ZigBee™ PRO modules based on the STM32W chipset
!-6
Features
■ 2.4 GHz IEEE 802.15.4-compliant SMD
modules based on the ST single chip
STM32W108CB featuring:
– Integrated 2.4 GHz transceiver
– PHY and MAC IEEE 802.15.4 features
– Integrated ARM
– Integrated 128 kB embedded Flash and 8
kB embedded RAM
– Integrated encryption (AES-128)
accelerator
– +3 dBm output power (+8 dBm in boost
mode)
– -99 dBm receiver sensitivity
■ Robust Wi-Fi and Bluetooth
■ 16 channels (IEEE 802.15.4 channel 11 to 26)
■ 24 general purpose I/O lines including
analogue inputs (all GPIOs of the
STM32W108CB are accessible)
■ Industry standard JTAG programming
■ Deep sleep current of sub 1 µA
■ Onboard 24 MHz and 32.768 kHz stable Xtal
■ Selectable chip integrated RC oscillator
■ Multiple antenna options: integrated antenna
(SPZB32W1A2.1) or integrated UFL connector
(SPZB32W1C2.1)
■ Single voltage supply (2.1 to 3.6 V)
■ FCC and CE compliant qualified
■ Small form factor: 16.4 x 26.5 mm
■ Operating temperature range: -40 °C to +85 °C
®
Cortex-M3 core
®
coexistence
SPZB32W1x2.1
July 2011 Doc ID 018899 Rev 2 1/19
www.st.com
19
Contents SPZB32W1x2.1
Contents
1 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2 RoHS compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3 Application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
4 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
5 Pin settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
5.1 Pin connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
6 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
6.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
6.2 Recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
6.3 DC electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
6.4 Digital I/O specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
6.5 RF electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
7 Mechanical dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
8 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
9 Product approvals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
9.1 FCC approvals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
9.2 European certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
10 Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
2/19 Doc ID 018899 Rev 2
SPZB32W1x2.1 Description
1 Description
SPZB32W1A2.1 and SPZB32W1C2.1 are ready-to-use ZigBee® modules optimized for
embedded applications that require low data rate communications. The modules are very
compact and enable OEMs to easily add wireless capabilities to electronic devices by
optimizing time-to-market, cost, size, and consumption of their target applications. No RF
experience or expertise is required to add this powerful wireless networking capability to the
final product.
The modules are based on the ST STM32W108CB single chip which integrates a 2.4 GHz,
IEEE 802.15.4-compliant transceiver together with an ARM
®
Cortex-M3 embedded
processor.
24 MHz high stability Xtal is available aboard the modules to perform the timing
requirements as per ZigBee specifications; additionally, a 32.768 kHz Xtal is also provided
onboard for low power operation.
A single supply voltage is requested to power the modules. The supply is in the range of 2.8
to 3.6 V.
An innovative 2.5 GHz RF design and the relevant internal RF amplifier onboard ensure the
optimal exploitation of the link budget, an excellent sensitivity and low power consumption
for battery powered operation.
The voltage supply also determines the I/O port level, allowing an easy interface with
additional peripherals.
To support user defined applications, a number of peripherals such as GPIO, UART, I
2
C,
ADC, and general purpose timers are available through the 24 configurable general purpose
I/O lines.
The modules can run the ZigBee PRO EmberZNet firmaware packages (ZigBee PRO stack)
which are accessible on the ST website.
Modules are available with two different antenna options:
● SPZB32W1A2.1, with an onboard integrated ceramic antenna
● SPZB32W1C2.1, with UFL RF connector for the connection of an external antenna.
Note: For details regarding STM32W108CB refer to the related datasheet available on the ST
website.
Doc ID 018899 Rev 2 3/19
RoHS compliance SPZB32W1x2.1
2 RoHS compliance
ST modules are RoHS compliant and comply with ECOPACK® norms.
3 Application
● Smart energy applications
● Machine2Machine industrial control
● Wireless sensor networks
● Home/building automation
● Smart appliances
● Wireless alarms and security systems
● Lighting control
● Remote monitoring
4/19 Doc ID 018899 Rev 2
SPZB32W1x2.1 Block diagram
4 Block diagram
Figure 1. SPZB32W1A2.1 block diagram
9GG
N+]
;WDO
;7$/
6,)
*3,2
670:
7UDQFHLYHU
&21756,*1
Figure 2. SPZB32W1C2.1 block diagram
9GG
6,)
*3,2
&21756,*1
N+]
;WDO
670:
7UDQFHLYHU
0+]
;WDO
0+]
;WDO
EDOXQ
EDOXQ
5)
DQWHQQD
%3)
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5)
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Doc ID 018899 Rev 2 5/19
Pin settings SPZB32W1x2.1
5 Pin settings
5.1 Pin connections
Figure 3. Pin connection diagram
Antenna
6/19 Doc ID 018899 Rev 2
TOP VIEW
AM09235V1
5.2 Pin description
Table 1. Pin description
Module pin n° Pin name Direction STM32W pin Description
Doc ID 018899 Rev 2 7/19
1
2
nBOOTMODE I 27 Embedded serial bootloader activation out of reset
TRACEDATA3 0 27 Synchronous CPU trace data bit 3
3
TRACEDATA2 O 26 Synchronous CPU trace data bit 2
SPZB32W1x2.1 Pin settings
PB5 I/O 43 Digital I/O
ADC0 Analog 43 ADC input 0
TIM2CLK I 43 Timer 2 external clock input
TIM1MSK I 43 Timer 1 external clock mask input
PA5 I/O 27 Digital I/O
ADC5 Analog 27 ADC input 1
PTI_DATA O 27 Frame signal of PTI (packet trace interface)
PA4 I/O 26 Digital I/O
ADC4 Analog 26 ADC input 0
PTI_EN O 26 Frame signal of PTI (packet trace interface)
PA3 I/O 25 Digital I/O
SC2nSSEL I 25 SPI slave select of serial controller 2
4
TIM2_CH2 I/O 25 Timer 2 channel 2 output (or input - disable remap with TIM2_OR[5])
TRACECLK O 25 Synchronous CPU trace clock
5 nRESET I 12 Active low reset (an internal pull-up of 30 kΩ typ. is provided)
PB3 I/O 19 Digital I/O
UART_CTS I 19 UART CTS handshake of serial controller 1
6
SC1SCLK I/O 19 SPI slave clock of serial controller SC1 / SPI master clock of serial controller SC1
TIM2_CH3 I/O 19 Timer 2 channel 3 input / timer 2 channel 3 output
8/19 Doc ID 018899 Rev 2
Table 1. Pin description (continued)
Module pin n° Pin name Direction STM32W pin Description
PB4 I/O 20 Digital I/O
UART_RTS O 20 UART RTS handshake of serial controller 1
7
TIM2_CH4 I/O 20 Timer 2 channel 4 input / timer 2 channel 4 output
SC1nSSEL I 20 SPI slave select of serial controller 1
PA0 I/O 21 Digital I/O
SC2MOSI O 21 SPI master data out of serial controller 2
8
SC2MOSI I 21 SPI slave data in of serial controller 2
TIM2_CH1 I/O 21 Timer 2 channel 1 input / timer 2 channel 1 output
PA1 I/O 22 Digital I/O
SC2MISO I 22 SPI master data in of serial controller 2
9
SC2MISO O 22 SPI slave data out of serial controller 2
SC2SDA I/O 22 TWI (I
TIM2_CH3 I/O 22 Timer 2 channel 3 input / timer 2 channel 3 output
PA2 I/O 24 Digital I/O
SC2SCLK O 24 SPI master clock of serial controller 2
2
C) data of serial controller 2
Pin settings SPZB32W1x2.1
10
SC2SCLK I 24 SPI slave clock of serial controller 2
SC2SCL I/O 24 TWI (I2C) clock of serial controller 2
TIM2_CH4 I/O 24 Timer 2 channel 4 input / timer 2 channel 4 output
11 GND -- 49 Ground
12 VDD Power 16,23,28,37 Input power supply
PC1 I/O 38 Digital I/O
ADC3 Analog 38 ADC input 3
13
SWO O 38 Serial wire output synchronous trace output to debugger
TRACEDATA0 O 38 Synchronous CPU trace data bit 0
Table 1. Pin description (continued)
Module pin n° Pin name Direction STM32W pin Description
PB0 I/O 36 Digital I/O
VREF (O/I) Analog 36 ADC reference output / ADC reference input
14
15
Doc ID 018899 Rev 2 9/19
16
TIM1CLK I 36 Timer 1 external clock input
TIM2MSK I 36 Timer 2 external clock mask input
IRQA I 36 External interrupt source A
TRACECLK O 36 Synchronous CPU trace clock
PB1 I/O 30 Digital I/O
SC1TXD O 30 UART transmit data of serial controller 1
SC1MOSI / SC1MISO O 30 SPI master data out of serial controller 1 / SPI slave data out of serial controller 1
SC1SDA I/O 30 TWI (I2C) data of serial controller 1
TIM2_CH1 I/O 30 Timer 2 channel 1 input / timer 2 channel 1 output
PB2 I/O 31 Digital I/O
SC1RXD I 31 UART receive data of serial controller 1
SC1MISO / SC1MOSI I 31 SPI master data in of serial controller SC1 / SPI slave data in of serial controller 1
SC1SCL I/O 31 TWI (I2C) clock of serial controller 1
SPZB32W1x2.1 Pin settings
17
18
19
20
TIM2_CH2 I/O 31 Timer 2 channel 2 input / timer 2 channel 2 output
JTCK I 32 JTAG clock input from debugger
SWCLK I/O 32 Serial wire clock input/output with debugger
PC2 I/O 33 Digital I/O
JTDO O 33 JTAG data out to debugger
SWO O 33 Serial wire output synchronous trace output to debugger
PC3 I/O 34 Digital I/O
JTDI I 34 JTAG data in from debugger
PC4 I/O 35 Digital I/O
JTMS I 35 JTAG mode select from debugger
SWDIO I/O 35 Serial wire bidirectional data to/from debugger
10/19 Doc ID 018899 Rev 2
Table 1. Pin description (continued)
Module pin n° Pin name Direction STM32W pin Description
PC0 I/O 40 Digital I/O (high current)
JRST I 40 JTAG reset input from debugger
21
TRACEDATA1 O 40 Synchronous CPU trace data bit 1
IRQD I 40 External interrupt source D
PB7 I/O 41 Digital I/O
TIM1_CH2 O 41 Timer 1 channel 2 output
22
TIM1 _CH2 I 41 Timer 1 channel 2 input
IRQC I 41 External interrupt source C
ADC2 I 41 ADC input 2
PB6 I/O 42 Digital I/O
TIM1_CH1 O 42 Timer 1 channel 1 output
23
TIM1_CH1 I 42 Timer 1 channel 1 input
IRQB I 42 External interrupt source B
ADC1 Analog 42 ADC input 1
PA6 I/O 29 Digital I/O
Pin settings SPZB32W1x2.1
24
25
26
TIM1_CH3 O 29 Timer 1 channel 3 output
TIM1_CH3 I 29 Timer 1 channel 3 input
PA7 I/O 18 Digital I/O
TIM1_CH4 O 18 Timer 1 channel 4 output
TIM1_CH4 I 18 Timer 1 channel 4 input
REG_EN O 18 External regulator open drain output (enabled after reset)
PC5 I/O 11 Digital I/O
TX_ACTIVE O 11 Logic level control for external Rx/Tx switch
SPZB32W1x2.1 Electrical characteristics
6 Electrical characteristics
6.1 Absolute maximum ratings
Table 2. Absolute maximum ratings
Symbol Parameter Min. Max. Unit
V
DD
V
in
T
stg
T
sold
Module supply voltage - 0.3 3.6 V
Input voltage on any digital pin - 0.3 Vdd + 0.3 V
Storage temperature -40 +85 °C
Soldering temperature < 10s 250 °C
6.2 Recommended operating conditions
Table 3. Recommended operating conditions
Symbol Parameter Conditions Min. Typ. Max. Unit
V
T
Module supply voltage -40 °C < T < +85 °C 2.8 3.3 3.6 V
DD
Operating ambient temperature -40 +85 °C
stg
6.3 DC electrical characteristics
Table 4. DC electrical characteristics
Symbol Parameter Conditions Min. Typ. Max. Unit
IRX RX current Vdd = 3.3 V, T= 25 °C - 28 - mA
ITX TX current
Po = 3 dBm, Vdd = 3.3 V,
T = 25 °C, F = 2450MHz
- 32 - mA
IDS
Deep sleep current
(32.768 kHz oscillator)
Vdd = 3.3 V, T = 25 °C - 1.3 - µA
Doc ID 018899 Rev 2 11/19
Electrical characteristics SPZB32W1x2.1
6.4 Digital I/O specifications
Table 5. Digital I/O specifications
Symbol Parameter Conditions Min. Typ. Max. Unit
V
Low level input voltage 2.1 < Vdd < 3.6 V 0 0.5 x Vdd V
IL
High level input voltage 2.1 < Vdd < 3.6 V 0.62 x Vdd Vdd V
V
IH
Input current for logic 0 2.1 < Vdd < 3.6 V -0.5 mA
I
il
I
Input current for logic 1 2.1 < Vdd < 3.6 V 0.5 mA
ih
R
R
V
V
I
I
I
I
I
Input pull-up resistor 30 kΩ
ipu
Input pull-down resistor 30 kΩ
ipd
Low level output voltage 0 0.18 x Vdd V
OL
High level output voltage 0.82 x Vdd Vdd V
OH
Output source current (standard) 4 mA
OHS
Output sink current (standard) 4 mA
OLS
Output source current (high current) 8 mA
OHH
Output sink current (high current) 8 mA
OLH
Total output current for I/O 40 mA
OTot
6.5 RF electrical characteristics
Table 6. Electrical characteristics
Symbol Parameter Conditions Min. Typ. Max. Unit
Frequency range Vdd = 3.3 V, T= 25 °C 2405 2480 MHz
TX Output power Vdd = 3.3 V, T= 25 °C 3 6 dBm
RX Sensitivity Vdd = 3.3 V, 1 % PER -95 - 97 dBm
Adjacent channel rejection
±5 MHz
±10 MHZ
35
40
dBm
12/19 Doc ID 018899 Rev 2
SPZB32W1x2.1 Mechanical dimensions
7 Mechanical dimensions
Figure 4. Mechanical dimensions
Figure 5. Pin land pattern (dimensions in mm)
Pitch = 1.27
Recommended land pattern top view
AM09234V1
Doc ID 018899 Rev 2 13/19
Soldering SPZB32W1x2.1
8 Soldering
The soldering phase must be carefully executed; in order to avoid undesired melting
phenomenon, particular attention must be paid to the set-up of the peak temperature.
Below are some suggestions for the temperature profile based on IPC/JEDEC J-STD-020C,
July 2004 recommendations
Table 7. Soldering
Profile feature PB free assembly
Average ramp up rate (T
to TP) 3 °C / sec max.
SMAX
Preheat
Temperature min. (T
Temperature max. (T
Time (T
S MIN
to T
S MAX
S MIN
S MAX
) (tS)
)
)
150 °C
200 °C
60 – 100 sec
Time maintained above:
Temperature T
Time t
L
Peak temperature (T
L
)240 + 0 °C
p
Time within 5 °C of actual peak temperature (t
) 10 – 20 sec
P
217 °C
40 – 70 sec
Ramp down rate 6 °C / sec
Time from 25 °C to peak temperature 8 minutes max.
Figure 6. Soldering profile
14/19 Doc ID 018899 Rev 2
SPZB32W1x2.1 Product approvals
9 Product approvals
These modules have been designed to meet national regulations for world wide use. In
particular the following certifications have been obtained
9.1 FCC approvals
The SPZB32W1A2.1 device, with integrated antenna, as well as the SPZB32W1C2.1, with
the antenna specified in Table 8, have been tested and found to comply with the limits for a
Class B digital device, pursuant to part 15 of the FCC rules. These limits are designed to
provide reasonable protection against harmful interference in a residential installation. This
equipment generates, uses, and can radiate, radio frequency energy and, if not installed and
used in accordance with the instructions, may cause harmful interference to radio
communications.
However, there is no guarantee that interference can not occur in a particular installation.
If this equipment does cause harmful interference to radio or television reception, which can
be determined by turning the equipment off and on, the user is encouraged to try to correct
the interference by one or more of the following measures:
● Reorient or relocate the receiving antenna
● Increase the separation between the equipment and receiver
● Connect the equipment to an outlet on a circuit different from that to which the receiver
is connected
Consult the dealer or an experienced radio/TV technician for help.
Module type: ZigBee
®
module, SPZB32W1A2.1 / SPZB32W1C2.1
FCC-ID: S9NZB32C2
Modular type: single modular
Table 8. FCC approvals
ITEM Part No. Manufacturer
1 2010B4844-01 (Titanis Antenna) Antenova
Any changes or modifications not expressly approved by the part responsible for compliance
may cause the module to cease to comply with FCC rules part 15, and therefore render void
the user’s authority to operate the equipment.
While the applicant for a device into which the SPZB32W1A2.1 or the SPZB32W1C2.1 with
the antenna specified in Table 8 installed is not required to obtain new authorization for the
module, this does not preclude the possibility that some other form of authorization or
testing may be required for the end product.
Doc ID 018899 Rev 2 15/19
Product approvals SPZB32W1x2.1
FCC labelling requirements
When integrating the SPZB32W1A2.1 / SPZB32W1C2.1 into the final product, it must be
ensured that the FCC labelling requirements, as specified below, are satisfied.
Based on the Public Notice from FCC, the product into which the ST transmitter module is
installed must display a label referring to the enclosed module.
The label should use wording such as “Contains Transmitter module FCC ID: S9NZB32C2
or “Contains FCC ID: S9NZB32C2, any similar wording that expressed the same meaning
may be used.
An example is:
Contains FCC ID: S9NZB32C2
9.2 European certification
The SPZB32W1A2.1 and the SPZB32W1C2.1 devices are CE certified:
Expert opinion N. 0365-ARAKO0071 released by IMQ refers to the following normatives:
● Radio: EN300 328: V1.7.1: 2006-10
● EMS: EN301 489-17 v 2.1.1: 2009
● Safety: EN60950-1:2006 + A11:2009
16/19 Doc ID 018899 Rev 2
SPZB32W1x2.1 Ordering information scheme
10 Ordering information scheme
Table 9. Ordering information scheme
SPZB 32W1 A 2
ZigBee modules
Based on STM32W108CB
A: Integrated antenna
C: Integrated UFL connector
2: Normal TX range
1: Long TX range
.1
ZigBee PRO (EmberZnet)
Doc ID 018899 Rev 2 17/19
Revision history SPZB32W1x2.1
11 Revision history
Table 10. Document revision history
Date Revision Changes
22-Jun-2011 1 Initial release.
Updated single voltage supply in features on cover
page.
Updated Table 4: DC electrical characteristics.
Updated test conditions in Table 5: Digital I/O
25-Jul-2011 2
specifications.
Removed CFE parameter in Table 5: Digital I/O
specifications.
Updated description of letter C inTable 9: Ordering
information scheme.
Minor text changes.
18/19 Doc ID 018899 Rev 2
SPZB32W1x2.1
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Doc ID 018899 Rev 2 19/19
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