the UART.
It should also be noted that power consumption in Stop mode is higher when the OSG is enabled (around 50µA at nominal conditions and room temperature).
-
-
-
-
-
-
-
-
18/83
ST6253C ST6263C ST6263B ST6260C ST6260B
(1)
VR001932
(3)
(2)
(4)
(1) (2) (3) (4)
Maximum Frequency for the device to work correctly Actual Quartz Crystal Frequency at OSCin pin Noise from OSCin
Resulting Internal Frequency
Main
VR001933
Internal
Emergency
Oscillator
Frequency
Oscillator
CLOCK SYSTEM (Cont’d)
Figure 10. OSG Filtering Principle
Figure 11. OSG Emergency Oscillator Principle
19/83
ST6253C ST6263C ST6263B ST6260C ST6260B
CLOCK SYSTEM (Cont’d) Oscillator Control Registers
Address: DCh — Write only Reset State: 00h
7 0
- - - -
Bit 7-4. These bits are not used. Bit 3. Reserved. Cleared at Reset. Must be kept
cleared. Bit 2. Reserved. Must be kept low. RS1-RS0. These bits select the division ratio of
the Oscillator Divider in order to generate the inter nal frequency. The following selctions are availa­ble:
OSCR
3
- RS1 RS0
RS1 RS0 Division Ratio
0 0 1 1
0 1 0 1
Note: Care is required when handling the OSCR register as some bits are write only. For this rea son, it is not allowed to change the OSCR contents while executing interrupt service routine, as the service routine cannot save and then restore its previous content. If it is impossible to avoid the writing of this register in interrupt service routine, an image of this register must be saved in a RAM location, and each time the program writes to
-
OSCR it must write also to the image register. The image register must be written first, so if an inter rupt occurs between the two instructions the OSCR is not affected.
1 2 4 4
-
-
20/83
ST6253C ST6263C ST6263B ST6260C ST6260B
MAIN
OSCILLATOR
OSG
LFAO
M U X
Core
: 13
:
12
:
1
TIMER 1
Watchdog
POR
f
INT
Main Oscillator off
OSCILLATOR
DIVIDER RS0,RS1
1
2.5
3.644.555.56
8
7
6
5
4
3
2
Maximum FREQUENCY (MHz)
SUPPLY VOLTAGE (V
DD
)
FUNCTIONALITY IS NOT
3
4
3
2
1
f
OSG
f
OSG
Min (at 85°C)
GUARANTEED
IN THIS AREA
VR01807J
f
OSG
Min (at 125°C)
CLOCK SYSTEM (Cont’d)
Figure 12. Clock Circuit Block Diagram
Figure 13. Maximum Operating Frequency (f
Notes:
1. In this area, operation is guaranteed at the
quartz crystal frequency.
2. When the OSG is disabled, operation in this
area is guaranteed at the crystal frequency. When the OSG is enabled, operation in this area is guar­anteed at a frequency of at least f
3. When the OSG is disabled, operation in this
OSG Min.
MAX
21/83
) versus Supply Voltage (VDD)
area is guaranteed at the quartz crystal frequency. When the OSG is enabled, access to this area is prevented. The internal frequency is kept a f
4. When the OSG is disabled, operation in this area is not guaranteed When the OSG is enabled, access to this area is prevented. The internal frequency is kept at f
OSG.
OSG.
ST6253C ST6263C ST6263B ST6260C ST6260B
INT LATCH CLEARED
NMI MASK SET
RESET
( IF PRESENT )
SELECT
NMI MODE FLAGS
IS RESET STILL
PRESENT?
YES
PUT FFEH
ON ADDRESS BUS
FROM RESET LOCATIONS
FFE/FFF
NO
FETCH INSTRUCTION
LOAD PC
VA000427

3.2 RESETS

The MCU can be reset in four ways: – by the external Reset input being pulled low; – by Power-on Reset; – by the digital Watchdog peripheral timing out. – by Low Voltage Detection (LVD)

3.2.1 RESET Input

The RESET pin may be connected to a device of the application board in order to reset the MCU if required. The RUN, WAIT or STOP mode. This input can be used to reset the MCU internal state and ensure a correct start-up procedure. The pin is active low and features a Schmitt trigger input. The internal Reset signal is generated by adding a delay to the external signal. Therefore even short pulses on
RESET pin are acceptable, provided VDD has
the completed its rising phase and that the oscillator is running correctly (normal RUN or WAIT modes). The MCU is kept in the Reset state as long as the RESET pin is held low.
If RESET activation occurs in the RUN or WAIT modes, processing of the user program is stopped (RUN mode only), the Inputs and Outputs are con figured as inputs with pull-up resistors and the main Oscillator is restarted. When the level on the RESET pin then goes high, the initialization se quence is executed following expiry of the internal delay period.
If RESET pin activation occurs in the STOP mode, the oscillator starts up and all Inputs and Outputs are configured as inputs with pull-up resistors. When the level of the the initialization sequence is executed following expiry of the internal delay period.

3.2.2 Power-on Reset

The function of the POR circuit consists in waking up the MCU by detecting around 2V a dynamic (rising edge) variation of the VDD Supply. At the beginning of this sequence, the MCU is configured in the Reset state: all I/O ports are configured as inputs with pull-up resistors and no instruction is executed. When the power supply voltage rises to a sufficient level, the oscillator starts to operate, whereupon an internal delay is initiated, in order to allow the oscillator to fully stabilize before execut ing the first instruction. The initialization sequence
RESET pin may be pulled low in
RESET pin then goes high,
is executed immediately following the internal de lay.
To ensure correct start-up, the user should take care that the VDD Supply is stabilized at a suffi cient level for the chosen frequency (see recom­mended operation) before the reset signal is re­leased. In addition, supply rising must start from 0V.
As a consequence, the POR does not allow to su­pervise static, slowly rising, or falling, or noisy (presenting oscillation) VDD supplies.
An external RC network connected to the RESET pin, or the LVD reset can be used instead to get the best performances.
Figure 14. Reset and Interrupt Processing
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ST6253C ST6263C ST6263B ST6260C ST6260B
RESET
RESET
VR02106A
time
V
Up
V
dn
V
DD
RESETS (Cont’d)

3.2.3 Watchdog Reset

The MCU provides a Watchdog timer function in order to ensure graceful recovery from software upsets. If the Watchdog register is not refreshed before an end-of-count condition is reached, the internal reset will be activated. This, amongst oth er things, resets the watchdog counter.
The MCU restarts just as though the Reset had been generated by the
RESET pin, including the
built-in stabilisation delay period.

3.2.4 LVD Reset

The on-chip Low Voltage Detector, selectable as user option, features static Reset when supply voltage is below a reference value. Thanks to this feature, external reset circuit can be removed while keeping the application safety. This SAFE RESET is effective as well in Power-on phase as in power supply drop with different reference val
Figure 15. LVD Reset on Power-on and Power-down (Brown-out)
ues, allowing hysteresis effect. Reference value in case of voltage drop has been set lower than the reference value for power-on in order to avoid any parasitic Reset when MCU start's running and sinking current on the supply.
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As long as the supply voltage is below the refer­ence value, there is a internal and static RESET command. The MCU can start only when the sup ply voltage rises over the reference value. There­fore, only two operating mode exist for the MCU: RESET active below the voltage reference, and running mode over the voltage reference as shown on the Figure 15, that represents a power- up, power-down sequence.
Note: When the RESET state is controlled by one of the internal RESET sources (Low Voltage De tector, Watchdog, Power on Reset), the RESET pin is tied to low logic level.
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3.2.5 Application Notes

No external resistor is required between VDD and the Reset pin, thanks to the built-in pull-up device.
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Direct external connection of the pin RESET to
must be avoided in order to ensure safe be-
V
DD
haviour of the internal reset sources (AND.Wired structure).
ST6253C ST6263C ST6263B ST6260C ST6260B
RESET
RESET
VECTOR
JP
JP:2 BYTES/4 CYCLES
RETI
RETI: 1 BYTE/2 CYCLES
INITIALIZATION ROUTINE
VA00181
V
DD
RESET
R
PU
R
ESD
1)
POWER
WATCHDOG RESET
CK
COUNTER
RESET
ST6 INTERNAL RESET
f
OSC
RESET
ON RESET
LVD RESET
VR02107A
AND. Wired
1) Resistive ESD protection. Value not guaranteed.
RESETS (Cont’d)

3.2.6 MCU Initialization Sequence

When a reset occurs the stack is reset, the PC is loaded with the address of the Reset Vector (locat ed in program ROM starting at address 0FFEh). A jump to the beginning of the user program must be coded at this address. Following a Reset, the In terrupt flag is automatically set, so that the CPU is in Non Maskable Interrupt mode; this prevents the initialisation routine from being interrupted. The in itialisation routine should therefore be terminated by a RETI instruction, in order to revert to normal mode and enable interrupts. If no pending interrupt is present at the end of the initialisation routine, the MCU will continue by processing the instruction immediately following the RETI instruction. If, how ever, a pending interrupt is present, it will be serv­iced.
Figure 17. Reset Block Diagram
Figure 16. Reset and Interrupt Processing
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ST6253C ST6263C ST6263B ST6260C ST6260B
RESETS (Cont’d)
Table 5Register Reset Status
Register Address(es) Status Comment
Oscillator Control Register EEPROM Control Register Port Data Registers Port Direction Register Port Option Register Interrupt Option Register TIMER Status/Control
AR TIMER Mode Control Register AR TIMER Status/Control 0 Register AR TIMER Status/Control 1 Register AR TIMER Compare Register
Miscellaneous Register SPI Registers SPI DIV Register SPI MOD Register SPI DSR Register
X, Y, V, W, Register Accumulator Data RAM Data RAM Page REgister Data ROM Window Register EEPROM A/D Result Register AR TIMER Load Register AR TIMER Reload/Capture Register
0DCh 0EAh 0C0h to 0C2h 0C4h to 0C6h 0CCh to 0CEh 0C8h 0D4h
0D5h 0D6h 0D7h
0DDh 0E0h to 0E2h 0E1h 0E2h 0E0h
080H TO 083H 0FFh 084h to 0BFh 0E8h 0C9h 00h to 03Fh 0D0h 0DBh 0D9h
00h 00h 00h 00h 00h 00h 00h
00h 00h 00h 00h
00h 00h 00h 00h
Undefined
Undefined
EEPROM disabled (if available) I/O are Input with pull-up I/O are Input with pull-up I/O are Input with pull-up Interrupt disabled TIMER disabled
AR TIMER stopped
SPI Output not connected to PC3 SPI disabled SPI disabled SPI disabled SPI disabled
As written if programmed
TIMER Counter Register TIMER Prescaler Register Watchdog Counter Register A/D Control Register
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0D3h 0D2h 0D8h 0D1h
FFh 7Fh FEh 40h
Max count loaded
A/D in Standby
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