802.15.4 long range modules based on the STM32W chipset
Features
■ 2.4 GHz IEEE 802.15.4-compliant SMD
modules based on the ST STM32W chipset
solution featuring:
– Integrated 2.4 GHz transceiver
– PHY and MAC IEEE 802.15.4 features
– Integrated ARM
– Integrated embedded Flash and RAM
– Integrated encryption (AES-128)
accelerator
■ Power amplified RF performances:
– Up to 20 dBm nominal TX output power
– Up to 105 dBm RX sensitivity
■ Robust Wi-Fi and Bluetooth
■ 16 channels (IEEE 802.15.4 channel 11 to 26)
■ Multiple configurable interfaces available
(UART, SPI, I
■ Industry standard JTAG programming
■ Onboard 24 MHz and 32.768 kHz stable Xtal
■ Less than 2 µA typ. power consumption in deep
sleep mode (32.768 Xtal)
■ Multiple antenna options: integrated antenna or
integrated UFL connector
■ Multiple protocol stack options
■ Single voltage supply (2.1 to 3.6 V)
■ FCC and CE compliant qualified
■ Small form factor: 16.4 x 26.5 mm
■ Operating temperature range: -40 °C to
+85 °C.
®
Cortex-M3 core
2
C, ADC, GPIOs)
®
coexistence
SPZB32W1x1.4
Datasheet − production data
May 2012 Doc ID 022933 Rev 1 1/19
This is information on a product in full production.
www.st.com
19
Contents SPZB32W1x1.4
Contents
1 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2 RoHS compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3 Application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
4 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
5 Pin settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
5.1 Pin connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
6 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
6.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
6.2 Recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
6.3 DC electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
6.4 Digital I/O specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
6.5 RF electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
7 Mechanical dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
8 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
9 Product approval . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
9.1 FCC approval . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
9.1.1 FCC labeling requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
9.2 European certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
10 Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
2/19
SPZB32W1x1.4 Description
1 Description
The SPZB32W1x.4 is a ready-to-use device, compliant with IEEE 802.15.4 and power
amplified RF modules optimized for embedded applications. It requires low data rate
communication and high transmission range capabilities based on the STM32W single chip,
which integrates a 2.4 GHz, IEEE 802.15.4-compliant transceiver together with an ARM
Cortex embedded processor.
The modules are very compact and enable OEMs to easily add wireless capabilities to
electronics devices by optimizing time-to-market, cost, size, and consumption of their target
applications. No RF experience or expertise is required to add this powerful networking
capability to the final product.
24 MHz high stability Xtal is available onboard the modules to perform the timing
requirements as per IEEE 802.15.4 specifications; additionally a 32.768 kHz Xtal is also
provided onboard for low power operation.
A single supply voltage is requested to power the modules. The supply is in the range of 2.1
to 3.6 V. The voltage supply also determines the I/O ports level allowing an easy interface
with additional peripherals.
An advanced solution integrating PA and LNA in a single package is onboard to ensure
excellent power transmission and receiver sensitivity performances.
To support user defined applications, a number of peripherals such as GPIO, UART, I
ADC and general purpose timers are available and user selectable.
®
2
C,
The size and footprint of this series of modules is equivalent to that of the series
SPZB32W1x2.4 to facilitate the evaluation of the different range options on the target
application.
The SPZB32W1x1.4 is based on the STM32W108CB chipset integrating 128 kB of
embedded flash memory and 8 kB of RAM available for data and program storage.
For technical details on the STM32W108CB chipset refer to the related datasheet. For
technical details on the supported stacks refer to the related user guides and application
notes available on the ST website.
Doc ID 022933 Rev 1 3/19
RoHS compliance SPZB32W1x1.4
2 RoHS compliance
ST modules are RoHS compliant and comply with ECOPACK® norms.
3 Application
● Smart energy applications
● Machine2Machine industrial control
● Wireless sensor networks
● Home/building automation
● Smart appliances
● Wireless alarms and security systems
● Lighting control
● Remote monitoring
4/19
SPZB32W1x1.4 Block diagram
4 Block diagram
Figure 1. SPZB32W1A1.4 block diagram
6$$
'0)/S
*TAG
3YSTEMSIGNALS
K(Z
8TAL
34- 73OC
Figure 2. SPZB32W1C1.4 block diagram
6$$
'0)/S
*TAG
3YSTEMSIGNALS
K(Z
8TAL
34- 73O#
- ( Z
8T AL
- ( Z
8T AL
,.!
0!
,.!
0!
2&
ANT ENNA
"0&
".W
"0&
5&)
#ONNECTOR
".W
Doc ID 022933 Rev 1 5/19
Pin settings SPZB32W1x1.4
5 Pin settings
5.1 Pin connections
Figure 3. Pin connection diagram
Antenna
6/19
TOP VIEW
AM09235v1
SPZB32W1x1.4 Pin settings
5.2 Pin description
Table 1. Pin description
Module
pin n°
Pin name Direction
PB5 I/O 43 Digital I/O
ADC0 Analog 43 ADC input 0
1
TIM2CLK I 43 Timer 2 external clock input
TIM1MSK I 43 Timer 1 external clock mask input
PA5 I/O 27 Digital I/O
ADC5 Analog 27 ADC input 1
2
PTI_DATA O 27 Frame signal of PTI (packet trace interface)
nBOOTMODE I 27 Embedded serial bootloader activation out of reset
TRACEDATA3 0 27 Synchrounus CPU trace data bit 3
PA4 I/O 26 Digital I/O
ADC4 Analog 26 ADC input 0
3
PTI_EN O 26 Frame signal of PTI (packet trace interface)
TRACEDATA2 O 26 Synchrounus CPU trace data bit 2
PA3 I/O 25 Digital I/O
SC2nSSEL I 25 SPI SLAVE SELECT of serial controller 2
4
TIM2_CH2 I/O 25
TRACECLK O 25 Synchrounus CPU trace clock
STM32W
pin
Description
Timer 2 channel 2 output (or input - disable remap with
TIM2_OR[5])
5 nRESET I 12
PB3 I/O 19 Digital I/O
UART_CTS I 19 UART CTS handshake of serial controller 1
6
SC1SCLK I/O 19
TIM2_CH3 I/O 19 Timer 2 channel 3 input / timer 2 channel 3 output
PB4 I/O 20 Digital I/O
UART_RTS O 20 UART RTS handshake of serial controller 1
7
TIM2_CH4 I/O 20 Timer 2 channel 4 input / timer 2 channel 4 output
SC1nSSEL I 20 SPI slave select of serial controller 1
PA0 I/O 21 Digital I/O
SC2MOSI O 21 SPI master data out of serial controller 2
8
SC2MOSI I 21 SPI slave data in of serial controller 2
TIM2_CH1 I/O 21 Timer 2 channel 1 input / timer 2 channel 1 output
Doc ID 022933 Rev 1 7/19
Active low reset (an internal pull-up of 30 kohm typ. is
provided)
SPI slave clock of serial controller SC1 / SPI master
clock of serial controller SC1
Pin settings SPZB32W1x1.4
Table 1. Pin description (continued)
Module
pin n°
Pin name Direction
STM32W
pin
PA1 I/O 22 Digital I/O
SC2MISO I 22 SPI master data in of serial controller 2
9
SC2MISO O 22 SPI slave data out of serial controller 2
SC2SDA I/O 22 TWI (I
TIM2_CH3 I/O 22 Timer 2 channel 3 input / timer 2 channel 3 output
PA2 I/O 24 Digital I/O
SC2SCLK O 24 SPI master clock of serial controller 2
10
SC2SCLK I 24 SPI slave clock of serial controller 2
SC2SCL I/O 24 TWI (I2C) clock of serial controller 2
TIM2_CH4 I/O 24 Timer 2 channel 4 input / timer 2 channel 4 output
11 GND -- 49 Ground
12 VDD Power
16,23,28,
37
Input power supply
PC1 I/O 38 Digital I/O
ADC3 Analog 38 ADC Input 3
13
SWO O 38 Serial wire output synchronous trace output to debugger
TRACEDATA0 O 38 Synchronous CPU trace data bit 0
Description
2
C) data of serial controller 2
14
15
16
PB0 I/O 36 Digital I/O
VREF (O/I) Analog 36 ADC reference output / ADC reference input
TIM1CLK I 36 Timer 1 external clock input
TIM2MSK I 36 Timer 2 external clock mask input
IRQA I 36 External interrupt source A
TRACECLK O 36 Synchronous CPU trace clock
PB1 I/O 30 Digital I/O
SC1TXD O 30 UART transmit data of serial controller 1
SC1MOSI /
SC1MISO
O30
SC1SDA I/O 30 TWI (I
SPI master data out of serial controller 1 / SPI slave
data out of serial controller 1
2
C) data of serial controller 1
TIM2_CH1 I/O 30 Timer 2 channel 1 input / timer 2 channel 1 output
PB2 I/O 31 Digital I/O
SC1RXD I 31 UART receive data of serial controller 1
SC1MISO /
SC1MOSI
I31
SC1SCL I/O 31 TWI (I
SPI master data in of serial controller SC1 / SPI slave
data in of serial controller 1
2
C) clock of serial controller 1
TIM2_CH2 I/O 31 Timer 2 channel 2 input / timer 2 channel 2 output
8/19
SPZB32W1x1.4 Pin settings
Table 1. Pin description (continued)
Module
pin n°
17
18
19
20
21
Pin name Direction
JTCK I 32 JTAG clock input from debugger
SWCLK I/O 32 Serial wire clock input/output with debugger
PC2 I/O 33 Digital I/O
JTDO O 33 JTAG data out to debugger
SWO O 33
PC3 I/O 34 Digital I/O
JTDI I 34 JTAG data in from debugger
PC4 I/O 35 Digital I/O
JTMS I 35 JTAG mode select from debugger
SWDIO I/O 35 Serial wire bidirectional data to/from debugger
PC0 I/O 40 Digital I/O (high current)
JRST I 40 JTAG reset input from debugger
TRACEDATA1 O 40 Synchronous CPU trace data bit 1
IRQD I 40 External interrupt source D
PB7 I/O 41 Digital I/O
TIM1_CH2 O 41 Timer 1 channel 2 output
STM32W
pin
Description
Serial wire output asynchronous trace output to
debugger
22
23
24
TIM1 _CH2 I 41 Timer 1 channel 2 input
IRQC I 41 External interrupt source C
ADC2 I 41 ADC input 2
PB6 I/O 42 Digital I/O
TIM1_CH1 O 42 Timer 1 channel 1 output
TIM1_CH1 I 42 Timer 1 channel 1 input
IRQB I 42 External interrupt source B
ADC1 Analog 42 ADC input 1
Digital input, module firmware dependent, externally
forced by the user dedicated firmware. This signal is
LNA/ENABLE I 29
PA6/LNA_ENABLE O 29
dedicated to manage the SIGE-SE2432L internal LNA.
(HIGH= internal LNA enabled, LOW= internal LNA
disabled).
Digital output, module firmware dependent, internally
forced by application dedicated firmware. This signal is
dedicated to manage the SIGE-SE2432L internal LNA.
(HIGH= internal LNA enabled, LOW= internal LNA
disabled).
Doc ID 022933 Rev 1 9/19
Pin settings SPZB32W1x1.4
Table 1. Pin description (continued)
Module
pin n°
25
Pin name Direction
RF_STANDBY I 18
PA7/RF_STANDBY O 18
STM32W
pin
Description
Digital input, module firmware dependent, externally
forced by the user dedicated firmware. This signal is
dedicated to manage the SIGE-SE2432L front-end
STANDBY state.
(HIGH= front-end enabled, LOW= front-end forced into
STANDBY state).
Digital output, module firmware dependent, internally
forced by application dedicated firmware. This signal is
dedicated to manage the SIGE-SE2432L front-end
STANDBY state.
(HIGH= front-end enabled, LOW= front-end forced into
STANDBY state).
10/19
SPZB32W1x1.4 Electrical characteristics
6 Electrical characteristics
6.1 Absolute maximum ratings
Table 2. Absolute maximum ratings
Symbol Parameter Min. Max. Unit
VDD Module supply voltage - 0.3 3.6 V
V
in
T
stg
T
sold
Input voltage on any digital pin - 0.3 VDD + 0.3 V
Storage temperature -40 +85 °C
Soldering temperature < 10s 250 °C
6.2 Recommended operating conditions
Table 3. Recommended operating conditions
Symbol Parameter Conditions Min. Typ. Max. Unit
VDD Module supply voltage -40 °C < T < +85 °C 2.1 3.3 3.6 V
T
Operating ambient temperature -40 +85 °C
stg
6.3 DC electrical characteristics
Table 4. DC electrical characteristics
Symbol Parameter Conditions Min. Typ. Max. Unit
IRX RX current VDD = 3.3 V, T= 25 °C - 20 - mA
ITX TX current
Po = 18 dBm, VDD = 3.3 V,
T = 25 °C, F= 2450 MHz
- 120 - mA
IDS
Deep sleep current
(32.768 kHz oscillator)
VDD = 3.3 V, T = 25 °C - 1.3 - mA
Doc ID 022933 Rev 1 11/19
Electrical characteristics SPZB32W1x1.4
6.4 Digital I/O specifications
Table 5. Digital I/O specifications
Symbol Parameter Conditions Min. Typ. Max. Unit
V
Low level input voltage 2.1 < VDD < 3.6 V 0 0.5 x VDD V
IL
V
High level input voltage 2.1 < VDD < 3.6 V
IH
Input current for logic 0 2.1 < VDD < 3.6 V -0.5 mA
I
il
I
Input current for logic 1 2.1 < VDD < 3.6 V 0.5 mA
ih
R
R
V
Input pull-up resistor 30 kΩ
ipu
Input pull-down resistor 30 kΩ
ipd
Low level output voltage 0
OL
0.62 x
VDD
VDD V
0.18 x
VDD
V
V
I
OHS
I
OLS
I
OHH
I
OLH
I
OTot
High level output voltage
OH
Output source current (standard) 4 mA
Output sink current (standard) 4 mA
Output source current (high current) 8 mA
Output sink current (high current) 8 mA
Total output current for I/O 40 mA
0.82 x
VDD
VDD V
6.5 RF electrical characteristics
Table 6. Electrical characteristics
Symbol Parameter Conditions Min. Typ. Max. Unit
Frequency range VDD = 3.3 V, T= 25 °C 2405 2480 MHz
TX Output power VDD = 3.3 V, T= 25 °C 20 dBm
RX Sensitivity VDD = 3.3 V, 1% PER -105 dBm
Adjacent channel rejection
±5 MHz
±10 MHZ
35
40
dBm
12/19
SPZB32W1x1.4 Mechanical dimensions
7 Mechanical dimensions
Figure 4. Mechanical dimensions
0.85
1.00
TOP VIEW
1
0.6
pitch = 1.27mm
Tolerances=±0.025mm
2.17
1.15
12
0.7
Scale 10:1
13.90
0.7
13
0.6
1.35
1
BOTTOM VIEW
Figure 5. Pin land pattern (dimensions in mm)
18.30
13.97 (11x1.27)
15.24 (12x1.27)
26.50
3.70
1.27
2.55
1
2.50
16.40
Antenna
25
RECOMMENDED LAND PATTERN TOP VIEW
pitch = 1.27
12
16.4
13
2.17
Doc ID 022933 Rev 1 13/19
1
2
1
25
26.5
AM09234v1
Soldering SPZB32W1x1.4
8 Soldering
The soldering phase must be carefully executed; in order to avoid undesired melting
phenomenon, particular attention must be paid to the set-up of the peak temperature.
Below are some suggestions for the temperature profile based on IPC/JEDEC J-STD-020C,
July 2004 recommendations.
Table 7. Soldering
Profile feature PB free assembly
Average ramp-up rate (T
to TP) 3 °C / sec max.
SMAX
Preheat
Temperature min. (T
Temperature max. (T
Time (T
S MIN
to T
S MAX
S MIN
S MAX
) (tS)
)
)
150 °C
200 °C
60 – 100 sec
Time maintained above:
Temperature T
Time t
L
Peak temperature (T
L
) 240 + 0 °C
p
Time within 5 °C of actual peak temperature (t
) 10 – 20 sec
P
217 °C
40 – 70 sec
Ramp-down rate 6 °C / sec
Time from 25 °C to peak temperature 8 minutes max.
Figure 6. Soldering profile
14/19
AM12858v1
SPZB32W1x1.4 Product approval
9 Product approval
These modules have been designed to meet national regulations for world wide use. They
are mechanically and electrically equivalent to the modules SPZB32W1A1.1
SPZB32W1C1.1
(a)
explicated with the last digit of the device part number. CE and FCC certifications have been
obtained for SPZB32W1A1.1 and SPZB32W1C1.1 as models representative of the
complete series SPZB32Wxyz1.t of 802.15.4/Zigbee RF modules. Each representative of
the series does not degrade the characteristics granted by the certification organisms on the
indicated model used during the certification process.
9.1 FCC approval
The SPZB32W1A1.1 device, with integrated antenna, as well as the SPZB32W1C1.1, with
the antenna specified in Ta bl e 8 , have been tested and found to comply with the limits for a
Class B digital device, pursuant to part 15 of the FCC rules. These limits are designed to
provide reasonable protection against harmful interference in a residential installation.
This equipment generates, uses, and can radiate radio frequency energy and, if not installed
and used in accordance with the instructions, may cause harmful interference to radio
communications.
However, there is no guarantee that interference does not occur in a particular installation. If
this equipment does cause harmful interference to radio or television reception, which can
be determined by turning the equipment off and on, the user is encouraged to try to correct
the interference by one or more of the following measures:
● Reorient or relocate the receiving antenna
● Increase the separation between the equipment and receiver
● Connect the equipment into an outlet on a circuit different from that to which the
receiver is connected.
(a)
and
, differing only in terms of the SW that they are enabled to run. This fact is
Consult the dealer or an experienced radio/TV technician for help.
Module type: ZigBee® module SPZB32W1A1.1 / SPZB32W1C1.1
FCC-ID: S9NZB32C1
Modular type: single modular
Table 8. Antenna used for FCC approvals
ITEM Part N° Manufacturer
1 2010B4844-01 (Titanis Antenna) Antenova
Any changes or modifications not expressly approved by the part responsible for compliance
may cause the module to cease to comply with FCC rules part 15, and therefore void the
user’s authority to operate the equipment.
a. Device used for testing only and is not available for purchase.
Doc ID 022933 Rev 1 15/19
Product approval SPZB32W1x1.4
While the user of a device into which the SPZB32W1A1.1 or the SPZB32W1C2.1, with the
antenna specified in Tab le 8 , is installed, they are not required to obtain new authorization
for the module, this does not preclude the possibility that some other form of authorization or
testing may be required for the end product.
9.1.1 FCC labeling requirements
When integrating the SPZB32W1A1.1 / SPZB32W1C1.1 into the final product, it must be
ensured that the FCC labelling requirements, as specified below, are satisfied.
Based on the public notice from FCC, the product into which the transmitter module is
installed must display a label referring to the enclosed module.
The label should use wording such as “Contains Transmitter module FCC ID: S9NZB32C1
or “Contains FCC ID: S9NZB32C1”, any similar wording that expresses the same meaning
may be used.
For example:
Contains FCC ID: S9NZB32C1
9.2 European certification
SPZB32W1A1.1 and SPZB32W1C2.1 devices are CE certified:
0051
Expert opinion N. 0420-ARAL00045 released by IMQ refers to the following normative:
Art. 3.1a Health : EN 62311 : 2008
Art .3.1a Safety : EN 60950-1:2006 + A11:2009 + A1:2010
Art. 3.1b EMC: EN 301 489-1 V.1.8.1:2008 / EN 301 489- 17 V 2.1.1:2009
Art.3.2 Radio Spectrum: EN 300 328: V1.7.1:2006
16/19
SPZB32W1x1.4 Ordering information scheme
10 Ordering information scheme
Table 9. Ordering information scheme
SPZB 32Wx y 1
802.15.4 / ZigBee modules
Memory options:
1: 128 kB Flash; 8 kB RAM
Antenna options:
x --> A: Integrated ceramic antenna
x --> C: Integrated UFL connector
.z
1: Long TX range
Firmware options:
4: SimpleMAC
Note: Check availability of the different versions with your ST sales representative.
Doc ID 022933 Rev 1 17/19
Revision history SPZB32W1x1.4
11 Revision history
Table 10. Document revision history
Date Revision Changes
07-May-2012 1 Initial release.
18/19
SPZB32W1x1.4
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Doc ID 022933 Rev 1 19/19
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