Features
■ Integrated 2.4 GHz, IEEE 802.15.4-compliant
transceiver, PHY and MAC
– 3 dBm nominal TX output power
– -95 dBm (typ) RX sensitivity
– + 5 dBm in boost mode
■ Integrated Murata antenna
■ 128 kb embedded Flash and 5 kb integrated
SRAM for program and data storage
■ 17 GPIO with alternate functions: GPIOs,
UART, I
■ 2 16-bit general purpose timers: one 16-bit
2
C, SPI, ADC
sleep timer
■ ADC, sigma-delta converter with 12-bit
resolution
■ On board 24 MHz stable crystal
■ Selectable integrated RC oscillator
(typ 10 kHz) or 32.768 kHz crystal for low
power operation
■ < 2 μA (typ) power consumption in deep sleep
mode
■ Watchdog timer and power on reset
■ Pins available for non-intrusive debug interface
(SIF)
■ Single supply voltage 2.1 to 3.6 Vdc
■ CE and FCC compliance. FCC ID:S9NZB250A
Applications
SPZB250
ZigBee® module
Description
SPZB250 is a low power consumption ZigBee®
module based on EM250 ZigBee
chip which integrates a 16 bit processor together
with a 2.4 GHz, IEEE 802.15.4-compliant
transceiver as well as IEEE 802.15.4 PHY and
MAC. It enables OEMs to easily add wireless
networking capability to any electronic device.
Such a module is a very comprehensive solution
to build wireless sensors with meshing and self
healing capability as required in a WSN scenario.
24 MHz high stability crystal is integrated in the
module to perform the timing requirements as per
ZigBee
®
specifications. An additional
32.768 kHz crystal is provided for low power
operation.
To support user defined applications, a number of
peripherals such as GPIO, UART, I
general purpose timers are available and user
selectable.
®
system-on-
2
C, ADC and
■ Industrial controls
■ Sensor networking
■ Monitoring of remote systems
■ Home applications
■ Security systems
■ Lighting controls
The deep sleep mode with power consumption
less than 2 μA (typ) allows the use in applications
where the battery life is a key constraint.
For other information and details, please refer to
EM250 datasheet available at the Ember
Corporation website.
May 2010 Doc ID 13919 Rev 6 1/18
www.st.com
18
Contents SPZB250
Contents
1 RoHS compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
3 Pin setting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3.1 Pin connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
4 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4.2 Operating ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
5 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5.1 DC electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5.2 DC I/O specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5.3 RF electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
6 Package mechanical dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
7 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Appendix A FCC statement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
A.1 Label instruction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
A.2 Special requirement for modular application. . . . . . . . . . . . . . . . . . . . . . . 15
8 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
2/18 Doc ID 13919 Rev 6
SPZB250 RoHS compliance
1 RoHS compliance
ST modules are RoHS compliant and being based on ST devices comply with ECOPACK®
norms implemented by ST.
2 Block diagram
Figure 1. Block diagram
6DD
3)&
'0)/
#
/.423)'.
K(Z
8TAL
%-
3O#
-(Z
8TAL
2&
ANTENNA
"ALUN
&ILTER
Doc ID 13919 Rev 6 3/18
Pin setting SPZB250
3 Pin setting
3.1 Pin connection
Figure 2. Pin connection diagram
4/18 Doc ID 13919 Rev 6
SPZB250 Pin setting
3.2 Pin description
Table 1. Pin description
Pin n Pin name Direction Description
GPIO6 I/O Digital I/O
ADC2 Analog ADC input 2
1
TMR2CLK I External clock input of timer 2
TMR1ENMSK I External enable mask of timer1
GPIO5 I/O Digital I/O
2
ADC1 Analog ADC input 1
PTI_DATA O Frame signal of PTI (packet trace interface)
GPIO4 I/O Digital I/O
3
ADC0 Analog ADC input 0
PTI_EN O Frame signal of PTI (packet trace interface)
GPIO3 I/O Digital I/O
4
SSEL I SPI slave select of serial controller SC2
TMR2IB.1 I Capture of input B of timer 1
5 RSTB I Active low reset (an internal pull-up of 30 kΩ typ is provided)
GPIO11 I/O Digital I/O
CTS I UART CTS handshake of serial controller SC1
6
MCLK O SPI master clock of serial controller SC1
TMR2IA.1 I Capture of input A of timer 2
GPIO12 I/O Digital I/O
7
RTS O UART RTS handshake of serial controller SC1
TMR2IB.1 I Capture of input B of timer 2
GPIO0 I/O Digital I/O
MOSI O SPI master data out of serial controller SC2
8
MOSI I SPI slave data in of serial controller SC2
TMR1IA.1 I Capture of input A of timer 1
GPIO1 I/O Digital I/O
MISO I SPI master data in of serial controller SC2
9
MISO O SPI slave data out of serial controller SC2
2
SDA I/O I
TMR2IA.2 I Capture of input A of timer 2
C data of serial controller SC2
Doc ID 13919 Rev 6 5/18
Pin setting SPZB250
Table 1. Pin description (continued)
Pin n Pin name Direction Description
GPIO2 I/O Digital I/O
MSCLK O SPI master clock of serial controller SC2
10
MSCLK I SPI slave clock of serial controller SC2
2
SCL I/O I
TMR2IA.2 I Capture of input B of timer 2
11 GND -- Ground
12 VDD Power Input power supply
GPIO7 I/O Digital I/O
13
ADC3 Analog ADC input 3
REG_EN O External regulator open collector output
GPIO8 I/O Digital I/O
VREF_OUT Analog ADC reference output
14
TMR1CLK I External clock input of timer 1
TMR2ENMSK I External enable mask of timer 2
IRQA I External interrupt source A
C clock of serial controller SC2
GPIO9 I/O Digital I/O
TXD O UART transmit data of serial controller SC1
15
MO O SPI master data out of serial controller SC1
2
MSDA I/O I
C data of serial controller SC1
TMR1IA.2 I Capture of input A of timer 2
GPIO10 I/O Digital I/O
RXD I UART receive data of serial controller SC1
16
MI I SPI master data in of serial controller SC1
2
MSCL I/O I
C clock of serial controller SC1
TMR1IB.2 I Capture of input B of timer 2
17 SIF_CLK I
18 SIF_MISO O
Non-intrusive debug interface
Serial interface clock signal (internal pull-down)
Non-intrusive debug interface
Serial interface master IN/ slave out
Non-intrusive debug interface
19 SIF_MOSI I
Serial interface master out/ slave in
To guarantee a proper signal level when in deep sleep mode
connect a 10kΩ resistor to GND
20 SIF_LOADB I/O
Non-intrusive debug interface
Serial interface load strobe (Open collector with internal pull-up)
To improve noise immunity connect a 10 kΩ resistor to V
DD
6/18 Doc ID 13919 Rev 6
SPZB250 Pin setting
Table 1. Pin description (continued)
Pin n Pin name Direction Description
GPIO16 I/O Digital I/O
TMR1OB O Waveform output B of timer 1
21
TMR2IB.3 I Capture of input B of timer 2
IRQD I External interrupt source D
GPIO15 I/O Digital I/O
TMR1OA O Waveform output A of timer 1
22
TMR2IA.3 I Capture of input A of timer 2
IRQC I External interrupt source C
GPIO14 I/O Digital I/O
TMR2OB O Waveform output B of timer 2
23
TMR1IB.3 I Capture of input B of timer 1
IRQB I External interrupt source B
GPIO13 I/O Digital I/O
24
TMR2OA O Waveform output A of timer 2
TMR1IA.3 I Capture of input A of timer 1
Doc ID 13919 Rev 6 7/18
Maximum ratings SPZB250
4 Maximum ratings
4.1 Absolute maximum ratings
Table 2. Absolute maximum ratings
Values
Symbol Parameter
Min. Max.
Unit
V
DD
V
IN
T
stg
T
sold
Module supply voltage -0.3 3.6 V
Input voltage on any digital pin -0.3 Vdd+0.3 V
Storage temperature -40 +85 °C
Soldering temperature < 10 s 240
4.2 Operating ranges
Table 3. Operating ranges
Symbol Parameter Conditions
V
DD
T
stg
Module supply voltage - 40°C < T < 85 °C 2.1 3.3 3.6 V
Operating ambient
temperature
Val ues
Unit
Min. Typ. Max.
-40 +85 °C
8/18 Doc ID 13919 Rev 6
SPZB250 Electrical characteristics
5 Electrical characteristics
5.1 DC electrical characteristics
Table 4. DC electrical characteristics
Val ues
Symbol Parameter Conditions
Min. Typ. Max.
IRX RX current (boost mode) Vdd = 3.0 V, T = 25 °C - 38 mA
IRX RX current (normal mode) Vdd = 3.0 V, T = 25 °C - 36 mA
ITX TX current (boost mode) Vdd = 3.0 V, T = 25 °C - 42 mA
ITX TX current (normal mode) Vdd = 3.0 V, T = 25 °C - 36 mA
Unit
IDS
IDS
Deep sleep current
(RC oscillator)
Deep sleep current
(32.768 kHz oscillator)
2.1 < Vdd < 3.6 V
T = 25 °C
2.1 < Vdd < 3.6 V
T = 25 °C
-24μA
-24.5μA
5.2 DC I/O specification
Table 5. DC input / output specification
Val ues
Symbol Parameter Conditions
Min. Typ. Max.
VIL Low level input voltage 2.1 < Vdd < 3.6 V 0 0.2 x Vdd V
VIH High level input voltage 2.1 < Vdd < 3.6 V 0.8 x Vdd Vdd V
Iil Input current for logic 0 2.1 < Vdd < 3.6 V -0.5 mA
Iih Input current for logic 1 2.1 < Vdd < 3.6 V 0.5 mA
Ripu Input pull-up resistor 30 kW
Ripd Input pull-down resistor 30 kW
VOL Low level output voltage 0 0.18 x Vdd V
VOH High level output voltage 0.82 x Vdd Vdd V
Unit
IOHS Output source current (GPIO 12: 0) 4 mA
IOLS Output sink current (GPIO 12: 0) 4 mA
IOHH Output source current (GPIO 16: 13) 8 mA
IOLH Output sink current (GPIO 16: 13) 8 mA
IOTot Total output current for I/O 40 mA
Doc ID 13919 Rev 6 9/18
Electrical characteristics SPZB250
5.3 RF electrical characteristics
Table 6. RF electrical characteristics
Val ues
Symbol Parameter Conditions
Min. Typ. Max.
Frequency range 2.1 < Vdd < 3.6 V 2405 2480 MHz
TX Output power Vdd = 3.0 V, F = 2450 MHz 3 dBm
RX Sensitivity Vdd = 3.0 V, 1% PER -95 dBm
CFE Carrier frequency error Vdd = 3.0 V -20 / + 70 °C -40 40 ppm
Error vector magnitude Normal / boost mode 15 25 %
Adjacent channel rejection
+/- 5 MHz
+/- 10 MHZ
35
40
Unit
dBm
10/18 Doc ID 13919 Rev 6
SPZB250 Package mechanical dimensions
6 Package mechanical dimensions
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK®
®
is an ST trademark.
Figure 3. Mechanical dimensions
Doc ID 13919 Rev 6 11/18
Package mechanical dimensions SPZB250
Figure 4. Solder pad layout
12/18 Doc ID 13919 Rev 6
SPZB250 Soldering
7 Soldering
Soldering phase has to be execute with care: in order to avoid undesired melting
phenomenon, particular attention has to be take on the set up of the peak temperature.
Here following some suggestions for the temperature profile based on
IPC/JEDEC J-STD-020C, July 2004 recommendations.
Table 7. Soldering
Profile feature PB free assembly
Average ramp up rate (T
SMAX to TP) 3 °C / sec max
Preheat
Temperature min (T
S MIN)
Temperature max (TS MAX)
Time (T
S MIN to TS MAX) (tS)
150 °C
200 °C
60 – 100 sec
Time maintained above:
Temperature T
Time tL
L
217 °C
40 – 70 sec
Peak temperature (Tp) 240+0 °C
Time within 5 °C of actual peak temperature (t
P) 10 – 20 sec
Ramp down rate 6 °C / sec
Time from 25 °C to peak temperature 8 minutes max
Figure 5. Soldering
Doc ID 13919 Rev 6 13/18
FCC statement SPZB250
Appendix A FCC statement
This device complies with part 15 of the FCC rules. Operation is subject to the following two
conditions: (1) this device may not cause harmful interference, and (2) this device must
accept any interference received, including interference that may cause undesired
operation.
Note: This equipment has been tested and found to comply with the limits for a class B digital
device, pursuant to part 15 of the FCC rules. These limits are designed to provide
reasonable protection against harmful interference in a residential installation. This
equipment generates, uses and can radiate radio frequency energy and, if not installed and
used in accordance with the instructions, may cause harmful interference to radio
communications. However, there is no guarantee that interference will not occur in a
particular installation. If this equipment does cause harmful interference to radio or
television reception, which can be determined by turning the equipment off and on, the user
is encouraged to try to correct the interference by one or more of the following measures:
● Reorient or relocate the receiving antenna
● Increase the separation between the equipment and receiver
● Connect the equipment into an outlet on a circuit different from that to which the
receiver is connected
Consult the dealer or an experienced radio/TV technician for help.
Antenna
Our module type SPZB250 is for OEM integrations only. The end-user product will be
professionally installed in such a manner that only the authorized antennas are used.
Caution
Any changes or modifications not expressed approved by the part responsible for
compliance could cause the module to cease to comply with FCC rules part 15, and thus
void the user’s authority to operate the equipment.
14/18 Doc ID 13919 Rev 6
SPZB250 FCC statement
A.1 Label instruction
Instruction manual for FCC ID labeling
Module type: ZigBee® module SPZB250
FCC-ID: S9NZB250A
This intends to inform you how to specify the FCC ID of our ZigBee
your final product.
Based on the public notice from FCC, the product into which our transmitter module is
installed must display a label referring to the enclosed module.
The label should use wording such as “contains transmitter module FCC ID: S9NZB250A or
“contains FCC ID: S9NZB250A, any similar wording that expressed the same meaning may
be use.
It shows an example below
Contains FCC ID: S9NZB250A
®
module SPZB250 on
A.2 Special requirement for modular application
The following requirements are fulfilled:
1. The modular transmitter must have its own RF shielding:
The RF module used on the board fulfils the emission requirements of the FCC rules
without additional shielding.
2. The modular transmitter must have buffered modulation/data inputs:
The module has a memory management unit inside of the IC. The processor
interfacing with the external application by means general purpose I/O (GPIO), Uart,
SPI. The processor interfaces also the RF part of the module exchanging data and
command with it. Inside the processor a Flash memory is available to download the
customer application and the ZigBee
3. The modular transmitter must have its own power supply regulation:
The IC contains an own voltage regulation. In case of changes in the supply voltage
VCC (for example caused by temperature changes or other effects), the internal
voltage will be stabilized.
4. The modular transmitter must comply with the antenna requirements of section 15.203
and 15.204:
The RF module is for OEM (original equipment manufacturer) integration only. The enduser product will be professionally installed in such a manner that only the authorized
antenna is used.
5. The modular transmitter must be tested in a stand-alone configuration:
The RF module was tested in a stand-alone configuration.
6. The modular transmitter must be labelled with its own FCC ID number:
The RF module will be labelled with its own FCC ID number. When the module is
installed inside the end-product, the label is not visible. The OEM manufacturer is
instructed how to apply the exterior label.
®
profiles.
Doc ID 13919 Rev 6 15/18
FCC statement SPZB250
7. The modular transmitter must comply with any specific rule or operating requirements
applicable to the transmitter and the manufacturer must provide adequate instructions
along with the module to explain any such requirements:
The EUT is compliant with all applicable FCC rules. Detail instructions are given in the
product users guide.
8. The modular transmitter must comply with any applicable RF exposure requirements.
● Maximum measured power output: 3.08 mW
● Maximum antenna gain: 0.6 dBi = numeric gain 1,148 (see also FCC test report)
Maximum permissible exposure defined in 47 CFR 1.1310: 1 mW/cm².
The RF module operates at low power level so it does not exceed the commission’s RF
exposure guidelines limits; furthermore, Spread spectrum transmitters operate according to
the section 15.247 are categorically excluded from routine environmental evaluation.
16/18 Doc ID 13919 Rev 6
SPZB250 Revision history
8 Revision history
Table 8. Document revision history
Date Revision Changes
08-Oct-2007 1 First release
18-Mar-2008 2
Updated cover page, Table 1 on page 5, Table 4 on page 9
Added new Section 7: Soldering on page 13
19-Jan-2009 3 Updated cover page and Table 6 on page 10
28-Apr-2009 4 Updated features and description in cover page
03-Nov-2009 5 Added Chapter 1 on page 3
27-May-2010 6 Updated cover page and Figure 1 on page 3
Doc ID 13919 Rev 6 17/18
SPZB250
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2010 STMicroelectronics - All rights reserved
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -
STMicroelectronics group of companies
Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
18/18 Doc ID 13919 Rev 6
Loading...