ST SPZB260C-PRO User Manual

Low-power, compact ZigBee® module
Features
transceiver: – + 3 dBm nominal TX output power (at UFL
connector level) – + 5 dBm in boost mode – -95 dBm (typ) RX sensitivity – RX filtering for co-existence with IEEE
802.11g and Bluetooth
– Integrated VCP and loop filter
SPI or UART interface available for connection
with a host processor
On-board 24 MHz stable Xtal
Operates in the -40 °C to +85 °C industrial
temperature range
1 µA power consumption in deep sleep mode
Pins available for non-intrusive debug interface
(SIF)
Single supply voltage (2.1 V to 3.6 V)
Integrated RF UFL connector for external
antenna
CE and RoHS compliant
FCC compliant (FCC ID: S9NZB260B)
®
devices
SPZB260C-PRO
Description
The SPZB260C-PRO is a low power, compact ZigBee applications. It enables OEMs to easily add wireless capability to electronic devices.
The module is based on the EM260 ZigBee network processor, which integrates a 2.4 GHz IEEE 802.15.4 compliant transceiver and IEEE
802.15.4 PHY and MAC.
A single supply voltage is required to power the module. The voltage supply also determines the I/O port level, allowing easy integration with the target device. The module integrates an RF UFL connector, allowing the use of an external antenna.
®
module optimized for embedded
Applications
The EM260 provides an SPI-based serial interface (EZSP - EmberZNet serial protocol) or
Industrial control
Sensor networking
Monitoring of remote systems
Home appliances
Security systems
Lighting control
Metering
September 2010 Doc ID 17301 Rev 1 1/15
UART interface to the EmberZNet APIs, both accessible from the module.
The module is shipped with the EmberZnet PRO version 3.3.1 loaded into the Flash memory for use of the SPI-based serial interface.
For details or additional information, please refer to the EM260 datasheet available on the Ember Corporation website.
www.st.com
15
Contents SPZB260C-PRO
Contents
1 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2 Pin information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1 Pin connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3.2 Operating ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
4 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
4.1 DC electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
4.2 DC I/O specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
4.3 RF electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
5 Package mechanical dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
6 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Appendix A FCC statement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
A.1 Instructions for FCC ID labeling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
A.2 Special requirement for modular application. . . . . . . . . . . . . . . . . . . . . . . 13
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2/15 Doc ID 17301 Rev 1
SPZB260C-PRO Block diagram

1 Block diagram

Figure 1. SPZB260C-PRO block diagram

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Doc ID 17301 Rev 1 3/15
Pin information SPZB260C-PRO

2 Pin information

2.1 Pin connections

Figure 2. Pin connection diagram

4/15 Doc ID 17301 Rev 1
SPZB260C-PRO Pin information

2.2 Pin description

Table 1. Pin description

Description
Pin n Pin name Direction
SPI mode UART mode
1 RTS O Not used
RTS signal (10 kΩ pull-up to VDD)
2 RSTB I Active low reset (a pull-up of 10 kΩ typ is provided with 10 nF to GND)
3 HOST_INT / RXD O /I
Host interrupt signal (from ZB module to host) - SPI mode
RXD signal
4 SPI_SSEL / CTS I SPI slave select (from host to ZB module) CTS signal
5 SPI MOSI I
6 SPI MISO O
SPI data, master out/slave in (from host to ZB module)
SPI data, master in/slave out (from ZB module to host)
Not used
Not used
7 SPI_CLK I SPI clock Not used
8 GND --- Ground
9
10 TXD O Not used
11 SIF_CLK I
VDD --- Input power supply
TXD signal (10 kΩ pull-up to VDD)
Non-intrusive debug interface. Serial interface clock signal (internal pull­down)
12 SIF_MISO O Non-intrusive debug interface. Serial interface master in/slave out
Non-intrusive debug interface
13 SIF_MOSI I
Serial interface master out/slave in To guarantee proper signal level when in deep sleep mode, a 10 kΩ resistor
to GND is included
Non-intrusive debug Interface
14 SIF_LOADB I/O
Serial interface load strobe (open collector with internal pull-up). To improve noise immunity, a 10 kΩ resistor to Vdd is included
15 PTI_EN O Frame signal of packet trace interface (PTI)
16 PTI_DATA O Data signal of packet trace interface (PTI)
17 WAKE I Wake interrupt signal from host to ZB module
18 ACTIVITY O Activity signal for application debug /monitor
19 SDBG O Spare debug signal
Doc ID 17301 Rev 1 5/15
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